CN202140871U - Novel LED (light-emitting diode) lighting structure with radiator - Google Patents
Novel LED (light-emitting diode) lighting structure with radiator Download PDFInfo
- Publication number
- CN202140871U CN202140871U CN201120267707U CN201120267707U CN202140871U CN 202140871 U CN202140871 U CN 202140871U CN 201120267707 U CN201120267707 U CN 201120267707U CN 201120267707 U CN201120267707 U CN 201120267707U CN 202140871 U CN202140871 U CN 202140871U
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- heat
- conducting substrate
- radiator
- base plate
- led
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Abstract
The utility model discloses a novel LED (light-emitting diode) lighting structure with a radiator, which is characterized by comprising a heat-conducting base plate and radiating scales connected on the heat-conducting base plate, a heat-conducting connecting layer capable of connecting and fixing the radiating scales on the heat-conducting base plate is arranged between the heat-conducting base plate and the radiating scales, and a flexible circuit board and a plurality of LED wafers connected with the flexible circuit board are arranged on the heat-conducting base plate; and solid crystal glue is arranged between the LED wafers and the heat-conducting base plate, and the LED wafers are tightly fixed on the heat-conducting base plate by the solid crystal glue. The utility model aims at overcoming the defects of the prior art and provides the novel LED lighting structure with the radiator, which is simple in structure, wide in applied range and high in radiating efficiency.
Description
[technical field]
The present invention relates to a kind of LED light structures, particularly a kind of New LED light structures that has radiator.
[background technology]
The weakness of LED illumination is exactly responsive to operating temperature, and when the operating temperature of LED lamp pearl surpassed the rated value of LED lamp pearl, the operating efficiency and the service life of light fixture reduced greatly.At present, the radiator structure of traditional LED lighting device is LED lamp pearl, heat-conducting substrate, radiator composition, fills with tin cream or heat conductive silica gel between LED lamp pearl, heat-conducting substrate, the radiator.Inconsistent because of the coefficient of conductivity, the heat that the conduction number of plies too much causes LED lamp pearl to be produced can't be derived efficiently.
[summary of the invention]
The objective of the invention is to overcome the weak point of prior art, a kind of simple in structure, applied range, the New LED light structures that has radiator that radiating efficiency is high are provided.
In order to solve the technical problem of above-mentioned existence, the present invention adopts following technical proposal:
A kind of New LED light structures that has radiator; It is characterized in that comprising heat-conducting substrate and be connected the heat radiation scale on the heat-conducting substrate; Between heat-conducting substrate and heat radiation scale, be provided with and can the heat radiation scale be fastened on the heat conduction articulamentum on the heat-conducting substrate, on heat-conducting substrate, be provided with flexible circuit board and several LED wafers that is connected with flexible circuit board.
Aforesaid a kind of New LED light structures that has radiator is characterized in that between LED wafer and heat-conducting substrate, being provided with crystal-bonding adhesive, and said LED wafer is fastened on the heat-conducting substrate through crystal-bonding adhesive.
Aforesaid a kind of New LED light structures that has radiator is characterized in that described crystal-bonding adhesive is heat conduction tin glue or heat conduction elargol.
Aforesaid a kind of New LED light structures that has radiator is characterized in that the heat conduction articulamentum is the tin slurry.
The present invention compared with prior art has following advantage: can the heat radiation scale be fastened on the heat conduction articulamentum on the heat-conducting substrate owing between heat-conducting substrate and heat radiation scale, be provided with, but the heat conduction articulamentum is the tin slurry of heat conduction, in addition; On heat-conducting substrate, be provided with flexible circuit board and several LED wafers that is connected with flexible circuit board, the LED wafer is fastened on the heat-conducting substrate through crystal-bonding adhesive, and crystal-bonding adhesive is heat conduction tin glue or heat conduction elargol; Therefore; During the work of LED wafer, the heat that the LED wafer is produced can directly conduction be to heat-conducting substrate through crystal-bonding adhesive, and heat-conducting substrate conducts to the heat radiation scale through the heat conduction articulamentum; Heat is dispersed on the heat radiation scale and is dissipated in the air with convection type; Therefore to compare radiating efficiency higher for the present invention and the radiator structure of traditional LED, and range of application is high, and structure is simpler.
[description of drawings]
Fig. 1 is a front schematic view of the present invention;
Fig. 2 is a vertical view of the present invention;
Fig. 3 is a upward view of the present invention;
Fig. 4 is the A portion enlarged drawing of Fig. 1 of the present invention.
[specific embodiment]
Below in conjunction with the accompanying drawing and the specific embodiment the present invention is done further description:
Shown in figure 1-3; A kind of New LED light structures that has radiator; Comprise heat-conducting substrate 1 and be connected the heat radiation scale 2 on the heat-conducting substrate 1; Between heat-conducting substrate 1 and heat radiation scale 2, be provided with and can heat radiation scale 2 be fastened on the heat conduction articulamentum 3 on the heat-conducting substrate 1, on heat-conducting substrate 1, be provided with flexible circuit board 4 and several LED wafers 5 that is connected with flexible circuit board 4; LED wafer 5 is provided with lead-in wire 6, and the lead-in wire 6 of said LED wafer 5 is welded on the flex circuit plate 4 and LED wafer 5 is electrically connected with flex circuit plate 4.
Between LED wafer 5 and heat-conducting substrate 1, be provided with crystal-bonding adhesive 7, said LED wafer 5 is fastened on the heat-conducting substrate 1 through crystal-bonding adhesive 7.
Crystal-bonding adhesive 7 is heat conduction tin glue or heat conduction elargol.
Owing between heat-conducting substrate 1 and heat radiation scale 2, is provided with and can heat radiation scale 2 be fastened on the heat conduction articulamentum 3 on the heat-conducting substrate 1, but heat conduction articulamentum 3 is the tin slurry of heat conduction, in addition; On heat-conducting substrate 1, be provided with flexible circuit board 4 and several LED wafers 5 that is connected with flexible circuit board 4, LED wafer 5 is fastened on the heat-conducting substrate 1 through crystal-bonding adhesive 7, and crystal-bonding adhesive 7 is heat conduction tin glue or heat conduction elargol; Therefore; During 5 work of LED wafer, the heat that LED wafer 5 is produced can directly conduction be to heat-conducting substrate 1 through crystal-bonding adhesive 7, and heat-conducting substrate 1 is given heat radiation scale 2 through 3 conduction of heat conduction articulamentum; Heat is dispersed on the heat radiation scale 2 and is dissipated in the air with convection type; Therefore to compare radiating efficiency higher for the present invention and the radiator structure of traditional LED, and range of application is high, and structure is simpler.
Claims (4)
1. New LED light structures that has radiator; It is characterized in that comprising heat-conducting substrate (1) and being connected the heat radiation scale (2) on the heat-conducting substrate (1); Between heat-conducting substrate (1) and heat radiation scale (2), be provided with and can heat radiation scale (2) be fastened on the heat conduction articulamentum (3) on the heat-conducting substrate (1), on heat-conducting substrate (1), be provided with flexible circuit board (4) and several LED wafers (5) that is connected with flexible circuit board (4).
2. a kind of New LED light structures that has radiator according to claim 1 is characterized in that between LED wafer (5) and heat-conducting substrate (1), being provided with crystal-bonding adhesive (7), and said LED wafer (5) is fastened on the heat-conducting substrate (1) through crystal-bonding adhesive (7).
3. a kind of New LED light structures that has radiator according to claim 1 is characterized in that described crystal-bonding adhesive (7) is heat conduction tin glue or heat conduction elargol.
4. a kind of New LED light structures that has radiator according to claim 1 is characterized in that heat conduction articulamentum (3) is the tin slurry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120267707U CN202140871U (en) | 2011-07-27 | 2011-07-27 | Novel LED (light-emitting diode) lighting structure with radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120267707U CN202140871U (en) | 2011-07-27 | 2011-07-27 | Novel LED (light-emitting diode) lighting structure with radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202140871U true CN202140871U (en) | 2012-02-08 |
Family
ID=45551929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120267707U Expired - Fee Related CN202140871U (en) | 2011-07-27 | 2011-07-27 | Novel LED (light-emitting diode) lighting structure with radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202140871U (en) |
-
2011
- 2011-07-27 CN CN201120267707U patent/CN202140871U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120208 Termination date: 20140727 |
|
| EXPY | Termination of patent right or utility model |