CN202344940U - Heat-radiating plate - Google Patents
Heat-radiating plate Download PDFInfo
- Publication number
- CN202344940U CN202344940U CN201120508592XU CN201120508592U CN202344940U CN 202344940 U CN202344940 U CN 202344940U CN 201120508592X U CN201120508592X U CN 201120508592XU CN 201120508592 U CN201120508592 U CN 201120508592U CN 202344940 U CN202344940 U CN 202344940U
- Authority
- CN
- China
- Prior art keywords
- heat
- radiating
- layer
- radiation
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat-radiating plate and belongs to the technical field of heat radiation. The heat-radiating plate comprises a base material layer and a composite heat-radiating layer; and the front surface of the base material layer is coated with the composite heat-radiating layer made of a heat-radiating material. The heat-radiating plate has the beneficial effects that the heat release is realized in a radiation manner through the heat-radiating material per se; the effect that a heat-conducting chain is formed on the surface of an iron plate is realized, so that the heat is quickly conducted out, and heat generated by an electronic product and equipment is quickly and effectively transmitted and radiated out; and the defects of high manufacturing cost, complicated process and bad heat radiation of the existing electronic product and the equipment are effectively overcome.
Description
Technical field
The utility model relates to a kind of iron plate, specially refers to a kind of heat radiating type sheet material.
Background technology
Along with science and technology progresses greatly day by day, following electronic product and Equipment Design trend will have following trend: compact, portable, do not take up space; High processing rate, high efficiency; Unit is multi-functional.But thing followed problem: the too small heat radiation in space is difficult for, and processing speed is accelerated, and temperature raises.Generally speaking, all the pigment on the general using steel plate dispels the heat to sun reflection of light on the market, but the effect of such coating heat radiation is unsatisfactory.High heat absorption japanning product is a kind of product that possesses heat radiation and electric conductivity on the market, generally adopting conventional manufacturing technique for painting dressing at the clad steel sheet upper surface and the back side, is coated with pretreatment layer; The back side second layer has applied the heat radiation coating; The upper surface second layer is a priming paint, and the 3rd layer is finish paint, but its preparation technology is comparatively complicated; Cost is higher relatively, and its thermal diffusivity has much room for improvement.
One Chinese patent application numbers 200620042239.6, a kind of heat radiation conduction color coated steel sheet comprises substrate and composite coating; Composite coating is for being coated with anti-fingerprint coating at the back side of substrate; The surface is coated with anti-fingerprint coating, priming paint and finish paint successively above that, and anti-fingerprint coating is an acrylate resin layer, but its structure is comparatively complicated; Manufacturing cost is higher, and radiating effect remains to be improved.
The material of heat radiation steel plate is for the development of miniature electronic product in the prior art; The particularly raising at full speed of miniature electronic product technology in recent years, increasing demand is strong, and especially the treatment effeciency of miniature electronic product is increasingly high; Cause electronic product and equipment self temperature to raise; If can't in time discharge heat, will cause shorten service life, bring puzzlement to the user.
Summary of the invention
1. invent the technical problem that will solve
Comparatively complicated to prior art heat radiation steel plate structure, manufacturing cost is higher, and radiating effect remains problems such as improvement; The utility model provides a kind of heat radiating type sheet material; It is high effectively to solve existing heat radiation iron plate manufacturing cost through the utility model, complex process, thermal diffusivity defect of bad.
2. technical scheme
A kind of heat radiating type sheet material comprises substrate layer and compound heat dissipating layer, and the front of said substrate layer scribbles the compound heat dissipating layer of being made up of compound heat sink material.
The material of substrate layer is iron plate, aluminium sheet or steel plate.
Compound heat dissipating layer is a black.
3. beneficial effect
(1) scribbles the compound heat dissipating layer of forming by compound heat radiation,, heat is dispelled the heat through radiation mode;
(2) see through heat sink material self and realize that heat discharges; Radiation mode and heat sink material self realizes that heat release is implemented in the iron plate surface and forms the heat conduction chain; Derive heat fast, the heat that electronic product and equipment produced is the most effectively transmitted dispel the heat away.
Description of drawings:
Fig. 1 is a kind of structural representation of heat radiating type sheet material.
Among the figure: the compound heat dissipating layer of 1-, 2-substrate layer.
The specific embodiment
Embodiment 1
A kind of heat radiating type sheet material as shown in Figure 1 comprises substrate layer 2 and compound heat dissipating layer 1, and the front of said substrate layer scribbles the compound heat dissipating layer of being made up of compound heat sink material 1.The material of substrate layer 2 is an iron plate.Compound heat dissipating layer is a black.Make the utility model compound heat sink material is uniformly coated on the iron plate surface,, make its curing through high-temperature baking; Farthest form the heat radiation network on the substrate layer surface; Enlarge area of dissipation, realize that through the heat sink material self of radiation mode and compound heat dissipating layer heat discharges, be implemented in the iron plate surface and form the heat conduction chain; Derive heat fast, the heat that electronic product and equipment produced is the most effectively transmitted dispel the heat away.
Embodiment 2
A kind of heat radiating type sheet material comprises substrate layer 2 and compound heat dissipating layer 1, and the front of said substrate layer scribbles the compound heat dissipating layer of being made up of compound heat sink material 1.The material of substrate layer 2 is an aluminium sheet.Compound heat dissipating layer is a black.When making the utility model compound heat sink material is uniformly coated on surface of aluminum plate,, makes its curing through high-temperature baking; Farthest form the heat radiation network on the substrate layer surface; Enlarge area of dissipation, realize that through the heat sink material self of radiation mode and compound heat dissipating layer heat discharges, be implemented in surface of aluminum plate and form the heat conduction chain; Derive heat fast, the heat that electronic product and equipment produced is the most effectively transmitted dispel the heat away.
Embodiment 3
A kind of heat radiating type sheet material comprises substrate layer 2 and compound heat dissipating layer 1, and the front of said substrate layer scribbles the compound heat dissipating layer of being made up of compound heat sink material 1.The material of substrate layer 2 is a steel plate.Compound heat dissipating layer is a black.Make the utility model compound heat sink material is uniformly coated on surface of steel plate,, make its curing through high-temperature baking; Farthest form the heat radiation network on the substrate layer surface; Enlarge area of dissipation, realize that through the heat sink material self of radiation mode and compound heat dissipating layer heat discharges, be implemented in surface of steel plate and form the heat conduction chain; Derive heat fast, the heat that electronic product and equipment produced is the most effectively transmitted dispel the heat away.
Claims (3)
1. heat radiating type sheet material, it is characterized in that: comprise substrate layer and compound heat dissipating layer, the front of said substrate layer scribbles the compound heat dissipating layer of being made up of compound heat sink material.
2. heat radiating type sheet material according to claim 1 is characterized in that: the material of said substrate layer is iron plate, aluminium sheet or steel plate.
3. heat radiating type sheet material according to claim 1 is characterized in that: said compound heat dissipating layer is a black.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120508592XU CN202344940U (en) | 2011-12-08 | 2011-12-08 | Heat-radiating plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120508592XU CN202344940U (en) | 2011-12-08 | 2011-12-08 | Heat-radiating plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202344940U true CN202344940U (en) | 2012-07-25 |
Family
ID=46533967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120508592XU Expired - Fee Related CN202344940U (en) | 2011-12-08 | 2011-12-08 | Heat-radiating plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202344940U (en) |
-
2011
- 2011-12-08 CN CN201120508592XU patent/CN202344940U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202941075U (en) | Combined-type graphite heat radiation sheet | |
| CN205920959U (en) | Temperature of air conditioner controller chip is reduced radiator and air conditioner | |
| CN105172259A (en) | Preparation method of high heat dissipation aluminum based copper clad laminate | |
| CN205705571U (en) | A kind of Graphene heat dissipation film | |
| CN202344940U (en) | Heat-radiating plate | |
| CN203618272U (en) | Novel thermal insulating structure | |
| CN109266178A (en) | A kind of LED light source heat radiation coating and its application | |
| CN202941076U (en) | Graphite heat radiation sheet for electronic product | |
| CN202463051U (en) | Heat dissipation type composite aluminum sheet | |
| CN202941077U (en) | Graphite heat radiation structure for electronic product | |
| CN204160826U (en) | A kind of Novel heat-conducting material structure | |
| CN201741694U (en) | Ceramic radiator | |
| CN201066978Y (en) | Multi-layer heat radiator | |
| CN204936365U (en) | High heat radiating metal aluminum-based copper-clad plate | |
| CN206472437U (en) | A kind of car navigation device monoblock type fin | |
| CN201294702Y (en) | Radiating module structure | |
| CN104296111B (en) | Heat dissipation material and application method thereof | |
| CN209710564U (en) | A kind of new radiator | |
| CN202759721U (en) | Nanometer silicon heat radiation structure | |
| CN205335272U (en) | Heat dissipation type solar energy component | |
| CN204494339U (en) | A kind of backlight module conducting strip | |
| CN207252049U (en) | The housing transfer thermal dispersant coatings structure of portable electronic devices | |
| CN208776645U (en) | A kind of heat-conducting glue band | |
| CN205488165U (en) | Novel photovoltaic module | |
| CN206402530U (en) | A kind of low-power consumption type printed circuit board (PCB) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 210000 Jiangsu city of Nanjing province science and Technology Innovation Park kylin (eco technology city) Qi East Road No. 666 Patentee after: Fang Yuyuan Address before: Taiwan Chinese YenCheng District of Kaohsiung city to teach at Street No. 41 in the 5 floor of benevolence Patentee before: Fang Yuyuan |
|
| ASS | Succession or assignment of patent right |
Owner name: JIANGSU YUANJING ELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FANG YUYUAN Effective date: 20130105 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20130105 Address after: 210000 Jiangsu city of Nanjing province science and Technology Innovation Park kylin (eco technology city) Qi East Road No. 666 Patentee after: Jiangsu Yuanjing Electronic Technology Co., Ltd. Address before: 210000 Jiangsu city of Nanjing province science and Technology Innovation Park kylin (eco technology city) Qi East Road No. 666 Patentee before: Fang Yuyuan |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Termination date: 20141208 |
|
| EXPY | Termination of patent right or utility model |