CN203026558U

CN203026558U - LED (lighting emitted diode) component

Info

Publication number: CN203026558U
Application number: CN 201220664097
Authority: CN
Inventors: 瞿崧; 文国军; 严华锋
Original assignee: Shanghai Dangoo Electronic Trading Co Ltd
Current assignee: Shanghai Dangoo Electronic Trading Co Ltd
Priority date: 2012-12-06
Filing date: 2012-12-06
Publication date: 2013-06-26
Anticipated expiration: 2022-12-06

Abstract

The utility model relates to an LED (lighting emitted diode) component. The LED component comprises LED chips and a glass substrate, wherein the LED chips and metal conductive circuits are fixed on the glass substrate; aluminum nitride coats are coated on the connection surfaces between the glass substrate and the LED chips; the LED chips are coated with phosphor powder glue; a plurality of LED chips are connected in series and are crystallized on thin film circuits of the aluminum nitride coats; phosphor powder is coated on the surfaces of the LED chips to form the white light component; and the aluminum nitride coat film grows on the glass substrate by a film forming manner of magnetron sputtering. The phosphor powder glue protection layers coating the LED chips can be in needed shapes according to the light emitting types of the chips. The aluminum nitride coat film is coated on the LED chips and the glass substrate to form a heat conduction insulating layer, so that the radiating area is enlarged, and the optimal radiation is achieved.

Description

The LED emitting components

Technical field

The utility model relates to a kind of LED emitting components, and is especially a kind of on LED chip and glass substrate, is provided with the LED emitting components of one deck heat conductive insulating layer.

Background technology

LED is light-emitting diode (LED, Lighting emitted diode), is to utilize under electric field action the Sony ericsson mobile comm ab that PN junction is luminous.Having high life/environmental protection/energy-conservation characteristics, is the new light sources of environmental protection.

The LED technology is increasingly full-fledged, and at present the LED white light is to excite the yellow-green fluorescence powder by blue chip, carries out that wavelength is in harmonious proportion and the white light that produces, and the luminous efficiency of LED has surpassed most of conventional light source at present.Generally speaking, LED is by MOCVD (Metal-organic Chemical Vapor Deposition, the metallo-organic compound chemical gaseous phase deposition) grow PN layer and luminescent layer on epitaxial wafer, then make the chip of different size by techniques such as a survey, diffusion, minute BIN, generally speaking 10*10 mil is arranged, 10*23 mil, 24*24 mil, 40*40 mil equidimension can be born the continuous current driving from 10mA ~ 1A.Traditional encapsulation is that these chips are fixed on a package support, by negative electrode and the anode of gold thread welding chip, pass into electric current and come driving LED to send blue single wavelength light, thereby excitated fluorescent powder forms white light.Support generally adopts engineering plastics or with the plastics of metal heat sink, then increases its light extraction yield by bottom reflection, or by the silica gel moulding or change the refractive index of internal material with secondary optical lens, thereby increase its bright dipping.

Traditional packaged type, quite low for the light utilization efficiency of LED chip, particularly fail to take full advantage of the all-round light of LED chip, therefore can by LED is encapsulated on glass substrate, increase it and go out optical range.But due to glass be the non-conductor of heat, effectively quick heat with LED chip distributes fast, therefore needs one deck resilient coating to realize the chip cooling of LED.

Summary of the invention

The utility model is the heat dissipation technology problem that will solve between LED chip and substrate, and provide a kind of LED emitting components, this LED emitting components to design one deck heat conductive insulating layer on LED chip and glass substrate, and increase its maximum area of dissipation, realize best heat radiation.

For achieving the above object, the technical solution of the utility model is: a kind of LED emitting components, comprise LED chip, glass substrate, fixed L ED chip and metallic conduction circuit above glass substrate, be characterized in: scribble aluminium nitride coating on glass substrate and LED chip joint face, and coat LED chip by phosphor gel.

Several LED chip series connection and die bond are on the circuit of aluminium nitride coating film.

LED chip chip surface coating fluorescent powder forms white light parts.

The aluminium nitride coating film is grown on glass substrate by the thin film-forming method of magnetron sputtering.

The protective layer of the outer phosphor gel that coats of LED chip can form required shape according to the luminous smooth type of chip.

The beneficial effects of the utility model are:

The LED emitting components is on LED chip and glass substrate, and being covered with one deck aluminium nitride (AlN) film has increased area of dissipation as the heat conductive insulating layer, realizes best heat radiation.

Aluminium nitride film is the high thermal conductivity insulating ceramic material, therefore can directly arrange plain conductor on its surface, on the circuit of AlN film, can realize the LED chip die bond LED is together in series, and can dissipate the LED chip heat effectively rapidly.At the chip surface coating fluorescent powder, perhaps adopt the mode of remote fluorescence powder simultaneously, by coating the layer of fluorescent powder layer, the blue-light excited fluorescent material that makes LED chip send forms white light parts.

Description of drawings

Fig. 1 is structural representation of the present utility model.

Embodiment

As shown in Figure 1, LED emitting components of the present utility model, comprise LED chip 1, metallic conduction circuit 2, aluminium nitride (AlN) coating 3, glass substrate 4, fixed L ED chip 1 and metallic conduction circuit 2 above glass substrate 4, scribble aluminium nitride (AlN) coating 3 on glass substrate 4 and LED chip 1 joint face, and coat LED chips by phosphor gel 5.

Several LED chip 1 series connection and die bond are on the circuit of aluminium nitride (AlN) coating 3 films.LED chip 1 chip surface coating fluorescent powder forms white light parts.

Aluminium nitride (AlN) coating 3 films are grown on glass substrate 4 by the thin film-forming method of magnetron sputtering.

The protective layer of the LED chip 1 outer phosphor gel 5 that coats can form required shape according to the luminous smooth type of chip.

The utility model is by take single LEDs chip 1 as the unit, be placed on high light transmittance glass substrate 4, be covered with the film of aluminium nitride (AlN) coating 3 on high transparent glass substrate 4, the film of aluminium nitride (AlN) coating 3 has thermal conductivity and insulating properties, can be grown on glass substrate 4 by the thin film-forming method of magnetron sputtering.

Aluminium nitride (AlN) coating 3 films are high thermal conductivity insulating ceramic materials, therefore can directly arrange plain conductor on its surface, LED chip 1 die bond on the circuit of AlN aluminium nitride coating 3 films, can realize LED is together in series, and can dissipate the LED chip heat effectively rapidly.At the chip surface coating fluorescent powder, perhaps adopt the mode of remote fluorescence powder simultaneously, by coating the layer of fluorescent powder layer, the blue-light excited fluorescent material that makes LED chip send forms white light parts.

Outer phosphor gel 5 protective layers that coat of LED chip 1 can be according to the luminous smooth type of chip; design the required shape of various application; at first apply the heat-conducting layer of one deck aluminium nitride (AlN) coating 3 by magnetron sputtering apparatus at transparency carrier; then cloth circuits on aluminium nitride (AlN) coating 3; and direct die bond LED chip 1, and form the light source luminescent device by fluorescent powder coated technique.

The manufacture method of LED emitting components of the present utility model comprises the following steps:

(1) plate aluminium nitride (AlN) coating 3 films by evaporation or ion sputtering on high transparent glass substrate 4;

(2) by the mode evaporation metal material of mask, form the circuit conductive layer of glass substrate 4;

(3) position according to design in advance is attached to LED chip 1 die bond on glass substrate 4;

(4) fluorescent powder silica gel is overlayed on above LED chip 1 by fluorescent material injection mould fixed packet.

Claims

1. LED emitting components, comprise LED chip (1), glass substrate (4), fixed L ED chip (1) and metallic conduction circuit (2) above glass substrate (4), it is characterized in that: scribble aluminium nitride coating (3) on described glass substrate (4) and LED chip (1) joint face, and coat LED chip (1) by phosphor gel (5).

2. LED emitting components according to claim 1 is characterized in that: several described LED chips (1) series connection and die bond are on the circuit of aluminium nitride coating (3) film.

3. LED emitting components according to claim 1, is characterized in that: the surperficial coating fluorescent powder of described LED chip (1), formation white light parts.

4. LED emitting components according to claim 1, it is characterized in that: described aluminium nitride coating (3) film is grown on glass substrate (4) by the thin film-forming method of magnetron sputtering.

5. LED emitting components according to claim 1 is characterized in that: the protective layer of the outer phosphor gel (5) that coats of described LED chip (1) can form required shape according to the luminous smooth type of chip.