CN202308024U - 适用于贴片式led固晶机的万能夹具 - Google Patents
适用于贴片式led固晶机的万能夹具 Download PDFInfo
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- CN202308024U CN202308024U CN2011204430458U CN201120443045U CN202308024U CN 202308024 U CN202308024 U CN 202308024U CN 2011204430458 U CN2011204430458 U CN 2011204430458U CN 201120443045 U CN201120443045 U CN 201120443045U CN 202308024 U CN202308024 U CN 202308024U
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- 239000007787 solid Substances 0.000 claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000013078 crystal Substances 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000003908 quality control method Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010068 moulding (rubber) Methods 0.000 description 1
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CN2011204430458U CN202308024U (zh) | 2011-11-10 | 2011-11-10 | 适用于贴片式led固晶机的万能夹具 |
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CN2011204430458U CN202308024U (zh) | 2011-11-10 | 2011-11-10 | 适用于贴片式led固晶机的万能夹具 |
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CN202308024U true CN202308024U (zh) | 2012-07-04 |
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CN2011204430458U Expired - Lifetime CN202308024U (zh) | 2011-11-10 | 2011-11-10 | 适用于贴片式led固晶机的万能夹具 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102368522A (zh) * | 2011-11-10 | 2012-03-07 | 东莞市凯格精密机械有限公司 | 适用于贴片式led固晶机的万能夹具 |
CN104810437A (zh) * | 2015-03-31 | 2015-07-29 | 长治市华光光电科技集团有限公司 | Led封装试配比夹具 |
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2011
- 2011-11-10 CN CN2011204430458U patent/CN202308024U/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102368522A (zh) * | 2011-11-10 | 2012-03-07 | 东莞市凯格精密机械有限公司 | 适用于贴片式led固晶机的万能夹具 |
CN104810437A (zh) * | 2015-03-31 | 2015-07-29 | 长治市华光光电科技集团有限公司 | Led封装试配比夹具 |
CN104810437B (zh) * | 2015-03-31 | 2018-03-30 | 长治市华光光电科技集团有限公司 | Led封装试配比夹具 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Universal clamp suitable for surface mount type LED die bonder Effective date of registration: 20160505 Granted publication date: 20120704 Pledgee: China Co truction Bank Corp Dongguan branch Pledgor: Dongguan Kaige Precision Machine Co., Ltd. Registration number: 2016990000358 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20170622 Granted publication date: 20120704 Pledgee: China Co truction Bank Corp Dongguan branch Pledgor: Dongguan Kaige Precision Machine Co., Ltd. Registration number: 2016990000358 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Universal clamp suitable for surface mount type LED die bonder Effective date of registration: 20170706 Granted publication date: 20120704 Pledgee: China Co truction Bank Corp Dongguan branch Pledgor: Dongguan Kaige Precision Machine Co., Ltd. Registration number: 2017990000610 |
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Address after: 523000 2 Sha long road, Dongcheng Street, Dongguan, Guangdong Patentee after: Dongguan Kaige Precision Machinery Co., Ltd Address before: 523000 No. 24 Guangming Avenue, Dongguan, Guangdong, Dongcheng District Patentee before: Dongguan Kaige Precision Machine Co., Ltd. |
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Date of cancellation: 20200605 Granted publication date: 20120704 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: GKG PRECISION MACHINE Co.,Ltd. Registration number: 2017990000610 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
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