CN103258924A - Tool for wiping LED chip - Google Patents
Tool for wiping LED chip Download PDFInfo
- Publication number
- CN103258924A CN103258924A CN2013101804373A CN201310180437A CN103258924A CN 103258924 A CN103258924 A CN 103258924A CN 2013101804373 A CN2013101804373 A CN 2013101804373A CN 201310180437 A CN201310180437 A CN 201310180437A CN 103258924 A CN103258924 A CN 103258924A
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- chip
- wafer
- wiping
- grooves
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Abstract
The invention discloses a tool for wiping a LED chip. The tool for wiping the LED chip comprises two acid-and-alkali resistant PTFE plates of the same specification, a plurality of 2-inch chip grooves are formed in the front face of each PTFE plate, a plurality of 4-inch chip grooves are formed in the back face of each PTFE plate, a cross-shaped drainage groove is formed in the center of each chip groove, the drainage grooves are mutually communicated in a straight-line mode, and the wall of each drainage groove is inclined in a certain degree, and the front face of one PTFE plate and the back face of the other PTFE plate are fixed together. The tool for wiping the LED chip not only greatly shortens wiping time and improves wiping efficiency, but also enables a chip to be capable of being taken out of the tool rapidly (the chip-taking angle is designed to enable a left hand and a right hand to take and put the chip conveniently), chip-taking speed is improved, and the possibility of breaking the chip during chip-taking is reduced.
Description
Technical field
The present invention relates to LED and manufacture the field, in particular, relate to a kind of special-purpose fixture of wiping sheet of LED wafer.
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Background technology
Some wafer is on even behind the photoresist in modern LED manufacturing process, through exposure, when developing, toast, removing photoresist again processing, because when process conditions or soup condition generation slight changes such as (photoresist, developer solution, strippers etc.), it is bad to cause portioned product to occur, need the artificial sheet of wiping with its wiped clean, need use the special wiping fixture during wiping.
At present, domestic most of LED makes industry does not also have specialty to wipe the sheet fixture, and major part is that wafer is placed on the left hand, and the right hand is taken non-dust cloth wiping wafer.Have only several families that simple wiping sheet fixture is arranged, there are many defectives in the design of this kind fixture, and the one, get the sheet mode inconvenience, just consider dexterous mode during design; The 2nd, between wafer backside and the fixture substrate residual soup is arranged, exist absorption affinity to be unfavorable for getting sheet when getting sheet, it is very difficult to get sheet sometimes, and strength is big a little a bit just may be broken wafer into pieces.
Summary of the invention
The present invention is directed to above-mentioned problems of the prior art, a kind of special-purpose fixture of wiping sheet of LED wafer is provided, efficient is low and wafer is often broken into pieces when manually all wiping sheet with hand problem and two inches and four inches compatible problems of wiping sheet fixture have not only been solved, and solved when getting sheet and have absorption affinity between the wafer backside and substrate, get the sheet difficult problem.
For achieving the above object, the technical solution adopted in the present invention is as follows:
The special-purpose fixture of a kind of wiping sheet of LED wafer, the acid and alkali-resistance PTFE plate that comprises two same sizes, the front of every block of PTFE plate processes several 2 inches wafer grooves, reverse side is processed several 4 inches wafer grooves, each wafer groove central authorities has all designed "+" type discharge opeing groove, described discharge opeing groove yi word pattern connects mutually, and discharge opeing groove cell wall is provided with the inclination of certain angle, and the tow sides of two blocks of PTFE plates are fixed together.
The tow sides of described two blocks of PTFE plates link together by fixed support.
24 2 inches wafer grooves of front processing of described PTFE plate, 64 inches wafer grooves of reverse side processing.
The angle of inclination of described discharge opeing groove cell wall is greater than 1 °.
Described wafer gash depth is than the little 0.05mm of thickness of wafer, and the degree of depth of discharge opeing groove is between the 2mm--5mm.
Described discharge opeing groove end all is processed with the leakage fluid dram that diameter is 3.5mm.
Increase the PTFE film of thickness 3mm in the bottom of two blocks of PTFE plates, protect a following plate not to be worn.
The beneficial effect that technical solution of the present invention is brought is as follows:
One, behind the new wiping of the use sheet fixture, wiping sheet efficient is 6 times of manual wiping sheet, shortens the wiping sheet time greatly, and sheet efficient is wiped in raising.
Two, behind the new wiping of the use sheet fixture, can fast wafer be taken out from fixture, improve and get sheet speed, be reduced in the possibility of when getting sheet wafer being broken into pieces.
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Description of drawings
Fig. 1 is the Facad structure schematic diagram of fixture provided by the present invention;
Fig. 2 is the reverse side structural representation of fixture provided by the present invention.
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Embodiment
Below embodiments of the invention are elaborated: present embodiment is being to implement under the prerequisite with the technical solution of the present invention, provided detailed execution mode and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
As shown in Figure 1 and Figure 2, selecting two block lengths is that 350mm, width are that 221mm, thickness are the acid and alkali-resistance of 35mm, high temperature resistant PTFE plate 1, the positive and negative of every block of PTFE plate 1 all carries out Milling Process, and the front is 24 2 inches wafer grooves 2 of processing, and the back side is 64 inches wafer grooves 2 of processing.The little 0.05mm of thickness of the depth ratio wafer of wafer groove 2.Each wafer groove central authorities has designed "+" type discharge opeing groove 3, and the yi word pattern groove on the same direction is to connect mutually.The degree of depth of discharge opeing groove 4 is 2mm--5mm, and cell wall has certain angle of inclination (angle of inclination＞1 °), is conducive to the residual liquor discharging.The degree of depth of getting the sheet position is 2mm, and the levelness of wafer groove bottom land requires high.When picking and placeing wafer can about carry out simultaneously, simultaneously can not produce the absorption affinity because existing soup to produce between wafer backside and the fixture floor, when getting sheet, wafer is broken into pieces.
With above-mentioned tow sides all the PTFE plate 1 usefulness 316L stainless steel screw of completion of processing be fixed on the 316L stainless steel fixed support; the fixture front is 2 inches wafer grooves 2; the back side is 4 inches wafer grooves 2, and the bottom can also increase the PTFE thin plate of thickness 3mm, protects a following plate not to be worn.If certain wearing and tearing all appear in the fixture positive and negative can not use the time, again two blocks of PTFE plates are unloaded the installation reverse side, so still 2 inches and 4 inches can compatiblely be used.
During use, wear the PE gloves with the fixture wiped clean, from left to right place wafer from top to bottom successively, dip in non-dust cloth and remove film and wipe sheet in certain sequence, get sheet in order, fixture is cleaned up replace.
The above only is embodiments of the invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. the special-purpose fixture of the wiping sheet of a LED wafer, it is characterized in that, the acid and alkali-resistance PTFE plate that comprises two same sizes, the front of every block of PTFE plate processes several 2 inches wafer grooves, reverse side is processed several 4 inches wafer grooves, and each wafer groove central authorities has all designed "+" type discharge opeing groove, and described discharge opeing groove yi word pattern connects mutually, and discharge opeing groove cell wall is provided with the inclination of certain angle, and the tow sides of two blocks of PTFE plates are fixed together.
2. the special-purpose fixture of the wiping sheet of LED wafer according to claim 1 is characterized in that the tow sides of described two blocks of PTFE plates link together by fixed support.
3. the special-purpose fixture of the wiping sheet of LED wafer according to claim 1 is characterized in that, 24 2 inches wafer grooves of front processing of described PTFE plate, 64 inches wafer grooves of reverse side processing.
4. the special-purpose fixture of the wiping sheet of LED wafer according to claim 1 is characterized in that the angle of inclination of described discharge opeing groove cell wall is greater than 1 °.
5. the special-purpose fixture of the wiping sheet of LED wafer according to claim 1 is characterized in that described discharge opeing groove end all is processed with the leakage fluid dram that diameter is 3.5mm.
6. the special-purpose fixture of the wiping sheet of LED wafer according to claim 4 is characterized in that described wafer gash depth is than the little 0.05mm of thickness of wafer, and the degree of depth of discharge opeing groove is between the 2mm--5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310180437.3A CN103258924B (en) | 2013-05-16 | 2013-05-16 | A kind of special fixture of pad of LED wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310180437.3A CN103258924B (en) | 2013-05-16 | 2013-05-16 | A kind of special fixture of pad of LED wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103258924A true CN103258924A (en) | 2013-08-21 |
| CN103258924B CN103258924B (en) | 2015-12-02 |
Family
ID=48962736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310180437.3A Expired - Fee Related CN103258924B (en) | 2013-05-16 | 2013-05-16 | A kind of special fixture of pad of LED wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103258924B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100854974B1 (en) * | 2007-04-25 | 2008-08-28 | (주)리드 | Substrate carrier and apparatus for manufacturing of light emitting diode |
| CN202268334U (en) * | 2011-09-20 | 2012-06-06 | 上海蓝光科技有限公司 | Protecting cover board for assisting in fixing substrate assembly device in dry etching process |
-
2013
- 2013-05-16 CN CN201310180437.3A patent/CN103258924B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100854974B1 (en) * | 2007-04-25 | 2008-08-28 | (주)리드 | Substrate carrier and apparatus for manufacturing of light emitting diode |
| CN202268334U (en) * | 2011-09-20 | 2012-06-06 | 上海蓝光科技有限公司 | Protecting cover board for assisting in fixing substrate assembly device in dry etching process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103258924B (en) | 2015-12-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171221 Address after: Wujiang District of Suzhou City, Jiangsu province 215215 Lili town FENHU Road No. 558 Patentee after: SINOPOWER SEMICONDUCTOR CO.,LTD. Address before: 230011 Anhui city in Hefei Province, the New Station Industrial Park Patentee before: HEFEI IRICO EPILIGHT TECHNOLOGY Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 |