CN202332822U

CN202332822U - SOT(Small Out-Line Transistor)23 transistor

Info

Publication number: CN202332822U
Application number: CN2011204729972U
Authority: CN
Inventors: 罗天秀; 樊增勇
Original assignee: Chengdu Advanced Power Semiconductor Co Ltd
Current assignee: Chengdu Advanced Power Semiconductor Co Ltd
Priority date: 2011-11-24
Filing date: 2011-11-24
Publication date: 2012-07-11
Anticipated expiration: 2021-11-24

Abstract

The utility model relates to the fields of transistor semiconductors, in particular to an SOT23 transistor. The SOT23 transistor comprises a plastic-sealed body, wherein four corners of the upper surface and four corners of the lower surface of the plastic-sealed body are rounded corners; the radius R1of each rounded corner is 0.2mm; and four connecting corners of the upper surface and other sides of the plastic-sealed body and four connecting corners of the lower surface and other lateral surfaces of the plastic-sealed body are respectively rounded corners; and the radius R2 of each rounded corner is 0.15mm. According to the SOT23 transistor disclosed by the utility model, the adhesive power between the die and the plastic-sealed body is reduced, the demoulding efficiency of the die is improved, the processing difficulty is reduced and the processing cost is reduced; and in addition, products have excellent electrical performances, so that the demand of customers is met.

Description

A kind of SOT23 transistor

Technical field

The utility model relates to the transistor semiconductor field, particularly a kind of SOT23 transistor.

Background technology

SOT (Small Out-Line Transistor) small outline transistor, SOT23 is a kind of surface-pasted packing forms, its fillet R value is related to product quality and production efficiency.The fillet size design of SOT23 product directly influences Shooting Technique and product electric property parameter.Fillet design load R increases can reduce the Mould Machining cost, reduces the adhesion of plastic-sealed body and mould, improves release property; But fillet is excessive, can reduce back operation typewriting coded area, and reduce the distance of built-in chip to the plastic-sealed body surface, and the product unit for electrical property parameters descends.At present in SOT23 package (encapsulation) fillet design process, ubiquity fillet R is too small to influence that the demoulding and R excessively cause that upper surface can print that area is little, plastic packaging material contains wall and crosses thin and problem such as electrical quantity difficulty up to standard occurs.Tradition SOT23 plastic-sealed body upper and lower surperficial fillet R=0.15 ㎜, upper and lower surface and side be connected fillet R=0.10 ㎜.In the production process of reality, because the design of traditional fillet is too small, form the stress concentration phenomenon at the fillet place, adhesion is big between plastic packaging material and the mould.When the plastic-sealed body on the whole piece framework from mould the inside during the demoulding simultaneously, total knockout press is excessive, simultaneously, plastic packaging material is prone to break away from product surface at the fillet place, is bonded on the mould, forms mold sticking.

The utility model content

The purpose of the utility model is: the problems referred to above to prior art exists, a kind of adhesion that reduces mould and plastic-sealed body is provided, and improve the SOT23 transistor of mold releasability property.

To achieve these goals, the technical scheme of the utility model employing is:

A kind of SOT23 transistor comprises plastic-sealed body, and 4 angles of said plastic-sealed body upper surface and 4 angles of lower surface are fillet, and radius of corner is R1=0.2 ㎜; 4 joint angles of plastic-sealed body upper surface and its side and 4 joint angles of plastic-sealed body lower surface and its side are fillet, and radius of corner is R2=0.15 ㎜.

In sum; Owing to adopted technique scheme; The beneficial effect of the utility model is: the SOT23 transistor of the utility model; Reduce the adhesion of mould and plastic-sealed body, improved mold releasability property, reduced ratio of defects such as Chipped Package, Break Package, CRACK PACKAGE, Bent Strip; Only need clear mould once every day, prolonged the production time; Reduced difficulty of processing, cut down finished cost; Good through the test products unit for electrical property parameters, meet customer need.

Description of drawings

Fig. 1 is a SOT23 transistor front view.

Fig. 2 is a SOT23 transistor vertical view.

Fig. 3 is a SOT23 transistor upward view.

Wherein, the upper and lower surperficial radius of corner of R1-plastic-sealed body, the radius of corner that is connected of the upper and lower surface of R2-plastic-sealed body and side.

Embodiment

Below in conjunction with accompanying drawing, the utility model is done detailed explanation.

For the purpose, technical scheme and the advantage that make the utility model is clearer,, the utility model is further elaborated below in conjunction with accompanying drawing and embodiment.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.

Embodiment 1

Like Fig. 1, Fig. 2 and shown in Figure 3, a kind of SOT23 transistor comprises plastic-sealed body; 4 joint angles of said envelope body upper surface and its side are fillet; And radius of corner is R2=0.15 ㎜, and 4 joint angles of plastic-sealed body lower surface and its side are fillet, and radius of corner is R2=0.15 ㎜.4 angles of plastic-sealed body upper surface and 4 angles of plastic-sealed body lower surface are fillet, and radius of corner is R1=0.2 ㎜.

Through a large amount of contrived experiments, above-mentioned radius of corner value is the optimum value to the SOT23 product of TOWA mould machine design.Through test, the product unit for electrical property parameters is good, meets customer need.The SOT23 transistor of the utility model has reduced the adhesion of mould and plastic-sealed body, has improved mold releasability property; Reduced difficulty of processing, cut down finished cost.

The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection range of the utility model.

Claims

1. a SOT23 transistor comprises plastic-sealed body, it is characterized in that, 4 angles of said plastic-sealed body upper surface and 4 angles of lower surface are fillet, and radius of corner is R1=0.2 ㎜; 4 joint angles of plastic-sealed body upper surface and its side and 4 joint angles of plastic-sealed body lower surface and its side are fillet, and radius of corner is R2=0.15 ㎜.