CN104465332A - Base plate cleaning device - Google Patents

Base plate cleaning device Download PDF

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Publication number
CN104465332A
CN104465332A CN201410855471.0A CN201410855471A CN104465332A CN 104465332 A CN104465332 A CN 104465332A CN 201410855471 A CN201410855471 A CN 201410855471A CN 104465332 A CN104465332 A CN 104465332A
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CN
China
Prior art keywords
cleaning area
photoetching
communicated
cleaning
recover
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Granted
Application number
CN201410855471.0A
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Chinese (zh)
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CN104465332B (en
Inventor
欧阳志华
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to CN201410855471.0A priority Critical patent/CN104465332B/en
Publication of CN104465332A publication Critical patent/CN104465332A/en
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Publication of CN104465332B publication Critical patent/CN104465332B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • H01L21/02068Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers

Abstract

The invention discloses a base plate cleaning device. The base plate cleaning device comprises a before-photoetching cleaning region (100) and an after-photoetching cleaning region (200). The before-photoetching cleaning region (100) comprises a water supply pipe and a waste discharge pipe. The water supply pipe of the before-photoetching cleaning region (100) is communicated with a first water storage device (120). The after-photoetching cleaning region (200) comprises a primary cleaning region (210), an intermediate cleaning region (220) and a terminal cleaning region (230), wherein the primary cleaning region (210), the intermediate cleaning region (220) and the terminal cleaning region (230) are sequentially and adjacently connected. The primary cleaning region (210), the intermediate cleaning region (220) and the terminal cleaning region (230) each comprise a water supply pipe and a waste discharge pipe. The water supply pipe (221) and the water supply pipe (231) of the terminal cleaning region (230) are communicated with a second water storage device (240). The water supply pipe (211) is communicated with a second recoverer (250), the waste discharge pipe (222) and the waste discharge pipe (232) are communicated with the second recoverer (250), and the second recoverer (250) are communicated with the waste discharge pipe (112). By the adoption of the base plate cleaning device, water generated after a base plate is cleaned in the before-photoetching cleaning region is recovered, the pure water consumption is reduced, and therefore production cost is reduced.

Description

A kind of base plate cleaning device
Technical field
The present invention relates to a kind of base plate cleaning device.
Background technology
In the manufacturing process of liquid crystal indicator, the substrate that will form thin-film transistor (TFT) substrate all needs through coating photoresist, exposure, the such photo-mask process of development.Wherein, the object of development is to remove the photoresist that there occurs light reaction in exposure process; thus the photoetching agent pattern corresponding with exposure mask plate is formed on substrate; development metacoxal plate is coated with the position of photoresist; due to the protection of photoresist in the process that next operation etches; the metal of relevant position or nonmetally can not to suffer damage, thus finally reach the object forming thin-film transistor (TFT) on substrate.
Due to very high to the purity requirements of substrate, so usually before the applied photoresist of substrate, and all need to clean substrate after development.Fig. 1 is the structural representation of a kind of base plate cleaning device of prior art.With reference to Fig. 1, in figure, A represents the cleaning area before the applied photoresist of substrate, in figure, B represents that substrate carries out the photoetching district of photoetching, in figure, H represents the transport trend of substrate, photoetching district is close to the cleaning area after photoetching, cleaning area after photoetching comprises three grades of cleaning areas, the substrate after photoetching is carried out to the cleaning of three phases, and these three grades of cleaning areas are specially adjacent successively elementary cleaning area C, intermediate cleaning area D and whole level cleaning area E.
Cleaning area A before the applied photoresist of substrate comprises feed pipe 11 and waste pipe 12, by feed pipe 11, the water in water receiver 10 is supplied to cleaning area A, to carry out the cleaning before photoetching to substrate, afterwards, the water in the A of cleaning area after cleaning base plate is directly discharged by waste pipe 12.Substrate enters after in photoetching district B, and substrate is carried out photoetching, i.e. the applied photoresist of substrate, exposure, development.Elementary cleaning area C is provided with feed pipe 21 and waste pipe 22, by feed pipe 21, the recycle-water in recover 30 is supplied to elementary cleaning area C, to carry out elementary cleaning to the substrate after photoetching, afterwards, in elementary cleaning area C, contaminated water is directly discharged by waste pipe 22.Middle rank cleaning area D is provided with feed pipe 31 and waste pipe 32, by feed pipe 31, the water in water receiver 20 is supplied to intermediate cleaning area D, to carry out middle rank cleaning to the substrate after elementary cleaning, afterwards, in middle rank cleaning area D, contaminated water is expelled in recover 30, to recycle by waste pipe 32.Whole level cleaning area E is provided with feed pipe 41 and waste pipe 42, by feed pipe 41, the water in water receiver 20 is supplied to whole level cleaning area E, to carry out whole level cleaning to the substrate after middle rank cleaning, afterwards, in whole level cleaning area E, contaminated water is expelled in recover 30, to recycle by waste pipe 42.
But in the prior art, the water cleanliness factor in the A of cleaning area after cleaning base plate is relatively high, and due to high to the requirement of base-plate cleaning before photoetching, the water therefore in the A of cleaning area after cleaning base plate can not be recycled in the A of cleaning area.And in the whole level cleaning area E of cleaning area after photoetching, in order to ensure the cleannes of substrate, pure water must be used, application pure water is not limited in elementary cleaning area C and intermediate cleaning area D, and in the prior art, the cycle water after intermediate cleaning area D and whole level cleaning area E cleaning base plate cannot meet the water consumption of elementary cleaning area C, therefore must fill up with pure water, improve the water consumption of pure water, add production cost.
Summary of the invention
In order to solve above-mentioned prior art Problems existing, the object of the present invention is to provide a kind of base plate cleaning device, comprise cleaning area after the front cleaning area of photoetching and photoetching, the front cleaning area of described photoetching comprises feed pipe and waste pipe, the feed pipe of the front cleaning area of described photoetching is communicated with the first water receiver, after described photoetching, cleaning area comprises elementary cleaning area adjacent successively, middle rank cleaning area and whole level cleaning area, described elementary cleaning area, described intermediate cleaning area and described whole level cleaning area include feed pipe and waste pipe, the feed pipe of described intermediate cleaning area is all communicated with the second water receiver with the feed pipe of described whole level cleaning area, the feed pipe of described elementary cleaning area is communicated with the second recover, the waste pipe of described intermediate cleaning area is all communicated with described second recover with the waste pipe of described whole level cleaning area, described second recover is communicated with the waste pipe of the front cleaning area of described photoetching.
Further, the waste pipe of the front cleaning area of described photoetching is communicated with the first recover, and described first recover is communicated with described second recover.
Further, described first water receiver and described second water receiver all store pure water.
Another object of the present invention is also to provide a kind of base plate cleaning device, comprise cleaning area after the front cleaning area of photoetching and photoetching, the front cleaning area of described photoetching comprises feed pipe and waste pipe, the feed pipe of the front cleaning area of described photoetching is communicated with the first water receiver, after described photoetching, cleaning area comprises elementary cleaning area adjacent successively, middle rank cleaning area and whole level cleaning area, described elementary cleaning area, described intermediate cleaning area and described whole level cleaning area include feed pipe and waste pipe, the feed pipe of described whole level cleaning area is communicated with the second water receiver, the feed pipe of described intermediate cleaning area is communicated with the 3rd water receiver, the feed pipe of described elementary cleaning area is communicated with the second recover, the waste pipe of described intermediate cleaning area is all communicated with described second recover with the waste pipe of described whole level cleaning area, described 3rd water receiver is communicated with the waste pipe of the front cleaning area of described photoetching.
Further, the waste pipe of the front cleaning area of described photoetching is communicated with the first recover, and described first recover is communicated with described 3rd water receiver.
Further, described first water receiver and described second water receiver all store pure water, and described 3rd water receiver stores the waste water of the front cleaning area of described photoetching that described first recover reclaims.
Another object of the present invention is again to provide a kind of base plate cleaning device, comprise cleaning area after the front cleaning area of photoetching and photoetching, the front cleaning area of described photoetching comprises feed pipe and waste pipe, the feed pipe of the front cleaning area of described photoetching is communicated with the first water receiver, after described photoetching, cleaning area comprises elementary cleaning area adjacent successively, middle rank cleaning area and whole level cleaning area, described elementary cleaning area, described intermediate cleaning area and described whole level cleaning area include feed pipe and waste pipe, the feed pipe of described whole level cleaning area is communicated with the second water receiver, the feed pipe of described intermediate cleaning area is communicated with the 3rd water receiver, the feed pipe of described elementary cleaning area is communicated with the second recover, the waste pipe of described intermediate cleaning area is all communicated with described second recover with the waste pipe of described whole level cleaning area, described 3rd water receiver and described second recover are all communicated with the waste pipe of the front cleaning area of described photoetching.
Further, the waste pipe of the front cleaning area of described photoetching is communicated with the first recover, and described first recover is communicated with described 3rd water receiver and described second recover.
Further, described first water receiver and described second water receiver all store pure water, and described 3rd water receiver stores the waste water of the front cleaning area of described photoetching that described first recover reclaims.
Base plate cleaning device of the present invention, by the water circulation use after cleaning base plate in front for photoetching cleaning area, reduces the water consumption of pure water, thus reduces production cost.
Accompanying drawing explanation
The following description carried out in conjunction with the drawings, the above-mentioned and other side of embodiments of the invention, feature and advantage will become clearly, in accompanying drawing:
Fig. 1 is the structural representation of a kind of base plate cleaning device of prior art;
Fig. 2 is the structural representation of the base plate cleaning device according to the first embodiment of the present invention;
Fig. 3 is the structural representation of base plate cleaning device according to a second embodiment of the present invention;
Fig. 4 is the structural representation of base plate cleaning device according to the third embodiment of the invention.
Embodiment
Below, embodiments of the invention are described in detail with reference to the accompanying drawings.But, the present invention can be implemented in many different forms, and the present invention should not be interpreted as being limited to the specific embodiment of setting forth here.On the contrary, provide these embodiments to be to explain principle of the present invention and practical application thereof, thus enable others skilled in the art understand various embodiment of the present invention and be suitable for the various amendments of certain expected application.
Fig. 2 is the structural representation of the base plate cleaning device according to the first embodiment of the present invention.
With reference to Fig. 2, comprise cleaning area 200 after the front cleaning area 100 of photoetching and photoetching according to the base plate cleaning device of the first embodiment of the present invention.Usually, photoetching district 300 to be arranged on after the front cleaning area 100 of photoetching and photoetching between cleaning area 200.Substrate carries out the cleaning of photoetching prebasal plate in the front cleaning area 100 of photoetching; The substrate cleaned before photoetching arrives photoetching district 300, in photoetching district 300, carry out lithography operations, and lithography operations comprises coating photoresist, exposure, development etc.; Cleaning area 200 after substrate arrival photoetching after photoetching, wherein, after photoetching, cleaning area 200 comprises elementary cleaning area 210, intermediate cleaning area 220 and whole level cleaning area 230, substrate after photoetching successively in elementary cleaning area 210, intermediate cleaning area 220 and whole level cleaning area 230 clean, through three grades of cleanings, photoresist on substrate the most at last after photoetching and developer solution are completely clear, ensure the cleannes of substrate, avoid causing the bad of substrate therefrom.In fig. 2, identify H and identify substrate trend.
On each cleaning area, all need to arrange water supply and waste discharge structure, specifically, the front cleaning area 100 of photoetching is provided with feed pipe 111 and waste pipe 112, elementary cleaning area 210 is provided with feed pipe 211 and waste pipe 212, and intermediate cleaning area 220 is provided with feed pipe 221 and waste pipe 222, and whole level cleaning area 230 is provided with feed pipe 231 and waste pipe 232, each cleaning area all provides water for cleaning by feed pipe, is drained by the waste water after cleaning by waste pipe.
Due to higher to the requirement of base-plate cleaning before photoetching, therefore pure water can only be utilized to clean substrate in the front cleaning area 100 of photoetching.Feed pipe 111 is communicated with in the first water receiver 120, first water receiver 120 and stores pure water, and feed pipe 111 utilizes the pure water in the first water receiver 120 to clean substrate, and the waste water after cleaning is discharged by waste pipe 112.
Substrate after photoetching, in cleaning process, without the need to all using pure water to clean, only need ensure to use pure water in whole level cleaning area 230.For this reason, the feed pipe 221 of middle rank cleaning area 220 is all communicated with the second water receiver 240 with the feed pipe 231 of whole level cleaning area 230, second water receiver 240 stores pure water, feed pipe 221 and feed pipe 231 utilize the pure water in the second water receiver 240 to the substrate through elementary cleaning carry out respectively middle rank cleaning and whole level cleaning, middle rank cleaning and whole level clean after waste water discharged by the waste pipe 222 of intermediate cleaning area 220 and the waste pipe 232 of whole level cleaning area 230 respectively.
The waste water that the waste pipe 112 of the front cleaning area of photoetching 100, the waste pipe 222 of intermediate cleaning area 220 and the waste pipe 232 of whole level cleaning area 230 are all communicated with the discharge of the second recover 250, second recover 250 pairs of waste pipes 112, waste pipe 222 and waste pipe 232 is recycled.The feed pipe 211 of elementary cleaning area 210 is communicated with the second recover 250, water after it utilizes the second recover 250 to reclaim carries out elementary cleaning to the substrate after photoetching, waste water after elementary cleaning comprises a large amount of photoresist and developer solution, cannot be recycled, directly be discharged by the waste pipe 212 of elementary cleaning area 210.
In the present embodiment, in order to the waste pipe 112 of front for photoetching cleaning area 100 is communicated with the second recover 250, further, the waste pipe 112 of the front cleaning area 100 of photoetching is communicated with the first recover 130, and this first recover 130 is communicated with the second recover 250 by pipeline.
To sum up, according to the base plate cleaning device of the first embodiment of the present invention, by the water circulation use after cleaning base plate in front for photoetching cleaning area 100, to be supplied to elementary cleaning area 210, meet the water consumption of elementary cleaning area 210, without the need to additionally filling up in pure water to elementary cleaning area 210, reducing the water consumption of pure water, thus reducing production cost.
Fig. 3 is the structural representation of base plate cleaning device according to a second embodiment of the present invention.
With reference to Fig. 3, base plate cleaning device according to a second embodiment of the present invention with shown in Fig. 2 according to compared with the base plate cleaning device of the first embodiment of the present invention, its difference is:
Substrate after photoetching, in cleaning process, without the need to all using pure water to clean, only need ensure to use pure water in whole level cleaning area 230.For this reason, the feed pipe 231 of whole level cleaning area 230 is communicated with the second water receiver 240, second water receiver 240 stores pure water, feed pipe 231 utilizes the pure water in the second water receiver 240 to carry out whole level cleaning to the substrate cleaned through middle rank, and the waste water after whole level cleaning is discharged by the waste pipe 232 of whole level cleaning area 230.
The waste pipe 112 of the front cleaning area 100 of photoetching is communicated with the 3rd water receiver 260, the feed pipe 221 of middle rank cleaning area 220 is communicated with the 3rd water receiver 260, and the water that the waste pipe 112 of the front cleaning area of photoetching 100 that feed pipe 221 utilizes the 3rd water receiver 260 to store is discharged carries out middle rank cleaning to the substrate after elementary cleaning.The waste water that the waste pipe 222 of middle rank cleaning area 220 and the waste pipe 232 of whole level cleaning area 230 are all communicated with second recover 250, second recover 250 pairs of waste pipes 222 and waste pipe 232 discharge is recycled.The feed pipe 211 of elementary cleaning area 210 is communicated with the second recover 250, water after it utilizes the second recover 250 to reclaim carries out elementary cleaning to the substrate after photoetching, waste water after elementary cleaning comprises a large amount of photoresist and developer solution, cannot be recycled, directly be discharged by the waste pipe 212 of elementary cleaning area 210.
In the present embodiment, in order to the waste pipe 112 of front for photoetching cleaning area 100 is communicated with the 3rd water receiver 260, further, the waste pipe 112 of the front cleaning area 100 of photoetching is communicated with the first recover 130, this first recover 130 is communicated with the 3rd water receiver 260 by pipeline, the Sewage treatment that first recover 130 pairs waste pipe 112 is got rid of utilizes, and the water after recycling is delivered to the 3rd water receiver 260.
To sum up, base plate cleaning device according to a second embodiment of the present invention, by the water circulation use after cleaning base plate in front for photoetching cleaning area 100, to be supplied to intermediate cleaning area 220, meet the water consumption of intermediate cleaning area 220, without the need to making intermediate cleaning area 220 utilize pure water to clean the substrate after elementary cleaning, reducing the water consumption of pure water, thus reducing production cost.
Fig. 4 is the structural representation of base plate cleaning device according to the third embodiment of the invention.
With reference to Fig. 4, base plate cleaning device according to the third embodiment of the invention with shown in Fig. 2 according to compared with the base plate cleaning device of the first embodiment of the present invention, its difference is:
Substrate after photoetching, in cleaning process, without the need to all using pure water to clean, only need ensure to use pure water in whole level cleaning area 230.For this reason, the feed pipe 231 of whole level cleaning area 230 is communicated with the second water receiver 240, second water receiver 240 stores pure water, feed pipe 231 utilizes the pure water in the second water receiver 240 to carry out whole level cleaning to the substrate cleaned through middle rank, and the waste water after whole level cleaning is discharged by the waste pipe 232 of whole level cleaning area 230.
The waste pipe 112 of the front cleaning area 100 of photoetching is communicated with the 3rd water receiver 260, the feed pipe 221 of middle rank cleaning area 220 is communicated with the 3rd water receiver 260, and the water that the waste pipe 112 of the front cleaning area of photoetching 100 that feed pipe 221 utilizes the 3rd water receiver 260 to store is discharged carries out middle rank cleaning to the substrate after elementary cleaning.
The waste water that the waste pipe 112 of the front cleaning area of photoetching 100, the waste pipe 222 of intermediate cleaning area 220 and the waste pipe 232 of whole level cleaning area 230 are all communicated with the discharge of the second recover 250, second recover 250 pairs of waste pipes 112, waste pipe 222 and waste pipe 232 is recycled.The feed pipe 211 of elementary cleaning area 210 is communicated with the second recover 250, water after it utilizes the second recover 250 to reclaim carries out elementary cleaning to the substrate after photoetching, waste water after elementary cleaning comprises a large amount of photoresist and developer solution, cannot be recycled, directly be discharged by the waste pipe 212 of elementary cleaning area 210.
In the present embodiment, in order to the waste pipe 112 of front for photoetching cleaning area 100 is communicated with the 3rd water receiver 260, second recover 250, further, the waste pipe 112 of the front cleaning area 100 of photoetching is communicated with the first recover 130, this first recover 130 is communicated with the 3rd water receiver 260, second recover 250 respectively by pipeline, the Sewage treatment that first recover 130 pairs waste pipe 112 is got rid of utilizes, and the water after recycling is delivered to the 3rd water receiver 260 and the second recover 250.
To sum up, according to the third embodiment of the invention base plate cleaning device, by the water circulation use after cleaning base plate in front for photoetching cleaning area 100, to be supplied to elementary cleaning area 210 and intermediate cleaning area 220, meet the water consumption of elementary cleaning area 210 and intermediate cleaning area 220, without the need to additionally filling up pure water to elementary cleaning area 210, and also without the need to making intermediate cleaning area 220 utilize pure water to clean the substrate after elementary cleaning, reduce the water consumption of pure water, thus reduce production cost.
Although illustrate and describe the present invention with reference to specific embodiment, but it should be appreciated by those skilled in the art that: when not departing from the spirit and scope of the present invention by claim and equivalents thereof, the various changes in form and details can be carried out at this.

Claims (9)

1. a base plate cleaning device, comprise cleaning area (200) after the front cleaning area of photoetching (100) and photoetching, the front cleaning area of described photoetching (100) comprises feed pipe and waste pipe, the feed pipe of the front cleaning area of described photoetching (100) is communicated with the first water receiver (120), after described photoetching, cleaning area (200) comprise elementary cleaning area (210) adjacent successively, middle rank cleaning area (220) and whole level cleaning area (230), described elementary cleaning area (210), described intermediate cleaning area (220) and described whole level cleaning area (230) include feed pipe and waste pipe, it is characterized in that, the feed pipe (221) of described intermediate cleaning area (220) is all communicated with the second water receiver (240) with the feed pipe (231) of described whole level cleaning area (230), the feed pipe (211) of described elementary cleaning area (210) is communicated with the second recover (250), the waste pipe (222) of described intermediate cleaning area (220) is all communicated with described second recover (250) with the waste pipe (232) of described whole level cleaning area (230), described second recover (250) is communicated with the waste pipe (112) of the front cleaning area of described photoetching (100).
2. base plate cleaning device according to claim 1, it is characterized in that, the waste pipe (112) of the front cleaning area of described photoetching (100) is communicated with the first recover (130), and described first recover (130) is communicated with described second recover (250).
3. according to the base plate cleaning device of claim 1 or 2, it is characterized in that, described first water receiver (120) and described second water receiver (240) all store pure water.
4. a base plate cleaning device, comprise cleaning area (200) after the front cleaning area of photoetching (100) and photoetching, the front cleaning area of described photoetching (100) comprises feed pipe and waste pipe, the feed pipe of the front cleaning area of described photoetching (100) is communicated with the first water receiver (120), after described photoetching, cleaning area (200) comprise elementary cleaning area (210) adjacent successively, middle rank cleaning area (220) and whole level cleaning area (230), described elementary cleaning area (210), described intermediate cleaning area (220) and described whole level cleaning area (230) include feed pipe and waste pipe, it is characterized in that, the feed pipe (231) of described whole level cleaning area (230) is communicated with the second water receiver (240), the feed pipe (221) of described intermediate cleaning area (220) is communicated with the 3rd water receiver (260), the feed pipe (211) of described elementary cleaning area (210) is communicated with the second recover (250), the waste pipe (222) of described intermediate cleaning area (220) is all communicated with described second recover (250) with the waste pipe (232) of described whole level cleaning area (230), described 3rd water receiver (260) is communicated with the waste pipe (112) of the front cleaning area of described photoetching (100).
5. base plate cleaning device according to claim 4, it is characterized in that, the waste pipe (112) of the front cleaning area of described photoetching (100) is communicated with the first recover (130), and described first recover (130) is communicated with described 3rd water receiver (260).
6. according to the base plate cleaning device of claim 4 or 5, it is characterized in that, described first water receiver (120) and described second water receiver (240) all store pure water, and described 3rd water receiver (260) stores the waste water of the front cleaning area of described photoetching (100) that described first recover (130) is reclaimed.
7. a base plate cleaning device, comprise cleaning area (200) after the front cleaning area of photoetching (100) and photoetching, the front cleaning area of described photoetching (100) comprises feed pipe and waste pipe, the feed pipe of the front cleaning area of described photoetching (100) is communicated with the first water receiver (120), after described photoetching, cleaning area (200) comprise elementary cleaning area (210) adjacent successively, middle rank cleaning area (220) and whole level cleaning area (230), described elementary cleaning area (210), described intermediate cleaning area (220) and described whole level cleaning area (230) include feed pipe and waste pipe, it is characterized in that, the feed pipe (231) of described whole level cleaning area (230) is communicated with the second water receiver (240), the feed pipe (221) of described intermediate cleaning area (220) is communicated with the 3rd water receiver (260), the feed pipe (211) of described elementary cleaning area (210) is communicated with the second recover (250), the waste pipe (222) of described intermediate cleaning area (220) is all communicated with described second recover (250) with the waste pipe (232) of described whole level cleaning area (230), described 3rd water receiver (260) and described second recover (250) are all communicated with the waste pipe (112) of the front cleaning area of described photoetching (100).
8. base plate cleaning device according to claim 7, it is characterized in that, the waste pipe (112) of the front cleaning area of described photoetching (100) is communicated with the first recover (130), and described first recover (130) is communicated with described 3rd water receiver (260) and described second recover (250).
9. according to the base plate cleaning device of claim 7 or 8, it is characterized in that, described first water receiver (120) and described second water receiver (240) all store pure water, and described 3rd water receiver (260) stores the waste water of the front cleaning area of described photoetching (100) that described first recover (130) is reclaimed.
CN201410855471.0A 2014-12-31 2014-12-31 A kind of base plate cleaning device Active CN104465332B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107479342A (en) * 2017-09-23 2017-12-15 武汉华星光电技术有限公司 A kind of developing apparatus and developing method
US10500607B2 (en) 2017-09-23 2019-12-10 Wuhan China Star Optoelectronics Technology Co., Ltd Developing device and developing method

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPS54155838A (en) * 1978-05-23 1979-12-08 Fsi Corp Method of and device for developing positive picture
CN101570404A (en) * 2008-04-30 2009-11-04 深超光电(深圳)有限公司 Washing system
CN202725542U (en) * 2012-08-28 2013-02-13 京东方科技集团股份有限公司 Cleaning device for developed substrates

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54155838A (en) * 1978-05-23 1979-12-08 Fsi Corp Method of and device for developing positive picture
CN101570404A (en) * 2008-04-30 2009-11-04 深超光电(深圳)有限公司 Washing system
CN202725542U (en) * 2012-08-28 2013-02-13 京东方科技集团股份有限公司 Cleaning device for developed substrates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107479342A (en) * 2017-09-23 2017-12-15 武汉华星光电技术有限公司 A kind of developing apparatus and developing method
WO2019056562A1 (en) * 2017-09-23 2019-03-28 武汉华星光电技术有限公司 Developing device, and developing method
US10500607B2 (en) 2017-09-23 2019-12-10 Wuhan China Star Optoelectronics Technology Co., Ltd Developing device and developing method

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