CN209379472U - A kind of testing integrated machine - Google Patents
A kind of testing integrated machine Download PDFInfo
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- CN209379472U CN209379472U CN201822253988.9U CN201822253988U CN209379472U CN 209379472 U CN209379472 U CN 209379472U CN 201822253988 U CN201822253988 U CN 201822253988U CN 209379472 U CN209379472 U CN 209379472U
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Abstract
The utility model discloses a kind of testing integrated machines, including voltage-withstand test mechanism, separating mechanism, conveying mechanism, electrical testing mechanism and electrical waste product ejecting mechanism, the voltage-withstand test mechanism is used to carry out voltage-withstand test to semiconductor devices, the separating mechanism is for separating the semiconductor devices of voltage-withstand test qualification to conveying mechanism, the electrical testing mechanism and electrical waste product ejecting mechanism are each attached on conveying mechanism, semiconductor devices for being successively delivered to electrical testing mechanism and electrical waste product ejecting mechanism by the conveying mechanism, and the semiconductor devices of output electric property test passes.The utility model can disposably be automatically completed the pressure resistance and electrical testing of square semiconductor device, and testing efficiency is greatly improved.
Description
Technical field
The utility model relates to technical field of semiconductor device more particularly to a kind of testing integrated machines, are mainly used for rectangular
The voltage-withstand test of semiconductor devices and electrical testing.
Background technique
Semiconductor refers to material of the electric conductivity between conductor and insulator under room temperature, therefore, goes out in such device
It needs to carry out pressure resistance and electrical testing to such device when factory, but does not occur preferable test equipment also in the market.
The prior art that Chinese patent notification number is CN205229397U discloses a kind of bridge heap production on May 11st, 2016
Product pressure resistance insulation tester comprising the right side of test machine shell, the Hi-pot test machine is connected with Hi-pot test by conducting wire
Platform, the Hi-pot test platform include Hi-pot test area, positioning disk are connected in the Hi-pot test area, and lay on positioning disk
Bridge heap rectifier, the bridge heap rectifier top is connected with testing needle by the first attachment base, and the first attachment base passes through symmetrically
Two electric telescopic rods fixed with the second attachment base.The bridge heap product pressure resistance insulation tester is surveyed by connecting high pressure with conducting wire
Test-run a machine and Hi-pot test platform, so that bridge heap product can obtain the production of bridge heap under the co-operation of Hi-pot test machine and Hi-pot test platform
The parameter of pressure resistance and the insulation of product realizes the test of the pressure resistance and insulation to bridge heap product.But the patent cannot carry out bridge heap
Electrical testing, and there is also the defects such as testing efficiency is low.
Utility model content
The purpose of the utility model is to overcome the above-mentioned problems in the prior art, provide a kind of testing integrated machine,
The utility model can disposably be automatically completed the pressure resistance and electrical testing of square semiconductor device, and test is greatly improved
Efficiency.
To achieve the above object, the technical solution adopted in the utility model is as follows:
A kind of testing integrated machine, it is characterised in that: including voltage-withstand test mechanism, separating mechanism, conveying mechanism, electrical testing
Mechanism and electrical waste product ejecting mechanism, the voltage-withstand test mechanism are used to carry out voltage-withstand test, the separation to semiconductor devices
For separating the semiconductor devices of voltage-withstand test qualification to conveying mechanism, the electrical testing mechanism and electrical waste product are pushed away for mechanism
Mechanism is each attached on conveying mechanism out, the conveying mechanism for semiconductor devices is successively delivered to electrical testing mechanism and
Electrical waste product ejecting mechanism, and the semiconductor devices of output electric property test passes.
The voltage-withstand test mechanism includes limit slideway and voltage-withstand test component, and the limit slideway inclination is fixed, described
Voltage-withstand test component includes support frame, voltage-withstand test part, to optical sensor, tested cylinder and positioning cylinder, and support frame is fixed on
It limits on slideway, tested cylinder is fixed on the support frame, and voltage-withstand test part is fixed on above limit slideway by tested cylinder and is used
In to semiconductor devices progress voltage-withstand test；Positioning cylinder is fixed below limit slideway and limits in slideway for making when testing
Semiconductor devices rests on the voltage-withstand test station below voltage-withstand test part, is fixed on limit slideway side to optical sensor and uses
Semiconductor devices on detection voltage-withstand test station.
The voltage-withstand test mechanism further includes the pressure-resistant waste product for releasing the underproof semiconductor devices of voltage-withstand test
Pushing material component, the pressure resistance waste product pushing material component includes pusher cylinder, limiting cylinder and housing, and limiting cylinder is fixed on limit and slides
For making the underproof semiconductor devices of voltage-withstand test rest on the pusher station of limit slideway, pusher station two sides below road
Symmetrical notch is offered, housing is arranged in indentation, there, and pusher cylinder is fixed on limit slideway side, and pusher cylinder and housing are solid
Fixed connection is for releasing unqualified semiconductor devices from indentation, there.
Charging control assembly is provided on the limit slideway, the charging control assembly includes two and is each attached to limit
Material splitting cylinder below slideway, two material splitting cylinders control the charging number of semiconductor devices by the interval expansion fit of piston rod
Amount.
The separating mechanism includes slide assemblies, material toggling block and switching conduit, and the one end for conduit of transferring is fixed at resistance to
The discharge end of mechanism for testing is pressed, the other end is fixed at the side of conveying mechanism, offers on conduit of transferring and voltage-withstand test
The corresponding feed inlet of mechanism discharge end, material toggling block are movably arranged in switching conduit, and slide assemblies are fixedly connected with material toggling block,
Slide assemblies and material toggling block, which cooperate, dials to the semiconductor devices transferred in conduit on conveying mechanism.
The slide assemblies include bracket, polished rod, sliding block and actuator, and bracket is fixed on the side of switching conduit, polished rod
It is fixed on bracket, one end of sliding block is flexibly connected with polished rod, and the other end is fixedly connected with material toggling block, and actuator passes through connecting rod
It connect with sliding block for driving sliding block to move back and forth on polished rod.
The conveying mechanism includes that conveying conduit, conveyor chain and transport motor, transport motor are connect with conveyor chain, defeated
Length direction setting of the chain along conveying conduit is sent, material toggling tooth is evenly arranged on conveyor chain, material toggling tooth is located at conveying conduit
It is interior to be used to stir semiconductor devices；It is provided with electrical testing station on conveying conduit and releases station, the electrical testing mechanism
It is arranged above electrical testing station for carrying out electrical testing to semiconductor devices, the electrical property waste product ejecting mechanism setting exists
It releases on station for the underproof semiconductor devices of electrical testing to be released conveying conduit.
The transverse movement direction of the conveying mechanism semiconductor-on-insulator device and the cross of voltage-withstand test mechanism semiconductor-on-insulator device
It is opposite to the direction of motion.
The electrical testing mechanism includes electrical testing seat, fixed block and two sets of clamping jaw cylinders, and two sets of clamping jaw cylinders are symmetrical
It is fixed on above conveying conduit, is provided with testing piece on electrical testing seat, electrical testing seat is fixed on two sets of folders by fixed block
Between pawl cylinder.
The quantity of the electrical testing seat is at least a set of.
The electrical property waste product ejecting mechanism includes releasing cylinder and positioning shell, releases station two sides and offers symmetrical lack
Mouth, the setting of positioning shell release cylinder and are fixed on conveying conduit side, release cylinder is fixedly connected with positioning shell and is used in indentation, there
The underproof semiconductor devices of electrical testing is released from indentation, there.
The quantity that cylinder and positioning shell are released in the electrical property waste product ejecting mechanism is at least three sets.
The quantity of the electrical testing mechanism is at least a set of, the quantity and electrical testing of the electrical property waste product ejecting mechanism
The quantity of mechanism is identical.
The output end of the conveying mechanism is additionally provided with rewinding case.
Using utility model has the advantages that
1, a kind of testing integrated machine of pressure resistance described in the utility model include voltage-withstand test mechanism, separating mechanism, conveying mechanism,
Electrical testing mechanism and electrical waste product ejecting mechanism can automatically square shaped semiconductor devices be carried out by voltage-withstand test mechanism
Voltage-withstand test, and automatically releasing the underproof semiconductor devices of voltage-withstand test, can automatically and in an orderly manner by separating mechanism
The semiconductor devices of voltage-withstand test qualification is separated to conveying mechanism, it is by conveying mechanism and electrical testing mechanism and electrically useless
The cooperation of product ejecting mechanism automatically semiconductor devices to voltage-withstand test qualification can carry out electrical testing, and by electrical survey
It tries underproof semiconductor devices to release, finally obtains qualified product.The utility model being capable of the disposable side of being automatically completed
The pressure resistance and electrical testing of shape semiconductor devices, intelligence degree is higher, and testing efficiency is greatly improved.
2, the voltage-withstand test mechanism of the utility model includes limit slideway and voltage-withstand test component, wherein will limit slideway
Fixed structure is tilted, semiconductor devices can be made to carry out voltage-withstand test from high-end automatic slide-in voltage-withstand test component, be conducive to subtract
Few conveying energy consumption.And voltage-withstand test component includes support frame, voltage-withstand test part, to optical sensor, tested cylinder and positioning cylinder
Structure, then be conducive to carry out accurate voltage-withstand test to semiconductor devices.
3, the voltage-withstand test mechanism of the utility model further includes for releasing the underproof semiconductor devices of voltage-withstand test
Pressure-resistant waste product pushing material component, by pressure-resistant waste product pushing material component can automatically by substandard product accurately release limit slide
Road is conducive to promote testing efficiency.
4, the utility model is provided with the interval expansion fit for passing through piston rod by two material splitting cylinders on limit slideway
The charging control assembly of semiconductor devices charging quantity is controlled, which ensure that the accuracy of charging, be conducive to accurately control
Charging.
5, the separating mechanism of the utility model includes slide assemblies, material toggling block and switching conduit, using the separation of the structure
Mechanism can make the semiconductor devices auto-steering of voltage-withstand test qualification and enter conveying mechanism in an orderly manner.
6, the slide assemblies in the utility model include bracket, polished rod, sliding block and actuator, using the Slide Group of the structure
Part not only has the advantages that structure is simple, also has the advantages that semiconductor devices accurately to be dialed to conveying mechanism.
7, the conveying mechanism of the utility model includes conveying conduit, conveyor chain and transport motor, and conveyor chain is along conveying
The length direction of conduit is arranged, and material toggling tooth is evenly arranged on conveyor chain, and material toggling tooth is located in conveying conduit for stirring half
Conductor device；The structure make semiconductor devices by conveyor chain stir conveying conduit in travel forward automatically, can be effective
Ground and electrical testing mechanism and electrical waste product ejecting mechanism cooperate, and realize electrical testing and the substandard product of semiconductor devices
Automatic release, be conducive to improve testing efficiency.
8, the transverse movement direction of conveying mechanism semiconductor-on-insulator device and voltage-withstand test mechanism upper half are led in the utility model
The transverse movement of body device is contrary, which enables conveying mechanism that the side of voltage-withstand test mechanism is arranged in, not only
So that the structure of whole equipment is more compact, saving dimensional footprint is also helped.
9, the electrical testing mechanism of the utility model includes electrical testing seat, fixed block and two sets of clamping jaw cylinders, two sets of folders
Pawl cylinder is symmetrically fixed on above conveying conduit, and testing piece is provided on electrical testing seat, and electrical testing seat is solid by fixed block
It is scheduled between two sets of clamping jaw cylinders.The structure makes semiconductor devices to be measured in clamping jaw cylinder moved beneath, saves installation space.
And testing piece is then able to drive by the piston motion of clamping jaw cylinder and clamps semiconductor devices pin, be effectively ensured testing piece and
The contact performance of semiconductor devices pin.
10, the quantity of electrical testing seat is at least a set of in the utility model, can when the more set electrical testing seats of setting
Electrical testing is carried out to multiple semiconductor devices simultaneously, further promotes testing efficiency.
11, the electrical waste product ejecting mechanism of the utility model includes releasing cylinder and positioning shell, releases cylinder and positioning shell
It is fixedly connected for releasing the unqualified semiconductor devices of electrical testing from indentation, there, which can be automatically by substandard product
Conveying conduit is accurately released, is conducive to promote testing efficiency.
12, cylinder is released in the utility model and positions the quantity of shell and is at least three sets, wherein first set and second set
The effect for releasing cylinder is respectively to release different types of substandard product, classifies to substandard product；And third
The effect that set releases cylinder is to repeat to push away substandard product, and waste product is protected not enter in qualified products.
13, the quantity of electrical testing mechanism is at least a set of in the utility model, the quantity of electrical waste product ejecting mechanism with
The quantity of electrical testing mechanism is identical.It is existing when the quantity of electrical testing mechanism and electrical waste product ejecting mechanism is more sets
Conducive to promotion testing efficiency, and be conducive to be promoted the accuracy of test.
14, the utility model is provided with rewinding case in the output end of conveying mechanism, realizes qualified products by rewinding case
Automatic collection.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the structural schematic diagram of voltage-withstand test mechanism.
Fig. 3 is the structural schematic diagram of separating mechanism.
Fig. 4 is the structural schematic diagram of conveyor chain in conveying mechanism.
Fig. 5 is the structural schematic diagram of electrical testing mechanism.
Fig. 6 is the schematic perspective view of electrical testing mechanism and electrical waste product ejecting mechanism on conveying conduit.
Label in figure are as follows: 1, voltage-withstand test mechanism, 2, voltage-withstand test component, 3, pressure-resistant waste product pushing material component, 4, limit
Slideway, 5, separating mechanism, 6, conveying mechanism, 7, electrical testing mechanism, 8, electrical waste product ejecting mechanism, 9, radium-shine printer, 10,
Rewinding case, 11, support frame, 12, voltage-withstand test part, 13, to optical sensor, 14, tested cylinder, 15, positioning cylinder, 16, pusher
Cylinder, 17, limiting cylinder, 18, housing, 19, material splitting cylinder, 20, voltage-withstand test station, 21, pusher station, 22, material toggling block,
23, switching conduit, 24, feed inlet, 25, bracket, 26, polished rod, 27, sliding block, 28, actuator, 29, connecting rod, 30, delivery chute
Road, 31, transport motor, 32, material toggling tooth, 33, electrical testing station, 34, release station, 35, conveyor chain, 36, electrical testing
Seat, 37, fixed block, 38, clamping jaw cylinder, 39, testing piece, 40, release cylinder, 41, semiconductor devices.
Specific embodiment
Embodiment 1
Present embodiment discloses a kind of testing integrated machines, including voltage-withstand test mechanism 1, separating mechanism 5, conveying mechanism 6, electricity
Property mechanism for testing 7 and electrical waste product ejecting mechanism 8, the voltage-withstand test mechanism 1 is for carrying out pressure-resistant survey to semiconductor devices 41
Examination, the separating mechanism 5 are used for the separation of semiconductor devices 41 of voltage-withstand test qualification to conveying mechanism 6, the electrical testing
Mechanism 7 and electrical waste product ejecting mechanism 8 are each attached on conveying mechanism 6, the conveying mechanism 6 be used for by semiconductor devices 41 according to
It is secondary to be delivered to electrical testing mechanism 7 and electrical waste product ejecting mechanism 8, and the semiconductor devices 41 of output electric property test passes, institute
The output end for stating conveying mechanism 6 is additionally provided with the rewinding case 10 of the semiconductor devices 41 for collecting test passes.
In the present embodiment, the voltage-withstand test mechanism 1 includes limit slideway 4, voltage-withstand test component 2 and is used to survey pressure resistance
The pressure-resistant waste product pushing material component 3 that underproof semiconductor devices 41 is released is tried, the inclination of limit slideway 4 is fixed, and slideway 4 is limited
It is high-end be 41 feed end of semiconductor devices, low side is discharge end, limit slideway 4 tilt angle semiconductor devices 41 can be made
It can be preferred automatically from high-end to low side sliding.It is provided with voltage-withstand test station 20 and pusher station 21 on limit slideway 4, pressure resistance
Test suite 2 and pressure-resistant waste product pushing material component 3 are separately fixed on voltage-withstand test station 20 and pusher station 21, voltage-withstand test group
The structure difference of part 2 and pressure-resistant waste product pushing material component 3 is as follows:
The voltage-withstand test component 2 includes: support frame 11, voltage-withstand test part 12, to optical sensor 13,14 and of tested cylinder
Positioning cylinder 15, support frame 11 are preferably gantry frame structure, are firmly secured on limit slideway 4, the cylinder barrel of tested cylinder 14
It is fixed on support frame 11, voltage-withstand test part 12 is fixed on the piston rod of tested cylinder 14, and voltage-withstand test part 12 passes through test
Cylinder 14 is fixed on above the voltage-withstand test station 20 of limit slideway 4 for the semiconductor devices 41 on voltage-withstand test station 20
Carry out voltage-withstand test.Positioning cylinder 15 is fixed below limit slideway 4 and limits the semiconductor in slideway 4 for making when voltage-withstand test
Device 41 rests on the voltage-withstand test station 20 of 12 lower section of voltage-withstand test part.Specifically, positioning cylinder 15 when voltage-withstand test
Piston rod stretches out to form semiconductor devices 41 from the bottom of limit slideway 4 to be stopped, and makes to limit the semiconductor devices 41 in slideway 4
It rests on the voltage-withstand test station 20 of 12 lower section of voltage-withstand test part, the piston rod of positioning cylinder 15 is slided from limit after voltage-withstand test
The bottom in road 4 retracts, the automatic slide downward of semiconductor devices 41 after voltage-withstand test.The blocking positioning function of positioning cylinder 15
It can be realized by the way that barrier sheet is fixedly installed on the piston rod of positioning cylinder 15.Limit slideway 4 is fixed on to optical sensor 13
Side is used to detect the semiconductor devices 41 on voltage-withstand test station 20, can be fixed on support frame 11 and be used for optical sensor 13
Whether in place to detect semiconductor devices 41.When voltage-withstand test, when semiconductor devices 41 is slipped down on voltage-withstand test station 20, partly lead
Body device 41 is placed exactly in the lower section of voltage-withstand test part 12, detects on voltage-withstand test station 20 there is semiconductor to optical sensor 13
After device 41, tested cylinder 14 controls voltage-withstand test part 12 and moves downward, until voltage-withstand test part 12 and pin contact start are surveyed
Examination, voltage-withstand test part 12 resets after the completion of test, and the piston rod of positioning cylinder 15 retracts, the semiconductor devices 41 after voltage-withstand test
It is snapped down to pusher station 21, after the semiconductor devices 41 after voltage-withstand test glides, the piston rod of positioning cylinder 15 stretches out again
Next group semiconductor devices to be tested 41 is positioned.
The pressure resistance waste product pushing material component 3 includes: pusher cylinder 16, limiting cylinder 17 and housing 18, and limiting cylinder 17 is solid
It is scheduled below limit slideway 4 for making the underproof semiconductor devices 41 of voltage-withstand test rest on the pusher station of limit slideway 4
On 21, effect and structure of the effect and structure of limiting cylinder 17 with positioning cylinder 15 are all the same；21 two sides of pusher station open up
There is symmetrical notch, the surface of notch is equal with the bottom surface of semiconductor devices 41, and the setting of housing 18 is in indentation, there, and housing 18 is rigid
Semiconductor devices 41 can be covered well, and pusher cylinder 16 is fixed on limit 4 side of slideway, pusher cylinder 16 and the fixed company of housing 18
It connects for releasing unqualified semiconductor devices 41 from another indentation, there.In actual work, when voltage-withstand test component 2 is tested with
After the underproof semiconductor devices 41 of voltage-withstand test, the piston rod stretching of limiting cylinder 17 stops underproof semiconductor devices 41
It stays on pusher station 21, housing 18 is then controlled from pusher cylinder 16 and is moved to another notch, underproof semiconductor devices
41 just take out of under the drive of housing 18 from another notch.Certainly, if through voltage-withstand test component 2 detection after semiconductor devices 41
Qualified, then limiting cylinder 17 does not limit semiconductor devices 41.
In the present embodiment, the voltage-withstand test component 2 is primary at least can to carry out voltage-withstand test to a semiconductor devices 41,
Voltage-withstand test can also be carried out to multiple semiconductor devices 41 simultaneously, correspondingly, when carrying out pressure-resistant survey to multiple semiconductor devices 41
When examination, the quantity to optical sensor 13 is also multiple.The present embodiment is excellent to carry out pressure resistance to two semiconductor devices 41 simultaneously
Test.Further, resistance to when carrying out voltage-withstand test when voltage-withstand test component 2 to one or simultaneously to multiple semiconductor devices 41
It is also to cover that the quantity of pressure waste product pushing material component 3 can be a set of more, the quantity and voltage-withstand test of preferably pressure-resistant waste product pushing material component 3
The quantity that component 2 can test semiconductor devices 41 is identical.Wherein, voltage-withstand test part 12 is existing conventional structure, is mainly wrapped
Positive grade and cathode are included, positive to be located in limit slideway 4, cathode is fixed on the piston rod of tested cylinder 14 for when testing and partly
The contact of 41 pin of conductor device.Voltage-withstand test part 12 uses 5MM thickness conductive rubber, and conductive rubber is fixed on voltage-withstand test part 12
On, voltage-withstand test part is customization workpiece.
In the present embodiment, charging control assembly is provided on the limit slideway 4, the charging control assembly includes two
It is each attached to the material splitting cylinder 19 of 4 lower section of limit slideway, two material splitting cylinders 19 are controlled by the interval expansion fit of piston rod
The charging quantity of semiconductor devices 41, the control principle of material splitting cylinder 19 are identical as the principle of above-mentioned positioning cylinder 15.Further
, the quantity of semiconductor devices 41 and voltage-withstand test component 2 can disposably test semiconductor between two material splitting cylinders 19
The quantity of device 41 is identical, if voltage-withstand test component 2 disposably can carry out voltage-withstand test to 4 semiconductor devices 41, then
Just 4 semiconductor devices 41 of control disposably enter voltage-withstand test station 20 to two material splitting cylinders 19.
In the present embodiment, the separating mechanism 5, conveying mechanism 6, electrical testing mechanism 7 and electrical waste product ejecting mechanism 8 can
It is realized using existing other routine techniques.Further, radium-shine printer 9, radium-shine printer 9 are additionally provided on conveying mechanism 6
It is printed for the product to 7 test passes of electrical testing mechanism, cancels manual lettering process.
The present embodiment by taking voltage-withstand test component 2 can carry out voltage-withstand tests to 2 semiconductor devices 41 simultaneously every time as an example,
Its working principle is that:
2 semiconductor devices 41 first are controlled by two material splitting cylinders 19 and enter test station, are detected when to optical sensor 13
After having semiconductor devices 41 on to voltage-withstand test station 20, tested cylinder 14 controls voltage-withstand test part 12 and moves downward, Zhi Daonai
Test block 12 and pin contact start is pressed to test, voltage-withstand test part 12 resets after the completion of test, the piston rod contracting of positioning cylinder 15
It returns, 41 slide downward of semiconductor devices after voltage-withstand test, after the semiconductor devices 41 after voltage-withstand test glides, positioning cylinder
15 piston rod stretches out again positions next group semiconductor devices to be tested 41.If the semiconductor devices 41 after voltage-withstand test
Have it is underproof, then limiting cylinder 17 piston rod stretch out, rest on unqualified semiconductor devices 41 on pusher station 21, then
Underproof semiconductor devices 41 is released from indentation, there with pusher cylinder 16 and housing 18,16 He of pusher cylinder after release
Housing 18 resets, and the piston rod of limiting cylinder 17 retracts, and qualified product is heavy with this then from the discharge end output of limit slideway
It is multiple.
Embodiment 2
Present embodiment discloses a kind of testing integrated machines, including voltage-withstand test mechanism 1, separating mechanism 5, conveying mechanism 6, electricity
Property mechanism for testing 7 and electrical waste product ejecting mechanism 8, the voltage-withstand test mechanism 1 is for carrying out pressure-resistant survey to semiconductor devices 41
Examination, the separating mechanism 5 are used for the separation of semiconductor devices 41 of voltage-withstand test qualification to conveying mechanism 6, the electrical testing
Mechanism 7 and electrical waste product ejecting mechanism 8 are each attached on conveying mechanism 6, the conveying mechanism 6 be used for by semiconductor devices 41 according to
It is secondary to be delivered to electrical testing mechanism 7 and electrical waste product ejecting mechanism 8, and the semiconductor devices 41 of output electric property test passes, institute
The output end for stating conveying mechanism 6 is additionally provided with the rewinding case 10 of the semiconductor devices 41 for collecting test passes.
In the present embodiment, the voltage-withstand test mechanism 1 includes limit slideway 4, voltage-withstand test component 2 and is used to survey pressure resistance
The pressure-resistant waste product pushing material component 3 that underproof semiconductor devices 41 is released is tried, the inclination of limit slideway 4 is fixed, and slideway 4 is limited
It is high-end be 41 feed end of semiconductor devices, low side is discharge end, limit slideway 4 tilt angle semiconductor devices 41 can be made
It can be preferred automatically from high-end to low side sliding.It is provided with voltage-withstand test station 20 and pusher station 21 on limit slideway 4, pressure resistance
Test suite 2 and pressure-resistant waste product pushing material component 3 are separately fixed on voltage-withstand test station 20 and pusher station 21, voltage-withstand test group
The structure difference of part 2 and pressure-resistant waste product pushing material component 3 is as follows:
The voltage-withstand test component 2 includes: support frame 11, voltage-withstand test part 12, to optical sensor 13,14 and of tested cylinder
Positioning cylinder 15, support frame 11 are preferably gantry frame structure, are firmly secured on limit slideway 4, the cylinder barrel of tested cylinder 14
It is fixed on support frame 11, voltage-withstand test part 12 is fixed on the piston rod of tested cylinder 14, and voltage-withstand test part 12 passes through test
Cylinder 14 is fixed on above the voltage-withstand test station 20 of limit slideway 4 for the semiconductor devices 41 on voltage-withstand test station 20
Carry out voltage-withstand test.Positioning cylinder 15 is fixed below limit slideway 4 and limits the semiconductor in slideway 4 for making when voltage-withstand test
Device 41 rests on the voltage-withstand test station 20 of 12 lower section of voltage-withstand test part.Specifically, positioning cylinder 15 when voltage-withstand test
Piston rod stretches out to form semiconductor devices 41 from the bottom of limit slideway 4 to be stopped, and makes to limit the semiconductor devices 41 in slideway 4
It rests on the voltage-withstand test station 20 of 12 lower section of voltage-withstand test part, the piston rod of positioning cylinder 15 is slided from limit after voltage-withstand test
The bottom in road 4 retracts, the automatic slide downward of semiconductor devices 41 after voltage-withstand test.The blocking positioning function of positioning cylinder 15
It can be realized by the way that barrier sheet is fixedly installed on the piston rod of positioning cylinder 15.Limit slideway 4 is fixed on to optical sensor 13
Side is used to detect the semiconductor devices 41 on voltage-withstand test station 20, can be fixed on support frame 11 and be used for optical sensor 13
Whether in place to detect semiconductor devices 41.
The pressure resistance waste product pushing material component 3 includes: pusher cylinder 16, limiting cylinder 17 and housing 18, and limiting cylinder 17 is solid
It is scheduled below limit slideway 4 for making the underproof semiconductor devices 41 of voltage-withstand test rest on the pusher station of limit slideway 4
On 21, effect and structure of the effect and structure of limiting cylinder 17 with positioning cylinder 15 are all the same；21 two sides of pusher station open up
There is symmetrical notch, the surface of notch is equal with the bottom surface of semiconductor devices 41, and the setting of housing 18 is in indentation, there, and housing 18 is rigid
Semiconductor devices 41 can be covered well, and pusher cylinder 16 is fixed on limit 4 side of slideway, pusher cylinder 16 and the fixed company of housing 18
It connects for releasing unqualified semiconductor devices 41 from another indentation, there.
In the present embodiment, the separating mechanism 5 includes slide assemblies, material toggling block 22 and switching conduit 23, conduit 23 of transferring
One end be fixed at the discharge end of voltage-withstand test mechanism 1, the other end is fixed at the side of conveying mechanism 6, slot of transferring
Feed inlet 24 corresponding with 1 discharge end of voltage-withstand test mechanism, the semiconductor devices after voltage-withstand test is qualified are offered on road 23
41 enter switching conduit 23 from charging product, and material toggling block 22 is movably arranged in switching conduit 23, and slide assemblies and material toggling block 22 are solid
Fixed connection, slide assemblies and material toggling block 22, which cooperate, dials to the semiconductor devices 41 transferred in conduit 23 on conveying mechanism 6.
Further, the slide assemblies include bracket 25, polished rod 26, sliding block 27 and actuator 28, and bracket 25 is fixed on
Transfer the side of conduit 23, polished rod 26 is fixed on bracket 25, and one end of sliding block 27 is flexibly connected with polished rod 26, the other end and group
Material block 22 is fixedly connected, and actuator 28 is connect with sliding block 27 for driving sliding block 27 back and forth to transport on polished rod 26 by connecting rod 29
It is dynamic.Wherein, it is sent into conveying mechanism 6 in an orderly manner in order to guarantee the semiconductor devices 41 transferred on conduit 23 is accurate, preferably
Actuator 28 and conveying mechanism 6 use same power mechanism.Actuator 28 can be existing conventional structure comprising chain, chain drum
With axis etc., the effect of actuator 28 is that sliding block 27 is enable to move back and forth on the polished rod 26 of bracket 25, to will partly lead
Body device 41 singly dials on conveying mechanism 6.
In the present embodiment, the conveying mechanism 6, electrical testing mechanism 7 and electrical waste product ejecting mechanism 8 can be used it is existing its
Its routine techniques is realized.
Embodiment 3
Present embodiment discloses a kind of testing integrated machines, including voltage-withstand test mechanism 1, separating mechanism 5, conveying mechanism 6, electricity
Property mechanism for testing 7 and electrical waste product ejecting mechanism 8, the voltage-withstand test mechanism 1 is for carrying out pressure-resistant survey to semiconductor devices 41
Examination, the separating mechanism 5 are used for the separation of semiconductor devices 41 of voltage-withstand test qualification to conveying mechanism 6, the electrical testing
Mechanism 7 and electrical waste product ejecting mechanism 8 are each attached on conveying mechanism 6, the conveying mechanism 6 be used for by semiconductor devices 41 according to
It is secondary to be delivered to electrical testing mechanism 7 and electrical waste product ejecting mechanism 8, and the semiconductor devices 41 of output electric property test passes, institute
The output end for stating conveying mechanism 6 is additionally provided with the rewinding case 10 of the semiconductor devices 41 for collecting test passes.
In the present embodiment, the voltage-withstand test mechanism 1 includes limit slideway 4, voltage-withstand test component 2 and is used to survey pressure resistance
The pressure-resistant waste product pushing material component 3 that underproof semiconductor devices 41 is released is tried, the inclination of limit slideway 4 is fixed, and slideway 4 is limited
It is high-end be 41 feed end of semiconductor devices, low side is discharge end, limit slideway 4 tilt angle semiconductor devices 41 can be made
It can be preferred automatically from high-end to low side sliding.It is provided with voltage-withstand test station 20 and pusher station 21 on limit slideway 4, pressure resistance
Test suite 2 and pressure-resistant waste product pushing material component 3 are separately fixed on voltage-withstand test station 20 and pusher station 21, voltage-withstand test group
The structure difference of part 2 and pressure-resistant waste product pushing material component 3 is as follows:
The voltage-withstand test component 2 includes: support frame 11, voltage-withstand test part 12, to optical sensor 13,14 and of tested cylinder
Positioning cylinder 15, support frame 11 are preferably gantry frame structure, are firmly secured on limit slideway 4, the cylinder barrel of tested cylinder 14
It is fixed on support frame 11, voltage-withstand test part 12 is fixed on the piston rod of tested cylinder 14, and voltage-withstand test part 12 passes through test
Cylinder 14 is fixed on above the voltage-withstand test station 20 of limit slideway 4 for the semiconductor devices 41 on voltage-withstand test station 20
Carry out voltage-withstand test.Positioning cylinder 15 is fixed below limit slideway 4 and limits the semiconductor in slideway 4 for making when voltage-withstand test
Device 41 rests on the voltage-withstand test station 20 of 12 lower section of voltage-withstand test part.Specifically, positioning cylinder 15 when voltage-withstand test
Piston rod stretches out to form semiconductor devices 41 from the bottom of limit slideway 4 to be stopped, and makes to limit the semiconductor devices 41 in slideway 4
It rests on the voltage-withstand test station 20 of 12 lower section of voltage-withstand test part, the piston rod of positioning cylinder 15 is slided from limit after voltage-withstand test
The bottom in road 4 retracts, the automatic slide downward of semiconductor devices 41 after voltage-withstand test.The blocking positioning function of positioning cylinder 15
It can be realized by the way that barrier sheet is fixedly installed on the piston rod of positioning cylinder 15.Limit slideway 4 is fixed on to optical sensor 13
Side is used to detect the semiconductor devices 41 on voltage-withstand test station 20, can be fixed on support frame 11 and be used for optical sensor 13
Whether in place to detect semiconductor devices 41.
The pressure resistance waste product pushing material component 3 includes: pusher cylinder 16, limiting cylinder 17 and housing 18, and limiting cylinder 17 is solid
It is scheduled below limit slideway 4 for making the underproof semiconductor devices 41 of voltage-withstand test rest on the pusher station of limit slideway 4
On 21, effect and structure of the effect and structure of limiting cylinder 17 with positioning cylinder 15 are all the same；21 two sides of pusher station open up
There is symmetrical notch, the surface of notch is equal with the bottom surface of semiconductor devices 41, and the setting of housing 18 is in indentation, there, and housing 18 is rigid
Semiconductor devices 41 can be covered well, and pusher cylinder 16 is fixed on limit 4 side of slideway, pusher cylinder 16 and the fixed company of housing 18
It connects for releasing unqualified semiconductor devices 41 from another indentation, there.
In the present embodiment, the separating mechanism 5 includes slide assemblies, material toggling block 22 and switching conduit 23, conduit 23 of transferring
One end be fixed at the discharge end of voltage-withstand test mechanism 1, the other end is fixed at the side of conveying mechanism 6, slot of transferring
Feed inlet 24 corresponding with 1 discharge end of voltage-withstand test mechanism, the semiconductor devices after voltage-withstand test is qualified are offered on road 23
41 enter switching conduit 23 from charging product, and material toggling block 22 is movably arranged in switching conduit 23, and slide assemblies and material toggling block 22 are solid
Fixed connection, slide assemblies and material toggling block 22, which cooperate, dials to the semiconductor devices 41 transferred in conduit 23 on conveying mechanism 6.
Further, the slide assemblies include bracket 25, polished rod 26, sliding block 27 and actuator 28, and bracket 25 is fixed on
Transfer the side of conduit 23, polished rod 26 is fixed on bracket 25, and one end of sliding block 27 is flexibly connected with polished rod 26, the other end and group
Material block 22 is fixedly connected, and actuator 28 is connect with sliding block 27 for driving sliding block 27 back and forth to transport on polished rod 26 by connecting rod 29
It is dynamic.Wherein, it is sent into conveying mechanism 6 in an orderly manner in order to guarantee the semiconductor devices 41 transferred on conduit 23 is accurate, preferably
Actuator 28 and conveying mechanism 6 use same power mechanism.Actuator 28 can be existing conventional structure comprising chain, chain drum
With axis etc., the effect of actuator 28 is that sliding block 27 is enable to move back and forth on the polished rod 26 of bracket 25, to will partly lead
Body device 41 singly dials on conveying mechanism 6.
In the present embodiment, the conveying mechanism 6 includes conveying conduit 30, conveyor chain 35 and transport motor 31, transmission electricity
Machine 31 is connect with actuator 28 and conveyor chain 35 respectively, length direction setting of the conveyor chain 35 along conveying conduit 30, conveying
Material toggling tooth 32 is evenly arranged on chain 35, material toggling tooth 32 is located in conveying conduit 30 for stirring semiconductor devices 41.Specifically
, slot can be opened up in the middle part of the length direction in conveying conduit 30, in order to which the material toggling tooth 32 on conveyor chain 35 is arranged
The movement of 41 electrotropism mechanism for testing 7 of semiconductor devices is stirred in conveying conduit 30.Further, it conveys and is arranged on conduit 30
Have electrical testing station 33 and release station 34, the electrical testing mechanism 7 be arranged above electrical testing station 33 for pair
Semiconductor devices 41 carries out electrical testing, and the electrical property waste product ejecting mechanism 8, which is arranged, to be used on releasing station 34 by electrical survey
It tries underproof semiconductor devices 41 and releases conveying conduit 30.
In the present embodiment, on the transverse movement direction of the 6 semiconductor-on-insulator device 41 of conveying mechanism and voltage-withstand test mechanism 1
The transverse movement of semiconductor devices 41 is contrary, and even 6 semiconductor-on-insulator device 41 of conveying mechanism moves from right to left, then through dividing
After structure 5 of disembarking turns to, the semiconductor devices 41 on conveying mechanism 6 just moves from left to right.
In the present embodiment, the electrical testing mechanism 7 includes electrical testing seat 36, fixed block 37 and two sets of clamping jaw cylinders
38, two sets of clamping jaw cylinders 38 are symmetrically fixed on 30 top of conveying conduit, are provided with testing piece 39 on electrical testing seat 36, electrically survey
Try the quantity of testing piece 39 and twice of 41 pin number of semiconductor devices, i.e. two testing pieces of each pin correspondence on seat 36
39.Electrical testing seat 36 is fixed between two sets of clamping jaw cylinders 38 by fixed block 37.Electrical testing seat 36 is customization workpiece,
The effect of clamping jaw cylinder 38 is that clamping jaw cylinder is acted by cylinder piston movement drive testing piece 39, will when clamping jaw cylinder 38 clamps
41 pin of semiconductor devices is clamped, and can effectively ensure that the contact performance of 41 pin of testing piece 39 and semiconductor devices.Wherein, electric
Property test bench on testing piece made of spring steel plate wire cutting bending and molding, surveyed using material is changed in electrical testing performance
Test piece contact is good, and wear-resisting property is good, and the service life can reach 20,000,000 times.The test of electrical testing seat uses Kevin method of testing, often
Corresponding two testing pieces of a semiconductor devices pin.The validity for guaranteeing test, with test instrumentation perfect cooperation.
In the present embodiment, the electrical property waste product ejecting mechanism 8 includes releasing cylinder 40 and positioning shell, releases 34 two sides of station
Symmetrical notch is offered, the setting of positioning shell releases cylinder 40 and be fixed on conveying 30 side of conduit, release cylinder 40 in indentation, there
It is fixedly connected with positioning shell for releasing the underproof semiconductor devices 41 of electrical testing from indentation, there.Wherein, electrical waste product
Ejecting mechanism 8 is roughly the same with pressure-resistant waste product 3 structures of pushing material component, and releasing cylinder 40 is pusher cylinder 16, and positioning shell is
Housing 18.
The quantity of the present embodiment, the electrical testing seat 36 is at least a set of, and preferably three sets, it can while to 3
Semiconductor devices 41 carries out electrical testing.Further, cylinder 40 is released in electrical waste product ejecting mechanism 8 and position the quantity of shell
It is at least three sets, the effect of first set and second set of release cylinder 40 is respectively to push away different types of substandard product
Out, classify to substandard product；And the effect that third set releases cylinder 40 is to repeat to push away substandard product, protects waste product
It will not enter in qualified products.
The present embodiment by taking voltage-withstand test component 2 can carry out voltage-withstand tests to 2 semiconductor devices 41 simultaneously every time as an example,
Its working principle is that:
2 semiconductor devices 41 first are controlled by two material splitting cylinders 19 and enter test station, are detected when to optical sensor 13
After having semiconductor devices 41 on to voltage-withstand test station 20, tested cylinder 14 controls voltage-withstand test part 12 and moves downward, Zhi Daonai
Test block 12 and pin contact start is pressed to test, voltage-withstand test part 12 resets after the completion of test, the piston rod contracting of positioning cylinder 15
It returns, 41 slide downward of semiconductor devices after voltage-withstand test, after the semiconductor devices 41 after voltage-withstand test glides, positioning cylinder
15 piston rod stretches out again positions next group semiconductor devices to be tested 41.
If the semiconductor devices 41 after voltage-withstand test has underproof, the piston rod of limiting cylinder 17 stretches out, and makes not
Qualified semiconductor devices 41 rests on pusher station 21, then by underproof semiconductor with pusher cylinder 16 and housing 18
Device 41 is released from indentation, there, and pusher cylinder 16 and housing 18 reset after release, and the piston rod of limiting cylinder 17 retracts.
Semiconductor devices 41 after qualification continues slide downward, and enters switching conduit 23 through feed inlet 24, into switching
The semiconductor devices 41 of conduit 23 enters conveying conduit 30 under the action of sliding part and material toggling block 22, and is located at conveyor chain 35
Material toggling tooth 32 between.Then semiconductor devices 41 moves to electrical testing station 33 under the action of material toggling tooth 32, presss from both sides at this time
The pin that pawl cylinder 38 controls 39 clamping semiconductor device 41 of testing piece carries out electrical testing, and later half conductor device 41 is completed in test
Continue to the movement of station 34 is released, if there is the underproof product of electrical testing, releasing cylinder 40 and positioning shell cooperation will not conform to
The product classification of lattice is released.Qualified product then moves forward under the drive of material toggling tooth 32, until automatically falling into rewinding
In case 10.
Embodiment 4
The present embodiment is substantially the same manner as Example 3, and the main distinction is:
The quantity of the electrical testing mechanism 7 is at least a set of, the quantity and electrically survey of the electrical property waste product ejecting mechanism 8
The quantity of test-run a machine structure 7 is identical.Further, the quantity of the preferred electrical testing mechanism 7 of the present embodiment is two sets, in order to half-and-half lead
Body device 41 carries out electrical testing twice, i.e., the semiconductor devices 41 after premenstrual a set of electrical testing is qualified also needs a set of under
Electrical testing mechanism 7 is tested, and guarantees the accuracy of electrical test results.
Voltage-withstand test mechanism 1, separating mechanism 5, conveyer in the utility model, in a kind of testing integrated machine of pressure resistance
Structure 6, electrical testing mechanism 7 and electrical waste product ejecting mechanism 8 are preferably uniformly controlled by PLC controller.
Claims (10)
1. a kind of testing integrated machine, it is characterised in that: including voltage-withstand test mechanism (1), separating mechanism (5), conveying mechanism (6),
Electrical testing mechanism (7) and electrical waste product ejecting mechanism (8), the voltage-withstand test mechanism (1) are used for semiconductor devices (41)
Voltage-withstand test is carried out, the separating mechanism (5) is used for semiconductor devices (41) separation of voltage-withstand test qualification to conveying mechanism
(6), the electrical testing mechanism (7) and electrical waste product ejecting mechanism (8) are each attached on conveying mechanism (6), the conveyer
Structure (6) is used to successively for semiconductor devices (41) to be delivered to electrical testing mechanism (7) and electrical waste product ejecting mechanism (8), and defeated
The semiconductor devices (41) of electrical testing qualification out.
2. a kind of testing integrated machine as described in claim 1, it is characterised in that: the voltage-withstand test mechanism (1) includes limit
Slideway (4) and voltage-withstand test component (2), limit slideway (4) inclination are fixed, and the voltage-withstand test component (2) includes support
Frame (11), voltage-withstand test part (12), to optical sensor (13), tested cylinder (14) and positioning cylinder (15), support frame (11) is solid
It is scheduled in limit slideway (4), tested cylinder (14) is fixed on support frame (11), and voltage-withstand test part (12) passes through tested cylinder
(14) it is fixed on above limit slideway (4) for carrying out voltage-withstand test to semiconductor devices (41)；Positioning cylinder (15) is fixed on
For making the semiconductor devices (41) in limit slideway (4) rest on voltage-withstand test part (12) when testing below limit slideway (4)
On the voltage-withstand test station (20) of lower section, limit slideway (4) side is fixed on for detecting voltage-withstand test to optical sensor (13)
Semiconductor devices (41) on station (20).
3. a kind of testing integrated machine as claimed in claim 2, it is characterised in that: the voltage-withstand test mechanism (1) further includes using
In the pressure-resistant waste product pushing material component (3) for releasing the underproof semiconductor devices of voltage-withstand test (41), the pressure resistance waste product pusher
Component (3) includes pusher cylinder (16), limiting cylinder (17) and housing (18), and limiting cylinder (17) is fixed on limit slideway (4)
The pusher station (21) that lower section is used to that the underproof semiconductor devices of voltage-withstand test (41) to be made to rest on limit slideway (4), pushes away
Material station (21) two sides offer symmetrical notch, and housing (18) is arranged in indentation, there, and pusher cylinder (16) is fixed on limit and slides
Road (4) side, pusher cylinder (16) are fixedly connected for pushing away unqualified semiconductor devices (41) from indentation, there with housing (18)
Out.
4. a kind of testing integrated machine as claimed in claim 2, it is characterised in that: be provided with charging on the limit slideway (4)
Control assembly, the material splitting cylinders (19) that the charging control assembly is each attached to below limit slideway (4) including two, two points
Expect the charging quantity of interval expansion fit control semiconductor devices (41) of cylinder (19) by piston rod.
5. a kind of testing integrated machine as described in claim 1, it is characterised in that: the separating mechanism (5) include slide assemblies,
One end of material toggling block (22) and switching conduit (23), switching conduit (23) is fixed at the discharge end of voltage-withstand test mechanism (1),
The other end is fixed at the side of conveying mechanism (6), offers and voltage-withstand test mechanism (1) discharge end in switching conduit (23)
Corresponding feed inlet (24), material toggling block (22) are movably arranged in switching conduit (23), and slide assemblies and material toggling block (22) are solid
The semiconductor devices (41) transferred in conduit (23) is dialed to conveying mechanism by fixed connection, slide assemblies and material toggling block (22) cooperation
(6) on.
6. a kind of testing integrated machine as claimed in claim 5, it is characterised in that: the slide assemblies include bracket (25), light
Bar (26), sliding block (27) and actuator (28), bracket (25) are fixed on the side of switching conduit (23), and polished rod (26) is fixed on branch
On frame (25), one end of sliding block (27) is flexibly connected with polished rod (26), and the other end is fixedly connected with material toggling block (22), actuator
(28) it is connect with sliding block (27) for driving sliding block (27) to move back and forth on polished rod (26) by connecting rod (29).
7. a kind of testing integrated machine as described in any one of claim 1-6, it is characterised in that: conveying mechanism (6) packet
It includes conveying conduit (30), conveyor chain (35) and transport motor (31), transport motor (31) to connect with conveyor chain (35), convey
Chain (35) is arranged along the length direction of conveying conduit (30), is evenly arranged with material toggling tooth (32), material toggling on conveyor chain (35)
Tooth (32) is located in conveying conduit (30) for stirring semiconductor devices (41)；Electrical testing work is provided in conveying conduit (30)
Position (33) and release station (34), electrical testing mechanism (7) setting is above electrical testing station (33) for half-and-half leading
Body device (41) carries out electrical testing, and electrical property waste product ejecting mechanism (8) setting is used on releasing station (34) will be electrical
The semiconductor devices (41) of test failure releases conveying conduit (30).
8. a kind of testing integrated machine as claimed in claim 7, it is characterised in that: conveying mechanism (6) the semiconductor-on-insulator device
(41) transverse movement direction is contrary with the transverse movement of voltage-withstand test mechanism (1) semiconductor-on-insulator device (41).
9. a kind of testing integrated machine as claimed in claim 7, it is characterised in that: the electrical testing mechanism (7) includes electrically
Test bench (36), fixed block (37) and two sets of clamping jaw cylinders (38), two sets of clamping jaw cylinders (38) are symmetrically fixed on conveying conduit
(30) it above, is provided with testing piece (39) on electrical testing seat (36), electrical testing seat (36) is fixed on by fixed block (37)
Between two sets of clamping jaw cylinders (38).
10. a kind of testing integrated machine as claimed in claim 7, it is characterised in that: the electrical property waste product ejecting mechanism (8) includes
Cylinder (40) and positioning shell are released, station (34) two sides is released and offers symmetrical notch, the setting of positioning shell is released in indentation, there
Cylinder (40) is fixed on conveying conduit (30) side, releases cylinder (40) and is fixedly connected with positioning shell for not conforming to electrical testing
The semiconductor devices (41) of lattice is released from indentation, there.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822253988.9U CN209379472U (en) | 2018-12-29 | 2018-12-29 | A kind of testing integrated machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822253988.9U CN209379472U (en) | 2018-12-29 | 2018-12-29 | A kind of testing integrated machine |
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| Publication Number | Publication Date |
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| CN209379472U true CN209379472U (en) | 2019-09-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111375569A (en) * | 2018-12-29 | 2020-07-07 | 乐山希尔电子股份有限公司 | Test all-in-one machine |
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2018
- 2018-12-29 CN CN201822253988.9U patent/CN209379472U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111375569A (en) * | 2018-12-29 | 2020-07-07 | 乐山希尔电子股份有限公司 | Test all-in-one machine |
| CN111375569B (en) * | 2018-12-29 | 2023-08-01 | 乐山希尔电子股份有限公司 | Test all-in-one machine |
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