CN104465332B - A kind of base plate cleaning device - Google Patents
A kind of base plate cleaning device Download PDFInfo
- Publication number
- CN104465332B CN104465332B CN201410855471.0A CN201410855471A CN104465332B CN 104465332 B CN104465332 B CN 104465332B CN 201410855471 A CN201410855471 A CN 201410855471A CN 104465332 B CN104465332 B CN 104465332B
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- Prior art keywords
- cleaning area
- photoetching
- area
- cleaning
- water
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
Abstract
The present invention discloses a kind of base plate cleaning device, including cleaning area (200) after the preceding cleaning area of photoetching (100) and photoetching, the preceding cleaning area of photoetching (100) includes feed pipe and waste pipe, the feed pipe of the preceding cleaning area of photoetching (100) connects the first water receiver (120), cleaning area (200) include primary cleaning area (210) adjacent successively after photoetching, intermediate cleaning area (220) and whole level cleaning area (230), primary cleaning area (210), intermediate cleaning area (220) and whole level cleaning area (230) include feed pipe and waste pipe, feed pipe (221) with feed pipe (231) connect the second water receiver (240), feed pipe (211) connects the second recover (250), waste pipe (222) connects the second recover (250) with waste pipe (232), second recover (250) connection waste pipe (112).The base plate cleaning device of the present invention, by the water circulation use after cleaning base plate in the preceding cleaning area of photoetching, reduces the water consumption of pure water, so as to reduce production cost.
Description
Technical field
The present invention relates to a kind of base plate cleaning device.
Background technology
In the manufacturing process of liquid crystal display device, will be formed thin film transistor (TFT) (TFT) substrate substrate be required for through
Cross coating photoresist, expose, develop such a photo-mask process.Wherein, the purpose of development is to remove in exposure process
The photoresist of light reaction is there occurs, so as to form photoetching agent pattern corresponding with exposure mask plate, base after development on substrate
Position covered with photoresist on plate, due to the protection of photoresist, the gold of relevant position during next process is etched
Category or it is nonmetallic will not suffer damage so that finally reach on substrate formed thin film transistor (TFT) (TFT) purpose.
Because the purity requirements to substrate are very high, so generally before substrate is applied photoresist, and development
It is both needed to clean substrate afterwards.Fig. 1 is a kind of structural representation of base plate cleaning device of prior art.Reference picture 1, figure
Middle A represents that B represents that substrate carries out H in the photoetching area of photoetching, figure and represents base in the cleaning area that substrate is applied before photoresist, figure
The transport trend of plate, photoetching area is close to the cleaning area after photoetching, and the cleaning area after photoetching includes three-level cleaning area, after photoetching
Substrate carry out the cleanings of three phases, this three-level cleaning area specially successively adjacent primary cleaning area C, middle rank cleaning area D
With whole level cleaning area E.
The cleaning area A that substrate is applied before photoresist includes feed pipe 11 and waste pipe 12, by feed pipe 11 by water storage
Water in device 10 is supplied to cleaning area A, to carry out the cleaning before photoetching, afterwards, the water in the A of cleaning area after cleaning base plate to substrate
It is expelled directly out by waste pipe 12.After substrate enters in photoetching area B, substrate is applied photoresist, exposure by carry out photoetching, i.e. substrate
Light, development.Primary cleaning area C is provided with feed pipe 21 and waste pipe 22, from feed pipe 21 by the recycle-water in recover 30 to
Primary cleaning area C supplies, to carry out primary cleaning to the substrate after photoetching, afterwards, contaminated water is by arranging in primary cleaning area C
Useless pipe 22 is expelled directly out.Intermediate cleaning area D is provided with feed pipe 31 and waste pipe 32, by feed pipe 31 by the water in water receiver 20
Supplied to intermediate cleaning area D, it is afterwards, contaminated in intermediate cleaning area D to carry out intermediate cleaning to the substrate after primary cleaning
Water is expelled in recover 30 by waste pipe 32, to recycle.Whole level cleaning area E is provided with feed pipe 41 and waste pipe 42,
The water in water receiver 20 is supplied to whole level cleaning area E from feed pipe 41, cleaned with carrying out whole level to the substrate after middle rank cleaning,
Afterwards, contaminated water is expelled in recover 30 by waste pipe 42 in whole level cleaning area E, to recycle.
However, in the prior art, the water cleanliness factor in the A of cleaning area after cleaning base plate is of a relatively high, and due to photoetching before
Requirement to base-plate cleaning is high, therefore the water in the A of cleaning area after cleaning base plate can not be recycled in the A of cleaning area.And
In the whole level cleaning area E of cleaning area after photoetching, in order to ensure the cleannes of substrate, it is necessary to use pure water, primary cleaning area C and
It is not limited to apply pure water in intermediate cleaning area D, and in the prior art, intermediate cleaning area D and whole level cleaning area E cleaning base plates
Cycle water afterwards can not meet primary cleaning area C water consumption, it is therefore necessary to be filled up with pure water, improve the water consumption of pure water,
Add production cost.
The content of the invention
In order to solve the problem of above-mentioned prior art is present, it is an object of the invention to provide a kind of base plate cleaning device,
Including cleaning area after the preceding cleaning area of photoetching and photoetching, the preceding cleaning area of photoetching includes feed pipe and waste pipe, before the photoetching
The feed pipe of cleaning area connects the first water receiver, and cleaning area includes primary cleaning area adjacent successively, middle rank clearly after the photoetching
Wash area and whole level cleaning area, the primary cleaning area, the intermediate cleaning area and the whole level cleaning area include feed pipe and
Waste pipe, the feed pipe of the intermediate cleaning area and the feed pipe of the whole level cleaning area connect the second water receiver, described first
The feed pipe of level cleaning area connects the waste pipe of the second recover, the waste pipe of the intermediate cleaning area and the whole level cleaning area
Second recover is connected, second recover connects the waste pipe of the preceding cleaning area of photoetching.
Further, the waste pipe of the preceding cleaning area of the photoetching connects the first recover, and first recover connects institute
State the second recover.
Further, first water receiver and second water receiver store pure water.
Another object of the present invention also resides in a kind of base plate cleaning device of offer, including after the preceding cleaning area of photoetching and photoetching clearly
Area is washed, the preceding cleaning area of photoetching includes feed pipe and waste pipe, and the feed pipe of the preceding cleaning area of photoetching connects the first water storage
Device, cleaning area includes primary cleaning area adjacent successively, intermediate cleaning area and whole level cleaning area after the photoetching, described primary clear
Washing area, the intermediate cleaning area and the whole level cleaning area includes feed pipe and waste pipe, the water supply of the whole level cleaning area
Pipe connects the second water receiver, and the feed pipe of the intermediate cleaning area connects the 3rd water receiver, the feed pipe of the primary cleaning area
The second recover is connected, the waste pipe of the intermediate cleaning area is connected described second time with the waste pipe of the whole level cleaning area
Device is received, the 3rd water receiver connects the waste pipe of the preceding cleaning area of photoetching.
Further, the waste pipe of the preceding cleaning area of the photoetching connects the first recover, and first recover connects institute
State the 3rd water receiver.
Further, first water receiver and second water receiver store pure water, the 3rd water receiver storage
The waste water for the preceding cleaning area of the photoetching that first recover is reclaimed.
A further object of the present invention is to provide a kind of base plate cleaning device again, including after the preceding cleaning area of photoetching and photoetching clearly
Area is washed, the preceding cleaning area of photoetching includes feed pipe and waste pipe, and the feed pipe of the preceding cleaning area of photoetching connects the first water storage
Device, cleaning area includes primary cleaning area adjacent successively, intermediate cleaning area and whole level cleaning area after the photoetching, described primary clear
Washing area, the intermediate cleaning area and the whole level cleaning area includes feed pipe and waste pipe, the water supply of the whole level cleaning area
Pipe connects the second water receiver, and the feed pipe of the intermediate cleaning area connects the 3rd water receiver, the feed pipe of the primary cleaning area
The second recover is connected, the waste pipe of the intermediate cleaning area is connected described second time with the waste pipe of the whole level cleaning area
Device is received, the 3rd water receiver connects the waste pipe of the preceding cleaning area of the photoetching with second recover.
Further, the waste pipe of the preceding cleaning area of the photoetching connects the first recover, and first recover connects institute
State the 3rd water receiver and second recover.
Further, first water receiver and second water receiver store pure water, the 3rd water receiver storage
The waste water for the preceding cleaning area of the photoetching that first recover is reclaimed.
The base plate cleaning device of the present invention, the water circulation use after cleaning base plate in the preceding cleaning area of photoetching is reduced pure
The water consumption of water, so as to reduce production cost.
Brief description of the drawings
Pass through the following description carried out with reference to accompanying drawing, above and other aspect, feature and the advantage of embodiments of the invention
It will become clearer, in accompanying drawing：
Fig. 1 is a kind of structural representation of base plate cleaning device of prior art；
Fig. 2 is the structural representation of the base plate cleaning device according to the first embodiment of the present invention；
Fig. 3 is the structural representation of base plate cleaning device according to the second embodiment of the present invention；
Fig. 4 is the structural representation of base plate cleaning device according to the third embodiment of the invention.
Embodiment
Hereinafter, with reference to the accompanying drawings to embodiments of the invention are described in detail.However, it is possible to come real in many different forms
Apply the present invention, and the specific embodiment of the invention that should not be construed as limited to illustrate here.It is opposite that there is provided these implementations
Example is in order to explain the principle and its practical application of the present invention, so that others skilled in the art are it will be appreciated that the present invention
Various embodiments and be suitable for the various modifications of specific intended application.
Fig. 2 is the structural representation of the base plate cleaning device according to the first embodiment of the present invention.
Reference picture 2, includes the preceding cleaning area 100 of photoetching and photoetching according to the base plate cleaning device of the first embodiment of the present invention
Cleaning area 200 afterwards.Generally, photoetching area 300 is arranged on after the preceding cleaning area 100 of photoetching and photoetching between cleaning area 200.Substrate is in light
Carve preceding cleaning area 100 and carry out photoetching prebasal plate cleaning；Substrate through being cleaned before photoetching reaches photoetching area 300, in photoetching area 300
Lithography operations are carried out, lithography operations include coating photoresist, exposure, development etc.；Substrate after photoetching reached and cleaned after photoetching
Area 200, wherein, cleaning area 200 includes primary cleaning area 210, intermediate cleaning area 220 and whole level cleaning area 230 after photoetching, through light
Substrate after quarter is cleaned in primary cleaning area 210, intermediate cleaning area 220 and whole level cleaning area 230 successively, clear by three-level
Wash, photoresist on substrate and developer solution most at last after photoetching are fully apparent from, it is ensured that the cleannes of substrate, it is to avoid lead therefrom
Cause the bad of substrate.In fig. 2, mark H marks substrate trend.
On each cleaning area, it is required for setting and supplies water and waste discharge structure, specifically, the preceding cleaning area 100 of photoetching is set
There are feed pipe 111 and waste pipe 112, primary cleaning area 210 is provided with feed pipe 211 and waste pipe 212, intermediate cleaning area 220
Feed pipe 221 and waste pipe 222 are provided with, whole level cleaning area 230 is provided with feed pipe 231 and waste pipe 232, each cleaning area
Water for cleaning all is provided by feed pipe, the waste water after cleaning is drained by waste pipe.
Can only be using pure water to base because the requirement before photoetching to base-plate cleaning is higher, therefore in the preceding cleaning area 100 of photoetching
Plate is cleaned.Feed pipe 111 connects the first water receiver 120, stores pure water in the first water receiver 120, and feed pipe 111 utilizes the
Pure water in one water receiver 120 is cleaned to substrate, and the waste water after cleaning is discharged by waste pipe 112.
Substrate after photoetching is in cleaning process, without all being cleaned using pure water, only need to ensure whole level cleaning area
Pure water is used in 230.Therefore, the feed pipe 221 of intermediate cleaning area 220 and the feed pipe 231 of whole level cleaning area 230 connect
Logical second water receiver 240, the second water receiver 240 storage pure water, feed pipe 221 and feed pipe 231 are using in the second water receiver 240
Pure water middle rank cleaning is carried out respectively to the substrate through primary cleaning and whole level is cleaned, it is useless after middle rank cleaning and whole level cleaning
Water is discharged by the waste pipe 222 of intermediate cleaning area 220 and the waste pipe 232 of whole level cleaning area 230 respectively.
The waste pipe 112 of the preceding cleaning area 100 of photoetching, the waste pipe 222 of intermediate cleaning area 220 and whole level cleaning area 230
Waste pipe 232 connects the second recover 250, and the second recover 250 is to waste pipe 112, waste pipe 222 and the row of waste pipe 232
The waste water gone out is recycled.The feed pipe 211 of primary cleaning area 210 connects the second recover 250, and it is reclaimed using second
Water after device 250 is reclaimed carries out primary cleaning to the substrate after photoetching, the waste water after primary cleaning include a large amount of photoresists and
Developer solution, it is impossible to be recycled, is expelled directly out by the waste pipe 212 of primary cleaning area 210.
In the present embodiment, in order to which the waste pipe 112 of the preceding cleaning area 100 of photoetching is connected with the second recover 250, one is entered
Step ground, the waste pipe 112 of the preceding cleaning area 100 of photoetching connects the first recover 130, and first recover 130 passes through pipeline and the
Two recovers 250 are connected.
To sum up, according to the base plate cleaning device of the first embodiment of the present invention, by cleaning base plate in the preceding cleaning area 100 of photoetching
Water circulation use afterwards, to be supplied to primary cleaning area 210, meets the water consumption of primary cleaning area 210, without additionally filling up
Pure water reduces the water consumption of pure water into primary cleaning area 210, so as to reduce production cost.
Fig. 3 is the structural representation of base plate cleaning device according to the second embodiment of the present invention.
Reference picture 3, shown in base plate cleaning device and Fig. 2 according to the second embodiment of the present invention according to the of the present invention
The base plate cleaning device of one embodiment is compared, and its difference is：
Substrate after photoetching is in cleaning process, without all being cleaned using pure water, only need to ensure whole level cleaning area
Pure water is used in 230.Therefore, the feed pipe 231 of whole level cleaning area 230 connects the second water receiver 240, the second water receiver
240 storage pure water, feed pipe 231 carries out whole level to the substrate through middle rank cleaning using the pure water in the second water receiver 240 and cleaned,
Waste water after whole level cleaning is discharged by the waste pipe 232 of whole level cleaning area 230.
The waste pipe 112 of the preceding cleaning area 100 of photoetching connects the 3rd water receiver 260, the feed pipe 221 of intermediate cleaning area 220
Connect the 3rd water receiver 260, the waste pipe 112 for the preceding cleaning area 100 of photoetching that feed pipe 221 is stored using the 3rd water receiver 260
The water of discharge carries out intermediate cleaning to the substrate after primary cleaning.The waste pipe 222 of intermediate cleaning area 220 and whole level cleaning area
230 waste pipe 232 connects the second recover 250, and the second recover 250 gives up to waste pipe 222 and the discharge of waste pipe 232
Water is recycled.The feed pipe 211 of primary cleaning area 210 connects the second recover 250, and it utilizes the second recover 250
Water after recovery carries out primary cleaning to the substrate after photoetching, and the waste water after primary cleaning includes a large amount of photoresists and development
Liquid, it is impossible to be recycled, is expelled directly out by the waste pipe 212 of primary cleaning area 210.
In the present embodiment, in order to which the waste pipe 112 of the preceding cleaning area 100 of photoetching is connected with the 3rd water receiver 260, one is entered
Step ground, the waste pipe 112 of the preceding cleaning area 100 of photoetching connects the first recover 130, and first recover 130 passes through pipeline and the
Three water receivers 260 are connected, and Sewage treatment that the first recover 130 is excluded to waste pipe 112 is utilized, and by the water after recycling
It is delivered to the 3rd water receiver 260.
To sum up, base plate cleaning device according to the second embodiment of the present invention, by cleaning base plate in the preceding cleaning area 100 of photoetching
Water circulation use afterwards, to be supplied to intermediate cleaning area 220, meets the water consumption of intermediate cleaning area 220, intermediate clear without making
Wash area 220 to clean the substrate after primary cleaning using pure water, the water consumption of pure water is reduced, so as to reduce production
Cost.
Fig. 4 is the structural representation of base plate cleaning device according to the third embodiment of the invention.
Reference picture 4, shown in base plate cleaning device and Fig. 2 according to the third embodiment of the invention according to the of the present invention
The base plate cleaning device of one embodiment is compared, and its difference is：
Substrate after photoetching is in cleaning process, without all being cleaned using pure water, only need to ensure whole level cleaning area
Pure water is used in 230.Therefore, the feed pipe 231 of whole level cleaning area 230 connects the second water receiver 240, the second water receiver
240 storage pure water, feed pipe 231 carries out whole level to the substrate through middle rank cleaning using the pure water in the second water receiver 240 and cleaned,
Waste water after whole level cleaning is discharged by the waste pipe 232 of whole level cleaning area 230.
The waste pipe 112 of the preceding cleaning area 100 of photoetching connects the 3rd water receiver 260, the feed pipe 221 of intermediate cleaning area 220
Connect the 3rd water receiver 260, the waste pipe 112 for the preceding cleaning area 100 of photoetching that feed pipe 221 is stored using the 3rd water receiver 260
The water of discharge carries out intermediate cleaning to the substrate after primary cleaning.
The waste pipe 112 of the preceding cleaning area 100 of photoetching, the waste pipe 222 of intermediate cleaning area 220 and whole level cleaning area 230
Waste pipe 232 connects the second recover 250, and the second recover 250 is to waste pipe 112, waste pipe 222 and the row of waste pipe 232
The waste water gone out is recycled.The feed pipe 211 of primary cleaning area 210 connects the second recover 250, and it is reclaimed using second
Water after device 250 is reclaimed carries out primary cleaning to the substrate after photoetching, the waste water after primary cleaning include a large amount of photoresists and
Developer solution, it is impossible to be recycled, is expelled directly out by the waste pipe 212 of primary cleaning area 210.
In the present embodiment, in order to by the water receiver 260, second of waste pipe 112 and the 3rd of the preceding cleaning area 100 of photoetching reclaim
Device 250 is connected, further, and the waste pipe 112 of the preceding cleaning area 100 of photoetching connects the first recover 130, first recover
130 are connected with the 3rd water receiver 260, the second recover 250 respectively by pipeline, and the first recover 130 is excluded to waste pipe 112
Sewage treatment utilize, and the water after recycling is delivered to the 3rd water receiver 260 and the second recover 250.
To sum up, base plate cleaning device according to the third embodiment of the invention, by cleaning base plate in the preceding cleaning area 100 of photoetching
Water circulation use afterwards, to be supplied to primary cleaning area 210 and intermediate cleaning area 220, meets primary cleaning area 210 and middle rank
The water consumption of cleaning area 220, without additionally filling up pure water to primary cleaning area 210, and it is sharp without intermediate cleaning area 220 is made
The substrate after primary cleaning is cleaned with pure water, the water consumption of pure water is reduced, so as to reduce production cost.
Although the present invention has shown and described with reference to specific embodiment, it should be appreciated by those skilled in the art that：
In the case where not departing from the spirit and scope of the present invention limited by claim and its equivalent, can carry out herein form and
Various change in details.
Claims (6)
1. it is clear before the photoetching after a kind of base plate cleaning device, including the preceding cleaning area of photoetching (100) and photoetching cleaning area (200)
Washing area (100) includes feed pipe and waste pipe, and the feed pipe of the preceding cleaning area of photoetching (100) connects the first water receiver (120),
Cleaning area (200) include primary cleaning area (210) adjacent successively, intermediate cleaning area (220) and whole level cleaning after the photoetching
Area (230), the primary cleaning area (210), the intermediate cleaning area (220) and the whole level cleaning area (230) include supplying
Water pipe and waste pipe, it is characterised in that set behind the preceding cleaning area of the photoetching (100) and the photoetching between cleaning area (200)
Put the photoetching area (300) for carrying out photoetching to substrate, the feed pipe (221) and the whole level of the intermediate cleaning area (220)
The feed pipe (231) of cleaning area (230) connects the second water receiver (240), the feed pipe of the primary cleaning area (210)
(211) the second recover of connection (250), the waste pipe (222) of the intermediate cleaning area (220) and the whole level cleaning area
(230) waste pipe (232) connects second recover (250), and second recover (250) is connected before the photoetching
The waste pipe (112) of cleaning area (100), first water receiver (120) and second water receiver (240) store pure water.
2. base plate cleaning device according to claim 1, it is characterised in that the waste pipe of the preceding cleaning area of photoetching (100)
(112) the first recover of connection (130), first recover (130) connects second recover (250).
3. it is clear before the photoetching after a kind of base plate cleaning device, including the preceding cleaning area of photoetching (100) and photoetching cleaning area (200)
Washing area (100) includes feed pipe and waste pipe, and the feed pipe of the preceding cleaning area of photoetching (100) connects the first water receiver (120),
Cleaning area (200) include primary cleaning area (210) adjacent successively, intermediate cleaning area (220) and whole level cleaning after the photoetching
Area (230), the primary cleaning area (210), the intermediate cleaning area (220) and the whole level cleaning area (230) include supplying
Water pipe and waste pipe, it is characterised in that set behind the preceding cleaning area of the photoetching (100) and the photoetching between cleaning area (200)
The photoetching area (300) for carrying out photoetching to substrate is put, feed pipe (231) connection second of the whole level cleaning area (230) is stored up
Hydrophone (240), the feed pipe (221) of the intermediate cleaning area (220) connects the 3rd water receiver (260), the primary cleaning area
(210) feed pipe (211) connects the second recover (250), the waste pipe (222) of the intermediate cleaning area (220) and described
The waste pipe (232) of whole level cleaning area (230) connects second recover (250), the 3rd water receiver (260) connection
The waste pipe (112) of the preceding cleaning area of photoetching (100)；First water receiver (120) and second water receiver (240) are
Pure water is stored, the 3rd water receiver (260) stores the waste water of the preceding cleaning area of photoetching (100).
4. base plate cleaning device according to claim 3, it is characterised in that the waste pipe of the preceding cleaning area of photoetching (100)
(112) the first recover of connection (130), first recover (130) connects the 3rd water receiver (260).
5. it is clear before the photoetching after a kind of base plate cleaning device, including the preceding cleaning area of photoetching (100) and photoetching cleaning area (200)
Washing area (100) includes feed pipe and waste pipe, and the feed pipe of the preceding cleaning area of photoetching (100) connects the first water receiver (120),
Cleaning area (200) include primary cleaning area (210) adjacent successively, intermediate cleaning area (220) and whole level cleaning after the photoetching
Area (230), the primary cleaning area (210), the intermediate cleaning area (220) and the whole level cleaning area (230) include supplying
Water pipe and waste pipe, it is characterised in that set behind the preceding cleaning area of the photoetching (100) and the photoetching between cleaning area (200)
The photoetching area (300) for carrying out photoetching to substrate is put, feed pipe (231) connection second of the whole level cleaning area (230) is stored up
Hydrophone (240), the feed pipe (221) of the intermediate cleaning area (220) connects the 3rd water receiver (260), the primary cleaning area
(210) feed pipe (211) connects the second recover (250), the waste pipe (222) of the intermediate cleaning area (220) and described
The waste pipe (232) of whole level cleaning area (230) connects second recover (250), the 3rd water receiver (260) and institute
State the waste pipe (112) that the second recover (250) connects the preceding cleaning area of the photoetching (100)；First water receiver (120)
Pure water is stored with second water receiver (240), the 3rd water receiver (260) stores the preceding cleaning area of photoetching (100)
Waste water.
6. base plate cleaning device according to claim 5, it is characterised in that the waste pipe of the preceding cleaning area of photoetching (100)
(112) the first recover of connection (130), first recover (130) connects the 3rd water receiver (260) and described second
Recover (250).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410855471.0A CN104465332B (en) | 2014-12-31 | 2014-12-31 | A kind of base plate cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410855471.0A CN104465332B (en) | 2014-12-31 | 2014-12-31 | A kind of base plate cleaning device |
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| Publication Number | Publication Date |
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| CN104465332A CN104465332A (en) | 2015-03-25 |
| CN104465332B true CN104465332B (en) | 2017-07-11 |
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| CN201410855471.0A Active CN104465332B (en) | 2014-12-31 | 2014-12-31 | A kind of base plate cleaning device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107479342B (en) * | 2017-09-23 | 2020-11-06 | 武汉华星光电技术有限公司 | Developing device and developing method |
| US10500607B2 (en) | 2017-09-23 | 2019-12-10 | Wuhan China Star Optoelectronics Technology Co., Ltd | Developing device and developing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101570404A (en) * | 2008-04-30 | 2009-11-04 | 深超光电（深圳）有限公司 | Washing system |
| CN202725542U (en) * | 2012-08-28 | 2013-02-13 | 京东方科技集团股份有限公司 | Cleaning device for developed substrates |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4197000A (en) * | 1978-05-23 | 1980-04-08 | Fsi Corporation | Positive developing method and apparatus |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101570404A (en) * | 2008-04-30 | 2009-11-04 | 深超光电（深圳）有限公司 | Washing system |
| CN202725542U (en) * | 2012-08-28 | 2013-02-13 | 京东方科技集团股份有限公司 | Cleaning device for developed substrates |
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| CN104465332A (en) | 2015-03-25 |
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