CN104810437B - Led封装试配比夹具 - Google Patents

Led封装试配比夹具 Download PDF

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CN104810437B
CN104810437B CN201510147157.1A CN201510147157A CN104810437B CN 104810437 B CN104810437 B CN 104810437B CN 201510147157 A CN201510147157 A CN 201510147157A CN 104810437 B CN104810437 B CN 104810437B
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CN104810437A (zh
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桑海彪
李慧
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Shanxi Huajia Tech Photoelectric Technology Co ltd
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Changzhi City Hua Guang Optoelectronics Technology Group Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)

Abstract

本发明LED封装试配比夹具，属于LED封装技术领域；提供了一种采用不需用胶水，且荧光粉可以回收利用的LED封装试配比夹具；采用的技术方案为：LED封装试配比夹具，底盘和外罩均为不透光的绝缘体材质，外罩为轴向开有通孔的柱体，外罩竖直设置在底盘上，外罩的侧面在竖直方向上开设有多个水平的空格，空格与外罩的轴向通孔相连通，空格内均活动匹配插装有薄片载体，薄片载体的中间设置有用于盛装荧光粉的凹槽，凹槽的内径与外罩通孔的内径相等，凹槽的材质为透明材质，底盘上还设置有用于安装固定LED的支座，支座位于外罩的通孔内，支座通过设置在底盘上的导电体与外界电源电连接；本发明广泛应用于LED封装领域。

Description

LED封装试配比夹具
技术领域
本发明LED封装试配比夹具，属于LED封装技术领域。
背景技术
在现有的LED(即发光二极管)封装领域，试配比时，采用荧光粉和胶水混合后或直接将荧光粉涂布于LED上，在涂抹过程中荧光粉和胶水浪费严重。
发明内容
本发明克服了现有技术存在的不足，提供了一种采用不需用胶水，且荧光粉可以回收利用的LED封装试配比夹具。
为了解决上述技术问题，本发明采用的技术方案为：LED封装试配比夹具，包括底盘和外罩，所述底盘和外罩均为不透光的绝缘体材质，所述外罩为轴向开有通孔的柱体，所述外罩竖直设置在底盘上，所述外罩的侧面在竖直方向上开设有多个水平的空格，所述空格与外罩的轴向通孔相连通，所述空格内均活动匹配插装有薄片载体，所述薄片载体的中间设置有用于盛装荧光粉的凹槽，所述凹槽的内径与外罩通孔的内径相等，所述凹槽的材质为透明材质，所述底盘上还设置有用于安装固定LED的支座，所述支座位于外罩的通孔内，所述支座通过设置在底盘上的导电体与外界电源电连接。
优选地，所述导电体位于底盘的上部。
优选地，所述导电体位于外罩的外部。
优选地，所述导电体和支座之间设置有紧固弹簧。
优选地，所述支座的外侧设置有夹具，所述夹具用于将支座夹持固定，所述紧固弹簧设置在夹具和导电体。
本发明与现有技术相比具有的有益效果是：本发明采用荧光粉分层混合理念，使从LED发出的光可以通过多层含有荧光粉的透明薄片载体，其中每层载体的荧光粉可以一样也可以不一样，但各层薄片载体的荧光粉必须一样，以便于回收利用，激发荧光粉得到所需要的光，本发明中荧光粉可以回收利用，节约资源，降低成本，通过对多层薄片载体中不同薄片载体中的荧光粉定量划分，可以提高试配比的速度。
附图说明
下面结合附图对本发明做进一步的说明。
图1为本发明的结构示意图。
图2为本发明中底盘和外罩的安装示意图。
图3为本发明的使用状态图。
图4为本发明中薄片载体的结构示意图。
图中，1为底盘、2为外罩、3为空格、4为薄片载体、5为凹槽、6为支座、7为导电体、8为紧固弹簧、9为夹具。
具体实施方式
如图1～图4所示，本发明LED封装试配比夹具，包括底盘1和外罩2，所述底盘1和外罩2均为不透光的绝缘体材质，所述外罩2为轴向开有通孔的柱体，所述外罩2竖直设置在底盘1上，所述外罩2的侧面在竖直方向上开设有多个水平的空格3，所述空格3与外罩2的轴向通孔相连通，所述空格3内均活动匹配插装有薄片载体4，所述薄片载体4的中间设置有用于盛装荧光粉的凹槽5，所述凹槽5的内径与外罩2通孔的内径相等，所述凹槽5的材质为透明材质，所述底盘1上还设置有用于安装固定LED的支座6，所述支座6位于外罩2的通孔内，所述支座6通过设置在底盘1上的导电体7与外界电源电连接。
所述导电体7位于底盘1的上部。
所述导电体7位于外罩2的外部。
所述导电体7和支座6之间设置有紧固弹簧8。
所述支座6的外侧设置有夹具9，所述夹具9用于将支座6夹持固定，所述紧固弹簧8设置在夹具9和导电体7。
本发明的使用流程为：在电子称上将定量荧光粉加入薄片载体，再将固有LED的支座固定在夹具底部的底盘1上，在导电体7处接上合适的电压，将LED点亮，通过插入载有不同含量或型号的荧光粉薄片载体4，就可以在顶部得到不同的光。本发明的重点在于荧光粉能回收再利用。
本发明采用荧光粉分层混合理念，使从LED发出的光可以通过多层含有荧光粉的透明薄片载体，其中每层载体的荧光粉可以一样也可以不一样，但各层薄片载体的荧光粉必须一样，以便于回收利用，激发荧光粉得到所需要的光，本发明中荧光粉可以回收利用，节约资源，降低成本，通过对多层薄片载体中不同薄片载体中的荧光粉定量划分，可以提高试配比的速度。例如：八个载体分别包含0.001 g,0.001 g,0.002 g,0.005 g,0.01 g,0.01g,0.02 g,0.05g的荧光粉，则可以通过简单的组合得到0.001-0.099g的所有数据。
上面结合附图对本发明的实施例作了详细说明，但是本发明并不限于上述实施例，在本领域普通技术人员所具备的知识范围内，还可以在不脱离本发明宗旨的前提下作出各种变化。

Claims (1)

1.LED封装试配比夹具，其特征在于：包括底盘（1）和外罩（2），所述底盘（1）和外罩（2）均为不透光的绝缘体材质，所述外罩（2）为轴向开有通孔的柱体，所述外罩（2）竖直设置在底盘（1）上，所述外罩（2）的侧面在竖直方向上开设有多个水平的空格（3），所述空格（3）与外罩（2）的轴向通孔相连通，所述空格（3）内均活动匹配插装有薄片载体（4），所述薄片载体（4）的中间设置有用于盛装荧光粉的凹槽（5），所述凹槽（5）的内径与外罩（2）通孔的内径相等，所述凹槽（5）的材质为透明材质，所述底盘（1）上还设置有用于安装固定LED的支座（6），所述支座（6）位于外罩（2）的通孔内，所述支座（6）通过设置在底盘（1）上的导电体（7）与外界电源电连接；所述导电体（7）位于底盘（1）的上部；所述导电体（7）位于外罩（2）的外部；所述导电体（7）和支座（6）之间设置有紧固弹簧（8）；所述支座（6）的外侧设置有夹具（9），所述夹具（9）用于将支座（6）夹持固定，所述紧固弹簧（8）设置在夹具（9）和导电体（7）。
CN201510147157.1A 2015-03-31 2015-03-31 Led封装试配比夹具 Active CN104810437B (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101740707A (zh) * 2009-12-11 2010-06-16 晶科电子（广州）有限公司 预成型荧光粉贴片及其与发光二极管的封装方法
CN202308024U (zh) * 2011-11-10 2012-07-04 东莞市凯格精密机械有限公司 适用于贴片式led固晶机的万能夹具
JP2012160447A (ja) * 2011-01-31 2012-08-23 Yung Pun Cheng 全方向に発光するｌｅｄを実装する方法及びｌｅｄパッケージ
CN204577451U (zh) * 2015-03-31 2015-08-19 长治市华光光电科技集团有限公司 一种led封装试配比夹具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101740707A (zh) * 2009-12-11 2010-06-16 晶科电子（广州）有限公司 预成型荧光粉贴片及其与发光二极管的封装方法
JP2012160447A (ja) * 2011-01-31 2012-08-23 Yung Pun Cheng 全方向に発光するｌｅｄを実装する方法及びｌｅｄパッケージ
CN202308024U (zh) * 2011-11-10 2012-07-04 东莞市凯格精密机械有限公司 适用于贴片式led固晶机的万能夹具
CN204577451U (zh) * 2015-03-31 2015-08-19 长治市华光光电科技集团有限公司 一种led封装试配比夹具

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