CN105576101B - A kind of cover board and bogey - Google Patents
A kind of cover board and bogey Download PDFInfo
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- CN105576101B CN105576101B CN201410532503.3A CN201410532503A CN105576101B CN 105576101 B CN105576101 B CN 105576101B CN 201410532503 A CN201410532503 A CN 201410532503A CN 105576101 B CN105576101 B CN 105576101B
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Abstract
The present invention provides a kind of cover board and bogeys, the cover board is used to multiple substrates being fixed on pallet, and multiple through-holes through cover sheet thickness are provided on the surface of cover board, the carrying position for being used to carry each substrate of each through-hole and pallet corresponds, and cover board is made of the material that can consume the free radical only to react in plasma with mask；Also, cover board upper surface includes multiple conversion zones, annular region of each conversion zone to be located at each bore periphery correspondingly, and the etching selection ratio size at the size of each conversion zone and corresponding lead to the hole site is positively correlated relationship.Cover board provided by the invention can improve etching homogeneity between the piece of single process, so as to improve the yields of single process.
Description
Technical field
The invention belongs to microelectronic processing technique fields, and in particular to a kind of cover board and bogey.
Background technology
Graphical sapphire substrate (Patterned Sapphire Substrate, hereinafter referred to as PSS) be at present more
The substrate of the raising LED component light extraction efficiency of mainstream, generally use dry etching technology is to there are the sapphire of mask pattern linings
Bottom performs etching, to obtain the Sapphire Substrate of image conversion.During PSS etching technics is carried out, in order to improve single work
The production capacity of skill, multiple substrates are placed on pallet by generally use to be transmitted to again on the indoor pedestal of reaction chamber, in reaction chamber
It is interior to be stacked on pallet by cover board, multiple substrates are fixed between pallet and cover board with realizing, so as to simultaneously to more
A substrate performs etching technique processing.
Fig. 1 is the vertical view that existing cover board and pallet are fixed to each other.Referring to Fig. 1, it specifically, is provided on cover board 10
With the one-to-one through-holes 101 of substrate S carried on pallet 11, when cover board 10 is stacked on pallet 11, each through-hole 101
The fringe region of corresponding substrate S is stacked in close to the annular region of its annular distance, can not only realize and fix substrate S,
Substrate S can also be made to correspond to the through-hole 101 to be located in the plasma environment of reaction chamber, subsequently substrate S is carried out with realizing
Etching technics is processed；The setting distribution of through-hole 101 on cover board 10 is as shown in Figure 1, the radial direction along cover board 10 is set from inside to outside
There are 1 through-hole 101,7 through-holes 101 positioned at inner circle area and 14 through-holes positioned at outer collar region positioned at central area
101。
However, it is inevitably had the following problems in practical applications using above-mentioned cover board 10：The center of cover board
Etching selection ratio in domain, inner circle area and outer collar region at each 101 position of through-hole is different, and is gradually reduced, wherein, etching
Selection, should if etching selection ratio is high than the ratio of the PSS etch rates equal to substrate and photoresist mask (PR) etch rate
The etching depth of substrate at lead to the hole site is deep, and etch topography is susceptible to inflection point；If etching selection ratio is low, the through-hole position
The etching depth for putting the substrate at place is low, and the low light extraction efficiency that can influence PSS of the etch topography difference and etching depth of substrate, because
This, can cause etching homogeneity poor, so as to cause the yields of single process low using existing cover board.
Invention content
The present invention is directed at least solve one of technical problem in the prior art, it is proposed that a kind of cover board and carrying dress
It puts, etching homogeneity between the piece of single process can be improved, so as to improve the yields of single process.
One of in order to solve the above problem, the present invention provides a kind of cover board, for multiple substrates to be fixed on pallet, and
Multiple through-holes through the cover sheet thickness are provided in the cover board upper surface, each through-hole is used to carry with the pallet
The carrying position of each substrate corresponds, which is characterized in that the cover board upper surface use can be consumed in plasma only with covering
The material for the free radical that film reacts is made；Also, the cover board upper surface includes multiple conversion zones, each conversion zone
To be located at the annular region of each bore periphery, and the size of each conversion zone and corresponding correspondingly
Etching selection ratio size at lead to the hole site is positively correlated relationship.
Wherein, the area equation of each conversion zone.
Wherein, the cover board is made of aluminum material.
Wherein, the substrate includes Sapphire Substrate.
Wherein, the multiple through-hole is uniformly arranged on the cover board from center to edge, and the cover board is circumferentially upper and leans on
The area of the area conversion zone corresponding with other through-holes of the corresponding conversion zone of each through-hole of the nearly side edge thereof it
Between error range 3~5%.
Wherein, a through-hole is arranged on the center of the cover board in the multiple through-hole, other described through-holes settings
In N number of ring layer centered on the center of center position through-hole, N is >=2 integer；Along the cover board from center to edge
Multiple ring layers successively be referred to as n-th of ring layer, 1 ＜ n≤N, and n be integer；Wherein M through-holes are along the cover board
It is circumferentially-spaced and be uniformly arranged in the 1st ring layer, M is >=3 integer, and the line of centres of M through-holes forms positive M sides
Shape；N*M through-hole is provided at circumferentially spaced along the cover board in n-th of ring layer, and the line of centres of the n*M through-hole is formed just
M sides shape；And the centre-to-centre spacing each between through-hole and each through-hole adjacent thereto is equal.
Wherein, it is each described positioned at the through-hole of the center of the cover board and in the 1~N-1 ring layer
The area of the corresponding conversion zone of through-hole is equal to the half of the cover board top surface area in the shape of positive M sides；Positioned at the n-th circle
The area of the corresponding conversion zone of each through-hole in layer is equal to the figure that the center line of each through-hole adjacent thereto is formed
The half of cover board top surface area in the shape+(center line of N*M through-hole in total top surface area-n-th ring layer of cover board
Cover board top surface area in the figure of formation)/(N*M).
Wherein, N=2, and M=6.
The present invention also provides a kind of bogeys, and including pallet and cover board, the pallet is described for carrying multiple substrates
Cover board is stacked on the pallet, and the substrate is fixed on the pallet, the cover board is using provided by the invention
Above-mentioned cover board.
The invention has the advantages that：
Cover board provided by the invention can be consumed in plasma by the use of cover board upper surface and only be reacted with mask
The material of free radical be made, therefore the free radical to react with mask can be reduced, so as to reduce the etching of mask speed
Rate, but not the etch rate of substrate is influenced, so as to improve the etching selection ratio with substrate, therefore, each conversion zone
Size and corresponding lead to the hole site at etching selection ratio size be positively correlated relationship.It is from the foregoing, it will be observed that of the invention
The cover board of offer can set the position distribution of multiple through-holes on cover board to change each lead to the hole site to realize according to above-mentioned relation
The size of the etching selection ratio at place, so that the etching selection ratio at multiple lead to the hole site is uniform, so as to improve single work
The etching homogeneity of multiple substrates of skill, that is, etching homogeneity between the piece of single process can be improved, and then single can be improved
The yields of technique.
Bogey provided by the invention uses cover board provided by the invention, thus can improve the piece of single process
Between etching homogeneity, so as to improve the yields of single process.
Description of the drawings
Fig. 1 is the vertical view that existing cover board and pallet are fixed to each other；
Fig. 2 is a kind of structure diagram of cover board provided in an embodiment of the present invention；
Centered on Fig. 3 a at position the size of the corresponding conversion zone of through-hole schematic diagram；
Schematic diagrames of Fig. 3 b for the size of the corresponding conversion zone of through-hole each in the 1st ring layer；And
Schematic diagrames of Fig. 3 c for the size of the corresponding conversion zone of through-hole each in the 2nd ring layer.
Specific embodiment
For those skilled in the art is made to more fully understand technical scheme of the present invention, come below in conjunction with the accompanying drawings to the present invention
The cover board and bogey that embodiment provides are described in detail.
Cover board provided in an embodiment of the present invention for multiple substrates to be fixed on pallet, also, is provided on the cover board
Multiple through-holes through cover sheet thickness, each through-hole and pallet correspond for carrying the carrying position of each substrate, cover board
Upper surface is made of the material that can consume the free radical only to react in plasma with mask；Also, cover board upper surface
Including multiple conversion zones, annular region of each conversion zone to be located at each bore periphery correspondingly, and it is each
Etching selection ratio size at the size of conversion zone and corresponding lead to the hole site is positively correlated relationship.
From the foregoing, it will be observed that since the use of cover board upper surface can consume the free radical only to react in plasma with mask
Material is made, this so that the corresponding conversion zone of through-hole can consume and covering on substrate in the through-hole in etching process
The free radical that film reacts, therefore the free radical to react with mask can be reduced, so as to reduce the etch rate of mask, but
The etch rate with substrate at the lead to the hole site is not interfered with, therefore, the size of each conversion zone and corresponding
Etching selection ratio size at lead to the hole site is positively correlated relationship, specifically, if the area of the corresponding conversion zone of through-hole is bigger,
Consume that the free radical to react with the mask on substrate in the through-hole is more, then the etching selection ratio at the lead to the hole site is got over
It is high；If the area of the corresponding conversion zone of through-hole is smaller, the freedom to react with the mask on substrate in the through-hole is consumed
Base is fewer, then the etching selection ratio at the lead to the hole site is smaller.Therefore, cover board provided in this embodiment, can be according to above-mentioned pass
System sets the position distribution of multiple through-holes on cover board to realize the size for changing the etching selection ratio at each lead to the hole site, so that
The etching selection ratio obtained at multiple lead to the hole site is uniform, so as to improve the etching homogeneity of multiple substrates of single process,
I.e., it is possible to improve etching homogeneity between the piece of single process, and then the yields of single process can be improved.
In the present embodiment, cover board is made of aluminum material, alternatively, being coated with layer of aluminum on cover board upper surface.Al materials
Material can react with the free radical to react in plasma with the mask on substrate；Also, substrate is served as a contrast including sapphire
Bottom (Al2O3), etching gas includes main etching gas and auxiliary etching gas, and main etching gas includes boron chloride (BCl3), auxiliary quarter
It loses gas and includes chlorine (Cl2), wherein, mask (including C, H, O) and Al materials can occur with the Cl free radicals in plasma
Following reaction：
Al+xCl→AlClx；
Cl+C→CClx；
H+Cl→HCl；
Boron chloride (the BCl in etching process3) under the conditions of glow discharge ionization and Sapphire Substrate occur it is following anti-
It should：
BCl3+e-→BCl2+Cl+e-；
BCl3+e-→BCl2 ++Cl+2e-；
BCl2+e-→BCl2 ++2e-；
BCl3+e-→Cl-+BCl2 +；
BCl3+e-→2Cl-+BCl+；
2BClx+Al2O3→Al+2BOClx；
And Al materials do not interfere with reacting between plasma and substrate.Based on the reason, if the corresponding reaction of through-hole
The area in region is bigger, then the etching selection ratio at the lead to the hole site is bigger；If the area of the corresponding conversion zone of through-hole is smaller,
Etching selection ratio then at the lead to the hole site is smaller.That is, the size of each conversion zone and corresponding logical
The etching selection ratio size of hole location is positively correlated relationship.
Therefore, for the prior art, to realize that the etching selection ratio at multiple lead to the hole site is uniform, can make on cover board
Each through-hole is set close to the central area of cover board in middle collar region and outer collar region, to increase the corresponding reaction of each through-hole
The size in region, while the size of the conversion zone of central area inner via hole can be reduced, this can compensate the outer collar region of cover board
Etching selection ratio at interior each lead to the hole site is relatively low and central area inner via hole position at etching selection it is higher, so as to
So that the etching selection ratio at each lead to the hole site is uniform, and then the yields of single process can be improved.
Preferably, the area equation of each conversion zone, that is to say, that on cover board on the annular cover plate of each bore periphery
Surface it is equal in magnitude, this can be avoided in the case where board etching homogeneity is good since through-hole each on cover board is corresponding anti-
It answers the size in region unequal and influences etching homogeneity between piece.
In the present embodiment, in the case where board etching homogeneity is good, can also multiple through-holes on the cover board from center
It is uniformly arranged to edge, the area of the corresponding conversion zone of each through-hole of the circumferentially upper and close side edge thereof of cover board is logical with other
Error range between the area of the corresponding conversion zone in hole is 3~5%.
To realize that multiple through-holes are uniformly arranged on the cover board from center to edge.Specifically, a through-hole in multiple through-holes
201 are arranged on the center of cover board 20, other through-holes are arranged on N number of centered on the center of center position through-hole 201
In ring layer, N is >=2 integer, as shown in Fig. 2, N=2；It is referred to as the successively by the extrorse multiple ring layers in center along cover board 20
N ring layer, 1 ＜ n≤N, and n are integer；Wherein, M through-hole along the circumferentially-spaced of cover board 20 and is uniformly arranged on the 1st ring layer
Interior, M is >=3 integer, and the line of centres of M through-hole forms positive M sides shape, as shown in Fig. 2, M=6；N*M through-hole is along cover board 20
Be provided at circumferentially spaced in n-th of ring layer, the line of centres of the n*M through-hole forms positive M sides shape；Also, each through-hole and
Centre-to-centre spacing L between each through-hole adjacent thereto is equal.In this case, cover board is circumferentially upper and close to each of side edge thereof
A through-hole is each through-hole in N ring layers, it is, each through-hole 203 in the 2nd ring layer as shown in Figure 2.
In the present embodiment, positioned at the through-hole 201 of the center of cover board 20 and each in the 1~N-1 ring layer
The area of the corresponding conversion zone of a through-hole is equal to the half of the cover board top surface area in the shape of positive M sides；Positioned at n-th ring layer
In the figure that the center line that the area of the interior corresponding conversion zone of each through-hole is equal to each through-hole adjacent thereto is formed
The half of cover board top surface area+(center line of N*M through-hole is formed in total top surface area-n-th ring layer of cover board
Cover board top surface area in figure)/(N*M).
The one-to-one conversion zone of each through-hole of cover board provided in this embodiment is described in detail with reference to Fig. 3 a- Fig. 3 c
Size calculation.Specifically, the line of centres of 6 through-holes 202 in the 1st ring layer forms regular hexagon,
Shown in dotted line as shown in Figure 2, in this case, positioned at area of 201 corresponding conversion zone of through-hole of center etc.
The half of the cover board top surface area in regular hexagon formed in through-hole 202 each in the 1st ring layer, it is, in Fig. 3 a
The half of shown shaded area.The area of 202 corresponding conversion zone of each through-hole in the 1st ring layer be equal to
Adjacent each through-hole the line of centres formed regular hexagon in cover board top surface area half, it is, figure
The half of shaded area shown in 3b, therefore, each through-hole is corresponding in 201 and the 1st ring layer of through-hole of center
The size of conversion zone is equal.The area of 203 corresponding conversion zone of each through-hole in the 2nd ring layer is equal to therewith
(the lid of+ten half of half of cover board top surface area in the figure of the formation of the line of centres of 3 adjacent through-holes
The cover board top surface area in regular hexagon that the line of centres of each through-hole is formed in total 2 ring layer of top surface area-the of plate), also
It is that ten halfs of the B of half+shaded area of the shaded area A in Fig. 3 c in practical applications, can cause
The area of the corresponding conversion zone of each through-hole in 2nd ring layer and the area of each through-hole in center and the 1st ring layer
Error range is 3~5%.
It is appreciated that the setting quantity of through-hole is inversely proportional with the centre-to-centre spacing L of two neighboring through-hole on cover board, therefore, in reality
In the application of border, under the premise of should tending to be uniform ensureing the etching selection ratio at each lead to the hole site, reduce as much as possible adjacent
The value of the centre-to-centre spacing L of two through-holes, to improve the setting quantity of through-hole as much as possible, so as to improve the work of single process
Skill quantity.
It should be noted that the invention is not limited in the corresponding conversion zone sizes of each through-hole of above-mentioned calculating
In practical applications, the size that other computational methods calculate each through-hole conversion zone may be used in method.Example
Such as, the method for being calculated as below may be used：The 201 corresponding reaction of through-hole of position centered on the shaded area of calculating as shown in Figure 3a
The area in region, and area of the shaded area shown in Fig. 3 b for the 202 corresponding conversion zone of each through-hole of the 1st ring layer, and
The area of the 203 corresponding conversion zone of each through-hole of 2nd ring layer for shaded area A and ten halfs shaded area B it
With.
It should also be noted that, in the present embodiment, in the case where board etching homogeneity is good, multiple through-holes on cover board
Distribution is set by the way of as shown in Figure 2.But the present invention is not limited thereto, it in practical applications, can also be in board
In the case that etching homogeneity is good, multiple through-holes realize the corresponding conversion zone of each through-hole using other modes on the plate
Size region is equal, numerous to list herein.
It is further to note that in practical applications, if the etching homogeneity of board equipment is poor, that is, there are eccentric feelings
Under condition, cover board provided in an embodiment of the present invention equally may be used, according to the face with through-hole each conversion zone correspondingly
Etching selection ratio size at product size and corresponding lead to the hole site is positively correlated relationship, sets multiple through-holes on cover board
Position distribution changes the size of the etching selection ratio at each lead to the hole site to realize, even above-mentioned etching machine bench is eliminated to improve
The eccentricity issues of equipment, so as to improve the uniformity of etching selection ratio between piece.
As another technical solution, the present embodiment also provides a kind of bogey, the bogey include pallet and
Cover board, for pallet for carrying multiple substrates, cover board uses the cover board that the above embodiment of the present invention provides.
Bogey provided in this embodiment, can be with single process by using the present embodiment provides above-mentioned cover boards
Etching homogeneity between piece, so as to improve the yields of single process.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (9)
1. a kind of cover board, for multiple substrates to be fixed on pallet, and it is provided in the cover board upper surface multiple through institute
The through-hole of cover sheet thickness is stated, each through-hole is corresponded with the pallet for carrying the carrying position of each substrate, feature
It is, the cover board upper surface is made of the material that can consume the free radical only to react in plasma with mask；And
And
The cover board upper surface includes multiple conversion zones, and each conversion zone is correspondingly positioned at each bore periphery
Annular region, and the size of each conversion zone and the etching selection ratio size at corresponding lead to the hole site are into just
Correlativity.
2. cover board according to claim 1, which is characterized in that the area equation of each conversion zone.
3. cover board according to claim 1, which is characterized in that the cover board is made of aluminum material.
4. cover board according to claim 1, which is characterized in that the substrate includes Sapphire Substrate.
5. cover board according to claim 1, which is characterized in that the multiple through-hole is on the cover board from center to edge
Be uniformly arranged, the cover board is circumferentially upper and the area of the corresponding conversion zone of each through-hole close to the side edge thereof and other
Error range between the area of the corresponding conversion zone of through-hole is 3~5%.
6. cover board according to claim 5 a, which is characterized in that through-hole is arranged on the cover board in the multiple through-hole
Center, other described through-holes are arranged in N number of ring layer centered on the center of center position through-hole, and N is >=2
Integer；It is whole to be referred to as n-th of ring layer, 1 ＜ n≤N, and n successively by the extrorse multiple ring layers in center along the cover board
Number；Wherein
M through-holes along the circumferentially-spaced of the cover board and are uniformly arranged in the 1st ring layer, and M is >=3 integer, M institute
The line of centres for stating through-hole forms positive M sides shape；
N*M through-hole is provided at circumferentially spaced along the cover board in n-th of ring layer, and the line of centres of the n*M through-hole is formed
Positive M sides shape；And
Centre-to-centre spacing each between through-hole and each through-hole adjacent thereto is equal.
7. cover board according to claim 6, which is characterized in that positioned at the through-hole of the center of the cover board and position
It is equal to the cover board upper surface in the shape of positive M sides in the area of the corresponding conversion zone of each through-hole in the 1~N-1 ring layer
Long-pending half；
The area of the corresponding conversion zone of each through-hole in the n-th ring layer is equal to adjacent thereto each logical
The half of the cover board top surface area in figure that the center line in hole is formed+(in total top surface area-n-th ring layer of cover board
The cover board top surface area in figure that the center line of N*M through-hole is formed)/(N*M).
8. the cover board described according to claim 6 or 7, which is characterized in that N=2, and M=6.
9. a kind of bogey, including pallet and cover board, for carrying multiple substrates, the cover board is stacked in described the pallet
On pallet, the substrate is fixed on the pallet, which is characterized in that the cover board is arbitrary using claim 1-8
Cover board described in one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410532503.3A CN105576101B (en) | 2014-10-10 | 2014-10-10 | A kind of cover board and bogey |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410532503.3A CN105576101B (en) | 2014-10-10 | 2014-10-10 | A kind of cover board and bogey |
Publications (2)
| Publication Number | Publication Date |
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| CN105576101A CN105576101A (en) | 2016-05-11 |
| CN105576101B true CN105576101B (en) | 2018-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110059499A (en) * | 2009-11-27 | 2011-06-02 | 주식회사 맥시스 | Tray for substrate |
| WO2012046418A1 (en) * | 2010-10-08 | 2012-04-12 | パナソニック株式会社 | Substrate plasma treatment method |
| CN202268334U (en) * | 2011-09-20 | 2012-06-06 | 上海蓝光科技有限公司 | Protecting cover board for assisting in fixing substrate assembly device in dry etching process |
| CN202268337U (en) * | 2011-09-20 | 2012-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Loading device and plasma processing equipment with loading device |
| CN103715118A (en) * | 2013-12-03 | 2014-04-09 | 靖江先锋半导体科技有限公司 | Cover plate structure for semiconductor medium etcher |
-
2014
- 2014-10-10 CN CN201410532503.3A patent/CN105576101B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110059499A (en) * | 2009-11-27 | 2011-06-02 | 주식회사 맥시스 | Tray for substrate |
| WO2012046418A1 (en) * | 2010-10-08 | 2012-04-12 | パナソニック株式会社 | Substrate plasma treatment method |
| CN202268334U (en) * | 2011-09-20 | 2012-06-06 | 上海蓝光科技有限公司 | Protecting cover board for assisting in fixing substrate assembly device in dry etching process |
| CN202268337U (en) * | 2011-09-20 | 2012-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Loading device and plasma processing equipment with loading device |
| CN103715118A (en) * | 2013-12-03 | 2014-04-09 | 靖江先锋半导体科技有限公司 | Cover plate structure for semiconductor medium etcher |
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| CN105576101A (en) | 2016-05-11 |
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