CN104810437A - Led封装试配比夹具 - Google Patents
Led封装试配比夹具 Download PDFInfo
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- CN104810437A CN104810437A CN201510147157.1A CN201510147157A CN104810437A CN 104810437 A CN104810437 A CN 104810437A CN 201510147157 A CN201510147157 A CN 201510147157A CN 104810437 A CN104810437 A CN 104810437A
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- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000004020 conductor Substances 0.000 claims abstract description 18
- 239000012212 insulator Substances 0.000 claims abstract description 4
- 239000012780 transparent material Substances 0.000 claims abstract description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 4
- 239000000969 carrier Substances 0.000 abstract description 2
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- 239000002131 composite material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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Abstract
本发明LED封装试配比夹具,属于LED封装技术领域;提供了一种采用不需用胶水,且荧光粉可以回收利用的LED封装试配比夹具;采用的技术方案为:LED封装试配比夹具,底盘和外罩均为不透光的绝缘体材质,外罩为轴向开有通孔的柱体,外罩竖直设置在底盘上,外罩的侧面在竖直方向上开设有多个水平的空格,空格与外罩的轴向通孔相连通,空格内均活动匹配插装有薄片载体,薄片载体的中间设置有用于盛装荧光粉的凹槽,凹槽的内径与外罩通孔的内径相等,凹槽的材质为透明材质,底座上还设置有用于安装固定LED的支座,支座位于外罩的通孔内,支座通过设置在底盘上的导电体与外界电源电连接;本发明广泛应用于LED封装领域。
Description
技术领域
本发明LED封装试配比夹具,属于LED封装技术领域。
背景技术
在现有的LED(即发光二极管)封装领域,试配比时,采用荧光粉和胶水混合后或直接将荧光粉涂布于LED上,在涂抹过程中荧光粉和胶水浪费严重。
发明内容
本发明克服了现有技术存在的不足,提供了一种采用不需用胶水,且荧光粉可以回收利用的LED封装试配比夹具。
为了解决上述技术问题,本发明采用的技术方案为:LED封装试配比夹具,包括底盘和外罩,所述底盘和外罩均为不透光的绝缘体材质,所述外罩为轴向开有通孔的柱体,所述外罩竖直设置在底盘上,所述外罩的侧面在竖直方向上开设有多个水平的空格,所述空格与外罩的轴向通孔相连通,所述空格内均活动匹配插装有薄片载体,所述薄片载体的中间设置有用于盛装荧光粉的凹槽,所述凹槽的内径与外罩通孔的内径相等,所述凹槽的材质为透明材质,所述底座上还设置有用于安装固定LED的支座,所述支座位于外罩的通孔内,所述支座通过设置在底盘上的导电体与外界电源电连接。
优选地,所述导电体位于底盘的上部。
优选地,所述导电体位于外罩的外部。
优选地,所述导电体和支座之间设置有紧固弹簧。
优选地,所述支座的外侧设置有夹具,所述夹具用于将支座夹持固定,所述紧固弹簧设置在夹具和导电体。
本发明与现有技术相比具有的有益效果是:本发明采用荧光粉分层混合理念,使从LED发出的光可以通过多层含有荧光粉的透明薄片载体,其中每层载体的荧光粉可以一样也可以不一样,但各层薄片载体的荧光粉必须一样,以便于回收利用,激发荧光粉得到所需要的光,本发明中荧光粉可以回收利用,节约资源,降低成本,通过对多层薄片载体中不同薄片载体中的荧光粉定量划分,可以提高试配比的速度。
附图说明
下面结合附图对本发明做进一步的说明。
图1为本发明的结构示意图。
图2为本发明中底盘和外罩的安装示意图。
图3为本发明的使用状态图。
图4为本发明中薄片载体的结构示意图。
图中,1为底盘、2为外罩、3为空格、4为薄片载体、5为凹槽、6为支座、7为导电体、8为紧固弹簧、9为夹具。
具体实施方式
如图1~图4所示,本发明LED封装试配比夹具,包括底盘1和外罩2,所述底盘1和外罩2均为不透光的绝缘体材质,所述外罩2为轴向开有通孔的柱体,所述外罩2竖直设置在底盘1上,所述外罩2的侧面在竖直方向上开设有多个水平的空格3,所述空格3与外罩2的轴向通孔相连通,所述空格3内均活动匹配插装有薄片载体4,所述薄片载体4的中间设置有用于盛装荧光粉的凹槽5,所述凹槽5的内径与外罩2通孔的内径相等,所述凹槽5的材质为透明材质,所述底座1上还设置有用于安装固定LED的支座6,所述支座6位于外罩2的通孔内,所述支座6通过设置在底盘1上的导电体7与外界电源电连接。
所述导电体7位于底盘1的上部。
所述导电体7位于外罩2的外部。
所述导电体7和支座6之间设置有紧固弹簧8。
所述支座6的外侧设置有夹具9,所述夹具9用于将支座6夹持固定,所述紧固弹簧8设置在夹具9和导电体7。
本发明的使用流程为:在电子称上将定量荧光粉加入薄片载体,再将固有LED的支座固定在夹具底部的底盘1上,在导电体7处接上合适的电压,将LED点亮,通过插入载有不同含量或型号的荧光粉薄片载体4,就可以在顶部得到不同的光。本发明的重点在于荧光粉能回收再利用。
本发明采用荧光粉分层混合理念,使从LED发出的光可以通过多层含有荧光粉的透明薄片载体,其中每层载体的荧光粉可以一样也可以不一样,但各层薄片载体的荧光粉必须一样,以便于回收利用,激发荧光粉得到所需要的光,本发明中荧光粉可以回收利用,节约资源,降低成本,通过对多层薄片载体中不同薄片载体中的荧光粉定量划分,可以提高试配比的速度。例如:八个载体分别包含0.001 g,0.001 g,0.002 g,0.005 g,0.01 g,0.01 g,0.02 g,0.05g的荧光粉,则可以通过简单的组合得到0.001-0.099g的所有数据。
上面结合附图对本发明的实施例作了详细说明,但是本发明并不限于上述实施例,在本领域普通技术人员所具备的知识范围内,还可以在不脱离本发明宗旨的前提下作出各种变化。
Claims (5)
1.LED封装试配比夹具,其特征在于:包括底盘(1)和外罩(2),所述底盘(1)和外罩(2)均为不透光的绝缘体材质,所述外罩(2)为轴向开有通孔的柱体,所述外罩(2)竖直设置在底盘(1)上,所述外罩(2)的侧面在竖直方向上开设有多个水平的空格(3),所述空格(3)与外罩(2)的轴向通孔相连通,所述空格(3)内均活动匹配插装有薄片载体(4),所述薄片载体(4)的中间设置有用于盛装荧光粉的凹槽(5),所述凹槽(5)的内径与外罩(2)通孔的内径相等,所述凹槽(5)的材质为透明材质,所述底座(1)上还设置有用于安装固定LED的支座(6),所述支座(6)位于外罩(2)的通孔内,所述支座(6)通过设置在底盘(1)上的导电体(7)与外界电源电连接。
2.根据权利要求1所述的LED封装试配比夹具,其特征在于:所述导电体(7)位于底盘(1)的上部。
3.根据权利要求1或2所述的LED封装试配比夹具,其特征在于:所述导电体(7)位于外罩(2)的外部。
4.根据权利要求3所述的LED封装试配比夹具,其特征在于:所述导电体(7)和支座(6)之间设置有紧固弹簧(8)。
5.根据权利要求4所述的LED封装试配比夹具,其特征在于:所述支座(6)的外侧设置有夹具(9),所述夹具(9)用于将支座(6)夹持固定,所述紧固弹簧(8)设置在夹具(9)和导电体(7)。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101740707A (zh) * | 2009-12-11 | 2010-06-16 | 晶科电子(广州)有限公司 | 预成型荧光粉贴片及其与发光二极管的封装方法 |
CN202308024U (zh) * | 2011-11-10 | 2012-07-04 | 东莞市凯格精密机械有限公司 | 适用于贴片式led固晶机的万能夹具 |
JP2012160447A (ja) * | 2011-01-31 | 2012-08-23 | Yung Pun Cheng | 全方向に発光するledを実装する方法及びledパッケージ |
CN204577451U (zh) * | 2015-03-31 | 2015-08-19 | 长治市华光光电科技集团有限公司 | 一种led封装试配比夹具 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101740707A (zh) * | 2009-12-11 | 2010-06-16 | 晶科电子(广州)有限公司 | 预成型荧光粉贴片及其与发光二极管的封装方法 |
JP2012160447A (ja) * | 2011-01-31 | 2012-08-23 | Yung Pun Cheng | 全方向に発光するledを実装する方法及びledパッケージ |
CN202308024U (zh) * | 2011-11-10 | 2012-07-04 | 东莞市凯格精密机械有限公司 | 适用于贴片式led固晶机的万能夹具 |
CN204577451U (zh) * | 2015-03-31 | 2015-08-19 | 长治市华光光电科技集团有限公司 | 一种led封装试配比夹具 |
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