CN203967038U - Device for cleaning back surface of wafer - Google Patents
Device for cleaning back surface of wafer Download PDFInfo
- Publication number
- CN203967038U CN203967038U CN201420240863.1U CN201420240863U CN203967038U CN 203967038 U CN203967038 U CN 203967038U CN 201420240863 U CN201420240863 U CN 201420240863U CN 203967038 U CN203967038 U CN 203967038U
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- Prior art keywords
- wafer
- back surface
- cleaning
- support bar
- cleaning back
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a kind of device for cleaning back surface of wafer, by the structural design to adsorbent equipment, in the time carrying out wafer rear cleaning, the contamination particle of wafer rear firmly can be adsorbed on adsorption tube, and can repeatedly repeatedly guarantee that the contamination particle of wafer rear different size is adsorbed.And then avoid contamination particle owing to being subject to the impact of electrostatic force, cannot pass through the fully effective removal of organic solvent, cause in the time using mask aligner to expose definition circuit figure, wafer can produce the out of focus of regional area, make graphical definition imperfect and cause the situation of defect, the exposure that has reduced wafer is out of focus, has improved the efficiency of wafer cleaning.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to device for cleaning back surface of wafer.
Background technology
In the manufacture process of semiconductor device, need to make the surface of semiconductor crystal wafer remain clean, not only require the front of wafer to remain clean, the same requirement in the back side of wafer remains clean, to avoid wafer to cause cross pollution in transmitting procedure, therefore need front and the back side to wafer to carry out clean.
The pollutant on wafer current surface, situation about occurring according to pollutant, is broadly divided into particle, organic substance, metal pollutant and oxide.The mechanism that pollutant adheres to mainly contains electrostatic force, Van der Waals force, chemical bond etc.The method that is generally used for wafer cleaning pollutant is slot type ablution, is immersed in rinse bath and cleans, although the method can be removed the pollutant of wafer frontside and wafer rear simultaneously by multi-disc wafer.But because the pollutant of removing is still stayed in cleaning fluid, pollutant may be attached on wafer again, causes cross pollution, thereby reduce the quality of semiconductor device.
In the manufacture of semiconductor chip, photoetching process is most critical technique in all four basic technologies, is determined the critical size of device by photoetching process.Mistake in photoetching process can cause figure distort or alignment bad, finally can be converted into the electrical characteristics of device are exerted an influence.The dislocation of figure also can cause similar bad result.Another problem in photoetching process is the defect problem causing due to pollutant.In fact because photoetching will complete 5 layers to 20 layers or more in wafer production process, so pollution problem will be amplified.For the defect that prevents that in photoetching process, pollutant causes, particularly prevent the light blockage coating process organic substance photoresistance polluting wafer back side, the method that organic solvent is sprayed in general employing overleaf, removes photoresistance with the method for chemolysis and pollutes.
But the particle adhering to for electrostatic force, organic solvent can not fully effectively be removed, when expose to definition circuit figure with mask aligner, if wafer rear has particle contamination, in the process of exposure, can produce regional area out of focus, make graphical definition imperfect and cause defect.
Utility model content
The purpose of this utility model is to provide a kind of device for cleaning back surface of wafer, to solve the contamination particle of wafer rear in prior art, owing to being subject to the impact of electrostatic force, cannot pass through the fully effective removal of organic solvent, cause in the time using mask aligner to expose definition circuit figure, wafer can produce the out of focus of regional area, makes graphical definition imperfect and cause the problem of defect.
In order to solve the problems of the technologies described above, the utility model provides a kind of device for cleaning back surface of wafer, and described device for cleaning back surface of wafer, comprising: drive unit, adsorbent equipment and support bar;
Described adsorbent equipment is arranged on described drive unit;
Described support bar is arranged on described drive unit and runs through described adsorbent equipment.
Optionally, in described device for cleaning back surface of wafer, described adsorbent equipment comprises: adsorption tube and the Attraction block being connected with described adsorption tube.
Optionally, in described device for cleaning back surface of wafer, the cross section of described Attraction block is circle, rectangle or square.
Optionally, in described device for cleaning back surface of wafer, the cross-sectional width of described Attraction block is more than or equal to brilliant diameter of a circle.
Optionally, in described device for cleaning back surface of wafer, the quantity of described adsorption tube is multiple; The shape of multiple described adsorption tubes is identical, and is uniformly distributed in the upper surface of described Attraction block.
Optionally, in described device for cleaning back surface of wafer, the material of described adsorption tube and described Attraction block is SiO
2with the mixed materials of HMDS or the mixed materials of Si and HMDS.
Optionally, in described device for cleaning back surface of wafer, the quantity of described support bar is three; Three triangular in shape being distributed on described drive unit of described support bar.
Optionally, in described device for cleaning back surface of wafer, the telescopic bar that described support bar is hollow.
Optionally, in described device for cleaning back surface of wafer, the length of described support bar is 5cm～10cm.
In device for cleaning back surface of wafer provided by the utility model, by the structural design to adsorbent equipment, in the time carrying out wafer rear cleaning, the contamination particle of wafer rear firmly can be adsorbed on adsorption tube, and can repeatedly repeatedly guarantee that the contamination particle of wafer rear different size is adsorbed.And then avoid contamination particle owing to being subject to the impact of electrostatic force, cannot pass through the fully effective removal of organic solvent, cause in the time using mask aligner to expose definition circuit figure, wafer can produce the out of focus of regional area, make graphical definition imperfect and cause the situation of defect, the exposure that has reduced wafer is out of focus, has improved the efficiency of wafer cleaning.
Brief description of the drawings
Fig. 1 is the vertical view of the utility model device for cleaning back surface of wafer;
Fig. 2 is the generalized section of the utility model device for cleaning back surface of wafer.
Embodiment
Below in conjunction with the drawings and specific embodiments, the device for cleaning back surface of wafer the utility model proposes is described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Please refer to Fig. 1 and Fig. 2, it is the relevant schematic diagram of the device for cleaning back surface of wafer of the utility model embodiment.As shown in Figure 1, described device for cleaning back surface of wafer comprises: drive unit 1, adsorbent equipment 2 and support bar 3; Described adsorbent equipment 2 is arranged on described drive unit 1; Described support bar 3 is arranged on described drive unit 1 and runs through described adsorbent equipment 2.
The principle of device for cleaning back surface of wafer application of the present utility model:
With reference to Fig. 2, in the time that wafer rear is cleaned:
The first step, is loaded the wafer that needs cleaning by support bar 3;
Second step, adjusts drive unit 1 and drives support bar 3 to shrink, and makes wafer rear on support bar 3 near adsorbent equipment 2;
The 3rd step, adjusts drive unit 1 and drives support bar 3 to do stretching motion repeated multiple times (contamination particle of wafer rear removes more completely if think, can carry out several times) more;
The 4th step, regulates drive unit 1 to drive support bar 3 to extend the wafer on unloading support bar 3;
The 5th step, finishes the cleaning operation of wafer rear, and the wafer after cleaning is positioned over and on mask aligner, carries out follow-up exposure process.
Preferably, described adsorbent equipment comprises: adsorption tube 22 and the Attraction block 21 being connected with described adsorption tube 22.
Preferably, the cross section of described Attraction block 21 is circle, rectangle or square, and the cross-sectional width of described Attraction block 21 is more than or equal to brilliant diameter of a circle.Concrete, wafer cross section is less than the cross section of adsorbent equipment 2, and when wafer is during near adsorbent equipment 2, the abundant Contact-sorption device 2 of wafer rear, makes the contamination particle of wafer rear be adsorbed device 2 and adsorb.
Preferably, the quantity of described adsorption tube 22 is multiple; The shape of multiple described adsorption tubes 22 is identical, and is uniformly distributed in the upper surface of described Attraction block 21.Concrete, the setting of adsorption tube 22, further guarantee absorption contamination particle can firmly stick with adsorbent equipment on, compare adsorption tube 22 is not set, it is only the adsorption structure of a plane, while moving on the support bar 3 that is mounted with wafer, avoid the contamination particle being adsorbed again to be taken away by wafer.
Preferably, the material of described adsorption tube 22 and described Attraction block 21 is SiO
2with the mixed materials of HMDS or the mixed materials of Si and HMDS.SiO
2can adsorb preferably the contamination particle of wafer rear with the mixed materials of HMDS or the mixed materials of Si and HMDS, by the adhesion of absorption, overcome the electrostatic force between contamination particle and wafer, thereby reach the object of removing contamination particle.
Preferably, the quantity of described support bar 3 is three; Three triangular in shape being distributed on described drive unit 1 of described support bar 3.Concrete, for wafer can be positioned on support bar 3 stably, the situation that does not exist crystal column surface to tilt.In the time that wafer rear cleans, because wafer rear does not measure up, at wafer, during near adsorbent equipment, part contamination particle cannot be adsorbed, and does not reach preferably adsorption effect.
Preferably, the telescopic bar that described support bar 3 is hollow.Concrete, support bar 3 is designed to hollow structure, is conducive to the vacuum suction of wafer to be fixed; Its scalability can do the operation moving up and down under the driving of drive unit 1, and then completes loading, unloading and the cleaning operation of wafer.
Preferably, the length of described support bar 3 is 5cm～10cm.Support bar can, as required near adsorbent equipment 2 or away from adsorbent equipment 2, complete the cleaning operation of wafer rear.
To sum up, in device for cleaning back surface of wafer provided by the utility model, by the structural design to adsorbent equipment, in the time carrying out wafer rear cleaning, the contamination particle of wafer rear firmly can be adsorbed on adsorption tube, and can repeatedly repeatedly guarantee that the contamination particle of wafer rear different size is adsorbed.And then avoid contamination particle owing to being subject to the impact of electrostatic force, cannot pass through the fully effective removal of organic solvent, cause in the time using mask aligner to expose definition circuit figure, wafer can produce the out of focus of regional area, make graphical definition imperfect and cause the situation of defect, the exposure that has reduced wafer is out of focus, has improved the efficiency of wafer cleaning.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model utility model.Like this, if these amendments of the present utility model and within modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to including these changes and modification.
Claims (8)
1. a device for cleaning back surface of wafer, is characterized in that, comprising: drive unit, adsorbent equipment and support bar;
Described adsorbent equipment is arranged on described drive unit;
Described support bar is arranged on described drive unit and runs through described adsorbent equipment.
2. device for cleaning back surface of wafer as claimed in claim 1, is characterized in that, described adsorbent equipment comprises: adsorption tube and the Attraction block being connected with described adsorption tube.
3. device for cleaning back surface of wafer as claimed in claim 2, is characterized in that, the cross section of described Attraction block is circle, rectangle or square.
4. device for cleaning back surface of wafer as claimed in claim 3, is characterized in that, the cross-sectional width of described Attraction block is more than or equal to brilliant diameter of a circle.
5. device for cleaning back surface of wafer as claimed in claim 2, is characterized in that, the quantity of described adsorption tube is multiple; The shape of multiple described adsorption tubes is identical, and is uniformly distributed in the upper surface of described Attraction block.
6. device for cleaning back surface of wafer as claimed in claim 1, is characterized in that, the quantity of described support bar is three; Three triangular in shape being distributed on described drive unit of described support bar.
7. device for cleaning back surface of wafer as claimed in claim 1, is characterized in that, the telescopic rod that described support bar is hollow.
8. device for cleaning back surface of wafer as claimed in claim 1, is characterized in that, the length of described support bar is 5cm～10cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420240863.1U CN203967038U (en) | 2014-05-12 | 2014-05-12 | Device for cleaning back surface of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420240863.1U CN203967038U (en) | 2014-05-12 | 2014-05-12 | Device for cleaning back surface of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203967038U true CN203967038U (en) | 2014-11-26 |
Family
ID=51927589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420240863.1U Expired - Fee Related CN203967038U (en) | 2014-05-12 | 2014-05-12 | Device for cleaning back surface of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203967038U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113126455A (en) * | 2021-04-28 | 2021-07-16 | 上海华力微电子有限公司 | Wafer back cleaning device, immersion lithography machine and wafer back cleaning method |
-
2014
- 2014-05-12 CN CN201420240863.1U patent/CN203967038U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113126455A (en) * | 2021-04-28 | 2021-07-16 | 上海华力微电子有限公司 | Wafer back cleaning device, immersion lithography machine and wafer back cleaning method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20190512 |