CN202221777U - Large power LED light ball - Google Patents
Large power LED light ball Download PDFInfo
- Publication number
- CN202221777U CN202221777U CN 201120144429 CN201120144429U CN202221777U CN 202221777 U CN202221777 U CN 202221777U CN 201120144429 CN201120144429 CN 201120144429 CN 201120144429 U CN201120144429 U CN 201120144429U CN 202221777 U CN202221777 U CN 202221777U
- Authority
- CN
- China
- Prior art keywords
- led chip
- metal heat
- heat sink
- center
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to a large power LED light ball installed in a secondary optical reflection cup in a shape of a parabolic sphere. The large power LED light ball includes a metal heat seat, an LED chip fixed in the center of the metal heat sink, pins on two sides of the metal heat sink, metal bonding leads connecting with LED chip and the pins, a fluorescent powder layer coating on the LED chip and a packaging material in the outermost layer of the LED light ball. The center of the metal heat sink is provided with round groove or a round die bond area of a cylindrical boss for fixing the LED chip. The center of the LED chip bonded in the round groove or on the cylindrical boss is in a high overlap ratio with a focus of the parabolic sphere of the secondary optical reflection cup. Thus, the condensation degree is improved. Fluorescent powders coat on the round groove or the cylindrical boss of the metal heat sink center for fixing the LED chip, thereby making the irradiation in a natural round shape. Thus, the irradiation effect is improved. At the same time, the light emitting area is reduced. Thus, light emitting paths around the chip are shortened, and accordingly yellow ring is not easy to generate.
Description
Technical field
The utility model relates to a kind of LED lamp pearl, especially in the flashlight or mine lamp in large-power LED light bead.
Background technology
Large-power LED light bead is used in flashlight or the mine lamp irradiation hot spot and degree of concentration all being had very high requirement, and its radiation response is good to present even circular light spot.At present, when on metal heat sink, applying fluorescent material, existing technology is difficult to control (as shown in Figure 1) to the scope of fluorescent material coating area and the diffusion of coating back, makes fluorescent material apply well beyond chip area, can't form point-source of light preferably; The parabola focus registration of fluorescent material coating area and light fixture secondary optics reflector is not high, causes spotlight effect bad; Simultaneously,, make that the side opticpath is longer around the chip, form yellow circle easily because it is bigger to apply the zone of fluorescent material.
The utility model content
The purpose of the utility model provides a kind of luminous large-power LED light bead that evenly, does not enclose and have good spotlight effect with Huang.
The technical scheme of the utility model is: a kind of large-power LED light bead is installed in the secondary optics reflector of parabola sphere the pin of the led chip that comprises metal heat sink, be fixed on the metal heat sink center, metal heat sink both sides, the metal bonding that connects led chip and pin goes between, is coated in phosphor powder layer and outermost encapsulating material above the led chip; The metal heat sink center is provided with the solid brilliant circle of fixed L ED chip, Gu the diameter of brilliant circle is added 0.2-0.4 mm for the led chip length of side.Said solid brilliant circle is circular groove or is the cylindrical protrusions platform, Gu the center of brilliant led chip on circular groove or cylindrical protrusions platform overlaps with the parabola sphere focus of said secondary optics reflector.
The degree of depth of said circular groove is 100-500 μ m, is preferably 200-300 μ m.The height of said cylindrical protrusions platform is 300-600 μ m, is preferably 400-500 μ m.
The beneficial effect of the utility model is:
1, the solid brilliant circle that is positioned at metal heat sink center fixation led chip comprises circular groove or cylindrical protrusions platform; The fluorescent material that is coated on circular groove or the cylindrical protrusions platform can long range diffusion, has reduced light-emitting zone greatly;
2, the parabola sphere focus registration of the center of solid brilliant led chip on circular groove or cylindrical protrusions platform and said secondary optics reflector is high, optically focused Du Gengjia;
3, fluorescent material is applied in the circular cell territory of led chip of circular groove or cylindrical protrusions platform, makes radiation response have the nature circle, and radiation response is better;
4, owing to apply the regional smaller of fluorescent material, it is shorter to make that side sends around the led chip light goes out light path from the fluorescent material cover layer around the chip, is not easy to form yellow the circle.
Description of drawings
The sketch map of the existing technology packaged LED lamp pearl of Fig. 1.
Fig. 2 is the structural representation (the A-A section of Fig. 3) of LED lamp pearl that is provided with the crystal bonding area of round groove.
Fig. 3 is the vertical view (the secondary optics reflector does not draw) of Fig. 2.
Fig. 4 is the structural representation (the B-B section of Fig. 5) of LED lamp pearl that is provided with the crystal bonding area of cylindrical protrusions platform.
Fig. 5 is the vertical view (the secondary optics reflector does not draw) of Fig. 4.
In the accompanying drawing: 1-metal heat sink, 2-circular groove crystal bonding area, 3-led chip; 4-phosphor powder layer, 5-pin, 6-round raised platforms crystal bonding area; 7-secondary optics reflector, 8-metal bonding lead-in wire, 9-outer encapsulating material.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Embodiment 12-3 shows like accompanying drawing: a kind of large-power LED light bead, be installed in the secondary optics reflector 7 of parabola sphere the led chip 3 that comprises metal heat sink 1, be fixed on the metal heat sink center, metal heat sink both sides pin 5, connect led chip 3 and pin 5 metal bonding lead-in wire 8, be coated in phosphor powder layer 4 and outermost encapsulating material 9 above the led chip.In degree of depth of metal heat sink 1 center punching press is the solid brilliant circle of the circular groove of 200-300 μ m 2 conducts, and the diameter of circular groove 2 is that led chip 3 maximal sides add 0.2-0.4mm; Led chip 3 is solid brilliant on circular groove 2, Gu the parabola sphere focus registration of the center of brilliant led chip on circular groove 2 and said secondary optics reflector 7 is high, optically focused Du Gengjia.Fluorescent material is applied in the circular cell territory of circular groove 2, can long range diffusion, reduced light-emitting zone greatly, and to go out light path shorter for side around the chip, is not easy to form yellow circle, and makes radiation response have nature circle, better effects if.
Adopt other encapsulating materials 9 commonly used such as silica gel or epoxy resin to carry out outermost encapsulation subsequently.
Embodiment 24-5 shows like accompanying drawing: a kind of large-power LED light bead, be installed in the secondary optics reflector 7 of parabola sphere the led chip 3 that comprises metal heat sink 1, be fixed on the metal heat sink center, metal heat sink both sides pin 5, connect led chip 3 and pin 5 metal bonding lead-in wire 8, be coated in phosphor powder layer 4 and outermost encapsulating material 9 above the led chip.At height of metal heat sink 1 center punching press is the solid brilliant circle of cylindrical protrusions platform 6 conducts of 400-500 μ m, and the diameter of cylindrical protrusions platform 6 is that led chip 3 maximal sides add 0.2-0.4mm; Led chip 3 is solid brilliant on cylindrical protrusions platform 6, Gu the parabola sphere focus registration of the center of brilliant led chip on cylindrical protrusions platform 6 and said secondary optics reflector 7 is high, optically focused Du Gengjia.Fluorescent material is applied in the circular cell territory on the cylindrical protrusions platform 6, can long range diffusion, reduced light-emitting zone greatly, and to go out light path shorter for side around the chip, is not easy to form yellow circle, and makes radiation response have nature circle, better effects if.
Adopt other encapsulating materials 9 commonly used such as silica gel or epoxy resin to carry out outermost encapsulation subsequently.
Claims (6)
1. large-power LED light bead; Be installed in the secondary optics reflector (7) of parabola sphere the led chip (3) that comprises metal heat sink (1), be fixed on the metal heat sink center, metal heat sink both sides pin (5), connect led chip (3) and pin (5) metal bonding lead-in wire (8), be coated in phosphor powder layer (4) and outermost encapsulating material (9) above the led chip; It is characterized in that: metal heat sink (1) center is provided with the solid brilliant circle of fixed L ED chip, Gu the diameter of brilliant circle is added 0.2-0.4 mm for the led chip length of side.
2. according to the said large-power LED light bead of claim 1; It is characterized in that: said solid brilliant circle is circular groove (2) or is cylindrical protrusions platform (6), Gu the center of brilliant led chip on circular groove (2) or cylindrical protrusions platform (6) overlaps with the parabola sphere focus of said secondary optics reflector (7).
3. according to the said large-power LED light bead of claim 2, it is characterized in that: the degree of depth of said circular groove (2) is 100-500 μ m.
4. according to the said large-power LED light bead of claim 3, it is characterized in that: the preferred depth of said circular groove (2) is 200-300 μ m.
5. according to the said large-power LED light bead of claim 2, it is characterized in that: the height of said cylindrical protrusions platform (6) is 300-600 μ m.
6. according to the said large-power LED light bead of claim 5, it is characterized in that: the preferred heights of said cylindrical protrusions platform (6) is 400-500 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120144429 CN202221777U (en) | 2011-05-10 | 2011-05-10 | Large power LED light ball |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120144429 CN202221777U (en) | 2011-05-10 | 2011-05-10 | Large power LED light ball |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202221777U true CN202221777U (en) | 2012-05-16 |
Family
ID=46043798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120144429 Expired - Fee Related CN202221777U (en) | 2011-05-10 | 2011-05-10 | Large power LED light ball |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202221777U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299233A (en) * | 2011-05-10 | 2011-12-28 | 江西科技师范学院 | Good-condensation high-power LED (light emitting diode) lamp beads without yellow circle |
-
2011
- 2011-05-10 CN CN 201120144429 patent/CN202221777U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299233A (en) * | 2011-05-10 | 2011-12-28 | 江西科技师范学院 | Good-condensation high-power LED (light emitting diode) lamp beads without yellow circle |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206958642U (en) | The LEDbulb lamp of LED filament and the application LED filament | |
| CN111219611A (en) | Full-angle luminous bulb | |
| CN100489386C (en) | Non-reflection high light extracting rate unit WLED power expanding type high power WLED light source | |
| CN201751679U (en) | High-power LED packaging single lamp with batwing light distribution function | |
| CN105304801A (en) | White-light LED light source with sterilization effect and manufacturing method thereof | |
| CN201590435U (en) | LED encapsulation structure | |
| CN201527991U (en) | LED with toroidal lens | |
| CN104465964B (en) | LED packaging structure | |
| CN102646784B (en) | Light emitting diode device | |
| CN202221777U (en) | Large power LED light ball | |
| CN101436638B (en) | High-power LED packaging structure | |
| CN204760416U (en) | LED encapsulation module and LED lamps and lanterns that have this LED encapsulation module | |
| CN102148321A (en) | LED (Light Emitting Diode) white light fluorescent cap and manufacturing method thereof | |
| CN202454609U (en) | Layered light-emitting diode (LED) packaging structure | |
| CN202549918U (en) | Fluorescent powder coating and packaging structure | |
| CN102299233A (en) | Good-condensation high-power LED (light emitting diode) lamp beads without yellow circle | |
| CN202018990U (en) | High-power white-light LED light source encapsulating structure | |
| CN205065534U (en) | Three -dimensional encapsulation illuminating source | |
| CN201303008Y (en) | Led packaging structure | |
| CN102176505A (en) | Integrated LED light source system | |
| CN203910789U (en) | Novel large-power LED integrated light source with integrated optical lens | |
| CN102522488A (en) | Encapsulating structure for lighting LED lamp strip | |
| CN202405255U (en) | Led integrated light source | |
| CN202972699U (en) | Parabolic aluminum reflector (PAR) lamp | |
| CN203162616U (en) | Light emitting diode lamp source plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120516 Termination date: 20130510 |