CN202153537U - 一种半导体发光二极管封装件 - Google Patents

一种半导体发光二极管封装件 Download PDF

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CN202153537U
CN202153537U CN2011202591845U CN201120259184U CN202153537U CN 202153537 U CN202153537 U CN 202153537U CN 2011202591845 U CN2011202591845 U CN 2011202591845U CN 201120259184 U CN201120259184 U CN 201120259184U CN 202153537 U CN202153537 U CN 202153537U
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lead frame
semiconductor light
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diode packaging
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袁毅
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Abstract

本实用新型公开了一种半导体发光二极管封装件，包括引线架第一端脚和引线架第二端脚，所述的引线架第一端脚上设有导电粘胶，在所述的导电粘胶上固定有半导体晶片，其技术方案的要点是，所述的引线架第一端脚和所述的引线架第二端脚上还设有用于封装所述的半导体晶片的密封体，所述半导体晶片与所述的引线架第二端脚之间由表面包覆铂层的键合铜丝连接。本实用新型目的是克服了现有技术的不足，提供一种结构简单，可提高可靠性、热转移效率、功率和光折射率、延长使用寿命、降低生产成本的通过表面包覆铂层的键合铜丝连接的半导体发光二极管封装件。

Description

一种半导体发光二极管封装件
【技术领域】
本实用新型涉及半导体发光二极管，更具体地说是一种半导体晶片与引线架之间通过表面包覆铂层的键合铜丝连接的半导体发光二极管LED。
【背景技术】
LED是英文light emitting diode发光二极管的缩写。发光二极管，是一种固态的半导体器件。它的基本结构是一块电致发光的半导体材料(晶片)，晶片置于一个引线架支架或基底上，一端是负极，另一端连接电源的正极，然后用环氧树脂或其它物质密封。是一种能够将电能转化为可见光的半导体器件。
晶片由三部分组成，一端是P型半导体，另一端是N型半导体，这两种半导体连接起来的时候，它们之间就形成一个“P-N结”。当电流通过导线键合丝作用于这个晶片的时候，电子就会被推向量子阱(P区)，在量子阱内电子跟空穴复合，然后就会以光子的形式发出能量，这就是发光二极管发光的原理。而光的波长也就是光的颜色，是由形成P-N结的材料决定的。
发光二极管封装是保护晶片和完成电气互连，并输出可见光。晶片粘结或烧结在引线架(支架或基底)负极上，晶片的正极通过金属丝与引线架另一端连接，目前金属丝一般采用键合金丝或键合硅铝丝，并通过焊线机完成接点的结合，成本高，原材料缺乏。
【实用新型内容】
本实用新型目的是克服了现有技术的不足，提供一种结构简单，可提高可靠性、热转移效率、功率和光折射率、延长使用寿命、降低生产成本的通过表面包覆铂层的键合铜丝连接的半导体发光二极管封装件。
本实用新型是通过以下技术方案实现的：
一种半导体发光二极管封装件，包括引线架第一端脚1和引线架第二端脚2，所述的引线架第一端脚1上设有导电粘胶3，在所述的导电粘胶3上固定有半导体晶片4，其特征在于：所述的引线架第一端脚1和所述的引线架第二端脚2上还设有用于封装所述的半导体晶片4的密封体5，所述半导体晶片4与所述的引线架第二端脚2之间由表面包覆铂层的键合铜丝6连接。
如上所述的半导体发光二极管封装件，其特征在于：所述的密封体5为全环氧密封。
如上所述的半导体发光二极管封装件，其特征在于：所述的密封体5为金属底座环氧密封。
如上所述的半导体发光二极管封装件，其特征在于：所述的密封体5为陶瓷底座环氧。
如上所述的半导体发光二极管封装件，其特征在于：所述的密封体5为玻璃密封。
如上所述的半导体发光二极管封装件，其特征在于：所述的导电粘胶3上固定有多个所述的半导体晶片4，相邻两所述的半导体晶片4之间通过第二键合铜丝7，其中一所述的半导体晶片4通过所述的键合铜丝6与所述的引线架第二端脚2连接。
如上所述的半导体发光二极管封装件，其特征在于：所述的导电粘胶3上固定有多个所述的半导体晶片4，所述的半导体晶片4分别通过所述的键合铜丝6与所述的引线架第二端脚2连接。
与现有技术相比，本实用新型有如下优点：
1、本实用新型采用表面包覆铂层的键合铜丝连接，可以提供最优的成本，并获得性能上的提高。
2、本实用新型铜的导热性、导电性高于金及铝，因而可提高其热转移效率及功率和光折射率。并有利于延长LED使用寿命。
3、本实用新型铜的成本相对金很低，更是成为替代焊接材料的一大优势，有利于降低生产成本。
【附图说明】
图1是本实用新型实施例1结构示意图；
图2是本实用新型A部放大图；
图3是本实用新型实施例2俯视结构示意图；
图4是本实用新型实施例3俯视结构示意图。
【具体实施方式】
实施例1：如图1、图2所示，一种半导体发光二极管封装件，包括引线架第一端脚1和引线架第二端脚2，所述的引线架第一端脚1上设有导电粘胶3，在所述的导电粘胶3上固定有半导体晶片4，所述的引线架第一端脚1和所述的引线架第二端脚2上还设有用于封装所述的半导体晶片4的密封体5，所述半导体晶片4与所述的引线架第二端脚2之间由表面包覆铂层的键合铜丝6连接。
密封体5封装可为全环氧密封或金属底座环氧密封或陶瓷底座环氧或玻璃密封或其它物质密封。
实施例2：如图3所示，与实施例1的区别在于所述的导电粘胶3上固定有多个所述的半导体晶片4，相邻两所述的半导体晶片4之间通过第二键合铜丝7，其中一所述的半导体晶片4通过所述的键合铜丝6与所述的引线架第二端脚2连接。
实施例3：如图4所示，与实施例1的区别在于所述的导电粘胶3上固定有多个所述的半导体晶片4，所述的半导体晶片4分别通过所述的键合铜丝6与所述的引线架第二端脚2连接。

Claims (7)

1.一种半导体发光二极管封装件，包括引线架第一端脚(1)和引线架第二端脚(2)，所述的引线架第一端脚(1)上设有导电粘胶(3)，在所述的导电粘胶(3)上固定有半导体晶片(4)，其特征在于：所述的引线架第一端脚(1)和所述的引线架第二端脚(2)上还设有用于封装所述的半导体晶片(4)的密封体(5)，所述半导体晶片(4)与所述的引线架第二端脚(2)之间由表面包覆铂层的键合铜丝(6)连接。
2.根据权利要求1所述的半导体发光二极管封装件，其特征在于：所述的密封体(5)为全环氧密封。
3.根据权利要求1所述的半导体发光二极管封装件，其特征在于：所述的密封体(5)为金属底座环氧密封。
4.根据权利要求1所述的半导体发光二极管封装件，其特征在于：所述的密封体(5)为陶瓷底座环氧。
5.根据权利要求1所述的半导体发光二极管封装件，其特征在于：所述的密封体(5)为玻璃密封。
6.根据权利要求1所述的半导体发光二极管封装件，其特征在于：所述的导电粘胶(3)上固定有多个所述的半导体晶片(4)，相邻两所述的半导体晶片(4)之间通过第二键合铜丝(7)，其中一所述的半导体晶片(4)通过所述的键合铜丝(6)与所述的引线架第二端脚(2)连接。
7.根据权利要求1所述的半导体发光二极管封装件，其特征在于：所述的导电粘胶(3)上固定有多个所述的半导体晶片(4)，所述的半导体晶片(4)分别通过所述的键合铜丝(6)与所述的引线架第二端脚(2)连接。
CN2011202591845U 2011-07-21 2011-07-21 一种半导体发光二极管封装件 Expired - Fee Related CN202153537U (zh)

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