CN104979259B - A kind of bogey and plasma processing device - Google Patents
A kind of bogey and plasma processing device Download PDFInfo
- Publication number
- CN104979259B CN104979259B CN201410130698.9A CN201410130698A CN104979259B CN 104979259 B CN104979259 B CN 104979259B CN 201410130698 A CN201410130698 A CN 201410130698A CN 104979259 B CN104979259 B CN 104979259B
- Authority
- CN
- China
- Prior art keywords
- pressure ring
- workpiece
- machined
- positioning pressure
- pallet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Jigs For Machine Tools (AREA)
Abstract
The present invention provides a kind of bogey and plasma processing equipment, which includes pallet, positioning pressure ring and cover board pressure ring, wherein the carrying position for carrying workpiece to be machined is provided on pallet;The quantity and position for positioning pressure ring are corresponded with the quantity of carrying position and position, and positioning pressure ring is used to the position of workpiece to be machined being limited in carrying position;The quantity of cover board pressure ring and position are corresponded with the quantity of the carrying position and position, and cover board pressure ring is with pallet by being threadedly coupled, and positioning pressure ring and workpiece to be machined are fixed on pallet.Bogey provided by the invention, can not only simplify workpiece to be machined cargo handling process, improve the efficiency of loading and unloading, but also can to avoid cover board chipping or tilt the phenomenon that, so as to reduce damage workpiece to be machined the case where.
Description
Technical field
The invention belongs to microelectronic processing technique fields, and in particular, to a kind of bogey and plasma process are set
It is standby.
Background technology
Graphical sapphire substrate(Patterned Sapphire Substrate, hereinafter referred to as PSS)Be at present more
The substrate of the raising LED component light extraction efficiency of mainstream, generally use dry etching technology is to there are the sapphire of mask pattern linings
Bottom performs etching, to obtain the Sapphire Substrate of image conversion.During carrying out PSS etching technics, in order to improve single work
Multiple substrates are sent on the indoor chuck of reaction chamber by the production capacity of skill, generally use bogey, with can simultaneously to multiple
Substrate carries out technique processing.
Fig. 1 is a kind of existing stereogram of bogey, and Fig. 2 is the sectional view of the Section A-A of bogey in Fig. 1.
Also referring to Fig. 1 and Fig. 2, bogey includes pallet 4 made of metal and the cover board 3 made of quartz and multiple
Screw 1.Wherein, multiple carrying positions for carrying workpiece to be machined 2 are provided on the upper surface of pallet 4, in the upper of cover board 3
Multiple through-holes of its thickness, and the following table of cover board 3 are provided through on surface, and at position corresponding with each load position
Face jointly grips workpiece to be machined 2 close to the annular region of each bore periphery and the carrying position of pallet 4, and
Pallet 4 is fixedly connected with cover board 3 by screw 1.
Above-mentioned bogey is inevitably present problems in practical applications:
First, due to using screw 1 to fix between cover board 3 and pallet 4, in order to ensure the uniform force of cover board 3, avoid covering
The problem of plate 3 chipping occurs or tilts, is often fixed using a fairly large number of screw 1(Carrying dress as shown in Figure 1
It sets, uses 28 screws altogether), this can cause, and the disassembly and assembly time of bogey is longer, disassembly process is cumbersome, to reduce production
Efficiency;Moreover, excessive screw 1 can increase cover board 3 there is the probability of slight crack in its through hole, to reduce making for cover board 3
Use the service life.
Second, since cover board 5 in the prior art uses monolithic construction, i.e. cover board 5 to be processed to all on pallet 4
Workpiece 2 is fixed, and this requires cover boards 5 to have higher flatness, can uniformly press all workpieces to be machined 2
It covers, to increase the difficulty of processing and manufacturing cost of bogey.
Invention content
The present invention is directed at least solve one of the technical problems existing in the prior art, it is proposed that a kind of bogey and wait
Plasma processing apparatus can not only simplify the cargo handling process of workpiece to be machined, improve the efficiency of loading and unloading, but also can be to avoid
The phenomenon that cover board chipping or inclination, so as to reduce the case where damaging workpiece to be machined.
A kind of bogey is provided to achieve the purpose of the present invention comprising pallet is arranged useful on the pallet
In the carrying position of carrying workpiece to be machined, the bogey further includes positioning pressure ring and cover board pressure ring, wherein the positioning pressure
The quantity of ring and position are corresponded with the quantity of the carrying position and position, and the positioning pressure ring is used for the processed work
The position of part is limited on the carrying position;The quantity and position one of the quantity of the cover board pressure ring and position with the carrying position
One corresponds to, and the cover board pressure ring is with the pallet by being threadedly coupled, and the positioning pressure ring and workpiece to be machined are fixed
On the pallet.
Wherein, the annular groove being looped around on the outside of the carrying position, the lid are provided on the upper surface of the pallet
Plate pressure ring includes ring body and claw, wherein the ring body is mutually nested with the positioning pressure ring, and the lower part of the ring body is located at
In the annular groove;The claw is arranged on the internal perisporium of the ring body, and the lower surface of the claw be stacked in it is described
On the upper surface for positioning pressure ring;On the internal perisporium of the ring body lower part and the side opposite with the internal perisporium of the annular groove
Internal thread and external screw thread are respectively correspondingly provided on wall, the internal thread and external screw thread cooperate.
Wherein, the annular groove being looped around on the outside of the carrying position, the lid are provided on the upper surface of the pallet
Plate pressure ring includes ring body and claw, wherein the ring body is mutually nested with the positioning pressure ring, and the lower part of the ring body is located at
In the annular groove;The claw is arranged on the internal perisporium of the ring body, and the lower surface of the claw be stacked in it is described
On the upper surface for positioning pressure ring;On the periphery wall of the ring body lower part and the side opposite with the periphery wall of the annular groove
External screw thread and internal thread are respectively correspondingly provided on wall, the external screw thread and internal thread cooperate.
Wherein, the annular region 111 close to its annular distance periphery of the lower surface of the positioning pressure ring is stacked in described added
The fringe region of work workpiece surface, and on the lower surface of the positioning pressure ring, and positioned at the outer of the annular region 111
Side is provided with protrusion, and recess portion 151 is accordingly provided on the upper surface of the pallet;The protrusion and the recess portion
151 match when the positioning pressure ring is stacked on the workpiece to be machined upper surface, for limiting the workpiece to be machined
Circumferential position.
Wherein, the annular region 111 close to its annular distance periphery of the lower surface of the positioning pressure ring is stacked in described added
The fringe region of work workpiece surface, and on the lower surface of the positioning pressure ring, and positioned at the outer of the annular region 111
Side is provided with recess portion 151, and is accordingly provided with protrusion on the upper surface of the pallet;The protrusion and the recess portion
151 match when the positioning pressure ring is stacked on the workpiece to be machined upper surface, for limiting the positioning pressure ring
Position.
Wherein, be additionally provided on the cover board pressure ring and tighten position, by it is described tighten position screw or unscrew it is described
Cover board pressure ring.
Wherein, the value model of width radially of the annular region 111 of the positioning pressure ring in the workpiece to be machined
It is trapped among 0.5~0.7mm.
Wherein, material used by the positioning pressure ring includes quartz or glass.
Wherein, material used by the cover board pressure ring includes aluminium alloy or stainless steel.
To achieve the above object, the present invention also provides a kind of plasma processing devices, including are used to carry processed
The bogey of workpiece, the bogey use above-mentioned bogey provided by the invention.
The present invention has following advantageous effects:
Bogey provided by the invention, by the way that the position of workpiece to be machined is limited in pallet by positioning pressure ring
It carries on position, and by cover board pressure ring by being threadedly coupled with pallet, and positioning pressure ring and workpiece to be machined is fixed on pallet
On, it can replace that monoblock type cover board and screw is utilized to fix workpiece to be machined in the prior art, and only by rotating the cover one by one
Pressure ring and so that it is screwed with pallet, you can realize and positioning pressure ring and workpiece to be machined be fixed on pallet, to not only
Can simplify workpiece to be machined cargo handling process, improve the efficiency of loading and unloading, but also can to avoid cover board chipping or tilt the phenomenon that,
The case where so as to reduce damage workpiece to be machined.In addition, due to cover board pressure ring of the present invention and positioning pressure ring point
Independently each workpiece to be machined is not fixed and is positioned, this can be dropped compared with monoblock type cover board in the prior art
The requirement of the low flatness to each cover board pressure ring and positioning pressure ring, so as to reduce difficulty of processing and the manufacture of bogey
Cost.
Plasma processing device provided by the invention, by using above-mentioned bogey provided by the invention, not only
Production efficiency can be improved, but also manufacturing cost can be reduced.
Description of the drawings
Fig. 1 is a kind of existing stereogram of bogey;
Fig. 2 is the sectional view of the Section A-A of bogey in Fig. 1;
Fig. 3 is the stereogram of bogey provided in an embodiment of the present invention;
Fig. 4 is the upward view that pressure ring is positioned in Fig. 3;
Fig. 5 is the sectional view of the line B-B along Fig. 4;
Fig. 6 is the partial cutaway view of bogey provided in an embodiment of the present invention;And
Fig. 7 is the sectional view of Fig. 3 cover plate pressure rings.
Specific implementation mode
To make those skilled in the art more fully understand technical scheme of the present invention, come below in conjunction with the accompanying drawings to the present invention
The bogey and plasma processing device of offer are described in detail.
Fig. 3 is the stereogram of bogey provided in an embodiment of the present invention.As shown in figure 3, bogey include pallet 15,
Position pressure ring 11 and cover board pressure ring 12.Wherein, the carrying position for carrying workpiece to be machined is provided on pallet 15;Position pressure ring
11 by the position of workpiece to be machined for being limited in the carrying position;It is connected through a screw thread between cover board pressure ring 12 and pallet 15,
It is fixed on the carrying position of pallet 15 so that pressure ring 11 and workpiece to be machined will be positioned.In addition, the quantity of above-mentioned carrying position can be
One or more, and quantity and position one of the cover board pressure ring 12 with positioning 11 respective quantity of pressure ring and position with the carrying position
One corresponds to.
Bogey provided in an embodiment of the present invention is fixed and is positioned by using cover board pressure ring 12 and positioning pressure ring 11
Workpiece to be machined, this in the prior art by monoblock type cover board 3 and screw 1 fix workpiece to be machined in the way of compared with, can be with
Positioning pressure ring 11 and workpiece to be machined can be fixed on pallet by screwing cover board pressure ring 12 one by one, thus can not only letter
Change the cargo handling process of workpiece to be machined, improve the efficiency of loading and unloading, additionally it is possible to the phenomenon that effectively avoiding cover board chipping or tilting, Jin Erke
To reduce the damage of workpiece to be machined.In addition, since cover board pressure ring 12 and positioning pressure ring 11 are separately processed to each
Workpiece is fixed and positions, this can be reduced compared with monoblock type cover board 3 in the prior art to each 12 He of cover board pressure ring
The requirement for positioning the flatness of pressure ring 11, so as to reduce the difficulty of processing and manufacturing cost of bogey.
Positioning pressure ring 11 is described in detail below.Fig. 4 is the upward view that pressure ring is positioned in Fig. 3, and Fig. 5 is along Fig. 4
The sectional view of line B-B, Fig. 6 are the partial cutaway view of bogey provided in an embodiment of the present invention.As Figure 4-Figure 6, positioning pressure
The insulating materials that quartz or glass etc. may be used in ring 11 makes.In the lower surface of positioning pressure ring 11 close to the ring on its annular distance periphery
Shape region 111 is stacked in the fringe region of workpiece to be machined upper surface.In practical applications, it should suitably set as the case may be
Width D radially of the annular region 111 in workpiece to be machined of pressure ring is positioned, as shown in Figure 4.This is because:If the width
It is too big to spend D, then can reduce the usable area of workpiece to be machined, the utilization rate of workpiece to be machined is caused to reduce;If annular region 111
The width D is too small, then will appear not pushing down when positioning pressure ring 11 and workpiece to be machined with larger installation error and added
The case where work workpiece, and be also possible to lead to the heat-exchange gas between workpiece to be machined and pallet 15(Such as helium)Leakage, from
And influence processing effect.Preferably, the annular region 111 of positioning pressure ring 11 takes in the width D radially of workpiece to be machined
It is worth range in 0.5~0.7mm.
There are two protrusions 110 on the lower surface of positioning pressure ring 11, and positioned at the setting of the outside of annular region 111, and
Recess portion 151 is accordingly provided on the upper surface of pallet 15, protrusion 110, which is stacked in recess portion 151 in positioning pressure ring 11, to be added
It is matched when on the upper surface of work workpiece 2, the position and limitation positioning pressure ring 11 for limiting positioning pressure ring 11 are in its circumferential direction
On rotary freedom, that is to say, that by the cooperation of raised part 110 and recess portion 151, positioning pressure ring 11 can be prevented opposite
In 15 transverse shifting of pallet and rotation, so as to limit position of the workpiece to be machined on pallet 15.
In the present embodiment, the quantity of protrusion 110 is two, the quantity of the quantity of recess portion 151 and position and protrusion 110 and
Position is corresponding;Also, projection of shape of the protrusion 110 on 15 upper surface of pallet is semicircle, and recess portion 151 is on pallet 15
Projection of shape on surface is adapted with protrusion 110.But the present invention is not limited thereto, and in practical applications, the number of protrusion
Amount can be one or three or more, and the quantity of recess portion and position are corresponding with the quantity of protrusion and position;Also, protrusion exists
Projection of shape on tray upper surface can also be the other arbitrary shapes of triangle, quadrangle, circle or irregular shape etc.;And
And projection of shape of the recess portion on tray upper surface can be adapted with the shape of protrusion, or can also use and can accommodate
The other arbitrary shapes of protrusion, if the recess portion 151 can protrusion be located at recess portion 151 its it is interior when limit positioning pressure ring position
And its rotary freedom in circumferential direction, wherein protrusion 110 is corresponded with the quantity of recess portion 151 and position.
It should be noted that in practical applications, it can also be on the lower surface of positioning pressure ring, and it is located at annular region
Recess portion is arranged in outside, and protrusion accordingly is arranged on the upper surface of pallet;Alternatively, can also be in the lower surface of positioning pressure ring
Above while it being equipped with protrusion and recess portion, and recess portion and protrusion are accordingly set on the upper surface of pallet.Due to the recess portion and protrusion
Structure and function there has been detailed description in the above-described embodiments, details are not described herein.
Cover board pressure ring 12 is described in detail below, Fig. 7 is the sectional view of Fig. 3 cover plate pressure rings.Also referring to Fig. 6
And Fig. 7, the annular groove being looped around on the outside of carrying position is provided on the upper surface of pallet 15.Aluminium may be used in cover board pressure ring 12
The metal material of alloy or stainless steel etc. is made comprising ring body 120 and claw 121.Wherein, ring body 120 and positioning pressure ring 11
It is mutually nested, that is, ring body 120 is looped around the outside of positioning pressure ring 11, and the internal perisporium of ring body 120 can be with positioning pressure ring 11
Periphery wall is in contact or keeps certain interval.Also, the lower part of ring body 120 is located in the annular groove of pallet 15, such as Fig. 6
It is shown.Claw 121 is arranged on the internal perisporium of ring body 120, and the lower surface of claw 121 is stacked in the upper surface of positioning pressure ring 11
On, and projection of shape of the claw 121 on the upper surface of positioning pressure ring 11 is an annular being closed, the claw of the closed annular
121 is overlapped with the fringe region of the annular of 11 upper surface of positioning pressure ring.
Moreover, on the internal perisporium of 120 lower part of ring body and the side wall opposite with the internal perisporium of annular groove(In Fig. 6
The inside side walls of annular groove)On be respectively correspondingly provided with internal thread and external screw thread, cover board pressure ring 12 and pallet 15 pass through interior
Screw thread and external screw thread cooperate and are fixed together.
Position is tightened in addition, being additionally provided on cover board pressure ring 12(It is not shown in figure), by this tighten position screw or
Cover board pressure ring is unscrewed, cover board pressure ring 12 is mounted on pallet 15 or is unloaded from pallet 15.
During loading workpiece to be machined, first, workpiece to be machined to be processed is positioned over to the carrying of pallet 15
On position;Then, installation positioning pressure ring 11, i.e.,:The lower surface of positioning pressure ring 11 is set to be stacked on the upper surface of workpiece to be machined, and
The protrusion of positioning pressure ring 11 is set to be located in the recess portion 151 of pallet;The nothing under the cooperation of protrusion and recess portion 151 of pressure ring 11 is positioned at this time
Method transverse shifting and rotation, so as to realize the positioning action to workpiece to be machined, and when subsequently screwing cover board pressure ring 12,
It can ensure that positioning pressure ring 11 and workpiece to be machined will not rotate with cover board pressure ring 12.Finally, installation cover board pressure ring 12, i.e.,:It is logical
It crosses and tightens position and screw cover board pressure ring 12, claw 121 is stacked on the upper surface of positioning pressure ring 11 at this time, and under ring body 120
Portion is located in the annular groove of pallet 15, and the external screw thread of ring body 120 is matched with the internal thread of annular groove, you can will cover
Plate pressure ring 12 is fixed on pallet 15, so that cover board pressure ring 12 will position pressure ring 11 and workpiece to be machined 2 is fixed on pallet 15.
It is similar with above-mentioned loading process during unloading workpiece to be machined, and only it is disassembly sequence and handling sequence phase
Instead, it is not described in detail herein.
It should be noted that in the present embodiment, internal thread is provided on the internal perisporium of 120 lower part of ring body, and corresponding
Ground is provided with external screw thread on the side wall opposite with the internal perisporium of annular groove, but the present invention is not limited thereto, in reality
In the application of border, external screw thread can also be set on the periphery wall of 120 lower part of ring body, and accordingly in annular groove and the periphery
The opposite side wall of wall(Such as the outside side wall of Fig. 6 annular recess)Upper setting internal thread, this again may be by the external screw thread and
The cooperation of internal thread and cover board pressure ring 12 and pallet 15 are fixed together.It is of course also possible to the internal perisporium in 120 lower part of ring body
Upper setting internal thread, while external screw thread is set on its periphery wall, and accordingly annular groove respectively with the internal perisporium and
It is provided with internal thread and external screw thread simultaneously in the corresponding two side walls of periphery wall.
It should also be noted that, in the present embodiment, projection of shape of the claw 121 on the upper surface of positioning pressure ring 11 is
One annular being closed, but the present invention is not limited thereto, in practical applications, claw 121 may be along ring body 120
The spaced multiple flanges of peripheral wall, multiple flanges and the fringe region of the annular of 11 upper surface of positioning pressure ring are overlapped.And
And projection of shape of the flange on 11 upper surface of positioning pressure ring can be the arbitrary shape of segmental arc etc..
Explanation is needed further exist for, in the present embodiment, is provided on the upper surface of pallet 15 and is looped around carrying position
The annular groove in outside, and the lower part of ring body 120 is located in the annular groove of pallet 15, still, the invention is not limited in
In practical applications the annular convex platform being looped around on the outside of carrying position can also be arranged, this in this on the upper surface of pallet 15
In the case of, the lower part of ring body 120 can be located at the inside or outside of the annular flange;Also, in the inside of the annular convex platform
Wall(And/or lateral wall)On be provided with internal thread(And/or external screw thread), and accordingly in the periphery wall of 120 lower part of ring body(With/
Or internal perisporium)On be provided with external screw thread(And/or internal thread), cover board pressure ring 12 and pallet 15 are mutual by internal thread and external screw thread
Coordinate and is fixed together.
As another technical solution, the present embodiment also provides a kind of plasma processing device, including is used to carry quilt
The bogey of workpieces processing, the bogey use above-mentioned bogey provided in an embodiment of the present invention.
Plasma processing device provided in an embodiment of the present invention above-mentioned is held by using provided in an embodiment of the present invention
It carries and sets, can not only improve production efficiency, but also manufacturing cost can be reduced.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of bogey comprising pallet is provided with the carrying position for carrying workpiece to be machined on the pallet,
Be characterized in that, the bogey further includes positioning pressure ring and cover board pressure ring, wherein the quantity of the positioning pressure ring and position with
The quantity of the carrying position and position correspond, and the positioning pressure ring is used to the position of the workpiece to be machined being limited in institute
It states on carrying position, the positioning pressure ring is used to limit the circumferential position of the workpiece to be machined;The quantity of the cover board pressure ring and
Position is corresponded with the quantity of the carrying position and position, and the cover board pressure ring is with the pallet by being threadedly coupled, with
The positioning pressure ring and workpiece to be machined are fixed on the pallet.
2. bogey according to claim 1, which is characterized in that be provided with and be looped around on the upper surface of the pallet
Annular groove on the outside of the carrying position,
The cover board pressure ring includes ring body and claw, wherein the ring body is mutually nested with the positioning pressure ring, and the ring body
Lower part be located in the annular groove;
The claw is arranged on the internal perisporium of the ring body, and the lower surface of the claw is stacked in the upper of the positioning pressure ring
On surface;
On the internal perisporium of the ring body lower part and on the side wall opposite with the internal perisporium of the annular groove respectively correspondingly
It is provided with internal thread and external screw thread, the internal thread and external screw thread cooperate.
3. bogey according to claim 1, which is characterized in that be provided with and be looped around on the upper surface of the pallet
Annular groove on the outside of the carrying position,
The cover board pressure ring includes ring body and claw, wherein the ring body is mutually nested with the positioning pressure ring, and the ring body
Lower part be located in the annular groove;
The claw is arranged on the internal perisporium of the ring body, and the lower surface of the claw is stacked in the upper of the positioning pressure ring
On surface;
On the periphery wall of the ring body lower part and on the side wall opposite with the periphery wall of the annular groove respectively correspondingly
It is provided with external screw thread and internal thread, the external screw thread and internal thread cooperate.
4. bogey according to claim 1, which is characterized in that its close annular distance of the lower surface of the positioning pressure ring
The annular region on periphery is stacked in the fringe region of the workpiece to be machined upper surface, and
On the lower surface of the positioning pressure ring, and it is provided with protrusion on the outside of the annular region, and accordingly existed
It is provided with recess portion on the upper surface of the pallet;
The protrusion is matched with the recess portion when the positioning pressure ring is stacked on the workpiece to be machined upper surface, is used for
Limit the circumferential position of the workpiece to be machined.
5. bogey according to claim 1, which is characterized in that its close annular distance of the lower surface of the positioning pressure ring
The annular region on periphery is stacked in the fringe region of the workpiece to be machined upper surface, and
On the lower surface of the positioning pressure ring, and it is provided with recess portion on the outside of the annular region, and accordingly existed
It is provided with protrusion on the upper surface of the pallet;
The protrusion is matched with the recess portion when the positioning pressure ring is stacked on the workpiece to be machined upper surface, is used for
Limit the position of the positioning pressure ring.
6. bogey according to claim 1, which is characterized in that be additionally provided with tightening portion on the cover board pressure ring
Position, the cover board pressure ring is screwed or unscrews by the position of tightening.
7. bogey according to claim 4 or 5, which is characterized in that the annular region of the positioning pressure ring is described
The value range of the width radially of workpiece to be machined is in 0.5~0.7mm.
8. bogey according to claim 1, which is characterized in that material used by the positioning pressure ring includes quartz
Or glass.
9. bogey according to claim 1, which is characterized in that material used by the cover board pressure ring includes that aluminium closes
Gold or stainless steel.
10. a kind of plasma processing device includes the bogey for carrying workpiece to be machined, which is characterized in that described
Bogey is using the bogey described in the claims 1-9 any one.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410130698.9A CN104979259B (en) | 2014-04-02 | 2014-04-02 | A kind of bogey and plasma processing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410130698.9A CN104979259B (en) | 2014-04-02 | 2014-04-02 | A kind of bogey and plasma processing device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104979259A CN104979259A (en) | 2015-10-14 |
CN104979259B true CN104979259B (en) | 2018-08-24 |
Family
ID=54275647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410130698.9A Active CN104979259B (en) | 2014-04-02 | 2014-04-02 | A kind of bogey and plasma processing device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104979259B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106384104A (en) * | 2016-10-21 | 2017-02-08 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and electronic device |
CN108807254B (en) * | 2017-05-04 | 2021-01-29 | 北京北方华创微电子装备有限公司 | Bearing device and reaction chamber |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101345184A (en) * | 2008-08-22 | 2009-01-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Plasma processing apparatus, gas dispensing device and gas delivery method |
CN202839577U (en) * | 2012-08-10 | 2013-03-27 | 北大方正集团有限公司 | Planetary plate |
CN103094037A (en) * | 2011-11-08 | 2013-05-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Holding device and plasma processing device using the same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101160253B1 (en) * | 2009-11-27 | 2012-06-26 | 주식회사 맥시스 | tray for substrate |
-
2014
- 2014-04-02 CN CN201410130698.9A patent/CN104979259B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101345184A (en) * | 2008-08-22 | 2009-01-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Plasma processing apparatus, gas dispensing device and gas delivery method |
CN103094037A (en) * | 2011-11-08 | 2013-05-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Holding device and plasma processing device using the same |
CN202839577U (en) * | 2012-08-10 | 2013-03-27 | 北大方正集团有限公司 | Planetary plate |
Also Published As
Publication number | Publication date |
---|---|
CN104979259A (en) | 2015-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103094037B (en) | A kind of clamping device and apply the plasma processing device of this clamping device | |
TWI690017B (en) | Substrate holding device | |
CN104282610B (en) | Bogey and plasma processing device | |
CN104916564A (en) | Reaction chamber and plasma processing device | |
CN105088167B (en) | Bogey, reaction chamber and semiconductor processing equipment | |
TWI827177B (en) | Process chamber and wafer processing method | |
CN104979259B (en) | A kind of bogey and plasma processing device | |
CN104425337A (en) | Clamping device and plasma processing device | |
JP2016208018A5 (en) | ||
CN106783722A (en) | Bogey and semiconductor processing equipment | |
TWM631800U (en) | Reaction chamber for semiconductor process | |
CN104916572B (en) | A kind of bogey and plasma processing device | |
KR200495564Y1 (en) | Non-scratching and durable substrate support pin | |
CN101615574B (en) | Processing device | |
TW201711123A (en) | Carrying device and reaction chamber capable of improving etching uniformity of a chip and reducing the maximum height of a corner generated after the main etching step | |
CN205944058U (en) | Bear device, "The reaction chamber" and semiconductor processing equipment | |
CN203242597U (en) | Segmental type focus ring assembly | |
CN204651300U (en) | A kind of carrier and etching apparatus | |
CN104347459B (en) | A kind of cover plate, bogey and plasma processing device | |
JP2011515854A (en) | Susceptor having a roll forming surface and method of forming the same | |
TW201830551A (en) | Hybrid substrate carrier | |
WO2020048306A1 (en) | Semiconductor processing device | |
CN104616956A (en) | Plasma etching apparatus and plasma etching method | |
CN105132890A (en) | Novel ceramic ring used in cavity | |
CN104342758B (en) | pressure ring and plasma processing device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant |