CN202268334U - Protecting cover board for assisting in fixing substrate assembly device in dry etching process - Google Patents
Protecting cover board for assisting in fixing substrate assembly device in dry etching process Download PDFInfo
- Publication number
- CN202268334U CN202268334U CN2011203542649U CN201120354264U CN202268334U CN 202268334 U CN202268334 U CN 202268334U CN 2011203542649 U CN2011203542649 U CN 2011203542649U CN 201120354264 U CN201120354264 U CN 201120354264U CN 202268334 U CN202268334 U CN 202268334U
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- China
- Prior art keywords
- cover plate
- protective cover
- loading device
- etch process
- dry etch
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model provides a protecting cover board for assisting in fixing a substrate assembly device in dry etching process, which is a transparent plastic board provided with a plurality of positioning holes corresponding to substrate assembly screw holes. During substrate assembly, the protecting cover board is used for covering a perpendicular area of a fixing top disk and a semiconductor substrate so as to protect the surface of the semiconductor substrate from being scratched during assembly, and can be simply pulled out after the assembly process is completed, so that substrate assembly speed and capacity are greatly increased, and manufacture cost is effectively reduced. The protecting cover board is simple in operation method and applicable to industrial production processes.
Description
Technical field
The utility model relates to a kind of protective cover plate, particularly relates to a kind of protective cover plate that is used for auxiliary fixing dry etch process loading device.
Background technology
Light-emitting diode has that volume is little, efficient is high and advantage such as the life-span is long, has a wide range of applications in fields such as traffic indication and outdoor panchromatic demonstrations.Especially utilize large-power light-emitting diodes possibly realize semiconductor solid lighting, cause the revolution of human illumination history, thereby become the research focus of present person in electronics gradually.In order to obtain the LED of high brightness, key will improve the internal quantum efficiency and the external quantum efficiency of device.At present; The chip light extraction efficiency is the principal element of limiting device external quantum efficiency; Its main cause is that the refractive index difference between epitaxial material, backing material and the air is bigger, and the light that causes active area to produce can not be derived chip in the generation total reflection of different refractivity material interface.
The technology path of main flow comes growing epitaxial with graph substrate exactly at present; This kind technology can be alleviated in substrate and the nitride epitaxial layer heteroepitaxial growth because the stress that the character mismatch causes; Reduce the density of GaN base epitaxial loayer threading dislocation, improve the epitaxial loayer crystal mass, the non-radiation that reduces semiconductive luminescent materials meets the center; Enhanced rad meets, to improve chip brightness.The manufacture method of present this graph substrate is on Sapphire Substrate, to do earlier the little figure of periodic arrangement with photoresist; Utilize again ICP (enhancing coupled plasma) dry etching technology with this photoresist figure transfer on Sapphire Substrate; And the cooling to substrate in the process of etching of this dry etching technology is most important; Otherwise the high temperature that the photoresist figure produces in can the process because of etching is out of shape, and then can't guarantee effective transfer of figure.The ICP etching is to adopt the aluminium dish to add quartz disk to the cooling means of substrate at present; He directly is passed into the Sapphire Substrate bottom to be cooled off Sapphire Substrate; This method can effectively be cooled off substrate, can guarantee effective transfer of figure, but needs a lot of screws that quartz disk and aluminium dish are fixed together during this method load; In the turn of the screw, be easy to the scratch substrate surface, and big limitations load speed with strengthen task difficulty.
Therefore, it is necessary to make a kind of protective cover plate that is used for auxiliary fixing dry etch process load.
The utility model content
The shortcoming of prior art in view of the above; The purpose of the utility model is to provide a kind of protective cover plate that is used for auxiliary fixing dry etch process loading device; Overcoming in the prior art load process scratch substrate surface easily, and caused big limitations load speed and the defective that strengthens task difficulty.
For realizing above-mentioned purpose and other relevant purposes; The utility model provides a kind of protective cover plate that is used for auxiliary fixing dry etch process loading device; Described loading device comprises fixedly at least, fixed underpan and said fixedly take over a business and fixed underpan between a plurality of semiconductor chips; And said fixedly take over a business with fixed underpan be fixed together by a plurality of fixtures, it is characterized in that: the position of this fixture offers a plurality of location holes to being applied to install respectively on the said protective cover plate.
In the protective cover plate of the utility model, said protective cover plate is transparent plastic plate.
In the protective cover plate of the utility model, being shaped as of said protective cover plate is discoid.
In the protective cover plate of the utility model, said location hole is a circular hole.
In the protective cover plate of the utility model, said fixture is bolt or screw.
Need to prove that the aperture of said location hole is greater than the nut diameter of said bolt or screw.
In the protective cover plate of the utility model, said loading device also comprises a plurality of sealing rings, is installed in respectively between said fixed underpan and the semiconductor chip.
In the protective cover plate of the utility model, said loading device also comprise a plurality of in order to the circulation refrigerating gas to cool off the cooling duct of described semiconductor chip, said cooling duct is between two said fixed underpans.
In the protective cover plate of the utility model, said fixed underpan is the aluminium dish.
In the protective cover plate of the utility model, saidly fixedly take over a business to be quartz disk.
In the protective cover plate of the utility model, saidly fixedly take over a business to be quartz disk.
As stated; The protective cover plate that is used for auxiliary fixing dry etch process loading device of the utility model is made on transparent plastic sheet has a plurality of and the corresponding location hole in load screw hole; In the process of load, be covered in described vertical zone of fixedly taking over a business with described semiconductor chip; With the protection semiconductor chip the surface in the load process not by scratch; And can detach simply after accomplishing the load process, thereby improve load speed and production capacity greatly, effectively reduce manufacturing cost.And the utility model method of operation is simple, is applicable to industrial processes.
Description of drawings
Fig. 1～Fig. 2 is shown as the structure chart of the utility model.
Embodiment
Below through the execution mode of specific instantiation explanation the utility model, those skilled in the art can be understood other advantages and the effect of the utility model easily by the content that this specification disclosed.The utility model can also be implemented or use through other different embodiment, and each item details in this specification also can be carried out various modifications or change based on different viewpoints and application under the spirit that does not deviate from the utility model.
Need to prove; The diagram that is provided in the present embodiment is only explained the basic conception of the utility model in a schematic way; Satisfy only show in graphic with the utility model in relevant assembly but not component count, shape and plotted when implementing according to reality; Kenel, quantity and the ratio of each assembly can be a kind of random change during its actual enforcement, and its assembly layout kenel also maybe be more complicated.
See also Fig. 1～Fig. 2; As shown in the figure; The utility model provides a kind of protective cover plate 2 that is used for auxiliary fixing dry etch process loading device, described loading device 1 comprise at least fixedly take over a business 12, fixed underpan 11 and said fixedly take over a business 12 and fixed underpan 11 between a plurality of semiconductor chips 14, and saidly fixedly take over a business 12 and be fixed together by a plurality of fixtures 13 with fixed underpan 11; Saidly fixedly take over a business 12 for quartz disk; Described fixed underpan 11 is the aluminium dish, certainly, also can be aluminum titanium alloy dish or tin titanium alloy dish etc.Said loading device 1 comprises that also a plurality of said cooling duct 16 is between two said fixed underpans 11 in order to the circulation cooling duct 16 of refrigerating gas to cool off described semiconductor chip 14, and wherein, described refrigerating gas is He or N
2Deng.Said loading device 1 also comprises a plurality of sealing rings 15, is installed in respectively between said fixed underpan 11 and the semiconductor chip 14, and described sealing ring 15 materials are rubber, can certainly be polymer such as fiber, aramid fiber.
See also Fig. 2, as shown in the figure, the position of this fixture 13 offers a plurality of location holes 21 to being applied to install respectively on the said protective cover plate 2.Said protective cover plate 2 is transparent plastic plate; Certainly; Also can be glass plate, ceramic wafer or metallic plate etc., in the load process, be covered in described fixedly take over a business 12 with the vertical zone at the said semiconductor-based end 14, described fixture 13 is installed in the position of described location hole 21 then; Detach described protective cover plate 2 again after installing all fixtures 13, to protect the semiconductor-based end 14 described in the installation process not by scratch.A preferred embodiment of the utility model does, being shaped as of said protective cover plate 2 is discoid, and described location hole 21 is a circular hole.Certainly, said location hole 21 can carry out processing and preparing according to the shape size of said fixture 13.
In a concrete embodiment; Described fixture 13 is bolt or screw; The aperture of the said location hole 21 of corresponding this embodiment is greater than the nut diameter of described bolt or screw; So that said fixture 13 can be installed by the position of described location hole 21, and described fixture 13 will saidly fixedly take over a business 12 and fixed underpan 11 be fixed together and detach described protective cover plate 2 after fixing.
In sum; The protective cover plate of the utility model is made on transparent plastic sheet has a plurality of and the corresponding location hole in load screw hole; In the process of load, be covered in described vertical zone of fixedly taking over a business with described semiconductor chip, with the surface of protection semiconductor chip in the load process not by scratch, and can detach simply after accomplishing the load process; Thereby improve the speed and the production capacity of load greatly, effectively reduce manufacturing cost.And the utility model method of operation is simple, is applicable to industrial processes.So the utility model has effectively overcome various shortcoming of the prior art and the tool high industrial utilization.
The foregoing description is the principle and the effect thereof of illustrative the utility model only, but not is used to limit the utility model.Any be familiar with this technological personage all can be under the spirit and category of the utility model, the foregoing description is modified or is changed.Therefore, have common knowledge the knowledgeable under such as in the technical field, must contain by the claim of the utility model not breaking away from all equivalence modification or changes that spirit that the utility model discloses and technological thought are accomplished down.
Claims (10)
1. protective cover plate that is used for auxiliary fixing dry etch process loading device; Described loading device comprises fixedly at least, fixed underpan and said fixedly take over a business and fixed underpan between a plurality of semiconductor chips; And said fixedly take over a business with fixed underpan be fixed together by a plurality of fixtures, it is characterized in that: the position of this fixture offers a plurality of location holes to being applied to install respectively on the said protective cover plate.
2. the protective cover plate that is used for auxiliary fixing dry etch process loading device according to claim 1 is characterized in that: said protective cover plate is transparent plastic plate.
3. the protective cover plate that is used for auxiliary fixing dry etch process loading device according to claim 1 is characterized in that: being shaped as of said protective cover plate is discoid.
4. the protective cover plate that is used for auxiliary fixing dry etch process loading device according to claim 1 is characterized in that: said location hole is a circular hole.
5. the protective cover plate that is used for auxiliary fixing dry etch process loading device according to claim 1 is characterized in that: said fixture is bolt or screw.
6. the protective cover plate that is used for auxiliary fixing dry etch process loading device according to claim 5 is characterized in that: the aperture of said location hole is greater than the nut diameter of said bolt or screw.
7. the protective cover plate that is used for auxiliary fixing dry etch process loading device according to claim 1 is characterized in that: said loading device also comprises a plurality of sealing rings, is installed in respectively between said fixed underpan and the semiconductor chip.
8. the protective cover plate that is used for auxiliary fixing dry etch process loading device according to claim 1; It is characterized in that: said loading device also comprise a plurality of in order to the circulation refrigerating gas to cool off the cooling duct of described semiconductor chip, said cooling duct is between two said fixed underpans.
9. the protective cover plate that is used for auxiliary fixing dry etch process loading device according to claim 1 is characterized in that: said fixed underpan is the aluminium dish.
10. the protective cover plate that is used for auxiliary fixing dry etch process loading device according to claim 1 is characterized in that: saidly fixedly take over a business to be quartz disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203542649U CN202268334U (en) | 2011-09-20 | 2011-09-20 | Protecting cover board for assisting in fixing substrate assembly device in dry etching process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203542649U CN202268334U (en) | 2011-09-20 | 2011-09-20 | Protecting cover board for assisting in fixing substrate assembly device in dry etching process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202268334U true CN202268334U (en) | 2012-06-06 |
Family
ID=46159118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203542649U Expired - Lifetime CN202268334U (en) | 2011-09-20 | 2011-09-20 | Protecting cover board for assisting in fixing substrate assembly device in dry etching process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202268334U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103258924A (en) * | 2013-05-16 | 2013-08-21 | 合肥彩虹蓝光科技有限公司 | Tool for wiping LED chip |
| CN105576101A (en) * | 2014-10-10 | 2016-05-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Cover plate and carrying device |
-
2011
- 2011-09-20 CN CN2011203542649U patent/CN202268334U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103258924A (en) * | 2013-05-16 | 2013-08-21 | 合肥彩虹蓝光科技有限公司 | Tool for wiping LED chip |
| CN103258924B (en) * | 2013-05-16 | 2015-12-02 | 合肥彩虹蓝光科技有限公司 | A kind of special fixture of pad of LED wafer |
| CN105576101A (en) * | 2014-10-10 | 2016-05-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Cover plate and carrying device |
| CN105576101B (en) * | 2014-10-10 | 2018-07-06 | 北京北方华创微电子装备有限公司 | A kind of cover board and bogey |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120606 |
|
| CX01 | Expiry of patent term |