CN111375569B - Test all-in-one machine - Google Patents
Test all-in-one machine Download PDFInfo
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- CN111375569B CN111375569B CN201811639170.9A CN201811639170A CN111375569B CN 111375569 B CN111375569 B CN 111375569B CN 201811639170 A CN201811639170 A CN 201811639170A CN 111375569 B CN111375569 B CN 111375569B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
Abstract
The invention discloses a test integrated machine which comprises a pressure-resistant testing mechanism, a separating mechanism, a conveying mechanism, an electrical testing mechanism and an electrical waste pushing mechanism, wherein the pressure-resistant testing mechanism is used for performing pressure-resistant testing on semiconductor devices, the separating mechanism is used for separating the semiconductor devices qualified in pressure-resistant testing to the conveying mechanism, the electrical testing mechanism and the electrical waste pushing mechanism are both fixed on the conveying mechanism, and the conveying mechanism is used for sequentially conveying the semiconductor devices to the electrical testing mechanism and the electrical waste pushing mechanism and outputting the semiconductor devices qualified in electrical testing. The invention can automatically complete the voltage withstanding and electrical property test of the square semiconductor device at one time, thereby greatly improving the test efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductor devices, in particular to a testing integrated machine which is mainly used for voltage withstand testing and electrical property testing of square semiconductor devices.
Background
Semiconductors refer to materials with conductivity between conductors and insulators at normal temperature, so that voltage withstand and electrical tests are required to be carried out on the devices when the devices leave a factory, but no good testing equipment exists in the market.
The prior art of chinese patent publication No. CN205229397U discloses a withstand voltage insulation test machine of bridge rectifier product on day 11 of 2016, and it includes the test machine casing, the right side of high voltage test machine is connected with the high voltage test board through the wire, the high voltage test board includes the high voltage test district, the joint has the positioning disk in the high voltage test district, and has laid bridge rectifier on the positioning disk, bridge rectifier top is connected with the test needle through first connecting seat, and first connecting seat is fixed with the second connecting seat through two electric telescopic handle of symmetry. The bridge pile product pressure-resistant insulation testing machine is connected with the high-voltage testing machine and the high-voltage testing table through the wires, so that the bridge pile product can obtain pressure-resistant and insulation parameters of the bridge pile product under the combined work of the high-voltage testing machine and the high-voltage testing table, and the pressure-resistant and insulation testing of the bridge pile product is realized. However, the patent cannot perform electrical testing on the bridge stack, and has the defects of low testing efficiency and the like.
Disclosure of Invention
The invention aims to overcome the problems in the prior art and provide the test integrated machine, which can automatically complete the voltage withstanding and electrical property test of the square semiconductor device at one time, thereby greatly improving the test efficiency.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the utility model provides a test all-in-one which characterized in that: the semiconductor device pressure-resistant testing device comprises a pressure-resistant testing mechanism, a separating mechanism, a conveying mechanism, an electrical testing mechanism and an electrical waste pushing mechanism, wherein the pressure-resistant testing mechanism is used for pressure-resistant testing of the semiconductor device, the separating mechanism is used for separating the semiconductor device which is qualified in pressure-resistant testing to the conveying mechanism, the electrical testing mechanism and the electrical waste pushing mechanism are both fixed on the conveying mechanism, and the conveying mechanism is used for sequentially conveying the semiconductor device to the electrical testing mechanism and the electrical waste pushing mechanism and outputting the semiconductor device which is qualified in electrical testing.
The withstand voltage test mechanism comprises a limiting slide way and a withstand voltage test assembly, wherein the limiting slide way is obliquely fixed, the withstand voltage test assembly comprises a support frame, a withstand voltage test piece, a light sensor, a test cylinder and a positioning cylinder, the support frame is fixed on the limiting slide way, the test cylinder is fixed on the support frame, and the withstand voltage test piece is fixed above the limiting slide way through the test cylinder and is used for withstand voltage test of the semiconductor device; the positioning cylinder is fixed below the limiting slide way and used for enabling the semiconductor device in the limiting slide way to stay on a pressure-resistant test station below the pressure-resistant test piece when the semiconductor device is tested, and the optical sensor is fixed on one side of the limiting slide way and used for detecting the semiconductor device on the pressure-resistant test station.
The pressure-resistant testing mechanism further comprises a pressure-resistant waste pushing assembly for pushing out the semiconductor devices with unqualified pressure-resistant tests, the pressure-resistant waste pushing assembly comprises a pushing cylinder, a limiting cylinder and a housing, the limiting cylinder is fixed below the limiting slide and used for enabling the semiconductor devices with unqualified pressure-resistant tests to stay on a pushing station of the limiting slide, symmetrical notches are formed in two sides of the pushing station, the housing is arranged at the notches, the pushing cylinder is fixed on one side of the limiting slide, and the pushing cylinder is fixedly connected with the housing and used for pushing out the unqualified semiconductor devices from the notches.
The semiconductor device feeding device is characterized in that a feeding control assembly is arranged on the limiting slide way and comprises two material distributing cylinders which are fixed below the limiting slide way, and the two material distributing cylinders are used for controlling the feeding quantity of the semiconductor device through interval expansion fit of a piston rod.
The separating mechanism comprises a sliding component, a stirring block and a switching channel, one end of the switching channel is fixedly arranged at the discharge end of the pressure-resistant testing mechanism, the other end of the switching channel is fixedly arranged at one side of the conveying mechanism, a feed inlet corresponding to the discharge end of the pressure-resistant testing mechanism is formed in the switching channel, the stirring block is movably arranged in the switching channel, the sliding component is fixedly connected with the stirring block, and the sliding component is matched with the stirring block to stir the semiconductor device in the switching channel to the conveying mechanism.
The sliding assembly comprises a support, a polished rod, a sliding block and a driving piece, wherein the support is fixed on one side of the switching channel, the polished rod is fixed on the support, one end of the sliding block is movably connected with the polished rod, the other end of the sliding block is fixedly connected with the material shifting block, and the driving piece is connected with the sliding block through a connecting rod and used for driving the sliding block to reciprocate on the polished rod.
The conveying mechanism comprises a conveying channel, a conveying chain and a conveying motor, the conveying motor is connected with the conveying chain, the conveying chain is arranged along the length direction of the conveying channel, and material stirring teeth are uniformly arranged on the conveying chain and positioned in the conveying channel and used for stirring the semiconductor device; the conveying channel is provided with an electrical test station and a pushing-out station, the electrical test mechanism is arranged above the electrical test station and used for conducting electrical test on the semiconductor device, and the electrical waste pushing-out mechanism is arranged on the pushing-out station and used for pushing out the semiconductor device which is unqualified in electrical test from the conveying channel.
The lateral movement direction of the semiconductor device on the conveying mechanism is opposite to the lateral movement direction of the semiconductor device on the withstand voltage testing mechanism.
The electric test mechanism comprises an electric test seat, a fixed block and two sets of clamping claw cylinders, wherein the two sets of clamping claw cylinders are symmetrically fixed above the conveying channel, a test piece is arranged on the electric test seat, and the electric test seat is fixed between the two sets of clamping claw cylinders through the fixed block.
The number of the electrical test seats is at least one.
The electrical waste pushing mechanism comprises a pushing cylinder and a positioning shell, symmetrical notches are formed in two sides of the pushing station, the positioning shell is arranged at the notch, the pushing cylinder is fixed on one side of the conveying channel, and the pushing cylinder is fixedly connected with the positioning shell and used for pushing out semiconductor devices which are unqualified in electrical test from the notch.
The number of the pushing cylinders and the number of the positioning shells in the electrical waste pushing mechanism are at least three.
The number of the electrical property testing mechanisms is at least one, and the number of the electrical property waste pushing mechanisms is the same as that of the electrical property testing mechanisms.
The output end of the conveying mechanism is also provided with a material receiving box.
The invention has the advantages that:
1. the pressure-resistant testing integrated machine comprises a pressure-resistant testing mechanism, a separating mechanism, a conveying mechanism, an electrical testing mechanism and an electrical waste pushing mechanism, wherein the pressure-resistant testing mechanism can automatically conduct pressure-resistant testing on square semiconductor devices and automatically push out semiconductor devices which are unqualified in pressure-resistant testing, the separating mechanism can automatically and orderly separate the semiconductor devices which are qualified in pressure-resistant testing onto the conveying mechanism, and the conveying mechanism is matched with the electrical testing mechanism and the electrical waste pushing mechanism, so that the electrical testing can be automatically conducted on the semiconductor devices which are qualified in pressure-resistant testing, the semiconductor devices which are unqualified in electrical testing are pushed out, and finally qualified products are obtained. The invention can automatically complete the voltage withstanding and electrical property test of the square semiconductor device at one time, has higher intelligent degree and greatly improves the test efficiency.
2. The pressure-resistant testing mechanism comprises the limiting slide way and the pressure-resistant testing assembly, wherein the structure of obliquely fixing the limiting slide way can enable the semiconductor device to automatically slide into the pressure-resistant testing assembly from a high end to conduct pressure-resistant testing, and is beneficial to reducing conveying energy consumption. The pressure-resistant testing assembly comprises a supporting frame, a pressure-resistant testing piece and structures of the optical sensor, the testing cylinder and the positioning cylinder, so that accurate pressure-resistant testing of the semiconductor device is facilitated.
3. The pressure-resistant testing mechanism also comprises a pressure-resistant waste pushing assembly for pushing out the semiconductor device with unqualified pressure-resistant test, and the unqualified product can be automatically and accurately pushed out of the limiting slideway through the pressure-resistant waste pushing assembly, so that the testing efficiency is improved.
4. According to the invention, the feeding control assembly for controlling the feeding quantity of the semiconductor devices through the interval telescopic cooperation of the piston rods is arranged on the limiting slide way, so that the feeding accuracy is ensured by the structure, and the feeding is controlled accurately.
5. The separating mechanism comprises the sliding component, the poking block and the switching channel, and the separating mechanism adopting the structure can enable the semiconductor devices which are qualified in the withstand voltage test to automatically turn and enter the conveying mechanism orderly.
6. The sliding component comprises the bracket, the polish rod, the sliding block and the driving piece, and the sliding component adopting the structure has the advantages of simple structure and capability of accurately poking the semiconductor device to the conveying mechanism.
7. The conveying mechanism comprises a conveying channel, a conveying chain and a conveying motor, wherein the conveying chain is arranged along the length direction of the conveying channel, and material stirring teeth are uniformly arranged on the conveying chain and positioned in the conveying channel and used for stirring the semiconductor device; the structure enables the semiconductor device to be stirred by the conveying chain to automatically move forwards in the conveying channel, can be effectively matched with the electrical testing mechanism and the electrical waste pushing mechanism, realizes electrical testing of the semiconductor device and automatic pushing of unqualified products, and is beneficial to improving testing efficiency.
8. According to the invention, the lateral movement direction of the semiconductor device on the conveying mechanism is opposite to the lateral movement direction of the semiconductor device on the pressure-resistant testing mechanism, and the conveying mechanism can be arranged on one side of the pressure-resistant testing mechanism, so that the structure of the whole equipment is more compact, and the space occupation area is saved.
9. The electric test mechanism comprises an electric test seat, a fixed block and two sets of clamping claw cylinders, wherein the two sets of clamping claw cylinders are symmetrically fixed above a conveying channel, a test piece is arranged on the electric test seat, and the electric test seat is fixed between the two sets of clamping claw cylinders through the fixed block. The structure enables the semiconductor device to be tested to move below the clamping jaw cylinder, and installation space is saved. The piston movement of the clamping jaw cylinder can drive the test piece to clamp the pins of the semiconductor device, so that the contact performance of the test piece and the pins of the semiconductor device is effectively ensured.
10. The number of the electrical test seats is at least one, and when a plurality of electrical test seats are arranged, electrical tests can be simultaneously carried out on a plurality of semiconductor devices, so that the test efficiency is further improved.
11. The electrical waste pushing mechanism comprises the pushing cylinder and the positioning shell, wherein the pushing cylinder is fixedly connected with the positioning shell and used for pushing out the electrical testing disqualified semiconductor device from the notch.
12. The number of the pushing-out air cylinders and the number of the positioning shells are at least three, wherein the first set of pushing-out air cylinders and the second set of pushing-out air cylinders are used for pushing out unqualified products of different types respectively and classifying the unqualified products; and the third set of pushing-out air cylinders are used for repeatedly pushing out unqualified products, so that waste products are prevented from entering the qualified products.
13. The number of the electrical testing mechanisms is at least one, and the number of the electrical waste pushing mechanisms is the same as that of the electrical testing mechanisms. When the number of the electrical testing mechanism and the number of the electrical waste pushing mechanisms are multiple, the testing efficiency and the testing accuracy are improved.
14. According to the invention, the material receiving box is arranged at the output end of the conveying mechanism, and the automatic collection of qualified products is realized through the material receiving box.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic structural diagram of the withstand voltage test mechanism.
Fig. 3 is a schematic structural view of the separation mechanism.
Fig. 4 is a schematic view of the structure of the conveying chain in the conveying mechanism.
Fig. 5 is a schematic structural diagram of the electrical testing mechanism.
Fig. 6 is a schematic perspective view of the electrical testing mechanism and the electrical waste pushing mechanism on the conveying channel.
The labels in the figures are: 1. the pressure-resistant testing mechanism, 2, the pressure-resistant testing component, 3, the pressure-resistant waste pushing component, 4, the limit slideway, 5, the separating mechanism, 6, the conveying mechanism, 7, the electrical testing mechanism, 8, the electrical waste pushing mechanism, 9, the laser printer, 10, the material receiving box, 11, the supporting frame, 12, the pressure-resistant testing piece, 13, the paired optical sensor, 14, the testing cylinder, 15, the positioning cylinder, 16, the pushing cylinder, 17, the limit cylinder, 18, the housing, 19 and the material distributing cylinder, 20, a withstand voltage test station, 21, a pushing station, 22, a material stirring block, 23, a switching channel, 24, a feed inlet, 25, a bracket, 26, a polished rod, 27, a sliding block, 28, a driving piece, 29, a connecting rod, 30, a conveying channel, 31, a conveying motor, 32, a material stirring tooth, 33, an electrical test station, 34, a pushing station, 35, a conveying chain, 36, an electrical test seat, 37, a fixed block, 38, a clamping jaw cylinder, 39, a test piece, 40, a pushing cylinder, 41 and a semiconductor device.
Detailed Description
Example 1
The embodiment discloses test all-in-one, including withstand voltage test mechanism 1, separating mechanism 5, conveying mechanism 6, electrical property test mechanism 7 and electrical property waste product release mechanism 8, withstand voltage test mechanism 1 is used for carrying out withstand voltage test to semiconductor device 41, separating mechanism 5 is used for separating the qualified semiconductor device 41 of withstand voltage test to conveying mechanism 6, electrical property test mechanism 7 and electrical property waste product release mechanism 8 are all fixed on conveying mechanism 6, conveying mechanism 6 is used for carrying semiconductor device 41 to electrical property test mechanism 7 and electrical property waste product release mechanism 8 in proper order to output the qualified semiconductor device 41 of electrical property test, the output of conveying mechanism 6 still is provided with the receipts workbin 10 that is used for collecting the qualified semiconductor device 41 of test.
In this embodiment, the voltage withstanding test mechanism 1 includes a limiting slide 4, a voltage withstanding test assembly 2, and a voltage withstanding waste pushing assembly 3 for pushing out a semiconductor device 41 that fails in voltage withstanding test, where the limiting slide 4 is obliquely fixed, the high end of the limiting slide 4 is a feeding end of the semiconductor device 41, the low end is a discharging end, and the inclination angle of the limiting slide 4 is preferably such that the semiconductor device 41 can automatically slide from the high end to the low end. The limiting slide way 4 is provided with a pressure-resistant test station 20 and a pushing station 21, the pressure-resistant test assembly 2 and the pressure-resistant waste pushing assembly 3 are respectively fixed on the pressure-resistant test station 20 and the pushing station 21, and the structures of the pressure-resistant test assembly 2 and the pressure-resistant waste pushing assembly 3 are respectively as follows:
the withstand voltage test assembly 2 includes: the support frame 11, withstand voltage test piece 12, to light sensor 13, test cylinder 14 and location cylinder 15, support frame 11 is preferably portal frame structure, fixes on spacing slide 4 steadily, and the cylinder of test cylinder 14 is fixed on support frame 11, and withstand voltage test piece 12 is fixed on the piston rod of test cylinder 14, and withstand voltage test piece 12 is used for carrying out withstand voltage test to the semiconductor device 41 on the withstand voltage test station 20 through test cylinder 14 fixing in the withstand voltage test station 20 top of spacing slide 4. The positioning cylinder 15 is fixed below the limiting slide 4 for enabling the semiconductor device 41 in the limiting slide 4 to stay on the pressure-resistant test station 20 below the pressure-resistant test piece 12 when in pressure-resistant test. Specifically, during the pressure-proof test, the piston rod of the positioning cylinder 15 extends out from the bottom of the limiting slideway 4 to form a barrier for the semiconductor device 41, so that the semiconductor device 41 in the limiting slideway 4 stays on the pressure-proof test station 20 below the pressure-proof test piece 12, the piston rod of the positioning cylinder 15 retracts from the bottom of the limiting slideway 4 after the pressure-proof test, and the semiconductor device 41 automatically slides downwards after the pressure-proof test. The blocking and positioning function of the positioning cylinder 15 can also be realized by fixedly arranging a blocking piece on a piston rod of the positioning cylinder 15. The photosensor 13 is fixed on one side of the limit slideway 4 and used for detecting the semiconductor device 41 on the withstand voltage test station 20, and the photosensor 13 can be fixed on the supporting frame 11 and used for detecting whether the semiconductor device 41 is in place. When the semiconductor device 41 slides down onto the withstand voltage test station 20 during the withstand voltage test, the semiconductor device 41 is just positioned under the withstand voltage test piece 12, after the light sensor 13 detects that the semiconductor device 41 is positioned on the withstand voltage test station 20, the test cylinder 14 controls the withstand voltage test piece 12 to move downwards until the withstand voltage test piece 12 contacts with a pin to start the test, the withstand voltage test piece 12 resets after the test is finished, the piston rod of the positioning cylinder 15 retracts, the semiconductor device 41 after the withstand voltage test slides down to the pushing station 21, and after the semiconductor device 41 after the withstand voltage test slides down, the piston rod of the positioning cylinder 15 stretches out again to position the next batch of semiconductor devices 41 to be tested.
The pressure-resistant waste pushing assembly 3 comprises: the device comprises a pushing cylinder 16, a limiting cylinder 17 and a housing 18, wherein the limiting cylinder 17 is fixed below a limiting slide way 4 and used for enabling a semiconductor device 41 which is unqualified in pressure resistance test to stay on a pushing station 21 of the limiting slide way 4, and the effect and the structure of the limiting cylinder 17 are the same as those of a positioning cylinder 15; symmetrical notches are formed in two sides of the pushing station 21, the surfaces of the notches are level with the bottom surface of the semiconductor device 41, the housing 18 is arranged at the notches, the housing 18 just can cover the semiconductor device 41, the pushing cylinder 16 is fixed on one side of the limiting slide 4, and the pushing cylinder 16 is fixedly connected with the housing 18 and used for pushing out the unqualified semiconductor device 41 from the other notch. When the pressure-resistant testing assembly 2 detects that the semiconductor device 41 is unqualified in pressure-resistant testing in actual operation, the piston rod of the limiting cylinder 17 stretches out to enable the unqualified semiconductor device 41 to stay on the pushing station 21, then the pushing cylinder 16 controls the housing 18 to move towards the other notch, and the unqualified semiconductor device 41 is driven by the housing 18 to be taken out from the other notch. Of course, if the semiconductor device 41 detected by the withstand voltage test assembly 2 is all qualified, the limiting cylinder 17 does not limit the semiconductor device 41.
In this embodiment, the voltage withstand test assembly 2 may perform voltage withstand test on at least one semiconductor device 41 at a time, or may perform voltage withstand test on a plurality of semiconductor devices 41 at the same time, and accordingly, when performing voltage withstand test on a plurality of semiconductor devices 41, the number of the light sensors 13 is also plural. The present embodiment is preferably capable of performing a withstand voltage test on two semiconductor devices 41 at the same time. Further, when the pressure-resistant testing assembly 2 performs pressure-resistant testing on one or a plurality of semiconductor devices 41 at the same time, the number of the pressure-resistant waste pushing assemblies 3 may be one set or a plurality of sets, and preferably the number of the pressure-resistant waste pushing assemblies 3 is the same as the number of the pressure-resistant testing assembly 2 capable of testing the semiconductor devices 41. The withstand voltage test piece 12 is of an existing conventional structure and mainly comprises a positive electrode and a negative electrode, wherein the positive electrode is located in the limiting slide way 4, and the negative electrode is fixed on a piston rod of the test cylinder 14 and is used for being in contact with a pin of the semiconductor device 41 during testing. The withstand voltage test piece 12 adopts 5MM thick conductive rubber, the conductive rubber is fixed on the withstand voltage test piece 12, and the withstand voltage test piece is a customized workpiece.
In this embodiment, a feeding control assembly is disposed on the limiting slide 4, and the feeding control assembly includes two distributing cylinders 19 that are all fixed below the limiting slide 4, and the two distributing cylinders 19 control the feeding quantity of the semiconductor device 41 through the interval expansion fit of the piston rod, and the control principle of the distributing cylinders 19 is the same as that of the positioning cylinder 15. Further, the number of semiconductor devices 41 between the two distributing cylinders 19 is the same as the number of semiconductor devices 41 that can be tested by the pressure-resistant testing assembly 2 at one time, if the pressure-resistant testing assembly 2 can perform pressure-resistant testing on 4 semiconductor devices 41 at one time, the two distributing cylinders 19 control the 4 semiconductor devices 41 to enter the pressure-resistant testing station 20 at one time.
In this embodiment, the separating mechanism 5, the conveying mechanism 6, the electrical testing mechanism 7 and the electrical waste pushing mechanism 8 may be implemented by other conventional technologies. Furthermore, the conveying mechanism 6 is also provided with a laser printer 9, and the laser printer 9 is used for printing products which are tested to be qualified by the electrical testing mechanism 7, and the manual printing procedure is canceled.
In this embodiment, taking the withstand voltage test assembly 2 capable of simultaneously performing withstand voltage tests on 2 semiconductor devices 41 each time as an example, the working principle thereof is as follows:
after the two material distributing cylinders 19 control 2 semiconductor devices 41 to enter the testing station, when the optical sensor 13 detects that the semiconductor devices 41 are arranged on the pressure-resistant testing station 20, the testing cylinder 14 controls the pressure-resistant testing piece 12 to move downwards until the pressure-resistant testing piece 12 contacts with pins to start testing, after the testing is finished, the pressure-resistant testing piece 12 is reset, the piston rod of the positioning cylinder 15 is retracted, the semiconductor devices 41 after the pressure-resistant testing slide downwards, and after the semiconductor devices 41 after the pressure-resistant testing slide downwards, the piston rod of the positioning cylinder 15 stretches out again to position the next batch of semiconductor devices 41 to be tested. If the semiconductor device 41 after the withstand voltage test has unqualified, the piston rod of the limiting cylinder 17 extends to enable the unqualified semiconductor device 41 to stay on the pushing station 21, the unqualified semiconductor device 41 is pushed out of the notch by the cooperation of the pushing cylinder 16 and the housing 18, the pushing cylinder 16 and the housing 18 reset after pushing out, the piston rod of the limiting cylinder 17 retracts, and qualified products are output from the discharging end of the limiting slideway, so that the process is repeated.
Example 2
The embodiment discloses test all-in-one, including withstand voltage test mechanism 1, separating mechanism 5, conveying mechanism 6, electrical property test mechanism 7 and electrical property waste product release mechanism 8, withstand voltage test mechanism 1 is used for carrying out withstand voltage test to semiconductor device 41, separating mechanism 5 is used for separating the qualified semiconductor device 41 of withstand voltage test to conveying mechanism 6, electrical property test mechanism 7 and electrical property waste product release mechanism 8 are all fixed on conveying mechanism 6, conveying mechanism 6 is used for carrying semiconductor device 41 to electrical property test mechanism 7 and electrical property waste product release mechanism 8 in proper order to output the qualified semiconductor device 41 of electrical property test, the output of conveying mechanism 6 still is provided with the receipts workbin 10 that is used for collecting the qualified semiconductor device 41 of test.
In this embodiment, the voltage withstanding test mechanism 1 includes a limiting slide 4, a voltage withstanding test assembly 2, and a voltage withstanding waste pushing assembly 3 for pushing out a semiconductor device 41 that fails in voltage withstanding test, where the limiting slide 4 is obliquely fixed, the high end of the limiting slide 4 is a feeding end of the semiconductor device 41, the low end is a discharging end, and the inclination angle of the limiting slide 4 is preferably such that the semiconductor device 41 can automatically slide from the high end to the low end. The limiting slide way 4 is provided with a pressure-resistant test station 20 and a pushing station 21, the pressure-resistant test assembly 2 and the pressure-resistant waste pushing assembly 3 are respectively fixed on the pressure-resistant test station 20 and the pushing station 21, and the structures of the pressure-resistant test assembly 2 and the pressure-resistant waste pushing assembly 3 are respectively as follows:
the withstand voltage test assembly 2 includes: the support frame 11, withstand voltage test piece 12, to light sensor 13, test cylinder 14 and location cylinder 15, support frame 11 is preferably portal frame structure, fixes on spacing slide 4 steadily, and the cylinder of test cylinder 14 is fixed on support frame 11, and withstand voltage test piece 12 is fixed on the piston rod of test cylinder 14, and withstand voltage test piece 12 is used for carrying out withstand voltage test to the semiconductor device 41 on the withstand voltage test station 20 through test cylinder 14 fixing in the withstand voltage test station 20 top of spacing slide 4. The positioning cylinder 15 is fixed below the limiting slide 4 for enabling the semiconductor device 41 in the limiting slide 4 to stay on the pressure-resistant test station 20 below the pressure-resistant test piece 12 when in pressure-resistant test. Specifically, during the pressure-proof test, the piston rod of the positioning cylinder 15 extends out from the bottom of the limiting slideway 4 to form a barrier for the semiconductor device 41, so that the semiconductor device 41 in the limiting slideway 4 stays on the pressure-proof test station 20 below the pressure-proof test piece 12, the piston rod of the positioning cylinder 15 retracts from the bottom of the limiting slideway 4 after the pressure-proof test, and the semiconductor device 41 automatically slides downwards after the pressure-proof test. The blocking and positioning function of the positioning cylinder 15 can also be realized by fixedly arranging a blocking piece on a piston rod of the positioning cylinder 15. The photosensor 13 is fixed on one side of the limit slideway 4 and used for detecting the semiconductor device 41 on the withstand voltage test station 20, and the photosensor 13 can be fixed on the supporting frame 11 and used for detecting whether the semiconductor device 41 is in place.
The pressure-resistant waste pushing assembly 3 comprises: the device comprises a pushing cylinder 16, a limiting cylinder 17 and a housing 18, wherein the limiting cylinder 17 is fixed below a limiting slide way 4 and used for enabling a semiconductor device 41 which is unqualified in pressure resistance test to stay on a pushing station 21 of the limiting slide way 4, and the effect and the structure of the limiting cylinder 17 are the same as those of a positioning cylinder 15; symmetrical notches are formed in two sides of the pushing station 21, the surfaces of the notches are level with the bottom surface of the semiconductor device 41, the housing 18 is arranged at the notches, the housing 18 just can cover the semiconductor device 41, the pushing cylinder 16 is fixed on one side of the limiting slide 4, and the pushing cylinder 16 is fixedly connected with the housing 18 and used for pushing out the unqualified semiconductor device 41 from the other notch.
In this embodiment, the separating mechanism 5 includes a sliding component, a stirring block 22 and a switching channel 23, one end of the switching channel 23 is fixedly disposed at a discharge end of the pressure-resistant testing mechanism 1, the other end is fixedly disposed at one side of the conveying mechanism 6, a feed inlet 24 corresponding to the discharge end of the pressure-resistant testing mechanism 1 is formed in the switching channel 23, the semiconductor device 41 after the pressure-resistant test is qualified enters the switching channel 23 from a feed product, the stirring block 22 is movably disposed in the switching channel 23, the sliding component is fixedly connected with the stirring block 22, and the sliding component cooperates with the stirring block 22 to stir the semiconductor device 41 in the switching channel 23 onto the conveying mechanism 6.
Further, the sliding assembly comprises a support 25, a polish rod 26, a sliding block 27 and a driving piece 28, wherein the support 25 is fixed on one side of the switching channel 23, the polish rod 26 is fixed on the support 25, one end of the sliding block 27 is movably connected with the polish rod 26, the other end of the sliding block 27 is fixedly connected with the material shifting block 22, and the driving piece 28 is connected with the sliding block 27 through a connecting rod 29 and used for driving the sliding block 27 to reciprocate on the polish rod 26. In order to ensure that the semiconductor devices 41 on the transfer channel 23 can be fed into the transport mechanism 6 accurately and orderly, it is preferable that the driving member 28 and the transport mechanism 6 use the same power mechanism. The driving member 28 may be of a conventional structure including a chain, a chain plate, a shaft, etc., and the driving member 28 functions to enable the slider 27 to reciprocate back and forth on the polish rod 26 of the holder 25, thereby shifting the semiconductor devices 41 one by one onto the conveying mechanism 6.
In this embodiment, the conveying mechanism 6, the electrical testing mechanism 7 and the electrical waste pushing mechanism 8 may be implemented by other conventional technologies.
Example 3
The embodiment discloses test all-in-one, including withstand voltage test mechanism 1, separating mechanism 5, conveying mechanism 6, electrical property test mechanism 7 and electrical property waste product release mechanism 8, withstand voltage test mechanism 1 is used for carrying out withstand voltage test to semiconductor device 41, separating mechanism 5 is used for separating the qualified semiconductor device 41 of withstand voltage test to conveying mechanism 6, electrical property test mechanism 7 and electrical property waste product release mechanism 8 are all fixed on conveying mechanism 6, conveying mechanism 6 is used for carrying semiconductor device 41 to electrical property test mechanism 7 and electrical property waste product release mechanism 8 in proper order to output the qualified semiconductor device 41 of electrical property test, the output of conveying mechanism 6 still is provided with the receipts workbin 10 that is used for collecting the qualified semiconductor device 41 of test.
In this embodiment, the voltage withstanding test mechanism 1 includes a limiting slide 4, a voltage withstanding test assembly 2, and a voltage withstanding waste pushing assembly 3 for pushing out a semiconductor device 41 that fails in voltage withstanding test, where the limiting slide 4 is obliquely fixed, the high end of the limiting slide 4 is a feeding end of the semiconductor device 41, the low end is a discharging end, and the inclination angle of the limiting slide 4 is preferably such that the semiconductor device 41 can automatically slide from the high end to the low end. The limiting slide way 4 is provided with a pressure-resistant test station 20 and a pushing station 21, the pressure-resistant test assembly 2 and the pressure-resistant waste pushing assembly 3 are respectively fixed on the pressure-resistant test station 20 and the pushing station 21, and the structures of the pressure-resistant test assembly 2 and the pressure-resistant waste pushing assembly 3 are respectively as follows:
the withstand voltage test assembly 2 includes: the support frame 11, withstand voltage test piece 12, to light sensor 13, test cylinder 14 and location cylinder 15, support frame 11 is preferably portal frame structure, fixes on spacing slide 4 steadily, and the cylinder of test cylinder 14 is fixed on support frame 11, and withstand voltage test piece 12 is fixed on the piston rod of test cylinder 14, and withstand voltage test piece 12 is used for carrying out withstand voltage test to the semiconductor device 41 on the withstand voltage test station 20 through test cylinder 14 fixing in the withstand voltage test station 20 top of spacing slide 4. The positioning cylinder 15 is fixed below the limiting slide 4 for enabling the semiconductor device 41 in the limiting slide 4 to stay on the pressure-resistant test station 20 below the pressure-resistant test piece 12 when in pressure-resistant test. Specifically, during the pressure-proof test, the piston rod of the positioning cylinder 15 extends out from the bottom of the limiting slideway 4 to form a barrier for the semiconductor device 41, so that the semiconductor device 41 in the limiting slideway 4 stays on the pressure-proof test station 20 below the pressure-proof test piece 12, the piston rod of the positioning cylinder 15 retracts from the bottom of the limiting slideway 4 after the pressure-proof test, and the semiconductor device 41 automatically slides downwards after the pressure-proof test. The blocking and positioning function of the positioning cylinder 15 can also be realized by fixedly arranging a blocking piece on a piston rod of the positioning cylinder 15. The photosensor 13 is fixed on one side of the limit slideway 4 and used for detecting the semiconductor device 41 on the withstand voltage test station 20, and the photosensor 13 can be fixed on the supporting frame 11 and used for detecting whether the semiconductor device 41 is in place.
The pressure-resistant waste pushing assembly 3 comprises: the device comprises a pushing cylinder 16, a limiting cylinder 17 and a housing 18, wherein the limiting cylinder 17 is fixed below a limiting slide way 4 and used for enabling a semiconductor device 41 which is unqualified in pressure resistance test to stay on a pushing station 21 of the limiting slide way 4, and the effect and the structure of the limiting cylinder 17 are the same as those of a positioning cylinder 15; symmetrical notches are formed in two sides of the pushing station 21, the surfaces of the notches are level with the bottom surface of the semiconductor device 41, the housing 18 is arranged at the notches, the housing 18 just can cover the semiconductor device 41, the pushing cylinder 16 is fixed on one side of the limiting slide 4, and the pushing cylinder 16 is fixedly connected with the housing 18 and used for pushing out the unqualified semiconductor device 41 from the other notch.
In this embodiment, the separating mechanism 5 includes a sliding component, a stirring block 22 and a switching channel 23, one end of the switching channel 23 is fixedly disposed at a discharge end of the pressure-resistant testing mechanism 1, the other end is fixedly disposed at one side of the conveying mechanism 6, a feed inlet 24 corresponding to the discharge end of the pressure-resistant testing mechanism 1 is formed in the switching channel 23, the semiconductor device 41 after the pressure-resistant test is qualified enters the switching channel 23 from a feed product, the stirring block 22 is movably disposed in the switching channel 23, the sliding component is fixedly connected with the stirring block 22, and the sliding component cooperates with the stirring block 22 to stir the semiconductor device 41 in the switching channel 23 onto the conveying mechanism 6.
Further, the sliding assembly comprises a support 25, a polish rod 26, a sliding block 27 and a driving piece 28, wherein the support 25 is fixed on one side of the switching channel 23, the polish rod 26 is fixed on the support 25, one end of the sliding block 27 is movably connected with the polish rod 26, the other end of the sliding block 27 is fixedly connected with the material shifting block 22, and the driving piece 28 is connected with the sliding block 27 through a connecting rod 29 and used for driving the sliding block 27 to reciprocate on the polish rod 26. In order to ensure that the semiconductor devices 41 on the transfer channel 23 can be fed into the transport mechanism 6 accurately and orderly, it is preferable that the driving member 28 and the transport mechanism 6 use the same power mechanism. The driving member 28 may be of a conventional structure including a chain, a chain plate, a shaft, etc., and the driving member 28 functions to enable the slider 27 to reciprocate back and forth on the polish rod 26 of the holder 25, thereby shifting the semiconductor devices 41 one by one onto the conveying mechanism 6.
In this embodiment, the conveying mechanism 6 includes a conveying channel 30, a conveying chain 35 and a conveying motor 31, the conveying motor 31 is connected with the driving member 28 and the conveying chain 35, the conveying chain 35 is disposed along the length direction of the conveying channel 30, the conveying chain 35 is uniformly provided with material-shifting teeth 32, and the material-shifting teeth 32 are located in the conveying channel 30 and are used for shifting the semiconductor device 41. Specifically, a slot may be formed in the middle of the conveying channel 30 in the length direction, so that the material stirring teeth 32 on the conveying chain 35 are disposed in the conveying channel 30 to stir the semiconductor device 41 to move toward the electrical testing mechanism 7. Further, the conveying channel 30 is provided with an electrical testing station 33 and a pushing station 34, the electrical testing mechanism 7 is arranged above the electrical testing station 33 for performing electrical testing on the semiconductor device 41, and the electrical waste pushing mechanism 8 is arranged on the pushing station 34 for pushing out the semiconductor device 41 which fails the electrical testing from the conveying channel 30.
In this embodiment, the lateral movement direction of the semiconductor device 41 on the conveying mechanism 6 is opposite to the lateral movement direction of the semiconductor device 41 on the withstand voltage test mechanism 1, that is, if the semiconductor device 41 on the conveying mechanism 6 moves from right to left, the semiconductor device 41 on the conveying mechanism 6 moves from left to right after being turned by the separating mechanism 5.
In this embodiment, the electrical testing mechanism 7 includes an electrical testing seat 36, a fixing block 37 and two sets of clamping claw cylinders 38, the two sets of clamping claw cylinders 38 are symmetrically fixed above the conveying channel 30, the electrical testing seat 36 is provided with testing pieces 39, and the number of the testing pieces 39 on the electrical testing seat 36 is twice as many as the pins of the semiconductor device 41, i.e. each pin corresponds to two testing pieces 39. The electrical test socket 36 is secured between two sets of collet cylinders 38 by a securing block 37. The electrical test seat 36 is a customized workpiece, and the clamping jaw air cylinder 38 is used for driving the test piece 39 to act through the movement of the piston of the air cylinder, so that pins of the semiconductor device 41 are clamped when the clamping jaw air cylinder 38 clamps, and the contact performance of the test piece 39 and the pins of the semiconductor device 41 can be effectively ensured. The test piece on the electrical test seat is manufactured by adopting spring steel sheet wire cutting, bending and forming, and the test piece is good in contact and wear resistance on the electrical test performance by adopting the modified material, and the service life can reach 2000 ten thousand times. The electrical test seat test adopts a Kevin test method, and each semiconductor device pin corresponds to two test pieces. The effectiveness of the test is guaranteed, and the test device is perfectly matched with a test instrument.
In this embodiment, the electrical waste pushing mechanism 8 includes a pushing cylinder 40 and a positioning shell, symmetrical notches are formed on two sides of the pushing station 34, the positioning shell is disposed at the notch, the pushing cylinder 40 is fixed on one side of the conveying channel 30, and the pushing cylinder 40 is fixedly connected with the positioning shell and is used for pushing out the semiconductor device 41 that is unqualified in electrical test from the notch. The electrical waste pushing mechanism 8 and the pressure-resistant waste pushing assembly 3 have the same structure, the pushing cylinder 40 is the pushing cylinder 16, and the positioning shell is the housing 18.
In this embodiment, the number of the electrical test sockets 36 is at least one, preferably three, so that the electrical tests can be performed on 3 semiconductor devices 41 simultaneously. Further, the number of the pushing cylinders 40 and the number of the positioning shells in the electrical waste pushing mechanism 8 are at least three, and the first set and the second set of pushing cylinders 40 are used for pushing out different types of unqualified products respectively and classifying the unqualified products; while the third set of push-out cylinders 40 serves to repeatedly push out reject product, protecting the reject product from entering the reject product.
In this embodiment, taking the withstand voltage test assembly 2 capable of simultaneously performing withstand voltage tests on 2 semiconductor devices 41 each time as an example, the working principle thereof is as follows:
after the two material distributing cylinders 19 control 2 semiconductor devices 41 to enter the testing station, when the optical sensor 13 detects that the semiconductor devices 41 are arranged on the pressure-resistant testing station 20, the testing cylinder 14 controls the pressure-resistant testing piece 12 to move downwards until the pressure-resistant testing piece 12 contacts with pins to start testing, after the testing is finished, the pressure-resistant testing piece 12 is reset, the piston rod of the positioning cylinder 15 is retracted, the semiconductor devices 41 after the pressure-resistant testing slide downwards, and after the semiconductor devices 41 after the pressure-resistant testing slide downwards, the piston rod of the positioning cylinder 15 stretches out again to position the next batch of semiconductor devices 41 to be tested.
If the semiconductor device 41 after the withstand voltage test is unqualified, the piston rod of the limiting cylinder 17 extends out, so that the unqualified semiconductor device 41 stays on the pushing station 21, the unqualified semiconductor device 41 is pushed out from the notch by the cooperation of the pushing cylinder 16 and the housing 18, the pushing cylinder 16 and the housing 18 reset after pushing out, and the piston rod of the limiting cylinder 17 is retracted.
The qualified semiconductor device 41 continues to slide downwards and enters the transfer channel 23 through the feed inlet 24, and the semiconductor device 41 entering the transfer channel 23 enters the conveying channel 30 under the action of the sliding member and the material shifting block 22 and is positioned between the material shifting teeth 32 of the conveying chain 35. Then the semiconductor device 41 moves to the electrical test station 33 under the action of the material stirring teeth 32, at this time, the clamping jaw air cylinder 38 controls the test piece 39 to clamp pins of the semiconductor device 41 for electrical test, after the test is completed, the semiconductor device 41 continues to move to the push-out station 34, and if a product with an unacceptable electrical test exists, the push-out air cylinder 40 cooperates with the positioning shell to push out the unacceptable product in a classified manner. The qualified products continue to move forward under the drive of the material shifting teeth 32 until automatically falling into the material receiving box 10.
Example 4
This embodiment is substantially the same as embodiment 3, with the main differences that:
the number of the electrical testing mechanisms 7 is at least one, and the number of the electrical waste pushing mechanisms 8 is the same as the number of the electrical testing mechanisms 7. Further, the number of the electrical test mechanisms 7 is preferably two, so that the semiconductor device 41 is subjected to electrical test twice, i.e. the semiconductor device 41 passing the previous electrical test needs to be tested by the next electrical test mechanism 7, thereby ensuring the accuracy of the electrical test result.
In the invention, the pressure-resistant testing mechanism 1, the separating mechanism 5, the conveying mechanism 6, the electrical testing mechanism 7 and the electrical waste pushing mechanism 8 in the pressure-resistant testing integrated machine are all preferably controlled by a PLC controller in a unified way.
Claims (4)
1. Test all-in-one, its characterized in that: the device comprises a pressure-resistant testing mechanism (1), a separating mechanism (5), a conveying mechanism (6), an electrical testing mechanism (7) and an electrical waste pushing mechanism (8), wherein the pressure-resistant testing mechanism (1) is used for conducting pressure-resistant testing on a semiconductor device (41), the separating mechanism (5) is used for separating the semiconductor device (41) which is qualified in pressure-resistant testing to the conveying mechanism (6), the electrical testing mechanism (7) and the electrical waste pushing mechanism (8) are both fixed on the conveying mechanism (6), and the conveying mechanism (6) is used for sequentially conveying the semiconductor device (41) to the electrical testing mechanism (7) and the electrical waste pushing mechanism (8) and outputting the semiconductor device (41) which is qualified in electrical testing;
the pressure-resistant testing mechanism (1) comprises a limiting slide way (4) and a pressure-resistant testing assembly (2), wherein the limiting slide way (4) is obliquely fixed, the pressure-resistant testing assembly (2) comprises a supporting frame (11), a pressure-resistant testing piece (12), a pair of optical sensors (13), a testing cylinder (14) and a positioning cylinder (15), the supporting frame (11) is fixed on the limiting slide way (4), the testing cylinder (14) is fixed on the supporting frame (11), and the pressure-resistant testing piece (12) is fixed above the limiting slide way (4) through the testing cylinder (14) and is used for pressure-resistant testing of a semiconductor device (41); the positioning cylinder (15) is fixed below the limiting slide way (4) and used for enabling the semiconductor device (41) in the limiting slide way (4) to stay on the pressure-resistant test station (20) below the pressure-resistant test piece (12) during testing, and the photosensor (13) is fixed on one side of the limiting slide way (4) and used for detecting the semiconductor device (41) on the pressure-resistant test station (20);
the pressure-resistant testing mechanism (1) further comprises a pressure-resistant waste pushing assembly (3) for pushing out the semiconductor device (41) which is unqualified in pressure-resistant testing, the pressure-resistant waste pushing assembly (3) comprises a pushing cylinder (16), a limiting cylinder (17) and a housing (18), the limiting cylinder (17) is fixed below the limiting slide (4) and used for enabling the semiconductor device (41) which is unqualified in pressure-resistant testing to stay on a pushing station (21) of the limiting slide (4), symmetrical notches are formed in two sides of the pushing station (21), the housing (18) is arranged at the notches, the pushing cylinder (16) is fixed on one side of the limiting slide (4), and the pushing cylinder (16) is fixedly connected with the housing (18) and used for pushing out the unqualified semiconductor device (41) from the notches;
the separating mechanism (5) comprises a sliding component, a stirring block (22) and a switching channel (23), one end of the switching channel (23) is fixedly arranged at the discharge end of the pressure-resistant testing mechanism (1), the other end of the switching channel is fixedly arranged at one side of the conveying mechanism (6), a feed inlet (24) corresponding to the discharge end of the pressure-resistant testing mechanism (1) is formed in the switching channel (23), the stirring block (22) is movably arranged in the switching channel (23), the sliding component is fixedly connected with the stirring block (22), and the sliding component is matched with the stirring block (22) to stir the semiconductor device (41) in the switching channel (23) to the conveying mechanism (6);
the sliding assembly comprises a support (25), a polish rod (26), a sliding block (27) and a driving piece (28), wherein the support (25) is fixed on one side of the switching channel (23), the polish rod (26) is fixed on the support (25), one end of the sliding block (27) is movably connected with the polish rod (26), the other end of the sliding block is fixedly connected with the stirring block (22), and the driving piece (28) is connected with the sliding block (27) through a connecting rod (29) and used for driving the sliding block (27) to reciprocate on the polish rod (26);
the conveying mechanism (6) comprises a conveying channel (30), a conveying chain (35) and a conveying motor (31), the conveying motor (31) is connected with the conveying chain (35), the conveying chain (35) is arranged along the length direction of the conveying channel (30), material stirring teeth (32) are uniformly arranged on the conveying chain (35), and the material stirring teeth (32) are positioned in the conveying channel (30) and used for stirring a semiconductor device (41); an electrical test station (33) and a pushing-out station (34) are arranged on the conveying channel (30), the electrical test mechanism (7) is arranged above the electrical test station (33) and is used for performing electrical test on the semiconductor device (41), and the electrical waste pushing-out mechanism (8) is arranged on the pushing-out station (34) and is used for pushing out the semiconductor device (41) which is unqualified in electrical test from the conveying channel (30);
the lateral movement direction of the semiconductor device (41) on the conveying mechanism (6) is opposite to the lateral movement direction of the semiconductor device (41) on the withstand voltage testing mechanism (1).
2. The test-in-one machine of claim 1, wherein: the feeding control assembly is arranged on the limiting slide way (4) and comprises two material distributing cylinders (19) which are fixed below the limiting slide way (4), and the two material distributing cylinders (19) are used for controlling the feeding quantity of the semiconductor devices (41) through the interval telescopic fit of the piston rods.
3. The test-in-one machine of claim 1, wherein: the electrical property testing mechanism (7) comprises an electrical property testing seat (36), a fixing block (37) and two sets of clamping claw air cylinders (38), wherein the two sets of clamping claw air cylinders (38) are symmetrically fixed above the conveying channel (30), a testing piece (39) is arranged on the electrical property testing seat (36), and the electrical property testing seat (36) is fixed between the two sets of clamping claw air cylinders (38) through the fixing block (37).
4. The test-in-one machine of claim 1, wherein: the electrical waste pushing mechanism (8) comprises a pushing cylinder (40) and a positioning shell, symmetrical notches are formed in two sides of the pushing station (34), the positioning shell is arranged at the notch, the pushing cylinder (40) is fixed on one side of the conveying channel (30), and the pushing cylinder (40) is fixedly connected with the positioning shell and used for pushing out semiconductor devices (41) which are unqualified in electrical test from the notch.
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