CN202268338U - Positioning cover plate used in substrate loading device for positioning semiconductor substrate in auxiliary manner - Google Patents
Positioning cover plate used in substrate loading device for positioning semiconductor substrate in auxiliary manner Download PDFInfo
- Publication number
- CN202268338U CN202268338U CN2011203596348U CN201120359634U CN202268338U CN 202268338 U CN202268338 U CN 202268338U CN 2011203596348 U CN2011203596348 U CN 2011203596348U CN 201120359634 U CN201120359634 U CN 201120359634U CN 202268338 U CN202268338 U CN 202268338U
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- Prior art keywords
- location
- cover plate
- semiconductor chip
- loading device
- positioning
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Abstract
The utility model provides a positioning cover plate used in a substrate loading device for positioning semiconductor substrates in an auxiliary manner. In the utility model, a plurality of positioning holes is arranged in a transparent plastic plate at positions corresponding to the semiconductor substrates. In a substrate loading process, the positioning cover plate covers on a corresponding position of a fixed base plate and a sealing ring. Then the semiconductors are disposed in the positioning holes, thereby guaranteeing that the semiconductor substrates do not shift in the substrate loading process. And the positioning cover plate can be extracted simply after the installation of semiconductor substrates is finished, thereby improving the substrate loading speed and the working efficiency substantially. And the positioning cover plate used in the substrate loading device for positioning semiconductor substrates in the auxiliary manner has a simple operation method and is suitable for an industrial production process.
Description
Technical field
The utility model relates to a kind of location cover plate, particularly relates to a kind of location cover plate that is used for loading device assist location semiconductor chip.
Background technology
Light-emitting diode has that volume is little, efficient is high and advantage such as the life-span is long, has a wide range of applications in fields such as traffic indication, outdoor panchromatic demonstrations.Especially utilize large-power light-emitting diodes possibly realize semiconductor solid lighting, cause the revolution of human illumination history, thereby become the research focus of present person in electronics gradually.In order to obtain the LED of high brightness, key will improve the internal quantum efficiency and the external quantum efficiency of device.At present; The chip light extraction efficiency is the principal element of limiting device external quantum efficiency; Its main cause is that the refractive index difference between epitaxial material, backing material and the air is bigger, and the light that causes active area to produce can not be derived chip in the generation total reflection of different refractivity material interface.
The technology path of main flow comes growing epitaxial with graph substrate exactly at present; This kind technology can be alleviated in substrate and the nitride epitaxial layer heteroepitaxial growth because the stress that lattice mismatch causes; Reduce the density of GaN base epitaxial loayer threading dislocation, improve the epitaxial loayer crystal mass, the non-radiation that reduces semiconductive luminescent materials meets the center; Enhanced rad meets, to improve chip brightness.The manufacture method of present this graph substrate is on Sapphire Substrate, to do earlier the little figure of periodic arrangement with photoresist; Utilize again ICP (enhancing coupled plasma) dry etching technology with this photoresist figure transfer on Sapphire Substrate; And the cooling to substrate in the process of etching of this dry etching technology is most important; Otherwise the high temperature that the photoresist figure produces in can the process because of etching is out of shape, and then can't guarantee effective transfer of figure.The ICP etching is to adopt the aluminium dish to add quartz disk to the cooling means of substrate at present, and the cold Sapphire Substrate bottom that directly is passed into of He is cooled off Sapphire Substrate, and this method can effectively be cooled off substrate; Can guarantee effective transfer of figure; But need substrate to be placed on the elastic tape during this method load, and position deviation can not be arranged, otherwise etching will be leaked helium; Make load speed reduce greatly like this, thereby stopped operating efficiency.
Therefore, it is necessary to make a kind of location cover plate that is used for loading device assist location semiconductor chip.
The utility model content
The shortcoming of prior art in view of the above; The purpose of the utility model is to provide a kind of location cover plate that is used for loading device assist location semiconductor chip; Squinting easily in position to overcome semiconductor chip in the prior art load process, causes refrigerating gas to leak and influence the defective of load speed and operating efficiency.
For realizing above-mentioned purpose and other relevant purposes; The utility model provides a kind of location cover plate that is used for loading device assist location semiconductor chip; Described loading device comprises fixedly at least, fixed underpan, be used for fixing said fixedly take over a business and the fixture of fixed underpan, the cooling duct between the two said fixed underpans, said fixedly take over a business and fixed underpan between a plurality of semiconductor chips and be used to seal respectively this cooling duct and a plurality of sealing rings of this semiconductor chip respectively, it is characterized in that: the position of this semiconductor chip offers a plurality of location holes to being applied to install respectively on the cover plate of said location.
In the cover plate of the location of the utility model, said location cover plate is transparent plastic plate.Being shaped as of said location cover plate is discoid.Said location hole is a circular hole.Described semiconductor chip be shaped as the disk shape, need to prove that the aperture of said location hole is greater than the diameter of said semiconductor chip.Described sealing ring is a rubber ring.Said fixed underpan is the aluminium dish.Saidly fixedly take over a business to be quartz disk.
As stated; The utility model provides a kind of location cover plate that is used for loading device assist location semiconductor chip; Said location cover plate is made the position corresponding positioning hole with semiconductor chip in a plurality of and the loading device on transparent plastic plate; In the load process, be covered on the relevant position of described fixed underpan and sealing ring, be placed on semiconductor chip in the described location hole then, to guarantee that semiconductor chip does not squint described in the load process; And described location cover plate can simply detach after said semiconductor chip installation, thereby has improved load speed and operating efficiency greatly.And the utility model method of operation is simple, is applicable to industrial processes.
Description of drawings
Fig. 1 is shown as the structural representation of prior art loading device.
Fig. 2 a～Fig. 2 b is shown as the structural representation of the utility model
Embodiment
Below through the execution mode of specific instantiation explanation the utility model, those skilled in the art can be understood other advantages and the effect of the utility model easily by the content that this specification disclosed.The utility model can also be implemented or use through other different embodiment, and each item details in this specification also can be carried out various modifications or change based on different viewpoints and application under the spirit that does not deviate from the utility model.
Need to prove; The diagram that is provided in the present embodiment is only explained the basic conception of the utility model in a schematic way; Satisfy only show in graphic with the utility model in relevant assembly but not component count, shape and plotted when implementing according to reality; Kenel, quantity and the ratio of each assembly can be a kind of random change during its actual enforcement, and its assembly layout kenel also maybe be more complicated.
See also Fig. 1～Fig. 2 b; As shown in the figure, the utility model provides a kind of location cover plate 2 that is used for loading device assist location semiconductor chip, described loading device 1 comprise at least fixedly take over a business 12, fixed underpan 11 saidly fixedly takes over a business 12 and the fixture 13 of fixed underpan 11 with being used for fixing; Wherein, Describedly fixedly take over a business 12 for quartz disk, described fixed underpan 11 be the aluminium dish, and is certain; Also can be aluminum titanium alloy dish or tin titanium alloy dish etc., described fixture 13 preferred bolt or screw; Described loading device 1 also comprises the cooling duct 16 between two said fixed underpans 11, and this cooling duct passes to refrigerating gas such as He or N
2Deng; This loading device also comprise said fixedly take over a business 12 and fixed underpan 11 between a plurality of semiconductor chips 14 and be used to seal respectively this cooling duct 16 and a plurality of sealing rings 15 of this semiconductor chip 14 respectively; Wherein, described semiconductor chip 14 cools off through said cooling duct 16.As a preferred version of present embodiment, described sealing ring 15 adopts rubber ring.
See also Fig. 2 a～Fig. 2 b, as shown in the figure, the position of this semiconductor chip 14 offers a plurality of location holes 21 to being applied to install respectively on the said location cover plate 2.Said location cover plate 2 is transparent plastic plate; Certainly; Also can be glass plate, ceramic wafer or metallic plate etc.; In the load process, be covered on the relevant position of described fixed underpan 11 and sealing ring 15, again detach described location cover plate 2 after being placed in the described location hole 21 then to semiconductor-based 14, in order to guarantee that semiconductor chip 14 does not squint described in the load process.In the present embodiment, being shaped as of described location cover plate 2 is discoid, and described location hole 21 is a circular hole, and certainly, said location hole 21 can carry out processing and preparing according to the shape size of said semiconductor chip 14.
In the embodiment of the utility model; Described semiconductor chip 14 be shaped as the disk shape; Then the said location hole 21 of corresponding this embodiment is a circular hole; And its aperture is greater than the diameter of described semiconductor chip 14, so that described semiconductor chip 14 can install according to the position of described location hole 21, and after said semiconductor chip 14 installations, detaches described location cover plate 2.
In sum; The utility model provides a kind of location cover plate that is used for loading device assist location semiconductor chip; Said location cover plate is made the position corresponding positioning hole with semiconductor chip in a plurality of and the loading device on transparent plastic plate; In the load process, be covered on the relevant position of described fixed underpan and sealing ring, be placed on semiconductor chip in the described location hole then, to guarantee that semiconductor chip does not squint described in the load process; And described location cover plate can simply detach after said semiconductor chip installation, thereby has improved load speed and operating efficiency greatly.And the utility model method of operation is simple, is applicable to industrial processes.So the utility model has effectively overcome various shortcoming of the prior art and the tool high industrial utilization.
The foregoing description is the principle and the effect thereof of illustrative the utility model only, but not is used to limit the utility model.Any be familiar with this technological personage all can be under the spirit and category of the utility model, the foregoing description is modified or is changed.Therefore, have common knowledge the knowledgeable under such as in the technical field, must contain by the claim of the utility model not breaking away from all equivalence modification or changes that spirit that the utility model discloses and technological thought are accomplished down.
Claims (9)
1. location cover plate that is used for loading device assist location semiconductor chip; Described loading device comprises fixedly at least, fixed underpan, be used for fixing said fixedly take over a business and the fixture of fixed underpan, the cooling duct between the two said fixed underpans, said fixedly take over a business and fixed underpan between a plurality of semiconductor chips and be used to seal respectively this cooling duct and a plurality of sealing rings of this semiconductor chip respectively, it is characterized in that: the position of this semiconductor chip offers a plurality of location holes to being applied to install respectively on the cover plate of said location.
2. the location cover plate that is used for loading device assist location semiconductor chip according to claim 1 is characterized in that: said location cover plate is transparent plastic plate.
3. the location cover plate that is used for loading device assist location semiconductor chip according to claim 1 is characterized in that: being shaped as of said location cover plate is discoid.
4. the location cover plate that is used for loading device assist location semiconductor chip according to claim 1 is characterized in that: said location hole is a circular hole.
5. the location cover plate that is used for loading device assist location semiconductor chip according to claim 1 is characterized in that: said semiconductor chip be shaped as the disk shape.
6. the location cover plate that is used for loading device assist location semiconductor chip according to claim 5, it is characterized in that: the aperture of said location hole is greater than the diameter of said semiconductor chip.
7. the location cover plate that is used for loading device assist location semiconductor chip according to claim 1 is characterized in that: said sealing ring is a rubber ring.
8. the location cover plate that is used for loading device assist location semiconductor chip according to claim 1 is characterized in that: said fixed underpan is the aluminium dish.
9. the location cover plate that is used for loading device assist location semiconductor chip according to claim 1 is characterized in that: saidly fixedly take over a business to be quartz disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203596348U CN202268338U (en) | 2011-09-23 | 2011-09-23 | Positioning cover plate used in substrate loading device for positioning semiconductor substrate in auxiliary manner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203596348U CN202268338U (en) | 2011-09-23 | 2011-09-23 | Positioning cover plate used in substrate loading device for positioning semiconductor substrate in auxiliary manner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202268338U true CN202268338U (en) | 2012-06-06 |
Family
ID=46159122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203596348U Expired - Lifetime CN202268338U (en) | 2011-09-23 | 2011-09-23 | Positioning cover plate used in substrate loading device for positioning semiconductor substrate in auxiliary manner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202268338U (en) |
-
2011
- 2011-09-23 CN CN2011203596348U patent/CN202268338U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120606 |