CN202065726U - LED (light-emitting diode) illumination structure with heat sink - Google Patents
LED (light-emitting diode) illumination structure with heat sink Download PDFInfo
- Publication number
- CN202065726U CN202065726U CN2011201313096U CN201120131309U CN202065726U CN 202065726 U CN202065726 U CN 202065726U CN 2011201313096 U CN2011201313096 U CN 2011201313096U CN 201120131309 U CN201120131309 U CN 201120131309U CN 202065726 U CN202065726 U CN 202065726U
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- led
- radiating plate
- heat radiating
- radiator
- metallic
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Abstract
The utility model discloses an LED (light-emitting diode) illumination structure with a heat sink. The LED illumination structure is characterized by comprising a metal cooling panel, wherein the metal cooling panel is provided with a plurality of LED wafers; the bottom of the metal cooling panel is provided with a plurality of cooling scales arranged at interval; wafer bonding glue is arranged between the LED wafers and the metal cooling panel; and the LED wafers are fixed on the metal cooling panel by the wafer bonding glue to form a bonded wafer lighting area. The LED illumination structure aims to overcome the deficiency of the prior art and provides the LED illumination structure with the heat sink, which has simple structure, wide application range and high cooling efficiency.
Description
[technical field]
The present invention relates to a kind of LED light structures, particularly a kind of LED light structures that has radiator.
[background technology]
The weakness of LED illumination is exactly to the operating temperature sensitivity, and when the operating temperature of LED lamp pearl surpassed the rated value of LED lamp pearl, the operating efficiency and the service life of light fixture reduced greatly.At present, the radiator structure of traditional LED lighting device is LED lamp pearl, heat-conducting substrate, radiator composition, fills with tin cream or heat conductive silica gel between LED lamp pearl, heat-conducting substrate, the radiator.Inconsistent because of the coefficient of conductivity, the heat that the conduction number of plies too much causes LED lamp pearl to be produced can't be derived efficiently.
[summary of the invention]
The objective of the invention is to overcome the deficiencies in the prior art part, a kind of simple in structure, applied range, the LED light structures that has radiator that radiating efficiency is high are provided.
In order to solve the technical problem of above-mentioned existence, the present invention adopts following technical proposal:
A kind of LED light structures that has radiator, it is characterized in that comprising metallic heat radiating plate, metallic heat radiating plate is provided with several LED wafers, be provided with several in the metallic heat radiating plate bottom and be spaced the heat radiation scale, be provided with crystal-bonding adhesive between LED wafer and metallic heat radiating plate, described LED wafer is fixed on the metallic heat radiating plate by crystal-bonding adhesive and forms the solid crystal illuminating zone.
Aforesaid a kind of LED light structures that has radiator is characterized in that described crystal-bonding adhesive is heat conduction tin glue or heat conduction elargol.
Aforesaid a kind of LED light structures that has radiator is characterized in that being provided with reflecting piece in the solid crystal illuminating area peripheral edge; On the solid crystal illuminating zone, be provided with transparent filling glue with the sealing of the LED wafer in the solid crystal illuminating zone.
Aforesaid a kind of LED light structures that has radiator is characterized in that described metallic heat radiating plate and heat radiation scale are that thermal conductive metallic material is made.
Aforesaid a kind of LED light structures that has radiator is characterized in that described reflecting piece made by heat conductive silica gel.
The present invention compared with prior art has following advantage: owing to be provided with between LED wafer and metallic heat radiating plate the LED wafer is fixed on crystal-bonding adhesive on the metallic heat radiating plate, crystal-bonding adhesive is heat conduction tin glue or heat conduction elargol, during the solid crystal illuminating regional work, the heat that the LED wafer is produced can directly conduct by crystal-bonding adhesive gives metallic heat radiating plate, conduct to the heat radiation scale from metallic heat radiating plate again, heat is dispersed on the heat radiation scale and is dissipated in the air with convection type, therefore to compare radiating efficiency higher for the present invention and the radiator structure of traditional LED, the range of application height.In addition, the periphery in the solid crystal illuminating zone is provided with the reflecting piece of being made by heat conductive silica gel, is provided with the transparent filling glue with the sealing of the LED wafer in the solid crystal illuminating zone on the solid crystal illuminating zone, and the light that makes the solid crystal illuminating zone be produced is very bright.
[description of drawings]
Fig. 1 is a cutaway view of the present invention;
Fig. 2 is a vertical view of the present invention;
Fig. 3 is the A portion enlarged drawing of Fig. 1 of the present invention.
[specific embodiment]
The invention will be further described below in conjunction with accompanying drawing and the specific embodiment:
Shown in figure 1-3, a kind of LED light structures that has radiator, comprise metallic heat radiating plate 1, metallic heat radiating plate 1 is provided with several LED wafers 2, be provided with several in metallic heat radiating plate 1 bottom and be spaced heat radiation scale 3, be provided with crystal-bonding adhesive 4 between LED wafer 2 and metallic heat radiating plate 1, described LED wafer 2 is fixed on the metallic heat radiating plate 1 by crystal-bonding adhesive 4 and forms solid crystal illuminating zone 5.Crystal-bonding adhesive 4 is heat conduction tin glue or heat conduction elargol.
5 peripheries are provided with reflecting piece 6 in the solid crystal illuminating zone; Described reflecting piece 6 is made by heat conductive silica gel; On solid crystal illuminating zone 5, be provided with transparent filling glue 7 with 2 sealings of the LED wafer in the solid crystal illuminating zone 5.
Metallic heat radiating plate 1 and heat radiation scale 3 are made for thermal conductive metallic material.
Owing between LED wafer 2 and metallic heat radiating plate 1, be provided with LED wafer 2 is fixed on crystal-bonding adhesive 4 on the metallic heat radiating plate 1, crystal-bonding adhesive 4 is heat conduction tin glue or heat conduction elargol, when work in solid crystal illuminating zone 5, the heat that LED wafer 2 is produced can directly conduct by crystal-bonding adhesive 4 gives metallic heat radiating plate 1, give heat radiation scale 3 from metallic heat radiating plate 1 conduction again, heat is dispersed on the heat radiation scale 3 and is dissipated in the air with convection type, therefore to compare radiating efficiency higher for the present invention and the radiator structure of traditional LED, the range of application height.In addition, the periphery in solid crystal illuminating zone 5 is provided with the reflecting piece of being made by heat conductive silica gel 6, is provided with the transparent filling glue 7 with 2 sealings of the LED wafer in the solid crystal illuminating zone 5 on solid crystal illuminating zone 5, and the light that makes solid crystal illuminating zone 5 be produced is very bright.
Claims (5)
1. LED light structures that has radiator, it is characterized in that comprising metallic heat radiating plate (1), metallic heat radiating plate (1) is provided with several LED wafers (2), be provided with several in metallic heat radiating plate (1) bottom and be spaced heat radiation scale (3), be provided with crystal-bonding adhesive (4) between LED wafer (2) and metallic heat radiating plate (1), described LED wafer (2) is fixed on metallic heat radiating plate (1) by crystal-bonding adhesive (4) and goes up and form solid crystal illuminating zone (5).
2. according to right 1 described a kind of LED light structures that has radiator, it is characterized in that described crystal-bonding adhesive (4) is heat conduction tin glue or heat conduction elargol.
3. according to right 1 described a kind of LED light structures that has radiator, it is characterized in that being provided with reflecting piece (6) at solid crystal illuminating zone (5) periphery; On solid crystal illuminating zone (5), be provided with transparent filling glue (7) with the sealing of the LED wafer (2) in solid crystal illuminating zone (5).
4. according to right 1 described a kind of LED light structures that has radiator, it is characterized in that described metallic heat radiating plate (1) and heat radiation scale (3) make for thermal conductive metallic material.
5. according to right 3 described a kind of LED light structures that have radiator, it is characterized in that described reflecting piece (6) made by heat conductive silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201313096U CN202065726U (en) | 2011-04-28 | 2011-04-28 | LED (light-emitting diode) illumination structure with heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201313096U CN202065726U (en) | 2011-04-28 | 2011-04-28 | LED (light-emitting diode) illumination structure with heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202065726U true CN202065726U (en) | 2011-12-07 |
Family
ID=45059588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201313096U Expired - Fee Related CN202065726U (en) | 2011-04-28 | 2011-04-28 | LED (light-emitting diode) illumination structure with heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202065726U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106572748A (en) * | 2014-07-04 | 2017-04-19 | 优利思百隆有限公司 | Pull-out guide for a movable furniture part |
-
2011
- 2011-04-28 CN CN2011201313096U patent/CN202065726U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106572748A (en) * | 2014-07-04 | 2017-04-19 | 优利思百隆有限公司 | Pull-out guide for a movable furniture part |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20140428 |