CN202063993U - 用于薄膜光伏器件的大规模mocvd系统 - Google Patents
用于薄膜光伏器件的大规模mocvd系统 Download PDFInfo
- Publication number
- CN202063993U CN202063993U CN2011200878041U CN201120087804U CN202063993U CN 202063993 U CN202063993 U CN 202063993U CN 2011200878041 U CN2011200878041 U CN 2011200878041U CN 201120087804 U CN201120087804 U CN 201120087804U CN 202063993 U CN202063993 U CN 202063993U
- Authority
- CN
- China
- Prior art keywords
- hot
- plate
- element structure
- sediment chamber
- steam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005229 chemical vapour deposition Methods 0.000 title claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 title description 9
- 239000002184 metal Substances 0.000 title description 9
- 239000000758 substrate Substances 0.000 claims abstract description 103
- 239000007788 liquid Substances 0.000 claims abstract description 48
- 238000002156 mixing Methods 0.000 claims abstract description 43
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 239000000126 substance Substances 0.000 claims abstract description 14
- 238000009792 diffusion process Methods 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 7
- 230000008093 supporting effect Effects 0.000 claims abstract description 6
- 239000013049 sediment Substances 0.000 claims description 86
- 239000007789 gas Substances 0.000 claims description 69
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 45
- 239000012530 fluid Substances 0.000 claims description 38
- 230000000873 masking effect Effects 0.000 claims description 30
- 239000002243 precursor Substances 0.000 claims description 28
- 229910052757 nitrogen Inorganic materials 0.000 claims description 22
- 238000012545 processing Methods 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 238000007493 shaping process Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 5
- 238000010408 sweeping Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 2
- 210000000689 upper leg Anatomy 0.000 claims 1
- 238000000151 deposition Methods 0.000 abstract description 16
- 230000008021 deposition Effects 0.000 abstract description 15
- 239000000203 mixture Substances 0.000 abstract description 6
- 238000011031 large-scale manufacturing process Methods 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 49
- 239000010408 film Substances 0.000 description 32
- 238000000034 method Methods 0.000 description 18
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical group CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 15
- 238000010586 diagram Methods 0.000 description 11
- 238000011068 loading method Methods 0.000 description 7
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 6
- 230000001737 promoting effect Effects 0.000 description 6
- 229940065287 selenium compound Drugs 0.000 description 6
- 150000003343 selenium compounds Chemical class 0.000 description 6
- 230000001105 regulatory effect Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000013022 venting Methods 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012806 monitoring device Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000001976 improved effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000006902 nitrogenation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000013082 photovoltaic technology Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45512—Premixing before introduction in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45572—Cooled nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31875010P | 2010-03-29 | 2010-03-29 | |
US61/318,750 | 2010-03-29 | ||
US13/049,114 US8142521B2 (en) | 2010-03-29 | 2011-03-16 | Large scale MOCVD system for thin film photovoltaic devices |
US13/049,114 | 2011-03-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202063993U true CN202063993U (zh) | 2011-12-07 |
Family
ID=44647571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011200878041U Expired - Fee Related CN202063993U (zh) | 2010-03-29 | 2011-03-29 | 用于薄膜光伏器件的大规模mocvd系统 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8142521B2 (zh) |
CN (1) | CN202063993U (zh) |
DE (1) | DE202011000715U1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105132891A (zh) * | 2015-08-24 | 2015-12-09 | 沈阳拓荆科技有限公司 | 新型温控系统在低温薄膜制备中的应用 |
CN110400764A (zh) * | 2018-04-25 | 2019-11-01 | 三星电子株式会社 | 气体注射器和具有其的晶圆处理设备 |
CN115289676A (zh) * | 2022-07-29 | 2022-11-04 | 中国科学技术大学先进技术研究院 | 加热装置及其加热方法 |
CN116121708A (zh) * | 2023-01-04 | 2023-05-16 | 上海欧展电器有限公司 | 一种用于真空镀膜机的加热装置 |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8017860B2 (en) | 2006-05-15 | 2011-09-13 | Stion Corporation | Method and structure for thin film photovoltaic materials using bulk semiconductor materials |
US9105776B2 (en) * | 2006-05-15 | 2015-08-11 | Stion Corporation | Method and structure for thin film photovoltaic materials using semiconductor materials |
US8071179B2 (en) | 2007-06-29 | 2011-12-06 | Stion Corporation | Methods for infusing one or more materials into nano-voids if nanoporous or nanostructured materials |
US8759671B2 (en) * | 2007-09-28 | 2014-06-24 | Stion Corporation | Thin film metal oxide bearing semiconductor material for single junction solar cell devices |
US7998762B1 (en) | 2007-11-14 | 2011-08-16 | Stion Corporation | Method and system for large scale manufacture of thin film photovoltaic devices using multi-chamber configuration |
US8772078B1 (en) | 2008-03-03 | 2014-07-08 | Stion Corporation | Method and system for laser separation for exclusion region of multi-junction photovoltaic materials |
US8642138B2 (en) | 2008-06-11 | 2014-02-04 | Stion Corporation | Processing method for cleaning sulfur entities of contact regions |
US8003432B2 (en) | 2008-06-25 | 2011-08-23 | Stion Corporation | Consumable adhesive layer for thin film photovoltaic material |
US9087943B2 (en) * | 2008-06-25 | 2015-07-21 | Stion Corporation | High efficiency photovoltaic cell and manufacturing method free of metal disulfide barrier material |
US7855089B2 (en) | 2008-09-10 | 2010-12-21 | Stion Corporation | Application specific solar cell and method for manufacture using thin film photovoltaic materials |
US7910399B1 (en) | 2008-09-30 | 2011-03-22 | Stion Corporation | Thermal management and method for large scale processing of CIS and/or CIGS based thin films overlying glass substrates |
US8383450B2 (en) * | 2008-09-30 | 2013-02-26 | Stion Corporation | Large scale chemical bath system and method for cadmium sulfide processing of thin film photovoltaic materials |
US7947524B2 (en) * | 2008-09-30 | 2011-05-24 | Stion Corporation | Humidity control and method for thin film photovoltaic materials |
US7863074B2 (en) * | 2008-09-30 | 2011-01-04 | Stion Corporation | Patterning electrode materials free from berm structures for thin film photovoltaic cells |
US8425739B1 (en) | 2008-09-30 | 2013-04-23 | Stion Corporation | In chamber sodium doping process and system for large scale cigs based thin film photovoltaic materials |
US8741689B2 (en) * | 2008-10-01 | 2014-06-03 | Stion Corporation | Thermal pre-treatment process for soda lime glass substrate for thin film photovoltaic materials |
US20110018103A1 (en) | 2008-10-02 | 2011-01-27 | Stion Corporation | System and method for transferring substrates in large scale processing of cigs and/or cis devices |
US8168463B2 (en) | 2008-10-17 | 2012-05-01 | Stion Corporation | Zinc oxide film method and structure for CIGS cell |
US8344243B2 (en) * | 2008-11-20 | 2013-01-01 | Stion Corporation | Method and structure for thin film photovoltaic cell using similar material junction |
US8372684B1 (en) | 2009-05-14 | 2013-02-12 | Stion Corporation | Method and system for selenization in fabricating CIGS/CIS solar cells |
US8507786B1 (en) | 2009-06-27 | 2013-08-13 | Stion Corporation | Manufacturing method for patterning CIGS/CIS solar cells |
US8398772B1 (en) | 2009-08-18 | 2013-03-19 | Stion Corporation | Method and structure for processing thin film PV cells with improved temperature uniformity |
US8809096B1 (en) | 2009-10-22 | 2014-08-19 | Stion Corporation | Bell jar extraction tool method and apparatus for thin film photovoltaic materials |
US8859880B2 (en) | 2010-01-22 | 2014-10-14 | Stion Corporation | Method and structure for tiling industrial thin-film solar devices |
US8263494B2 (en) | 2010-01-25 | 2012-09-11 | Stion Corporation | Method for improved patterning accuracy for thin film photovoltaic panels |
US9096930B2 (en) * | 2010-03-29 | 2015-08-04 | Stion Corporation | Apparatus for manufacturing thin film photovoltaic devices |
US8782996B2 (en) * | 2010-06-11 | 2014-07-22 | Douglas Moyles | Systems and methods for ground mounted solar array |
US8461061B2 (en) | 2010-07-23 | 2013-06-11 | Stion Corporation | Quartz boat method and apparatus for thin film thermal treatment |
US8628997B2 (en) | 2010-10-01 | 2014-01-14 | Stion Corporation | Method and device for cadmium-free solar cells |
US8728200B1 (en) | 2011-01-14 | 2014-05-20 | Stion Corporation | Method and system for recycling processing gas for selenization of thin film photovoltaic materials |
US8998606B2 (en) | 2011-01-14 | 2015-04-07 | Stion Corporation | Apparatus and method utilizing forced convection for uniform thermal treatment of thin film devices |
US8436445B2 (en) | 2011-08-15 | 2013-05-07 | Stion Corporation | Method of manufacture of sodium doped CIGS/CIGSS absorber layers for high efficiency photovoltaic devices |
CN103031535B (zh) * | 2011-09-28 | 2015-12-09 | 核心能源实业有限公司 | 薄膜工艺设备及其制作方法 |
KR101327458B1 (ko) * | 2012-01-10 | 2013-11-08 | 주식회사 유진테크 | 냉각 방식의 샤워헤드 및 이를 구비하는 기판 처리 장치 |
KR20150020757A (ko) * | 2013-08-19 | 2015-02-27 | 삼성전자주식회사 | 기판 처리 시스템 및 이의 제어 방법 |
US9276190B2 (en) | 2013-10-01 | 2016-03-01 | The Pen | Practical method of producing an aerogel composite continuous thin film thermoelectric semiconductor material by modified MOCVD |
US10388820B2 (en) | 2015-02-03 | 2019-08-20 | Lg Electronics Inc. | Metal organic chemical vapor deposition apparatus for solar cell |
KR102332969B1 (ko) * | 2018-10-12 | 2021-12-01 | 영남대학교 산학협력단 | 태양전지 제조장치 |
CN110993742B (zh) * | 2019-12-23 | 2021-07-09 | 顺德中山大学太阳能研究院 | 晶体硅太阳能电池板修复处理装置及其使用方法 |
CN112702012B (zh) * | 2020-12-29 | 2022-07-19 | 山西大学 | 太阳能光伏板清洁吹扫系统 |
JP2024521705A (ja) * | 2021-05-21 | 2024-06-04 | アプライド マテリアルズ インコーポレイテッド | 大気チャンバから真空チャンバへの一貫した既知の体積の液体金属または金属合金の移送 |
CN114016129B (zh) * | 2021-10-09 | 2023-03-24 | 山东有研国晶辉新材料有限公司 | 一种新的硒化锌生长方法 |
TWI775661B (zh) * | 2021-10-27 | 2022-08-21 | 天虹科技股份有限公司 | 噴灑裝置及應用該噴灑裝置的薄膜沉積設備 |
CN114941124B (zh) * | 2022-06-01 | 2024-04-30 | 江苏邑文微电子科技有限公司 | 一种真空晶圆镀膜装置 |
Family Cites Families (88)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0002109B1 (en) | 1977-11-15 | 1981-12-02 | Imperial Chemical Industries Plc | A method for the preparation of thin photoconductive films and of solar cells employing said thin photoconductive films |
US4213781A (en) | 1978-11-20 | 1980-07-22 | Westinghouse Electric Corp. | Deposition of solid semiconductor compositions and novel semiconductor materials |
JPS55127074A (en) | 1979-03-26 | 1980-10-01 | Canon Inc | Photoelectric transfer element with high molecular film as substrate |
US4239553A (en) | 1979-05-29 | 1980-12-16 | University Of Delaware | Thin film photovoltaic cells having increased durability and operating life and method for making same |
US4502225A (en) | 1983-05-06 | 1985-03-05 | Rca Corporation | Mechanical scriber for semiconductor devices |
US4611091A (en) | 1984-12-06 | 1986-09-09 | Atlantic Richfield Company | CuInSe2 thin film solar cell with thin CdS and transparent window layer |
US4612411A (en) | 1985-06-04 | 1986-09-16 | Atlantic Richfield Company | Thin film solar cell with ZnO window layer |
US4915745A (en) | 1988-09-22 | 1990-04-10 | Atlantic Richfield Company | Thin film solar cell and method of making |
US4873118A (en) | 1988-11-18 | 1989-10-10 | Atlantic Richfield Company | Oxygen glow treating of ZnO electrode for thin film silicon solar cell |
US4996108A (en) | 1989-01-17 | 1991-02-26 | Simon Fraser University | Sheets of transition metal dichalcogenides |
DK170189B1 (da) | 1990-05-30 | 1995-06-06 | Yakov Safir | Fremgangsmåde til fremstilling af halvlederkomponenter, samt solcelle fremstillet deraf |
EP0460287A1 (de) | 1990-05-31 | 1991-12-11 | Siemens Aktiengesellschaft | Neuartige Chalkopyrit-Solarzelle |
US5261968A (en) | 1992-01-13 | 1993-11-16 | Photon Energy, Inc. | Photovoltaic cell and method |
US5501744A (en) | 1992-01-13 | 1996-03-26 | Photon Energy, Inc. | Photovoltaic cell having a p-type polycrystalline layer with large crystals |
JP2756050B2 (ja) | 1992-03-03 | 1998-05-25 | キヤノン株式会社 | 光起電力装置 |
US5248349A (en) | 1992-05-12 | 1993-09-28 | Solar Cells, Inc. | Process for making photovoltaic devices and resultant product |
JP3057671B2 (ja) | 1993-06-14 | 2000-07-04 | キヤノン株式会社 | 太陽電池モジュール |
US5855974A (en) | 1993-10-25 | 1999-01-05 | Ford Global Technologies, Inc. | Method of producing CVD diamond coated scribing wheels |
US5589006A (en) | 1993-11-30 | 1996-12-31 | Canon Kabushiki Kaisha | Solar battery module and passive solar system using same |
DE69425230T2 (de) | 1993-12-17 | 2001-02-22 | Canon K.K., Tokio/Tokyo | Herstellungsverfahren einer Elektronen emittierenden Vorrichtung, einer Elektronenquelle und eine Bilderzeugungsvorrichtung |
US5578103A (en) | 1994-08-17 | 1996-11-26 | Corning Incorporated | Alkali metal ion migration control |
DE4442824C1 (de) | 1994-12-01 | 1996-01-25 | Siemens Ag | Solarzelle mit Chalkopyrit-Absorberschicht |
US6743723B2 (en) | 1995-09-14 | 2004-06-01 | Canon Kabushiki Kaisha | Method for fabricating semiconductor device |
TW340957B (en) * | 1996-02-01 | 1998-09-21 | Canon Hanbai Kk | Plasma processor and gas release device |
JP3344287B2 (ja) | 1996-08-30 | 2002-11-11 | 住友電気工業株式会社 | Ii−vi族化合物半導体結晶の表面清浄化方法 |
US6169246B1 (en) | 1998-09-08 | 2001-01-02 | Midwest Research Institute | Photovoltaic devices comprising zinc stannate buffer layer and method for making |
US5985691A (en) | 1997-05-16 | 1999-11-16 | International Solar Electric Technology, Inc. | Method of making compound semiconductor films and making related electronic devices |
US5948176A (en) | 1997-09-29 | 1999-09-07 | Midwest Research Institute | Cadmium-free junction fabrication process for CuInSe2 thin film solar cells |
US6258620B1 (en) | 1997-10-15 | 2001-07-10 | University Of South Florida | Method of manufacturing CIGS photovoltaic devices |
WO1999039890A1 (fr) | 1998-02-05 | 1999-08-12 | Nippon Sheet Glass Co., Ltd. | Article a surface rugueuse, procede de production dudit article et composition a cet effet |
US6077722A (en) | 1998-07-14 | 2000-06-20 | Bp Solarex | Producing thin film photovoltaic modules with high integrity interconnects and dual layer contacts |
JP3428931B2 (ja) | 1998-09-09 | 2003-07-22 | キヤノン株式会社 | フラットパネルディスプレイの解体処理方法 |
US6134049A (en) | 1998-09-25 | 2000-10-17 | The Regents Of The University Of California | Method to adjust multilayer film stress induced deformation of optics |
US6335479B1 (en) | 1998-10-13 | 2002-01-01 | Dai Nippon Printing Co., Ltd. | Protective sheet for solar battery module, method of fabricating the same and solar battery module |
US6380480B1 (en) | 1999-05-18 | 2002-04-30 | Nippon Sheet Glass Co., Ltd | Photoelectric conversion device and substrate for photoelectric conversion device |
US6328871B1 (en) | 1999-08-16 | 2001-12-11 | Applied Materials, Inc. | Barrier layer for electroplating processes |
US6310281B1 (en) | 2000-03-16 | 2001-10-30 | Global Solar Energy, Inc. | Thin-film, flexible photovoltaic module |
US6423565B1 (en) | 2000-05-30 | 2002-07-23 | Kurt L. Barth | Apparatus and processes for the massproduction of photovotaic modules |
JP2002196337A (ja) | 2000-09-06 | 2002-07-12 | Seiko Epson Corp | 電気光学装置の製造方法及び製造装置、並びに液晶パネルの製造方法及び製造装置 |
US6537845B1 (en) | 2001-08-30 | 2003-03-25 | Mccandless Brian E. | Chemical surface deposition of ultra-thin semiconductors |
JP4236081B2 (ja) | 2001-10-16 | 2009-03-11 | 大日本印刷株式会社 | パターン形成体の製造方法 |
WO2003036657A1 (fr) | 2001-10-19 | 2003-05-01 | Asahi Glass Company, Limited | Substrat a couche d'oxyde conductrice transparente, son procede de production et element de conversion photoelectrique |
US6635307B2 (en) | 2001-12-12 | 2003-10-21 | Nanotek Instruments, Inc. | Manufacturing method for thin-film solar cells |
JP3867230B2 (ja) | 2002-09-26 | 2007-01-10 | 本田技研工業株式会社 | メカニカルスクライブ装置 |
WO2004032189A2 (en) | 2002-09-30 | 2004-04-15 | Miasolé | Manufacturing apparatus and method for large-scale production of thin-film solar cells |
JP4171428B2 (ja) | 2003-03-20 | 2008-10-22 | 三洋電機株式会社 | 光起電力装置 |
JP2004288898A (ja) | 2003-03-24 | 2004-10-14 | Canon Inc | 太陽電池モジュールの製造方法 |
JP2004289034A (ja) | 2003-03-25 | 2004-10-14 | Canon Inc | 酸化亜鉛膜の処理方法、それを用いた光起電力素子の製造方法 |
JP2004311965A (ja) | 2003-03-26 | 2004-11-04 | Canon Inc | 光起電力素子の製造方法 |
EP1619728A4 (en) | 2003-04-09 | 2006-08-09 | Matsushita Electric Ind Co Ltd | SOLAR CELL |
KR101027318B1 (ko) | 2003-08-14 | 2011-04-06 | 유니버시티 오브 요하네스버그 | Ⅰb-ⅲa-ⅵa족 4원 또는 그 이상의 고원 합금 반도체필름 제조 방법 |
AU2003300775A1 (en) | 2003-09-03 | 2005-04-21 | Midwest Research Institute | Zno/cu(inga)se2 solar cells prepared by vapor phase zn doping |
EP1521308A1 (de) | 2003-10-02 | 2005-04-06 | Scheuten Glasgroep | Kugel- oder kornförmiges Halbleiterbauelement zur Verwendung in Solarzellen und Verfahren zur Herstellung; Verfahren zur Herstellung einer Solarzelle mit Halbleiterbauelement und Solarzelle |
US8623448B2 (en) | 2004-02-19 | 2014-01-07 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from chalcogenide microflake particles |
US20070169810A1 (en) | 2004-02-19 | 2007-07-26 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer by use of chalcogen-containing vapor |
US7663057B2 (en) | 2004-02-19 | 2010-02-16 | Nanosolar, Inc. | Solution-based fabrication of photovoltaic cell |
US8957300B2 (en) | 2004-02-20 | 2015-02-17 | Sharp Kabushiki Kaisha | Substrate for photoelectric conversion device, photoelectric conversion device, and stacked photoelectric conversion device |
JP4695850B2 (ja) | 2004-04-28 | 2011-06-08 | 本田技研工業株式会社 | カルコパイライト型太陽電池 |
CN101080511A (zh) | 2004-11-10 | 2007-11-28 | 德斯塔尔科技公司 | 用于使用连续过程形成薄膜太阳能电池的方法和设备 |
CA2586963A1 (en) | 2004-11-10 | 2006-05-18 | Daystar Technologies, Inc. | Process and photovoltaic device using an akali-containing layer |
JP2008520101A (ja) | 2004-11-10 | 2008-06-12 | デイスター テクノロジーズ,インコーポレイティド | Cigsにおいて現場接合層を作製するための熱プロセス |
JP4801928B2 (ja) | 2005-04-25 | 2011-10-26 | 富士フイルム株式会社 | 有機電界発光素子 |
JP2007012976A (ja) | 2005-07-01 | 2007-01-18 | Honda Motor Co Ltd | 太陽電池モジュール |
JP3963924B2 (ja) | 2005-07-22 | 2007-08-22 | 本田技研工業株式会社 | カルコパイライト型太陽電池 |
EP1920454A4 (en) | 2005-08-05 | 2014-01-22 | First Solar Inc | PREPARATION OF PHOTOVOLTAIC DEVICES |
US7442413B2 (en) | 2005-11-18 | 2008-10-28 | Daystar Technologies, Inc. | Methods and apparatus for treating a work piece with a vaporous element |
US7235736B1 (en) | 2006-03-18 | 2007-06-26 | Solyndra, Inc. | Monolithic integration of cylindrical solar cells |
US7585547B2 (en) | 2006-04-13 | 2009-09-08 | Solopower, Inc. | Method and apparatus to form thin layers of materials on a base |
US8207442B2 (en) | 2006-04-18 | 2012-06-26 | Itn Energy Systems, Inc. | Reinforcing structures for thin-film photovoltaic device substrates, and associated methods |
US8017860B2 (en) | 2006-05-15 | 2011-09-13 | Stion Corporation | Method and structure for thin film photovoltaic materials using bulk semiconductor materials |
WO2008014492A2 (en) | 2006-07-27 | 2008-01-31 | Nanosolar, Inc. | Individually encapsulated solar cells and/or solar cell strings |
TW200810167A (en) | 2006-08-09 | 2008-02-16 | Ind Tech Res Inst | Dye-sensitized solar cell and the method of fabricating thereof |
US8426722B2 (en) | 2006-10-24 | 2013-04-23 | Zetta Research and Development LLC—AQT Series | Semiconductor grain and oxide layer for photovoltaic cells |
US8203073B2 (en) | 2006-11-02 | 2012-06-19 | Guardian Industries Corp. | Front electrode for use in photovoltaic device and method of making same |
US8076571B2 (en) | 2006-11-02 | 2011-12-13 | Guardian Industries Corp. | Front electrode for use in photovoltaic device and method of making same |
FR2908406B1 (fr) | 2006-11-14 | 2012-08-24 | Saint Gobain | Couche poreuse, son procede de fabrication et ses applications. |
MX2009006725A (es) | 2006-12-21 | 2009-06-30 | Helianthos Bv | Metodo para elaborar sub-celdas solares a partir de una celda solar. |
US7846750B2 (en) | 2007-06-12 | 2010-12-07 | Guardian Industries Corp. | Textured rear electrode structure for use in photovoltaic device such as CIGS/CIS solar cell |
US7875945B2 (en) | 2007-06-12 | 2011-01-25 | Guardian Industries Corp. | Rear electrode structure for use in photovoltaic device such as CIGS/CIS photovoltaic device and method of making same |
KR100882668B1 (ko) | 2007-07-18 | 2009-02-06 | 삼성모바일디스플레이주식회사 | 유기전계발광 표시 장치 및 그의 제조 방법 |
FR2919429B1 (fr) | 2007-07-27 | 2009-10-09 | Saint Gobain | Substrat de face avant de cellule photovoltaique et utilisation d'un substrat pour une face avant de cellule photovoltaique |
JP2009099476A (ja) | 2007-10-19 | 2009-05-07 | Sony Corp | 色素増感光電変換素子およびその製造方法 |
US8981211B2 (en) | 2008-03-18 | 2015-03-17 | Zetta Research and Development LLC—AQT Series | Interlayer design for epitaxial growth of semiconductor layers |
US20090235987A1 (en) | 2008-03-24 | 2009-09-24 | Epv Solar, Inc. | Chemical Treatments to Enhance Photovoltaic Performance of CIGS |
US8980008B2 (en) | 2008-04-15 | 2015-03-17 | Hanergy Hi-Tech Power (Hk) Limited | Apparatus and methods for manufacturing thin-film solar cells |
FR2932009B1 (fr) | 2008-06-02 | 2010-09-17 | Saint Gobain | Cellule photovoltaique et substrat de cellule photovoltaique |
US8383450B2 (en) | 2008-09-30 | 2013-02-26 | Stion Corporation | Large scale chemical bath system and method for cadmium sulfide processing of thin film photovoltaic materials |
US8709856B2 (en) | 2009-03-09 | 2014-04-29 | Zetta Research and Development LLC—AQT Series | Enhancement of semiconducting photovoltaic absorbers by the addition of alkali salts through solution coating techniques |
-
2011
- 2011-03-16 US US13/049,114 patent/US8142521B2/en not_active Expired - Fee Related
- 2011-03-29 CN CN2011200878041U patent/CN202063993U/zh not_active Expired - Fee Related
- 2011-03-29 DE DE202011000715U patent/DE202011000715U1/de not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105132891A (zh) * | 2015-08-24 | 2015-12-09 | 沈阳拓荆科技有限公司 | 新型温控系统在低温薄膜制备中的应用 |
WO2017031822A1 (zh) * | 2015-08-24 | 2017-03-02 | 沈阳拓荆科技有限公司 | 新型温控系统在低温薄膜制备中的应用 |
CN110400764A (zh) * | 2018-04-25 | 2019-11-01 | 三星电子株式会社 | 气体注射器和具有其的晶圆处理设备 |
CN110400764B (zh) * | 2018-04-25 | 2024-06-07 | 三星电子株式会社 | 气体注射器和具有其的晶圆处理设备 |
CN115289676A (zh) * | 2022-07-29 | 2022-11-04 | 中国科学技术大学先进技术研究院 | 加热装置及其加热方法 |
CN116121708A (zh) * | 2023-01-04 | 2023-05-16 | 上海欧展电器有限公司 | 一种用于真空镀膜机的加热装置 |
CN116121708B (zh) * | 2023-01-04 | 2023-09-08 | 上海欧展电器有限公司 | 一种用于真空镀膜机的加热装置 |
Also Published As
Publication number | Publication date |
---|---|
US20110230006A1 (en) | 2011-09-22 |
US8142521B2 (en) | 2012-03-27 |
DE202011000715U1 (de) | 2011-09-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN202063993U (zh) | 用于薄膜光伏器件的大规模mocvd系统 | |
US9096930B2 (en) | Apparatus for manufacturing thin film photovoltaic devices | |
CN102485953B (zh) | 托盘装置及结晶膜生长设备 | |
CN101587814B (zh) | 等离子体处理装置和其使用的处理气体供给装置 | |
CN102839360B (zh) | 批量式处理装置 | |
CN102424956B (zh) | 用于金属有机化合物化学气相沉积设备的喷淋装置 | |
CN105441904A (zh) | 气体喷淋装置、化学气相沉积装置和方法 | |
TWI537416B (zh) | A CVD reactor with a strip inlet region and a method of depositing a layer on the substrate in such a CVD reactor | |
JP5313890B2 (ja) | モジュラーcvdエピタキシャル300ミリ型リアクタ | |
CN102505115A (zh) | 真空涂覆装置 | |
CN102154628A (zh) | 用于化学气相沉积反应器的多气体分配喷射器 | |
CA2907852A1 (en) | Plant cultivation facility | |
CN103098175A (zh) | 具有气体注射分配装置的喷头组件 | |
CN106498368A (zh) | 一种用于mocvd设备的喷淋头 | |
CN103276373B (zh) | 一种pecvd装置 | |
WO2011126926A2 (en) | System and method for alternating fluid flow | |
US20120017831A1 (en) | Chemical vapor deposition method and system for semiconductor devices | |
CN104141116A (zh) | 金属有机化学气相沉积装置、气体喷淋组件及其气体分配的控制方法 | |
CN109576784A (zh) | 一种SiC外延层的制备方法及装置 | |
CN115341197B (zh) | 喷淋冷却一体板及用于金属有机化学气相沉积的喷淋系统 | |
CN103014669A (zh) | 化学气相沉积装置 | |
CN102586759B (zh) | 一种气体输送系统及应用该系统的半导体处理设备 | |
CN103361624B (zh) | 金属有机化合物化学气相沉积方法及其装置 | |
CN203007411U (zh) | 喷淋头及化学气相沉积设备 | |
US20150361583A1 (en) | Dual auxiliary dopant inlets on epi chamber |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HETF SOLAR INC. Free format text: FORMER OWNER: DEVELOPMENT EXPERT COMPANY Effective date: 20150206 Owner name: DEVELOPMENT EXPERT COMPANY Free format text: FORMER OWNER: CM MANUFACTURING INC. Effective date: 20150206 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: STION CORP. Free format text: FORMER NAME: HETF SOLAR INC. Owner name: CM MANUFACTURING INC. Free format text: FORMER NAME: STION CORP. |
|
CP01 | Change in the name or title of a patent holder |
Address after: California, USA Patentee after: STION Corp. Address before: California, USA Patentee before: HETF solar |
|
CP03 | Change of name, title or address |
Address after: California, USA Patentee after: CM manufacturing Co. Address before: American California Patentee before: Stion Corp. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20150206 Address after: California, USA Patentee after: HETF solar Address before: California, USA Patentee before: Development Specialist Effective date of registration: 20150206 Address after: California, USA Patentee after: Development Specialist Address before: California, USA Patentee before: CM manufacturing Co. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20170329 |
|
CF01 | Termination of patent right due to non-payment of annual fee |