CN202362583U

CN202362583U - Manual etching device

Info

Publication number: CN202362583U
Application number: CN2011205138541U
Authority: CN
Inventors: 李剑江
Original assignee: Semiconductor Manufacturing International Shanghai Corp
Current assignee: Semiconductor Manufacturing International Beijing Corp
Priority date: 2011-12-09
Filing date: 2011-12-09
Publication date: 2012-08-01
Anticipated expiration: 2021-12-09

Abstract

The utility model relates to a manual etching device which is used for repairing a chromium defect on a mask plate. The manual etching device comprises an optical microscope, a mask plate placement base and an etching liquid nozzle, wherein the optical microscope sequentially comprises an eyepiece, a lamp, a lens base, an optical lens and an optical microscope base from top to bottom; the mask plate placement base is positioned between the optical lens and the optical microscope base; and the etching liquid nozzle is positioned on one side of the optical microscope. The position of the defect is determined by using the optical microscope in the manual etching device, and the defect is exposed by the white light of the optical microscope, subjected to wet etching by using the etching liquid nozzle of the manual etching device and then repaired. The manual etching device is simple in structure and can repair a large area of chromium defect on the mask plate, a great amount of repair time is saved, and a great number of resources are saved.

Description

Manual etching device

Technical field

The utility model relates to semiconductor applications, particularly a kind of manual etching device.

Background technology

In semiconductor applications, mask is to be used to provide line pattern so that carry out the element of design transfer, and the chromium plate mask of existing general usefulness is that sol evenning chromium plate is passed through the product after light is painted processing.

The manufacturing process of existing chromium plate mask is shown in Fig. 1 a-1i, and shown in Fig. 1 a, deposit molybdenum silicide 101, chromium layer 102, chromium oxide ARC 103 successively on quartz glass 100 apply first photoresist 104 on chromium oxide ARC 103; Shown in Fig. 1 b, first photoresist 104 is made public, then first photoresist 104 is developed, partly form the first window 104a through chemical solvent dissolving resist exposure; Shown in Fig. 1 c, the chromium oxide ARC 103 in the etching first window 104a forms the second window 103a with chromium layer 102; Shown in Fig. 1 d, remove first photoresist; Shown in Fig. 1 e, dry etching is removed the molybdenum silicide 101 in the second window 103a; Shown in Fig. 1 f, cleaning and removing is removed dust and impurity, then at said structure surface-coated second photoresist 105; Shown in Fig. 1 g, second photoresist 105 is made public, then second photoresist 105 is developed, partly form the 3rd window 105a through chemical solvent dissolving resist exposure; Shown in Fig. 1 h, chromium oxide ARC 103 and chromium layer 102 in etching the 3rd window 105a; Shown in Fig. 1 i, remove second photoresist 105 again, obtain phase shift mask (PSM, Phase-Shift Mask).

In the process of making mask; Thereby can on mask, produce defective by residual chromium; The defective of repairing on the mask is perplexing us, generally needs cost great amount of time and resource, when defective during greater than 20 μ m; Need the cost more time, the defective that chromium residues causes mainly be cleaning and removing remove dust and impurity and apply second photoresist, particle is introduced generation in the wet etching of exposure imaging and chromium for the second time.Be illustrated in figure 2 as the synoptic diagram of phase shift mask under optical microscope that has the chromium defective; Irregular figure is the defective that chromium residues causes; The least unit of coordinate is 5 μ m among the said figure, among the figure on the ordinate of chromium defective greater than 30 μ m, generally repair the chromium defective on the mask in the prior art with FIB; But FIB can only be handled the defective below the 20um; Large-area defective can not be repaired with FIB, and phase shift mask as shown in Figure 2 just can not be repaired with FIB, thereby causes some important mask to have to abandon.

The utility model content

The purpose of the utility model provides a kind of manual etching device, to repair mask large tracts of land defective.

The technical solution of the utility model is a kind of manual etching device, comprises optical microscope, mask placement pedestal and etching liquid nozzle; Said optical microscope comprises eyepiece, lamp, camera lens pedestal, optical lens and optical microscope pedestal from top to bottom successively; Said mask is placed pedestal between optical lens and optical microscope pedestal, and said etching liquid nozzle is positioned at optical microscope one side.

As preferably: said optical microscope also comprises optical filter, and said optical filter places on the camera lens pedestal.

As preferably: said optical filter is a yellow filter.

As preferably: said manual etching device comprises that also mask places the antidetonation basal plane of pedestal below.

As preferably: said manual etching device also comprises the container of placing etching liquid, and said container links to each other with the etching liquid nozzle.

As preferably: said manual etching device comprises that also mask places pedestal coordinate display system, and said mask is placed pedestal coordinate display system and is positioned on the optical microscope pedestal.

Compared with prior art; Optical microscope in the manual etching device of the utility model utilization is sought the position of confirming defective, makes public to expose defective with the microscopical white light of optics, uses the etching liquid nozzle wet etching of manual etching device again; Repair-deficiency; Said apparatus structure is simple and can repair large-area chromium defective on the mask, saves a large amount of repair time, saves a large amount of resources.

Description of drawings

Fig. 1 a-1i is the making process flow diagram of prior art phase shift mask.

Fig. 2 is the synoptic diagram of chromium defective on the phase shift mask.

Fig. 3 is the synoptic diagram of the manual etching device of the utility model.

Embodiment

The utility model below will combine accompanying drawing to do further to detail:

A lot of details have been set forth in the following description so that make much of the present invention.But the present invention can implement much to be different from alternate manner described here, and those skilled in the art can do similar popularization under the situation of intension of the present invention, so the present invention does not receive the restriction of following disclosed practical implementation.

Secondly, the present invention utilizes synoptic diagram to be described in detail, when the embodiment of the invention is detailed; For ease of explanation; The sectional view of expression device architecture can be disobeyed general ratio and done local the amplification, and said synoptic diagram is instance, and it should not limit the scope of the present invention's protection at this.The three dimensions size that in actual fabrication, should comprise in addition, length, width and the degree of depth.

Fig. 3 shows the synoptic diagram of the manual etching device of the utility model.

See also shown in Figure 3ly, in the present embodiment, a kind of manual etching device is used to repair the chromium defective on the mask, comprises that optical microscope, mask place pedestal 1 and etching liquid nozzle 3; Said optical microscope comprises eyepiece 21, lamp 22, camera lens pedestal 24, optical lens 25 and optical microscope pedestal 26 from top to bottom successively; Said mask is placed 1 pedestal between optical lens 25 and optical microscope pedestal 26, and said etching liquid nozzle 3 is positioned at optical microscope one side.Said optical microscope also comprises optical filter 23, and said optical filter 23 places on the camera lens pedestal 24, and said optical filter 23 is a yellow filter.Because optical lens 25 can be very near from mask in the exposure process, cause optical lens 25 to break for fear of the 25 collision mask of optical lens in exposure process, said manual etching device also comprises the antidetonation basal plane 4 of mask placement pedestal 1 below.Said manual etching device also comprises the container 31 of placing etching liquid, and this container 31 links to each other with etching liquid nozzle 3, to supply etching liquids to etching liquid nozzle 3.Said manual etching device also comprises mask placement pedestal coordinate display system (not shown), is positioned on the optical microscope pedestal 26.

The method of application of said manual etching device is following: the mask cleaning and removing that will have the chromium defective is removed dust or impurity; At mask surface-coated photoresist, insert yellow filter 23 to optical microscope again, utilize optical microscope alignment mask version to seek the position of confirming defective on the mask; Above-mentioned defective locations is presented at mask and places on the pedestal coordinate display system; The yellow filter 23 of removal optical microscope utilizes the photoresist of the white light aligning defective locations of optical microscope to make public again, photoresist is developed again; Form window; Expose defective in the said window, use the interior chromium defective of etching liquid nozzle 3 wet etching windows of manual etching device again, repair-deficiency.

Optical microscope in the manual etching device of the utility model utilization is sought the position of confirming defective; Make public to expose defective with the microscopical white light of optics; Use the etching liquid nozzle wet etching of manual etching device again, repair-deficiency, said apparatus structure is simple and can repair large-area chromium defective on the mask; Save a large amount of repair time, save a large amount of resources.

The above is merely the preferred embodiment of the utility model, and all equalizations of being done according to the utility model claim scope change and modify, and all should belong to the covering scope of the utility model claim.

Claims

1. a manual etching device is used to repair the chromium defective on the mask, it is characterized in that: comprise optical microscope, mask placement pedestal and etching liquid nozzle; Said optical microscope comprises eyepiece, lamp, camera lens pedestal, optical lens and optical microscope pedestal from top to bottom successively; Said mask is placed pedestal between optical lens and optical microscope pedestal, and said etching liquid nozzle is positioned at optical microscope one side.

2. according to the said manual etching device of claim 1, it is characterized in that: said optical microscope also comprises optical filter, and said optical filter places on the camera lens pedestal.

3. according to the said manual etching device of claim 2, it is characterized in that: said optical filter is a yellow filter.

4. according to the said manual etching device of claim 1, it is characterized in that: said manual etching device also comprises the antidetonation basal plane of mask placement pedestal below.

5. according to the said manual etching device of claim 1, it is characterized in that: said manual etching device also comprises the container of placing etching liquid, and this container links to each other with said etching liquid nozzle.

6. according to the said manual etching device of claim 1, it is characterized in that: said manual etching device also comprises mask placement pedestal coordinate display system, and said mask is placed pedestal coordinate display system and is positioned on the optical microscope pedestal.