CN204651300U - A kind of carrier and etching apparatus - Google Patents
A kind of carrier and etching apparatus Download PDFInfo
- Publication number
- CN204651300U CN204651300U CN201520331302.7U CN201520331302U CN204651300U CN 204651300 U CN204651300 U CN 204651300U CN 201520331302 U CN201520331302 U CN 201520331302U CN 204651300 U CN204651300 U CN 204651300U
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- CN
- China
- Prior art keywords
- pressure ring
- cover plate
- boss
- paw
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005530 etching Methods 0.000 title claims abstract description 14
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 40
- 238000000034 method Methods 0.000 description 11
- 238000001312 dry etching Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 210000003141 lower extremity Anatomy 0.000 description 2
- 239000012050 conventional carrier Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- -1 pottery Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a kind of carrier and etching apparatus, and it comprises disassembled chassis, pressure ring and cover plate, described chassis is provided with several boss of carrier substrate, described boss is equipped with seal, and substrate is placed on described seal; Described cover plate be provided with corresponding with described boss and run through several through holes of described boss, it is characterized in that: described boss periphery is provided with pressure ring, described pressure ring is distributed with several paws be connected as a single entity, described cover plate is placed on described pressure ring, described paw embeds in described cover plate, with stationary substrate; Described cover plate and chassis are fixed by draw-in groove.The utility model, on the one hand by being arranged at the paw stationary substrate on pressure ring, increases the working (finishing) area of substrate, and when paw damages, by changing the pressure ring with paw, reduces the consume of cover plate; On the other hand, by draw-in groove fixed underpan and cover plate, easy to operate when making combination and disassemble carrier.
Description
Technical field
The utility model belongs to field of semiconductor processing, particularly relates to a kind of carrier and has the etching apparatus of this carrier.
Background technology
Graphical sapphire substrate is one of method of the comparatively raising LED light extraction efficiency of main flow at present, and the method adopts dry etching technology to etch the Sapphire Substrate that there is mask pattern usually, to make figure on a sapphire substrate.Sense coupling equipment is the equipment that a kind of Application comparison makes graphical sapphire substrate widely, and in etching technics, in order to improve the production capacity of single process, multiple substrate is sent in its reaction chamber by usual employing load plate, to carry out processes to multiple substrate (or wafer) simultaneously.
At present conventional carrier comprises the screw of chassis, cover plate and multiple fixed underpan and cover plate.Wherein, the upper surface on chassis is provided with several boss, it is equipped with seal, substrate is placed on seal, the position corresponding with boss at cover plate is provided with through hole, and the diameter of through hole is less than the diameter of substrate, make the upper edge region of the lower limb of through hole and substrate overlapped, in order to be fixed on chassis by substrate.
But, following problem is inevitably there is in above-mentioned load plate in the process of carrying out technique, that is: on the one hand due to the through hole lower limb of cover plate and the upper edge region of substrate overlapped, make the fringe region of substrate cannot be etched or etch uneven, decrease the usable floor area of substrate.On the other hand, adopt screw fixed underpan and cover plate, be separated or fixed underpan and cover plate time all need manual operation, and complicated operation, add manpower consumption, and reduce production efficiency.Meanwhile, once the through hole edge of cover plate is impaired, namely needs to change cover plate, cause the waste of cover plate.
Summary of the invention
For solving the problem, the utility model provides a kind of carrier, for carrying workpiece to be machined, it comprises disassembled chassis and is arranged at the cover plate on described chassis, the upper surface on described chassis have several boss, described boss is equipped with seal, in order to carry workpiece to be machined, described cover plate is provided with correspondence and runs through several through holes of described boss, it is characterized in that: described boss periphery is provided with pressure ring, described pressure ring is distributed with several paws be connected as a single entity, described cover plate is placed on described pressure ring, described paw embeds in described cover plate, with fixing described workpiece to be machined, described cover plate and chassis are fixed by draw-in groove.
Preferably, described boss is annular boss or central area is the boss of Openworks shape.
Preferably, described paw comprises the vertical component vertical with described pressure ring and the horizontal component with described pressure ring level, and described horizontal component is wedge shape, single described pressure ring is evenly distributed with at least 3 described paws.
Preferably, the lower surface of described paw horizontal component and the spacing of seal upper surface equal the thickness of described workpiece to be machined.
Preferably, described through hole edge has the breach corresponding with described paw quantity and position, and described paw inserts in described breach, embeds in described cover plate to realize described paw.
Preferably, described boss and seal outer diameter are all identical with described workpiece to be machined external diameter, and described through hole internal diameter is identical with described pressure ring external diameter.
Preferably, described draw-in groove is uniformly distributed, and number is at least 3.
Preferably, described pressure ring is metal pressure ring, alloy pressure ring, ceramic pressure ring, quartzy pressure ring, carborundum pressure ring.
The utility model additionally provides a kind of etching apparatus, and it comprises above-mentioned carrier.
The carrier that the utility model provides is for dry etching, on the one hand, by arranging pressure ring in boss periphery, and pressure ring has the paw of stationary substrate, the contact area of paw and substrate reduces, thus increases the working (finishing) area of substrate surface, and when paw is damaged, only need change the pressure ring with paw and without the need to changing whole cover plate, thus reduce the loss of cover plate; On the other hand, by draw-in groove fixed underpan and cover plate, avoid the use of screw, convenient to operation, reduce manpower consumption.
Accompanying drawing explanation
Fig. 1 is the three-dimensional disassembly diagram of carrier in the embodiment of the utility model.
Fig. 2 is the partial side view of carrier in the embodiment of the utility model.
Fig. 3 is the vertical view of boss and seal in the embodiment of the utility model.
Fig. 4 is the vertical view of pressure ring in the embodiment of the utility model.
Fig. 5 is the vertical view of through hole in the embodiment of the utility model.
Fig. 6 is the vertical view of pressure ring and through hole in the embodiment of the utility model.
Accompanying drawing marks: 1: chassis; 11: boss; 12: seal; 13: substrate; 2: pressure ring; 21: paw; 3: cover plate; 31: through hole; 32: breach; 4: draw-in groove; 41: protuberance; 42: groove.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail, which show preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
Embodiment
Referring to accompanying drawing 1, a kind of carrier that the utility model provides, for carrying workpiece to be machined, such as substrate (or wafer), comprises dismountable chassis 1, pressure ring 2 and cover plate 3.Chassis 1 upper surface is equipped with several boss 11, and its number rationally can be arranged according to the area on need of production and chassis 1, and the external diameter of boss 11 is identical with the substrate diameter size that it carries, and makes substrate be positioned on boss 11 completely; Pressure ring 2 is placed on boss 11 periphery, namely the internal diameter of pressure ring 2 is greater than the external diameter of boss 11, makes pressure ring 2 just be close to boss 11 outer wall, in order to adapt to the hot conditions of dry etching environment, pressure ring 2 need be made up of exotic material, such as metal, alloy, pottery, quartz, carborundum etc.; Cover plate 3 has the through hole 31 corresponding with boss 11, cover plate 3 is placed on pressure ring 2, and therefore, the internal diameter of through hole 31 equals the internal diameter of pressure ring 2; Chassis 1 and cover plate 3 are fixed by draw-in groove 4, and draw-in groove 4 forms with the groove 42 be positioned on cover plate 3 by being positioned at the One On The Chassis protuberance 41, and draw-in groove 4 is evenly distributed, and number is at least 3, and the present embodiment preferably all arranges 1 draw-in groove 4 between adjacent lands 11.
Referring to accompanying drawing 2 and 3, particularly, boss 11 is placed with the seal 12 preventing etching gas from entering boss 11 inside, substrate 13 is placed on seal 12, seal 12 external diameter is identical with boss 11 external diameter size, with the gap between seal boss 11 upper surface and substrate 13, prevent heat-exchange medium between the two from revealing, avoid the process environments of heat-exchange medium to dry etching reaction chamber revealed to pollute further.In dry etching process, etching gas just etching in the face of substrate 13 from carrier, equally, also most important to the cooling of substrate, otherwise photoetching offset plate figure can be out of shape because of the high temperature produced in the process of etching, and then effective transfer of figure cannot be ensured.In etching process, in order to accelerate the cooling of substrate 13, annular is arranged to by boss 11 or central area is the boss of Openworks shape, such as cross hollow out or rhombus hollow out, the preferred annular boss of the present embodiment, He or N
2the back side that refrigerating gas passes boss 11 pairs of substrates 13 from the bottom of boss 11 cools.
Referring to accompanying drawing 2 and 4, particularly, pressure ring 2 is evenly distributed with several paws 21 be connected as a single entity, paw 21 comprises the vertical component vertical with pressure ring 2 and the horizontal component parallel with pressure ring 2, wherein horizontal component is wedge shape, to reduce the impact on etching gas air-flow, horizontal component extends towards the center of pressure ring 2; The lower surface of paw 21 horizontal component and the spacing of seal 12 upper surface equal the thickness of substrate 13, make the EDGE CONTACT of paw 21 horizontal component lower surface and substrate 13 upper surface, with stationary substrate 13.The number of paw 21 is at least 3, and the present embodiment is 6 paws 21 preferably; Because the contact area of paw 21 with substrate 13 edge reduces, the etched area of substrate 13 increases; In etching process, when paw 21 is etched damage, only need having the pressure ring 2 of paw 21, without the need to changing cover plate 3, thus reducing the loss of cover plate 3.
Referring to accompanying drawing 5 and Fig. 6, particularly, the edge of through hole 31 has several breach 32, position, the number of this breach 32 and paw 21 are all corresponding, and paw 21 inserts in breach 32, be embedded in cover plate 3 to realize paw 21, cover plate 3 is positioned over the assembled state on pressure ring 2.
The carrier that the utility model provides in use, utilizes paw 21 stationary substrate 13 less with substrate 13 EDGE CONTACT area, increases the working (finishing) area of substrate 13; When paw 21 is damaged, carry out maintenance carrier by changing the pressure ring 2 with paw 21, cover plate 3 then without the need to changing, thus reduces the consume of cover plate 3 consumption; Meanwhile, by draw-in groove 4 fixed underpan 1 and cover plate 3, convenient to operation.
The utility model also provides a kind of dry etching equipment, and during production operation, it utilizes above-mentioned carrier carrier substrate, improves production efficiency.
Should be understood that, above-mentioned specific embodiments is preferred embodiment of the present utility model, and scope of the present utility model is not limited to this embodiment, and all any changes done according to the utility model, all belong within protection range of the present utility model.
Claims (10)
1. a carrier, for carrying workpiece to be machined, it comprises disassembled chassis and is arranged at the cover plate on described chassis, the upper surface on described chassis is provided with several boss, described boss is equipped with seal, described workpiece to be machined is placed on described seal, described cover plate is provided with correspondence and runs through several through holes of described boss, it is characterized in that: described boss periphery is provided with pressure ring, described pressure ring is distributed with several paws be connected as a single entity, described cover plate is placed on described pressure ring, described paw embeds in described cover plate, with fixing described workpiece to be machined, described cover plate and chassis are fixed by draw-in groove.
2. a kind of carrier according to claim 1, is characterized in that: described boss is annular boss or central area is Openworks shape boss.
3. a kind of carrier according to claim 1, it is characterized in that: described paw has vertical component and horizontal component, wherein said vertical component is vertical with described pressure ring, and described horizontal component is parallel with described pressure ring.
4. a kind of carrier according to claim 3, is characterized in that: described paw horizontal component is wedge shape, single described pressure ring is evenly distributed with at least 3 described paws.
5. a kind of carrier according to claim 3, is characterized in that: the lower surface of described paw horizontal component and the spacing of seal upper surface equal the thickness of described workpiece to be machined.
6. a kind of carrier according to claim 1, is characterized in that: described through hole edge has the breach corresponding with described paw quantity and position, and described paw inserts in described breach, embeds in described cover plate to realize it.
7. a kind of carrier according to claim 1, is characterized in that: described boss and seal outer diameter are all identical with described workpiece to be machined external diameter, and described through hole internal diameter is identical with described pressure ring internal diameter.
8. a kind of carrier according to claim 1, it is characterized in that: described draw-in groove is evenly distributed, number is at least 3.
9. a kind of carrier according to claim 1, is characterized in that: described pressure ring is metal pressure ring, alloy pressure ring, ceramic pressure ring, quartzy pressure ring, carborundum pressure ring.
10. an etching apparatus, is characterized in that: comprise any one carrier described in claim 1 ~ 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520331302.7U CN204651300U (en) | 2015-05-21 | 2015-05-21 | A kind of carrier and etching apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520331302.7U CN204651300U (en) | 2015-05-21 | 2015-05-21 | A kind of carrier and etching apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204651300U true CN204651300U (en) | 2015-09-16 |
Family
ID=54104017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520331302.7U Active CN204651300U (en) | 2015-05-21 | 2015-05-21 | A kind of carrier and etching apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204651300U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106548969A (en) * | 2015-09-22 | 2017-03-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Clamping device and semiconductor processing equipment |
| CN109119373A (en) * | 2017-06-23 | 2019-01-01 | 北京北方华创微电子装备有限公司 | pressure ring assembly and reaction chamber |
| CN112853499A (en) * | 2020-12-31 | 2021-05-28 | 湖南三安半导体有限责任公司 | Silicon carbide substrate etching jig |
-
2015
- 2015-05-21 CN CN201520331302.7U patent/CN204651300U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106548969A (en) * | 2015-09-22 | 2017-03-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Clamping device and semiconductor processing equipment |
| CN109119373A (en) * | 2017-06-23 | 2019-01-01 | 北京北方华创微电子装备有限公司 | pressure ring assembly and reaction chamber |
| CN112853499A (en) * | 2020-12-31 | 2021-05-28 | 湖南三安半导体有限责任公司 | Silicon carbide substrate etching jig |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |