CN201629348U - 一种半导体发光二极管封装件 - Google Patents

一种半导体发光二极管封装件 Download PDF

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CN201629348U
CN201629348U CN2010201155473U CN201020115547U CN201629348U CN 201629348 U CN201629348 U CN 201629348U CN 2010201155473 U CN2010201155473 U CN 2010201155473U CN 201020115547 U CN201020115547 U CN 201020115547U CN 201629348 U CN201629348 U CN 201629348U
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袁毅
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Abstract

本实用新型公开了一种半导体发光二极管封装件，包括两引线架端，一引线架端上有导电粘胶，在导电粘胶上固定有至少一块半导体晶片，半导体晶片与另一引线架端之间连接有键合铜丝，两引线架端上还设置有用于将半导体晶片、键合铜丝封装起来的密封体。本实用新型目的是是提供一种结构简单，可提高可靠性、热转移效率和功率，延长使用寿命，降低生产成本的半导体发光二极管封装件。

Description

一种半导体发光二极管封装件
[技术领域]
本实用新型涉及半导体发光二极管，特别涉及到半导体晶片与引线架(支架或基底)之间通过键合铜丝连接的半导体发光二极管(LED)。
[背景技术]
LED是英文light emitting diode(发光二极管)的缩写。发光二极管，是一种固态的半导体器件。它的基本结构是一块电致发光的半导体材料(晶片)，晶片置于一个引线架(支架或基底)上，引线架一端是负极，另一端连接电源的正极，然后用环氧树脂或其它物质密封。是一种能够将电能转化为可见光的半导体器件。
晶片由三部分组成，一端是P型半导体，另一端是N型半导体，这两种半导体连接起来的时候，它们之间就形成一个“P-N结”。当电流通过导线(键合丝)作用于这个晶片的时候，电子就会被推向量子阱(P区)，在量子阱内电子跟空穴复合，然后就会以光子的形式发出能量，这就是发光二极管发光的原理。而光的波长也就是光的颜色，是由形成P-N结的材料决定的。
发光二极管封装是保护晶片和完成电气互连，并输出可见光。发光二极管封装结构可分有全环氧包封、金属底座环氧封装、陶瓷底座环氧及玻璃或其它物质材料等。发光二极管封装方式可分为有引脚(直插式)封装，表面贴装封装(SMD)及功率型封装。
晶片粘结或烧结在负极引线架(支架或基底)负极上，晶片的正极通过金属丝与引线架另一端(正极)连接，目前金属丝一般采用键合金丝或键合硅铝丝，并通过焊线机完成接点的结合，然后封装。本发明就是在这样的背景下作出的。
[实用新型内容]
本实用新型所要解决的问题是提供一种结构简单，可提高可靠性、热转移效率和功率，延长使用寿命，降低生产成本的半导体发光二极管封装件。
本实用新型采用下述技术方案：
一种半导体发光二极管封装件，包括两引线架端，一引线架端上有导电粘胶，在导电粘胶上固定有至少一块半导体晶片，其特征在于半导体晶片与另一引线架端之间连接有键合铜丝，两引线架端上还设置有用于将半导体晶片、键合铜丝封装起来的密封体；
如上所述的一种半导体发光二极管封装件，其特征在于所述一引线架端上的导电粘胶上固定有多个半导体晶片，键合铜丝对应有多根，各半导体晶片各自通过一键合铜丝与另一引线架端连接；
如上所述的一种半导体发光二极管封装件，其特征在于所述密封体为环氧树脂密封体或玻璃密封体。
本实用新型的有益效果是：
1、采用键合铜丝连接，可以提供最优的成本，并获得性能上的显着提高。
2、铜的导热性、导电性高于金及铝，因而可提高其热转移效率及功率，铜的机械特性也比金优良，在塑型封装时能维持极佳的焊球颈强度及线弧的稳定度。
3、金属间化合物在铜焊点的生成较金焊点减缓许多，因此电阻较小、产生的热量较低，也就能够提高焊点的可靠性及器件的效能和提高高功率器件的封装合格率，同时由于铜有较低金属间共金化合物生成率、电阻、热量方面的优势，因此长期的电阻增加现象较小，老化现象较慢，铜焊点的金属间共金化合物生成率较慢，能够显著提高可靠性有利于延长LED使用寿命。
4、铜的成本相对很低，更是成为替代焊接材料的一大优势，有利于降低生产成本。
[附图说明]
图1为本实用新型实施方式一内部结构示意图；
图2为图1中A处放大图；
图3为本实用新型实施方式二俯瞰透视图。
[具体实施方式]
一种半导体发光二极管封装件，包括两引线架端1和引线架端2，引线架端1上有导电粘胶3，在导电粘胶3上固定有至少一块半导体晶片4，半导体晶片4与引线架端2之间连接有键合铜丝6，引线架端1和引线架端2上还设置有用于将半导体晶片4、键合铜丝6封装起来的密封体5，密封体5可为环氧树脂密封体或玻璃密封体。
如图1、2所示实施方式一，导电粘胶3上固定有一个半导体晶片4，半导体晶片4负极通过导电粘胶3粘结在引线架端1上，半导体晶片4的正极通过键合铜丝6与引线架端2电连接。
导电粘胶3上还可固定有二个或二个以上半导体晶片4，如图3所示实施方式二，引线架端1上的导电粘胶3上固定有三个半导体晶片4，键合铜丝6对应有多根，各半导体晶片4各自通过一键合铜丝6与引线架端2连接。

Claims (3)

1.一种半导体发光二极管封装件，包括引线架端(1)和引线架端(2)，引线架端(1)上有导电粘胶(3)，在导电粘胶(3)上固定有至少一块半导体晶片(4)，其特征在于所述半导体晶片(4)与引线架端(2)之间连接有键合铜丝(6)，所述引线架端(1)和引线架端(2)上还设置有用于将半导体晶片(4)、键合铜丝(6)封装起来的密封体(5)。
2.根据权利要求1所述的一种半导体发光二极管封装件，其特征在于所述引线架端(1)上的导电粘胶(3)上固定有多个半导体晶片(4)，键合铜丝(6)对应有多根，各半导体晶片(4)各自通过一键合铜丝(6)与引线架端(2)连接。
3.根据权利要求1所述的一种半导体发光二极管封装件，其特征在于所述密封体(5)为环氧树脂密封体或玻璃密封体。
CN2010201155473U 2010-02-03 2010-02-03 一种半导体发光二极管封装件 Expired - Fee Related CN201629348U (zh)

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