CN110416149A - A kind of thinned wafer bracing means - Google Patents
A kind of thinned wafer bracing means Download PDFInfo
- Publication number
- CN110416149A CN110416149A CN201910644662.5A CN201910644662A CN110416149A CN 110416149 A CN110416149 A CN 110416149A CN 201910644662 A CN201910644662 A CN 201910644662A CN 110416149 A CN110416149 A CN 110416149A
- Authority
- CN
- China
- Prior art keywords
- fixing piece
- bracing means
- thinned wafer
- fixed part
- mounting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a kind of thinned wafer bracing means, including fixing piece, negative pressure hole is provided on the fixing piece, mounting portion is provided on the fixing piece, the fixed replaceable fixed part of the mounting portion, the replaceable fixed part and negative pressure hole are connected, and are provided with fixing groove in the replaceable fixed part, the fixing groove is treated fixing piece and is fixed, and the part upper surface to be fixed is not less than replaceable fixed part, mounting portion and fixing piece upper surface.The present invention can realize the fixation to various sizes of part to be fixed by replaceable fixed part well.
Description
Technical field
The present invention relates to thinned wafer bracing means technical field, specially a kind of thinned wafer bracing means.
Background technique
In the test of product, but due to some special process or the demand of special parameter, need first to be processed
Workpiece carries out thinned, then is tested, with the continuous reduction of workpiece to be processed thickness, thin slice is more easier to be crushed.
During the test, by Arm (transferring arm), the lift thimble being transmitted on Chuck (slide holder), thimble
Decline, is placed on workpiece to be processed in the groove on Chuck, by negative pressure, workpiece to be processed is adsorbed on Chuck, this
In pilot process, groove size is certain, and various sizes of workpiece to be processed can not be fixed well.
Summary of the invention
The purpose of the present invention is to provide a kind of thinned wafer bracing means, can be good to various sizes of to be processed
Workpiece is fixed, to solve the problems mentioned in the above background technology.
To achieve the above object, the invention provides the following technical scheme: a kind of thinned wafer bracing means, including fixation
Part is provided with negative pressure hole on the fixing piece, and mounting portion is provided on the fixing piece, and the mounting portion is fixed replaceable fixed
Portion, the replaceable fixed part and negative pressure hole are connected, and are provided with fixing groove in the replaceable fixed part, the fixing groove is treated
Fixing piece is fixed, and the part upper surface to be fixed is not less than replaceable fixed part, mounting portion and fixing piece upper surface.
Preferably, the fixing piece is using round fixed disc.
Preferably, the negative pressure hole is uniformly arranged on fixing piece.
Preferably, the mounting portion uses groove, and the replaceable fixed part is made of spacing collar and retainer plate, described solid
Fixed circle is located on spacing collar inner wall.
Preferably, the replaceable fixed part is made of spacing collar and retainer plate, and the retainer plate is located at spacing collar inner wall
On.
Preferably, the fixing piece also on be provided with limiting slot, the limiting slot and spacing collar are adapted.
Preferably, the spacing collar is bonded on limiting slot inner wall by double-sided adhesive.
Preferably, the spacing collar is connected by connecting bolt with limiting slot inner wall.
Preferably, the fixing groove is round fixing groove.
Preferably, the mounting portion uses square box, and the replaceable fixed part uses square plate.
Compared with prior art, the beneficial effects of the present invention are:
The present invention can realize the fixation to various sizes of part to be fixed by replaceable fixed part well.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the fixing piece top view of the embodiment of the present invention 1；
Fig. 3 is the replaceable fixing part structure schematic diagram of the embodiment of the present invention 1；
The top view of Fig. 4 the embodiment of the present invention 2.
In figure: 1, fixing piece；2, replaceable fixed part；3, negative pressure hole；4, limiting slot；5, mounting portion；6, retainer plate；7, it limits
Position circle.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1:
Fig. 1-3 is please referred to, the present invention provides a kind of technical solution: a kind of thinned wafer bracing means, including fixing piece 1,
It is provided with negative pressure hole 3 on fixing piece 1, mounting portion 5 is provided on fixing piece 1, mounting portion 5 fixes replaceable fixed part 2, alternatively
Fixed part 2 and negative pressure hole 3 are connected, and are provided with fixing groove in replaceable fixed part 2, and fixing groove is treated fixing piece and is fixed, to
Fixing piece upper surface is not less than 1 upper surface of replaceable fixed part 2, mounting portion 5 and fixing piece.
Specifically, fixing piece 1 avoids the occurrence of the situation of scuffing using round fixed disc.
Specifically, negative pressure hole 3 is uniformly arranged on fixing piece 1, the fixed effect of part to be fixed is more preferable.
Specifically, mounting portion 5 uses groove, replaceable fixed part 2 is made of spacing collar and retainer plate, and retainer plate is located at limit
On the circle inner wall of position.
Specifically, replaceable fixed part 2 is made of spacing collar 7 and retainer plate 6, retainer plate 6 is located on 7 inner wall of spacing collar.
Specifically, fixing piece 1 also on be provided with limiting slot 4, limiting slot 4 and spacing collar 7 are adapted, convenient to can well
Replace the fixation of fixed part 2.
Specifically, spacing collar 7 is bonded on 4 inner wall of limiting slot by double-sided adhesive, facilitate according to different needs to can replace
Change the disassembly of fixed part 2 and replacement.
Specifically, fixing groove is round fixing groove.
Embodiment 2: it referring to Fig. 4, a kind of thinned wafer bracing means, including fixing piece 1, is provided on fixing piece 1 negative
Hole 3 is pressed, mounting portion 5, the fixed replaceable fixed part 2 of mounting portion 5, replaceable fixed part 2 and negative pressure hole 3 are provided on fixing piece 1
It is connected, is provided with fixing groove in replaceable fixed part 2, fixing groove is treated fixing piece and is fixed, and part upper surface to be fixed is not low
In 1 upper surface of replaceable fixed part 2, mounting portion 5 and fixing piece
Specifically, fixing piece 1 is using round fixed disc.
Specifically, negative pressure hole 3 is uniformly arranged on fixing piece 1.
Specifically, replaceable fixed part uses square plate as shown in figure 4, mounting portion uses square box.
Specifically, fixing groove is round fixing groove.
Embodiment 3:
A kind of thinned wafer bracing means, including fixing piece 1 are provided with negative pressure hole 3 on fixing piece 1, are arranged on fixing piece 1
There is mounting portion 5, the fixed replaceable fixed part 2 of mounting portion 5, replaceable fixed part 2 and negative pressure hole 3 are connected, in replaceable fixed part 2
It is provided with fixing groove, fixing groove is treated fixing piece and is fixed, and part upper surface to be fixed is not less than replaceable fixed part 2, installation
1 upper surface of portion 5 and fixing piece.
Specifically, fixing piece 1 is using round fixed disc.
Specifically, negative pressure hole 3 is uniformly arranged on fixing piece 1.
Specifically, mounting portion 5 uses groove, replaceable fixed part 2 is made of spacing collar and retainer plate, and retainer plate is located at limit
On the circle inner wall of position.
Specifically, replaceable fixed part 2 is made of spacing collar 7 and retainer plate 6, retainer plate 6 is located on 7 inner wall of spacing collar.
Specifically, fixing piece 1 also on be provided with limiting slot 4, limiting slot 4 and spacing collar 7 are adapted.
Specifically, spacing collar 7 can also be connected by connection bolt with 4 inner wall of limiting slot.
Working principle: the equipment is made using conductor material or insulating materials in use, can according to need, will be thinned
Wafer is directly placed in the fixing groove 5 of fixing piece 1, when the diameter of thinned wafer is less than the diameter of fixing groove 5, can choose
Different replaceable fixed parts 2 is fixed in fixing groove 5 by two-sided glue sticking or connection bolt, to adapt to different sizes
Thinned wafer, while being cooperated by negative pressure equipment and negative pressure hole 3, well thinned wafer be adsorbed under the action of negative pressure
Inside the equipment.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (9)
1. a kind of thinned wafer bracing means, including fixing piece, negative pressure hole is provided on the fixing piece, it is characterised in that: institute
It states and is provided with mounting portion on fixing piece, the fixed replaceable fixed part of the mounting portion, the replaceable fixed part and negative pressure hole are led
It is logical, fixing groove is provided in the replaceable fixed part, the fixing groove is treated fixing piece and is fixed, on the part to be fixed
Surface is not less than replaceable fixed part, mounting portion and fixing piece upper surface.
2. a kind of thinned wafer bracing means according to claim 1, it is characterised in that: the fixing piece is using round solid
Fixed disk.
3. a kind of thinned wafer bracing means according to claim 1, it is characterised in that: the negative pressure hole is uniformly arranged
On fixing piece.
4. a kind of thinned wafer bracing means according to claim 4, it is characterised in that: the mounting portion uses groove,
The replaceable fixed part is made of spacing collar and retainer plate, and the retainer plate is located on spacing collar inner wall.
5. a kind of thinned wafer bracing means according to claim 1 or 4, it is characterised in that: the fixing piece also on set
It is equipped with limiting slot, the limiting slot and spacing collar are adapted.
6. a kind of thinned wafer bracing means according to claim 1 or 5, it is characterised in that: the spacing collar passes through double
Face glue sticking is on limiting slot inner wall.
7. a kind of thinned wafer bracing means according to claim 1 or 5, it is characterised in that: the spacing collar passes through company
Connecting bolt is connected with limiting slot inner wall.
8. a kind of thinned wafer bracing means according to claim 1, it is characterised in that: the fixing groove is round fixed
Slot.
9. a kind of thinned wafer bracing means according to claim 1, it is characterised in that: the mounting portion is using fixation
Circle, the mounting portion use square box, and the replaceable fixed part uses square plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910644662.5A CN110416149A (en) | 2019-07-17 | 2019-07-17 | A kind of thinned wafer bracing means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910644662.5A CN110416149A (en) | 2019-07-17 | 2019-07-17 | A kind of thinned wafer bracing means |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110416149A true CN110416149A (en) | 2019-11-05 |
Family
ID=68361782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910644662.5A Pending CN110416149A (en) | 2019-07-17 | 2019-07-17 | A kind of thinned wafer bracing means |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110416149A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111060493A (en) * | 2019-12-28 | 2020-04-24 | 安徽中科赛飞尔科技有限公司 | Surface-enhanced Raman spectrum multi-sample detection system |
| CN111060495A (en) * | 2019-12-28 | 2020-04-24 | 安徽中科赛飞尔科技有限公司 | Air pump accurate control structure for SERS |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014027007A (en) * | 2012-07-24 | 2014-02-06 | Disco Abrasive Syst Ltd | Method of processing wafer and annular convex part removal device |
| CN207572352U (en) * | 2017-12-25 | 2018-07-03 | 君泰创新（北京）科技有限公司 | Silicon chip of solar cell bogey and Transmission system |
| WO2018155337A1 (en) * | 2017-02-23 | 2018-08-30 | 日本新工芯技株式会社 | Electrode ring |
| CN108735648A (en) * | 2017-04-18 | 2018-11-02 | 日新离子机器株式会社 | Electrostatic chuck |
| CN208385385U (en) * | 2018-07-03 | 2019-01-15 | 苏州映真智能科技有限公司 | Silicon wafer sucking disc and silicon wafer grasping mechanism |
| CN109786314A (en) * | 2018-12-19 | 2019-05-21 | 华进半导体封装先导技术研发中心有限公司 | For clamping the fixation device and vacuum sputtering of metal thin-film technique of plastic packaging wafer |
-
2019
- 2019-07-17 CN CN201910644662.5A patent/CN110416149A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014027007A (en) * | 2012-07-24 | 2014-02-06 | Disco Abrasive Syst Ltd | Method of processing wafer and annular convex part removal device |
| WO2018155337A1 (en) * | 2017-02-23 | 2018-08-30 | 日本新工芯技株式会社 | Electrode ring |
| CN108735648A (en) * | 2017-04-18 | 2018-11-02 | 日新离子机器株式会社 | Electrostatic chuck |
| CN207572352U (en) * | 2017-12-25 | 2018-07-03 | 君泰创新（北京）科技有限公司 | Silicon chip of solar cell bogey and Transmission system |
| CN208385385U (en) * | 2018-07-03 | 2019-01-15 | 苏州映真智能科技有限公司 | Silicon wafer sucking disc and silicon wafer grasping mechanism |
| CN109786314A (en) * | 2018-12-19 | 2019-05-21 | 华进半导体封装先导技术研发中心有限公司 | For clamping the fixation device and vacuum sputtering of metal thin-film technique of plastic packaging wafer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111060493A (en) * | 2019-12-28 | 2020-04-24 | 安徽中科赛飞尔科技有限公司 | Surface-enhanced Raman spectrum multi-sample detection system |
| CN111060495A (en) * | 2019-12-28 | 2020-04-24 | 安徽中科赛飞尔科技有限公司 | Air pump accurate control structure for SERS |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191105 |