CN202008997U - Light emitting device - Google Patents
Light emitting device Download PDFInfo
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- CN202008997U CN202008997U CN2011200749500U CN201120074950U CN202008997U CN 202008997 U CN202008997 U CN 202008997U CN 2011200749500 U CN2011200749500 U CN 2011200749500U CN 201120074950 U CN201120074950 U CN 201120074950U CN 202008997 U CN202008997 U CN 202008997U
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- emitting device
- emitting diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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Abstract
The utility model provides a light emitting device, which comprises a bearing substrate, a first layer structure, a plurality of light-emitting diode elements and a second layer structure, wherein the first layer structure includes one or a plurality of kinds of fluorescent powder inside and is provided with first refractive index, the light-emitting diode elements are positioned between the bearing substrate and the first layer structure, and the second layer structure positioned between the bearing substrate and the first layer structure covers one or a plurality of light-emitting diode elements and is provided with second refractive index larger than or equal to the first refractive index. By the aid of the collocation mode that the refractive index of the second layer structure is larger than or equal to that of the first layer structure, light emission loss of the light-emitting diode elements can be decreased, and because of jointing of the first layer structure and the second layer structure, no residual air exists so that the problem of lower integral light emission efficiency of the light-emitting diode elements is avoided. Since the second layer structure can be formed in a coating mode, the upper surface of the second layer structure is a flat surface in fact, and convenience in manufacture is provided.
Description
Technical field
This is novel to be the encapsulation technology of relevant light-emitting diode, refer to especially a kind of when reducing with light-emitting diode as light source, at the light-emitting device of the colour temperature difference of different rising angles.
Background technology
(light emitting diode, LED) element has that volume is little to light-emitting diode, the life-span is long, reaction speed is fast, low power consumption and than advantages such as environmental protection, is widely used in gradually in the field of lighting apparatus or backlight.
Utilize in the known light-emitting device of light-emitting diode as light source, modal problem is that the colour temperature (Color Temperature) of light-emitting device or chromaticity coordinates value can be because of the different deviations to some extent of rising angle, that is, when the different rising angles of light-emitting device were measured, colour temperature or chromaticity coordinates value of its output light had notable difference.And, the colour temperature difference problem between different rising angles, obvious especially in the light source of polycrystalline encapsulating structure.Such shortcoming can reduce the usefulness performance and the market acceptance of light-emitting diode, especially changes more sensitive lighting field in the colour temperature to light source.
Summary of the invention
In view of this, in the colour temperature difference of different rising angles, be the industry problem demanding prompt solution when how to improve with light-emitting diode as light source.
This specification provides a kind of embodiment of light-emitting device, and it includes: a bearing substrate; One ground floor structure, its inside includes one or more phosphor powder, and this ground floor structure has one first refractive index; A plurality of light-emitting diodes, between this bearing substrate and this ground floor structure in; And a second layer structure, between this bearing substrate and this ground floor structure, coat this one or more light-emitting diode, and this second layer structure has one second refractive index more than or equal to this first refractive index.
Compare the technique effect that the utility model obtained with existing scheme:
1) by the refractive index of this second layer structure configuration mode more than or equal to the refractive index of this ground floor structure, can reduce the light loss that of light-emitting diode component, and the ground floor structure can with second layer structural engagement, do not have the therebetween residual and problem that causes the whole light extraction efficiency of light-emitting diode component to reduce of air;
2) because second layer structure can form with coating method,, has the convenience in the manufacturing so its upper surface can be the plane in fact;
3) simultaneously difference is gone out the collocation use in light-emitting device together of photochromic LED crystal particle, the color rendering performance in the time of can effectively promoting light-emitting device as light source or backlight.
Description of drawings
Fig. 1 is the vertical view after an embodiment of light-emitting device of the present utility model simplifies.
Fig. 2 and Fig. 3 are the profile after the different embodiment of the light-emitting device among Fig. 1 simplify.
Fig. 4 is the vertical view after another embodiment of light-emitting device of the present utility model simplifies.
Fig. 5 and Fig. 6 are the profile after the different embodiment of the light-emitting device among Fig. 4 simplify.
Fig. 7 is the profile after another embodiment of light-emitting device of the present utility model simplifies.
[main element symbol description]
100 light-emitting devices
110 bearing substrates
112 outer male structure
114 disposal areas
120 lens jacket structures
122 convex surfaces
130 light-emitting diodes
132 leads
140 binder course structures
150 encapsulation layer structure
324 micro-structurals
Embodiment
Below will the arrange in pairs or groups correlative type of this novel part embodiment illustrates the technology contents that this is novel.In these are graphic, the function that may be denoted by the same reference numerals or similar elements identical with structure.Mentioned " element " speech in the middle of specification in the whole text and follow-up claim has comprised notions such as member, layer structure or zone.
Illustrating when graphic, some size of component and relative size can be carried out amplification, so that graphic content can be known expression.In addition, the shape of some element can be simplified conveniently to illustrate.Therefore, shape, size and the relative size of each element that is illustrated in graphic are not in order to limit claim of the present utility model.In addition, the utility model can embody with many different forms, when explaining claim of the present utility model, does not answer the aspect of limit in the exemplary embodiment that this specification proposed.
In specification and follow-up claim, used some vocabulary to censure specific element.The technical staff should understand in the affiliated field, and same element may be called with different nouns.This specification and follow-up claim are not used as distinguishing the mode of element with the difference of title, but the benchmark that is used as distinguishing with the difference of element on function.Be an open term mentioned " comprising " in the middle of specification and the follow-up claim in the whole text, so should be construed to " comprise but be not limited to ... ".This is employed " and/or " describing mode, comprise cited one of them or the combination in any of a plurality of projects.In addition, unless specialize, otherwise the term of any odd number lattice all comprises the connotation of plural lattice in this manual simultaneously.
In the middle of specification in the whole text and follow-up claim, if describe first element be positioned on second element, above second element, connect, engage, be coupled to second element or join with second element, can represent that then first element is located immediately on second element, directly connects, directly engages, directly is coupled to second element, also can represent that first element and second interelement have other medium elements to exist.Relatively, be located immediately on second element, directly connect, directly engage, directly couple or directly be connected to second element mutually, then represent first element and second interelement not to have other medium elements existence if describe first element.
For the convenience on illustrating, may use some narrations relevant in the specification with the relative position in the space, for example " in ... on ", " in ... top ", " in ... down ", " in ... below ", " being higher than ... ", " being lower than ... ", " making progress ", " downwards " or the like, function or this element and other interelement relative space relations of a certain element in graphic described.The technical staff should understand in the affiliated field, the narration that these are relevant with the relative position in the space, not only comprise the points relationship (orientation) of described element in graphic, also comprised the various different points relationships of described element when using, operating or assembling.For example, if turn upside down with graphic, then originally used " in ... on " element described, will become " in ... time ".Therefore, employed in specification " in ... on " describing mode, comprised in the explanation " in ... down " and " in ... on " two kinds of different points relationships.In like manner, at this employed " making progress " speech, " making progress " and " downwards " two kinds of different points relationships have been comprised in the explanation.
Please refer to Fig. 1, its illustrate is an embodiment of light-emitting device 100 of the present utility model vertical view after simplifying.Light-emitting device 100 includes bearing substrate 110, includes one or more outer male structure 112 on the bearing substrate 110, to form a disposal area 114.Disposal area 114 in Fig. 1 is surrounded by an outer male structure 112 of sealing round, but this only is an embodiment, but not limits to actual execution mode of the present utility model.On real the work, also can on bearing substrate 110, be provided with and have male structure 112 outside a little gap a plurality of to each other, define the scope of disposal area 114 jointly.
Below will arrange in pairs or groups Fig. 2 and Fig. 3 further specifies the execution mode of light-emitting device 100.
Fig. 2 is the profile after an embodiment of light-emitting device 100 simplifies along the A-A ' direction among Fig. 1.As shown in Figure 2, above bearing substrate 110, be provided with a lens jacket structure 120, and the inside of lens jacket structure 120 includes one or more phosphor powder.The phosphor powder quantity, kind, concentration and the distribution mode that are comprised in the lens jacket structure 120 can be adjusted according to the application purpose difference of light-emitting device 100, are not limited to specific implementations.On making, can utilize ejection formation or other manufactures to make lens jacket structure 120, so its shape can be controlled according to the needs of design.In bearing substrate 110 and lens jacket structure 120 formed spaces, be provided with one or more light-emitting diode 130 and binder course structure 140.
In the present embodiment, between bearing substrate 110 and binder course structure 140, also be provided with encapsulation layer structure 150, in order to coat and protection light-emitting diode 130.
Light-emitting diode 130 is to be used for light source as light-emitting device 100.When assembling, light-emitting diode 130 can be utilized directly solid brilliant (the Chip on Board of joint of electronic component, COB) or other modes, be coupled to the metal electrode on the bearing substrate 110, light-emitting diode 130 is installed in the outer male structure 112 formed disposal areas 114 on the bearing substrate 110.By the time after light-emitting diode 130 is installed on the bearing substrate 110; again the packaging plastic of liquid form is coated in the disposal area 114 on the bearing substrate 110; to cover light-emitting diode 130 and the lead 132 of being correlated with and to form encapsulation layer structure 150, reach the function of protection light-emitting diode 130.
Afterwards, bearing substrate 110 is aligned with each other with lens jacket structure 120 engages.For example, in the embodiment of Fig. 2, lens jacket structure 120 can be linked in the outer male structure 112 on the bearing substrate 110.Next, with the injecting in encapsulation layer structure 150 and lens jacket structure 120 space between the two of liquid form, fill up this space as far as possible again to form binder course structure 140 in conjunction with glue.In the process that forms binder course structure 140, the air that originally is present between encapsulation layer structure 150 and the lens jacket structure 120 can be discharged gradually.Just can both engage with lens jacket structure 120 and encapsulation layer structure 150 after solidifying on binder course structure 140, and finish the canned program of light-emitting diode 130.
The material of lens jacket structure 120, binder course structure 140 and/or encapsulation layer structure 150, materials such as available silica gel, epoxy resin and acryl one of them or wherein both mix at least.In order to reduce the loss of light intensity that of light-emitting diode 130, the material of above-mentioned three layer structures can be through suitably selecting, make that the refractive index N3 of encapsulation layer structure 150 can be more than or equal to the refractive index N2 of binder course structure 140, and the refractive index N2 of binder course structure 140 can be more than or equal to the refractive index N1 of lens jacket structure 120.
As previously mentioned, the air that originally is present between encapsulation layer structure 150 and the lens jacket structure 120 can be discharged from the process of assembling.Therefore, in the light-emitting device 100 that encapsulation is finished, the upper surface of binder course structure 140 can with the lower surface engages of lens jacket structure 120, the lower surface of binder course structure 140 then can engage with the upper surface of encapsulation layer structure 150, does not have the therebetween residual and problem that causes the whole light extraction efficiency of light-emitting diode 130 to reduce of air.In addition, because encapsulation layer structure 150 can form with coating method, so its upper surface can be the plane in fact, have the convenience in the manufacturing, and the top surface area of encapsulation layer structure 150 can be identical in fact with the following table area of binder course structure 140.
In the embodiment of Fig. 2, the upper surface of lens jacket structure 120 is the shapes that are designed to have single convex surface 122, so that light-emitting device 100 obtains wider rising angle scope, then contained whole light-emitting diode 130 in the orthographic projection scope of convex surface 122 belows.As shown in the figure, the thickness of the convex surface 122 of lens jacket structure 120 is with middle part the thickest (T1 is greater than 0.1 centimeter), and successively decreases in past gradually both sides.Through test, such design can effectively promote the colour temperature consistency of light-emitting device 100 between different rising angles, significantly improves known light-emitting device has the different existence of color temperature difference between different rising angles problem.
On real the work, a plurality of light-emitting diodes 130 that illustrated among Fig. 2 can be the light-emitting diodes with a kind of bright dipping look, also can comprise two or more difference and go out photochromic light-emitting diode.For example, in one embodiment, a plurality of light-emitting diodes 130 in the light-emitting device 100, be to go out photochromic LED crystal particle by two kinds of differences to combine for example combination of the combination of the combination of ruddiness crystal grain and blue light crystal grain, ruddiness crystal grain and green dies or green dies and blue light crystal grain or the like.In another embodiment, a plurality of light-emitting diodes 130 in the light-emitting device 100 have then comprised ruddiness crystal grain, blue light crystal grain and green dies simultaneously.Simultaneously difference is gone out the collocation use in light-emitting device 100 together of photochromic LED crystal particle, the color rendering performance in the time of can effectively promoting light-emitting device 100 as light source or backlight.
Profile after another embodiment that Fig. 3 illustrates light-emitting device 100 simplifies along the A-A ' direction among Fig. 1.In the embodiment shown in fig. 3, be formed with a plurality of micro-structurals 324 on the lower surface of lens jacket structure 120.These micro-structurals 324 can be pyramid, tetrahedron, cone, wavy, the irregular concavo-convex or mixing of above structure of annular.The subrange that micro-structural 324 can only be located at convex surface 122 lower surfaces of lens jacket structure 120 (for example in the scope of central authorities' 20～70% areas, also can be covered with the lower surface of lens jacket structure 120 and the whole zone of binder course structure 140 connecting parts.
As previously mentioned, the thickness of lens jacket structure 120 and varied in thickness are with to keep colour temperature (or the chromaticity coordinates value) consistency of light-emitting device 100 at different rising angles relevant.Utilize the setting of a plurality of micro-structurals 324 on the lower surface of lens jacket structure 120, can not influence under the conforming situation of bright dipping colour temperature of light-emitting device 100, reduce the required thickness of convex surface 122 of lens jacket structure 120, reduce the use amount of material.That is, make under the identical in fact situation of the colour temperature (or chromaticity coordinates value) of the different rising angles of light-emitting device 100, the maximum ga(u)ge T2 of the convex surface 122 of lens jacket structure 120 in Fig. 3 embodiment can be less than the maximum ga(u)ge T1 in Fig. 2 embodiment.
In addition, the fluorescent powder that light-emitting diode 130 has in part bright dipping meeting and the lens jacket structure 120 bumps generation to inscattering, or total reflection takes place in light when being entered lens jacket structure 120 by binder course structure 140 or entering air by lens jacket structure 120, thereby influences the light extraction efficiency of light-emitting diode 130.Utilize the setting of aforementioned a plurality of micro-structural 324, also can effectively reduce the problems referred to above, and then promote the light extraction efficiency of light-emitting diode 130.
On real the work, a plurality of micro-structurals 324 are changed the upper surface that is arranged on lens jacket structure 120, or a plurality of micro-structurals 324 all are set, can both reach similar aforesaid effect at the upper surface and the lower surface of lens jacket structure 120.
Please refer to Fig. 4, its illustrate is another embodiment of light-emitting device 100 of the present utility model vertical view after simplifying.In the present embodiment, the upper surface of lens jacket structure 120 is the shapes that are designed to have a plurality of convex surfaces 122, has then contained several light-emitting diodes 130 in the orthographic projection scope of each convex surface 122 below respectively.Below will arrange in pairs or groups Fig. 5 and Fig. 6 further specifies the embodiment of Fig. 4.
Fig. 5 is the profile after an embodiment of light-emitting device 100 simplifies along the A-A ' direction among Fig. 4.As shown in Figure 5, the thickness of each convex surface 122 of lens jacket structure 120 is with middle part the thickest (T3 is greater than 0.05 centimeter), and successively decreases in past gradually both sides.Similar with previous embodiment, it is identical in fact that such design can make the colour temperature (or chromaticity coordinates value) of the different rising angles of light-emitting device 100 keep, and the output light that improves known light-emitting device has the problem of colour temperature notable difference existence between different rising angles.
In addition, design the mode of a plurality of convex surfaces 122 at the upper surface of lens jacket structure 120, can not influence under the conforming situation of bright dipping colour temperature of light-emitting device 100, reduce the required thickness of each convex surface 122 of lens jacket structure 120, reduce the use amount of material and the overall volume of light-emitting device 100.That is, the colour temperature (or chromaticity coordinates value) of the different rising angles of light-emitting device 100 is kept under the identical in fact situation, the maximum ga(u)ge T3 of the convex surface 122 of lens jacket structure 120 in Fig. 5 embodiment can be less than the maximum ga(u)ge T1 in Fig. 2 embodiment.
Profile after another embodiment that Fig. 6 illustrates light-emitting device 100 simplifies along the A-A ' direction among Fig. 4.In the embodiment of Fig. 6, also be formed with a plurality of micro-structurals 324 on the lower surface of lens jacket structure 120.Micro-structural 324 can only be located at the subrange (for example in the scope of central authorities' 20～70% areas) of each convex surface 122 pairing lower surface of lens jacket structure 120, also can be covered with the lower surface of lens jacket structure 120 and the whole zone of binder course structure 140 connecting parts.
Similar with previous embodiment, utilization is positioned at the setting of a plurality of micro-structurals 324 of the lower surface of lens jacket structure 120, can not influence under the conforming situation of bright dipping colour temperature of light-emitting device 100, reduce the required thickness of convex surface 122 of lens jacket structure 120, reduce the use amount of material.That is, the colour temperature (or chromaticity coordinates value) of the different rising angles of light-emitting device 100 is kept under the identical in fact situation, the maximum ga(u)ge T4 of the convex surface 122 of lens jacket structure 120 in Fig. 6 embodiment can be less than the maximum ga(u)ge T3 in Fig. 5 embodiment.Similarly, the setting of a plurality of micro-structurals 324 also can promote the light extraction efficiency of light-emitting diode 130.
On real the work, a plurality of micro-structurals 324 are changed the upper surface of each convex surface 122 that is arranged on lens jacket structure 120, or a plurality of micro-structurals 324 all are set at the upper surface and the lower surface of each convex surface 122 of lens jacket structure 120, can both reach similar aforesaid effect.
Profile after another embodiment that Fig. 7 illustrates light-emitting device 100 simplifies.In the embodiment of Fig. 7, the upper surface of lens jacket structure 120 is designed to have more convex surface 122, and has only a light-emitting diode 130 in the orthographic projection scope of each convex surface 122 below.That is, convex surface 122 numbers of lens jacket structure 120 upper surfaces in the present embodiment are identical with the number of light-emitting diode 130.Such configuration mode, can not influence light-emitting device 100 under the conforming situation of the colour temperature of different rising angles, further reduce the required thickness of convex surface 122 of lens jacket structure 120, more can reduce the use amount of material and the overall volume of light-emitting device 100, allow the manufacturing environmental protection more of light-emitting device 100.
In the aforementioned embodiment, binder course structure 140 is directly to join with lens jacket structure 120 and encapsulation layer structure 150, with as lens jacket structure 120 and encapsulation layer structure 150 both engage media.In other embodiments, also can be between binder course structure 140 and lens jacket structure 120, and/or between binder course structure 140 and encapsulation layer structure 150, other suitable printing opacities are set engage media.
The person with usual knowledge in their respective areas should understand, on the aforementioned bearing substrate 110 by number, shape or the position of outer male structure 112 formed disposal areas 114, all can adjust, be not limited to the aspect that previous embodiment illustrates according to the needs of side circuit design.The disposal area 114 that a plurality of that separate, difformities and size for example, also can be arranged on the bearing substrate 110.When the number of disposal area 114, shape or position change, number, shape or the position of lens jacket structure 120, binder course structure 140 and the encapsulation layer structure 150 that is provided with disposal area 114 corresponding collocation all will and then be adjusted.
In certain embodiments, also binder course structure 140 or encapsulation layer structure 150 can be omitted.For example, in the assembling process of some embodiment, after light-emitting diode 130 is installed in the disposal area 114 on the bearing substrate 110, can skip the step of coating packaging plastic, directly bearing substrate 110 is aligned with each other with lens jacket structure 120 and engage.Then, again with the injecting in bearing substrate 110 and lens jacket structure 120 space between the two of liquid form, covering light-emitting diode 130 and relevant lead 132, and fill up this space as far as possible to form single binder course structure 140 in conjunction with glue.In the process that forms binder course structure 140, the air that originally is present between bearing substrate 110 and the lens jacket structure 120 can be discharged gradually.Just can both engage with lens jacket structure 120 and bearing substrate 110 after solidifying on binder course structure 140, and finish the canned program of light-emitting diode 130.In order to reduce the light loss that of light-emitting diode 130, the material of said lens layer structure 120 and binder course structure 140 can make that the refractive index N2 of binder course structure 140 can be more than or equal to the refractive index N1 of lens jacket structure 120 through suitably selecting.If the forming process of lens jacket structure 120 or binder course structure 140 is because the influence of technological level, appointed condition; thereby the abutted surface that causes 140 on lens jacket structure 120 and binder course structure not exclusively is the plane; perhaps cause the surface area of abutted surface of two layer structures slightly different, also should belong to the protection range of this patent.
Again for example, in the assembling process of some embodiment, can earlier packaging plastic be coated in the disposal area 114 on the bearing substrate 110, reach relevant lead 132 to form encapsulation layer structure 150 to cover light-emitting diode 130.Afterwards, to imbed the mode of moulding (insert molding), on encapsulation layer structure 150, directly form lens jacket structure 120 again, and finish the canned program of light-emitting diode 130.In this embodiment, the joining part of 150 of lens jacket structure 120 and encapsulation layer structure can be essentially the plane.In order to reduce the light loss that of light-emitting diode 130, the material of said lens layer structure 120 and encapsulation layer structure 150 can make that the refractive index N3 of encapsulation layer structure 150 can be more than or equal to the refractive index N1 of lens jacket structure 120 through suitably selecting.If the forming process of lens jacket structure 120 or encapsulation layer structure 150 is because the influence of technological level, appointed condition; thereby the abutted surface that causes 150 of lens jacket structure 120 and encapsulation layer structure not exclusively is the plane; perhaps cause the surface area of abutted surface of two layer structures slightly different, also should belong to the protection range of this patent.
Multinomial technical characterictic among the aforementioned different embodiment can make up mutually, and it is identical in fact to cause colour temperature between the different rising angles of light-emitting device 100 to be kept, and promotes the whole light extraction efficiency of light-emitting device 100.In addition, also the multinomial technical characterictic among the aforementioned different embodiment can be made up mutually, to reduce the material use amount in the manufacture process.
The above only is preferred embodiment of the present utility model, and all equalizations of being done according to the utility model claim change and modify, and all should belong to covering scope of the present utility model.
Claims (10)
1. a light-emitting device is characterized in that, includes:
One bearing substrate;
One ground floor structure, its inside includes one or more phosphor powder, and this ground floor structure has one first refractive index;
A plurality of light-emitting diodes, between this bearing substrate and this ground floor structure in; And
One second layer structure between this bearing substrate and this ground floor structure, coats this one or more light-emitting diode, and this second layer structure has one second refractive index more than or equal to this first refractive index.
2. light-emitting device as claimed in claim 1 is characterized in that, includes one or more outer male structure on this bearing substrate, and forming a disposal area, and these a plurality of light-emitting diodes are positioned at this disposal area.
3. light-emitting device as claimed in claim 2 is characterized in that the upper surface of this ground floor structure and/or lower surface have a plurality of micro-structurals.
4. light-emitting device as claimed in claim 1 is characterized in that, this second layer structure is after this bearing substrate and this ground floor structural engagement, injects in this bearing substrate and this formed space of ground floor structure.
5. light-emitting device as claimed in claim 1 is characterized in that the maximum ga(u)ge of this ground floor structure is greater than 0.1 centimeter.
6. light-emitting device as claimed in claim 1 is characterized in that, the abutted surface of this ground floor structure and this second layer structure is the plane.
7. as each described light-emitting device in the claim 1 to 6, it is characterized in that these a plurality of light-emitting diodes comprise two or more difference and go out photochromic light-emitting diode.
8. as each described light-emitting device in the claim 1 to 6, it is characterized in that this ground floor structure has one or more convex surface.
9. light-emitting device as claimed in claim 8 is characterized in that, includes one or more light-emitting diodes in the orthographic projection scope of each convex surface below.
10. light-emitting device as claimed in claim 8 is characterized in that, these a plurality of light-emitting diodes comprise one or more to have one first and go out photochromic light-emitting diode, and one or more has one second and goes out photochromic light-emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200749500U CN202008997U (en) | 2011-03-21 | 2011-03-21 | Light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200749500U CN202008997U (en) | 2011-03-21 | 2011-03-21 | Light emitting device |
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| CN202008997U true CN202008997U (en) | 2011-10-12 |
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| CN2011200749500U Expired - Fee Related CN202008997U (en) | 2011-03-21 | 2011-03-21 | Light emitting device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620215A (en) * | 2012-04-11 | 2012-08-01 | 深圳市华星光电技术有限公司 | LED backlight light source |
| CN103311418A (en) * | 2012-03-06 | 2013-09-18 | 展晶科技(深圳)有限公司 | Light emitting diode module |
| CN103700654A (en) * | 2013-12-20 | 2014-04-02 | 纳晶科技股份有限公司 | LED (Light-Emitting Diode) based on COB (Chip On Board) package and manufacturing method thereof |
| CN103730560A (en) * | 2012-10-16 | 2014-04-16 | 隆达电子股份有限公司 | Light emitting diode structure |
| CN106773298A (en) * | 2016-12-26 | 2017-05-31 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display |
| CN110047988A (en) * | 2016-07-26 | 2019-07-23 | 宏齐科技股份有限公司 | The encapsulating structure of light-emitting diode |
| CN110379802A (en) * | 2019-07-23 | 2019-10-25 | 济南南知信息科技有限公司 | A kind of overall plastic seal structure of LED and its plastic package process |
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2011
- 2011-03-21 CN CN2011200749500U patent/CN202008997U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311418A (en) * | 2012-03-06 | 2013-09-18 | 展晶科技(深圳)有限公司 | Light emitting diode module |
| CN102620215A (en) * | 2012-04-11 | 2012-08-01 | 深圳市华星光电技术有限公司 | LED backlight light source |
| CN102620215B (en) * | 2012-04-11 | 2014-08-13 | 深圳市华星光电技术有限公司 | LED backlight light source |
| CN103730560A (en) * | 2012-10-16 | 2014-04-16 | 隆达电子股份有限公司 | Light emitting diode structure |
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