CN100464233C - Backlight module - Google Patents

Backlight module Download PDF

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Publication number
CN100464233C
CN100464233C CN 200610005070 CN200610005070A CN100464233C CN 100464233 C CN100464233 C CN 100464233C CN 200610005070 CN200610005070 CN 200610005070 CN 200610005070 A CN200610005070 A CN 200610005070A CN 100464233 C CN100464233 C CN 100464233C
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backlight
module
backlight module
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CN 200610005070
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Chinese (zh)
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CN101004512A (en )
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游川倍
黎瑞雍
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群康科技(深圳)有限公司;群创光电股份有限公司
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

本发明公开一种背光模块,其包括有一具有一入光面与一出光面的导光板以及至少一发光二极管混光元件,设于该入光面附近,以作为该背光模块的光源。 The present invention discloses a backlight module, which includes a light incident surface and having a surface of a light guide plate, and a mixed light emitting diode element, disposed in the vicinity of the surface at least, as the backlight module. 其中,该发光二极管混光元件包括有至少一第一色光LED芯片与至少一相对应的第一色补偿膜,设置于该导光板的入光面表面,以及至少一第二色光LED芯片与至少一相对应的第二色补偿膜,设置于该导光板的入光面表面。 Wherein the mixed light emitting diode element comprises at least one LED chip and the first color compensating film comprising at least a first color corresponding to the light guide plate disposed on the surface of light incident surface, and at least a second color LED chips at least a corresponding second color compensation film disposed on the light incident surface of the light guide plate surface. 此外,该背光模块又包括有至少一光谱(spectrum)感应器设置于该出光面上。 Further, the backlight module further comprises at least one spectrum (Spectrum) sensor disposed on the light-emitting surface.

Description

背光模块 Backlight module

技术领城 Technical collar city

本发明提供一种背光模块,特别是涉及一种具有能产生白光的发光二极管混光元件的背光模块。 The present invention provides a backlight module, particularly to a backlight unit having a light emitting diode to produce white light mixing element.

背景技术 Background technique

由于发光二极管(light emitting diode, LED)具有寿命长、体积小、高耐震性、发热度小及耗电量低等优点,故发光二极管已被广泛地应用于家电制品及各式仪器的指示灯或光源。 Since the light-emitting diode (light emitting diode, LED) having a long life, small volume, high shock resistance, low power consumption and small heat of advantages, so the light emitting diode has been widely used in household electric appliances and various types of indicator instruments or a light source. 而且近年来,更由于发光二极管朝向多色彩及高亮度化发展,因此其应用范围已拓展至各种携带式或大型电子产品中,用以作为显示器的背光源、灯具、警示号志以及户外多媒体彩色看板等,成为兼具省电和环保概念的新照明光源。 And in recent years, due to the more multi-color light emitting diode toward the development and high brightness, and therefore its application has expanded to a large variety of portable electronic products or to display as a backlight, lighting, outdoor display and warning semaphores color billboards, etc., as a new illumination light source of both energy saving and environmental protection.

请参阅图1,图1为现有一发光二极管封装元件10的剖面示意图。 Please refer to FIG. 1, FIG. 1 is a cross-sectional schematic view of a conventional light emitting diode package component 10. 现有发光二极管封装元件10包括有一封装基底12以及一发光二极管芯片14, 发光二极管芯片14上有一N型电极16以及一P型电极18,而封装基底12 上也有二相对的电极20、 22。 Conventional LED package component 10 includes a package substrate 12 and 14, a light emitting diode chip emitting diode chip 14 an N-type electrode 16 and a P-type electrode 18, and the package substrate 12 also has two opposite electrodes 20, 22. 在芯片式发光二极管封装元件10的制作工艺中,是先将发光二极管芯片14以银胶(图未示)黏着固定于封装基底12上。 In the production process of chip type LED package component 10, the first LED chip 14 is silver paste (not shown) is fixed to the adhesive 12 on the package substrate. 当发光二极管芯片14被固定于封装基底12上后即进行打线步骤,将发光二极管芯片14上的N型电极16与P型电极18分别以导线24与26连接至封装基底12上的二电极20与22。 When the second electrode is fixed to the LED chip 14 to the package substrate 12 after the wire bonding step for the N-type electrode 14 on the LED chip 16 and the P-type electrode 18 respectively connected to the wires 24 and 26 on the package substrate 12 20 and 22. 打线完成后再进行封胶制作工艺,即将整个发光二极管封装元件10置于一模具中(图未示),并利用环氧树脂(印oxy)或其它防水抗热的耐久透明材料填充的并待其硬化后取出,最后发光二极管芯片14、封装基底12以及各电极与各导线,便都被包覆在一由环氧树脂所充填形成的封胶28中。 Production process for the sealant after wire bonding is completed, i.e. the entire light emitting diode package component 10 is placed in a mold durable transparent material (not shown), and an epoxy resin (Oxy printing) or other water filled and heat wait until removed after hardening, and finally the light emitting diode chip 14, the package substrate 12 and the respective lead wires and electrodes, they are coated in a sealant 28 formed of an epoxy resin is filled.

由于一般信息产品的平面显示器所需的背光源都以白光为主,因此应用作为背光源的LED也需能产生白光。 Due to the required general information flat display backlight white light sources, hence the LED as a backlight application also need to be able to produce white light. 然而,与目前普及的照明器具白炽鴒丝灯泡或日光灯相比,虽然白光LED有体积小、反应'速度快、发热量低、 低耗电量、寿命长、可平面封装、低污染及高防震性等优点,但因白光LED However, compared with the current popularity of the luminaire incandescent filament bulb or fluorescent ling, although the white LED has a small size, fast response 'speed, low heat, low power consumption, long life, flat package, low pollution and high shock and other advantages, but white LED

成本高、发光效率4氐,因此白光LED目前商品化的产品不多。 Cost, luminous efficiency 4 Di, so much white LED current commercial products. 在现有技术中,业界一般产生白光的方式包括有: In the prior art embodiment, the industry generally produces white light comprising:

(1) .使用蓝光LED芯片加黄绿光荧光粉而形成白光,此方法成本及效率皆较低,为大部分业界所采用,但其有一明显缺点为所产生的白光缺少红光部分,故其色彩表现不佳; (1), while the white light using a blue LED chip and a yellow green phosphor, the cost and efficiency of this method are low, most of the industry is adopted, but there is a significant disadvantage as the lack of the red portion of the white light generated, so the color poor performance;

(2) . ^f吏用红、蓝、绿光三颗LED芯片,利用调整通过三颗LED芯片的电流来产生白光,此法效率最高,但生产成本亦最高; . (2) ^ f officials red, blue, green three LED chips by adjusting the current through the three LED chips to produce white light, this method is the most efficient, but also the highest cost of production;

(3) . 4吏用紫外光(UV)芯片加上红、绿、蓝光荧光粉,但此法效率较低, 而且UV光易造成环氧树脂老化;以及 (3) 4 Officials with ultraviolet light (UV) chip plus red, green and blue phosphors, but this method is less efficient, but could easily lead to UV light aging epoxy; and

(4) .蓝色LED芯片加上红、绿光荧光粉,然此法效率偏低。 (4) The blue LED chips combined with red, green phosphors, and then the efficiency of this method is low.

所以目前业界另研发出将红光LED芯片、蓝光LED芯片以及绿光LED 芯片同时封装在一封装元件内,并用传统的环氧树脂加以封装保护,以使同一发光二极管封装元件能同时产生红光、蓝光以及绿光。 Therefore, the industry to further develop a red LED chip, a blue LED chip and the green LED chips in a package and the package member, and be protected by a conventional epoxy resin package, so the light emitting diode package of the same element can be simultaneously generate red light , blue and green. 然而, 一般环氣树脂的混光效果不佳,因此,为了提高混光效果以得到所需的白光,必须在导光板与发光二极管封装元件之间另设一混光机构,或是增加导光板尺寸以及显示器显示区域(viewingarea)至发光二极管封装元件的距离,以改善混光效果。 However, poor gas barrier resin mixed light generally ring effect, therefore, in order to improve light mixing effect to obtain the desired white light, the light must be mixed with a separate means between the guide plate and the light emitting diode package component, or to increase the light guide plate and a display size of a display area (viewingarea) distance to the light emitting diode package component to improve light mixing effect.

如图2所示,图2为现有为改善混光效果的导光板与发光二极管封装元件的配置图。 2, FIG. 2 is a conventional light guide plate to improve the light mixing effect is a configuration diagram of the light emitting diode element package shown in FIG. 现有发光二极管封装元件30同时封装三种红光LED芯片、蓝光LED芯片以及绿光LED芯片,当发光二极管封装元件30应用于一側光式背光模块时,会设置于一导光板32的一侧面32a。 Conventional LED element package 30 and the package three kinds of red LED chip, a blue LED chip and a green LED chip, when applied to the light emitting diode package component 30 side of the light-type backlight module, a light guide plate be disposed in a 32 side 32a. 然而,由于发光二极管封装元件30的混光效果不佳,因此必须增加发光二极管封装元件30至导光板32的显示区域34间的距离,以提高混光效果,故导光板32的尺寸必须加大,以提供一混光区城36,使得从发光二极管封装元件30产生的光线能在混光区域36充分混光而产生白光,进入显示区域34中。 However, due to poor mixing effect of the light emitting diode package 30 element, it is necessary to increase the distance between the light guide plate 30 to the display area 32 of the light emitting diode package component 34, in order to improve light mixing effect, it is necessary to increase the size of the light guide plate 32 to provide a mixing zone city 36, 36 can be thoroughly mixed so that the light generated in the light mixing region from the white light emitting diode package component 30 enters the space 34 in the display region. 因此,不论是利用增加导光板长度或是在导光板或发光二极管封装元件之间加设混光机构, 都有必须增加整体背光模块的尺寸以及提高背光模块的制作成本等缺点。 Therefore, whether the use of the light guide plate increases or the length of the light guide plate between the light emitting diode package component or a light mixing means disposed addition, there must be increased the overall size of the backlight module manufacturing cost and to improve the disadvantages of the backlight module.

由上述可知,如何提供成本低廉、发光效率高而能产生白光的发光二极管封装元件,仍为业界亟待研究的方向。 From the foregoing, how to provide low cost, high luminous efficiency and can produce white light emitting diode package component, the direction the industry is still urgent research.

发明内容 SUMMARY

因此本发明的主要目的在于提供一种包括有不同色LED芯片与相对应 The main object of the present invention is therefore to provide a different color LED chips comprising corresponding

各色LED芯片的补偿膜的发光二极管混光元件,以使多色发光二极管所产生的多色光能在背光模块中充分混光而产生白光,以解决现有发光二极管因需产生白光而导致背光模块体积增大的问题。 Multicolor light emitting diode LED chips of each color compensation film light mixing element, so that multi-color LED light generated in the backlight module are thoroughly mixed to produce white light, in order to solve the conventional light emitting diode generating white light caused because of the need of the backlight module volume increases.

本发明的目的是这样实现的,即提供一种背光模块,其包括有一具有一入光面与一出光面的导光板以及至少一发光二极管混光元件设于该入光面附近,以作为该背光模块的光源。 Object of the present invention is achieved, i.e., to provide a backlight module, which includes a light incident surface and having a surface of a guide plate and a mixed light emitting diode elements disposed in the vicinity of the surface at least, as the the light source of the backlight module. 其中,该发光二极管混光元件包括有至少一第一色光LED芯片与至少一相对应的第一色补偿膜设置于该导光板的入光面表面,以及至少一笫二色光LED芯片与至少一相对应的第二色补偿膜设置于该导光板的入光面表面。 Wherein the light emitting diode comprises a light mixing element into a surface of at least a first surface of the LED chip and at least one color light corresponding to a first color compensation film disposed on the light guide plate, and at least one colored LED chip and Zi at least two corresponding to a second color compensation film disposed on the light incident surface of the light guide plate surface. 此外,该背光模块又包括有至少一光谱(spectrum)感应器设置于该出光面上。 Further, the backlight module further comprises at least one spectrum (Spectrum) sensor disposed on the light-emitting surface.

由于本发明是将红光LED芯片、蓝光LED芯片及绿光LED芯片配合相对应红光LED芯片的青色补偿膜、相对应绿光LED芯片的紫色补偿膜以及相对应蓝光LED芯片的黄色补偿膜形成一发光二极管混光元件,因此可以更短的距离来达成混光的效果,进而改善现有利用发光二极管产生白光需加大导光板尺寸的问题。 Since the present invention is a cyan compensation film corresponding to red LED chip red LED chip, a green LED and a blue LED chip with the chip, corresponding to the green LED chip and a yellow purple compensation film compensation film corresponding to the blue LED chip formation of a mixed light emitting diode element, it is possible to achieve a shorter distance light mixing effect, thereby improving the light emitting diode using the conventional problem of white light need to increase the size of the light guide plate. 此外,本发明的背光模块又可同时放置至少一感应器于导光板的出光面表面来测量发光二极管混光元件所投射出的光谱,然后根据感应器所测量出的光谱参数来适时调整背光模块的电压或电流,以维持显示区域中色彩的均匀性。 Further, the backlight module of the present invention is placed in turn at least one sensor while the light guide plate exit surface of a surface to be measured mixed light emitting diode element projected out of the spectrum, and then adjust the backlight module according to the measured sensor spectral parameters voltage or current, to maintain the uniformity of color in the display region. 其次,由于本发明背光模块的混光元件可混合出六种颜色,故在整个模块所包括的色饱和度(NTSC)较以往三色LED含盖更广的区域,因此NTSC值会相对的提高。 Secondly, since the light mixing element according to the present invention, a backlight module of six colors can be mixed, so that the entire module comprising a color saturation (NTSC) than the conventional three-color LED covers a wider area, thus improving the relative value NTSC . 然后通过分别调控三LED的电流及电压值来改变每个区碱的色度值及进一步调整模块的色度分布状态。 Each base region is then changed by three separately regulated LED current value and the voltage value of the chromaticity and chromaticity distribution module further adjustments. 换言之,所含盖的NTSC值会因此旋转,由此挑逸出最适宜的颜色输出。 In other words, the covering so that the rotation of the NTSC values, thereby escaping pick optimum color output.

附图说明 BRIEF DESCRIPTION

图1为现有一芯片式发光二极管封装元件的剖面示意图; Figure 1 is a cross-sectional conventional chip type LED package component schematic;

图2为现有为改善混光效果的导光板与发光二极管封装元件的配置图; FIG 2 is a conventional light guide plate to improve the light mixing effect of the light emitting diode package component configuration diagram;

图3为本发明一背光模块的剖面示意图; 3 is a sectional view of the invention in a schematic view a backlight module;

图4为图3所示导光板与发光二极管混光元件的示意图; 4 is a schematic view of the light guide plate shown in FIG. 3 and the mixed light emitting diode element;

图5为本发明的导光板、发光二极管混光元件与感应器的示意图; The light guide plate of the present invention. FIG. 5, a schematic view of a light emitting diode light mixing element of the inductor;

图6为本发明利用回路方式调整背光模块色度分布的方块示意图; FIG adjustment block 6 chromaticity distribution of the backlight module using a circuit schematic embodiment of the present invention;

图7为本发明背光模块于C正坐标上调整色饱和度的示意图。 Figure 7 a schematic view of a backlight module to adjust the color saturation of the C n-coordinate of the present invention. 主要元件符号说明 The main element SIGNS LIST

10 发光二极管元件 12 封装基底 10 light emitting diode element 12 of the package substrate

14 发光二极管芯片 16 N型电极 14 LED chip 16 N-type electrode

18 P型电极 20 电极 18 P-type electrode 20 is an electrode

22 电极 24 导线 22 lead electrode 24

26 导线 28 封胶 26 lead plastic 28

30 发光二极管封装元件 32 导光板 32 light guide plate 30 light emitting diode package component

32a 导光板側面 34 显示区域 The light guide plate 34 side surface of the display region 32a

36 混光区域 50 发光二极管混光元件 Light mixing region 36 mixed light emitting diode element 50

64 背光模块 66 导光板 The light guide plate 64 of the backlight module 66

68 光学膜片 70 光学膜片 Optical film 70 Optical film 68

72 入光面 73 出光面 Surface 72 into the surface 73

74 红光LED芯片 76 绿光LED芯片 A red LED chip 74 LED chip 76 green

78 蓝光LED芯片 84 青色补偿膜 78 blue LED chip 84 cyan compensation film

86 紫色补偿膜 88 黄色补偿膜 86 88 Purple Yellow compensation film compensation film

90 感应器 92 混光区 Sensor 90 mixing zone 92

94 混光区 96 混光区 94 mixing zone 96 mixing zone

102 控制IC 104 电源 Power supply control IC 104 102

106 发光二极管 108 输出端 106 light emitting diode 108 output terminal

110 感应器 Sensor 110

具体实施方式 detailed description

请参照图3,图3为本发明一背光模块64的剖面示意图。 Referring to FIG 3, a cross-sectional view of the backlight module 64 of FIG. 3 of the present invention. 如图3所示, 本发明的背光模块64包括有一透明的导光板66、多个光学膜片68、 70,以及至少一发光二极管混光元件50,作为侧光源。 As shown in FIG. 3, the backlight module 64 of the present invention comprises a transparent light guide plate 66, a plurality of optical films 68, 70, and at least one light emitting diode light mixing element 50, a side light.

如图3所示。 As shown in Figure 3. 导光板66的一側面为一入光面72,用来接受側光源所产生的光线。 A side surface of the light guide plate 66 is a light incident surface 72 for receiving the light generated by the light source side. 此外,导光板66另包括有一出光面73,设于导光板66的上表面, 而入光面72与出光面73外的导光板66的其它表面上都分别设置有一反射层(图未示),使得从入光面72进入导光板66的光线仅能从出光面73离开导光板66,以提高光利用率。 Further, the light guide plate 66 further comprises a surface 73, provided on the upper surface of the light guide plate 66, the outer guide plate 73 of the pitch surface 72 and the surface 66 of the upper surface, are provided with a reflective layer (not shown) other , so that the light incident surface 72 into the light guide plate 66 can only leave the light guide plate 73 from the surface 66, in order to improve light utilization efficiency. 另一方面,光学膜片68、 70设置于导光板66 On the other hand, the optical film 68, the light guide plate 70 disposed 66

的出光面73上,用来提高光线的辉度和均匀性。 On the surface 73, to improve the brightness and uniformity of light. 一般而言,光学膜片68、 70可为扩散片或棱镜片,由于此技术为熟于此技者所现有,故不在此赘述。 In general, the optical film 68, 70 may be a prism sheet or a diffusion sheet, since this technique is done by the conventional technology herein, it is not repeat them here. 根据本发明的较佳实施例,背光模块64为一側光式背光模块,其側光源为发光二极管混光元件50。 According to an embodiment, the backlight module of the preferred embodiment of the present invention 64 is a side light type backlight module, the light source is a side emitting LED light mixing element 50. 然而,不局限于此側光模式,本发明的背光模块64也可为一直下式背光模块,且当背光模块64为一直下式背光模块时, 该背光模块的入光面(图未示)则设于导光板的底面。 However, not limited to this mode sidelight, backlight module 64 of the present invention may also be a direct type backlight module, and when the backlight module 64 has when the backlight module, the surface of the backlight module (not shown) it is provided on the bottom surface of the light guide plate. 其中,导光板66的形状可为一楔形板或平板。 Wherein the shape of the light guide plate 66 may be a flat plate or wedge plate.

请参照图4,其为图3所示导光板66与发光二极管混光无件50的示意图。 Referring to FIG. 4, which is shown in FIG. 3 the light guide plate 66 and the LED 50 light mixing member schematic no. 如图4所示,发光二极管混光元件50作为本发明的背光模块64的光源, 且设于导光板66入光面72附近。 , The light source 50 shown in FIG. 4 mixed light emitting diode device as a backlight module of the present invention in FIG. 64, and the light guide plate 66 provided in the vicinity of the surface 72. 其中,发光二极管混光元件50包括有至少一红光LED芯片74、至少一绿光LED芯片76以及至少一蓝光LED芯片78,其中,红光LED芯片74、绿光LED芯片76以及蓝光LED芯片78分别用来产生出红光、绿光以及蓝光。 Wherein the light emitting diode element 50 comprising mixing at least one red LED chip 74, at least one green LED chip 76 and at least one blue LED chip 78, wherein the red LED chip 74, green LED chip and a blue LED chip 76 78 are used to generate a red, green, and blue. 此外,各红光LED芯片74、绿光LED 芯片76以及蓝光LED芯片78分别通过导线(图未示)连接于背光模块66上的电极(图未示),并可藉由背光模块66与外界导线电连接。 In addition, each of 74 red LED chip, green LED chip and a blue LED chip 76, respectively, via a wire 78 (not shown) connected to the electrode (not shown) on a backlight module 66, and a backlight module 66 with the outside by wire electrical connection. 其次,发光二极管混光元件50另包括有至少一相对应红光LED芯片74的青色补偿膜84、 至少一相对应缘光LED芯片76的紫色补偿膜86以及至少一相对应蓝光LED 芯片78的黄色补偿膜88设置于导光板66的入光面72表面。 Then, the mixed light emitting diode element 50 further comprises at least one red LED chip corresponding cyan compensation film 74 is 84, corresponding to the at least one edge of the purple-light LED chip 76 and the compensation film 86 corresponding to at least one blue LED chip 78 yellow compensation film 72 surface 88 is provided on the light guide plate 66 into the surface. 根据本发明的较佳实施例,青色补偿膜84、紫色补偿膜86以及黄色补偿膜88可为全透式补偿膜或半透式补偿膜。 According to one embodiment, the compensation film 84 cyan, yellow and purple compensation film 86 may be a full compensation film 88 is permeable or semi-type compensator film as a compensation film according to the present preferred embodiment of the invention.

值得注意的是,本发明先利用至少一红光LED芯片、蓝光LED芯片76 以及绿光LED芯片并配合相对应的互补色系的补偿膜,进而利用补偿混光的方式来产生白光,并将混合的白光投射进导光板66的入光面72,因此能有效减短发光二极管的混光距离,以改善现有发光二极管芯片产生白光时需加大导光板66的问题。 Notably, the present invention is the first use of the chip 76 and the green LED and the complementary color system corresponding with a compensation film comprising at least a red LED chip, a blue LED chip, and further mixed using a compensated light to generate white light, and mixing white light projected into the light guide plate 66 into the surface 72, it is possible to effectively shorten the mixing of light from the light emitting diode, the light emitting diode chip to improve the conventional problem of the need to increase the light guide plate 66 when white light is generated.

根据本发明的较佳实施例,本发明的背光模块64又可设置至少一感应器卯,例如一光谱感应器(spectrumsensor)于导光板66表面,来配合先前所迷的发光二极管混光元件50调整背光模块64的输入电流与混光后的颜色、与辉度。 According to a preferred embodiment of the present invention, the backlight module 64 of the present invention but also at least one sensor disposed d, for example, a spectral sensor (spectrumsensor) to the surface of the light guide plate 66 to the light emitting diode with light mixing fans previously element 50 adjust the backlight module and the input current color of the mixed light 64, the luminance. 请参照图5,其为本发明的导光板66、发光二极管混光元件50与数个感应器90的示意图。 Referring to FIG. 5, the light guide plate 66 which of the present invention, a schematic diagram 50 with a plurality of sensors 90 mixed light emitting diode element. 如图5所示,由于红光LED芯片74、绿光LED芯片76以及蓝光LED芯片78与相对应的青色补偿膜84、紫色补偿膜86以及 5, since the red LED chip 74, a green LED chips and blue LED chips 76 and 78 corresponding to cyan compensation film 84, the compensation film 86 and the purple

黄色补偿膜88于混光后会形成不同的混光区92、 94、 96,因此本发明又可设置至少一感应器90于导光板66的出光面73表面,或是分别于各混光区92、 94、 96均设置一感应器卯,如图中所示,然后通过感应器90来侦测不同混光区92、 94、 96于背光模块64表面所形成的光谱(spectrum)。 Yellow compensation film 88 may be formed after the light mixing different mixing zones 92, 94, 96, thus the present invention is in turn provided with at least one sensor 90 to a surface of the light guide plate 73 of the surface 66, or respectively to each light mixing region 92, 94, 96 are provided with a sensor sockets, as shown, and then to detect a different light mixing zone 92, 94 through the inductor 90, spectroscopy (spectrum) 96 on the surface of the backlight module 64 is formed. 接着将所侦测的结果通过回授(feedback)的方式来个别调整各色发光二极管芯片的输入电流或电压值,以保持显示区城中色彩的均匀性,进而能调整混光后的颜色及辉度变化。 The detection result is then used to individually adjust the input current or voltage value of each color light emitting diode chip through feedback (Feedback) in a manner to maintain uniformity of color display area of ​​the city, and thus can adjust the color of the light mixing and luminance Variety.

一般而言,现有三色LED芯片所使用的波长分别为红光(5卯-700nm)、 绿光(500-560nm)以及蓝光(400-480nm)。 Generally, the wavelength of the conventional three-color LED chips are used for red light (5 d -700nm), green (500 to 560 nm) and blue (400-480nm). 然而,本发明所揭露的背光模块除了包括有现有三色LED芯片所具有之三种波长,亦因为各相对应补偿膜的设置,而同时更包括有相对应三色LED芯片的青色、紫色以及黄色等三种波长。 However, the present invention is disclosed backlight module comprises in addition to the conventional three-color LED of three wavelengths with the chip, but also because each of the corresponding compensation film disposed while corresponding further comprises a tri-color cyan LED chips, purple and yellow, three wavelengths. 因此,通过搭配红光LED芯片74、绿光LED芯片76以及蓝光LED 芯片78与相对应的互补色系的青色补偿膜84、紫色补偿膜86以及黄色补偿膜88 ,本发明的背光模块64可调配出比现有仅利用三色LED芯片的背光模 Accordingly, with the red LED chip 74 may be, green and blue LED chip 76 LED chip 78 corresponding to a complementary color of cyan compensation film 84, the compensation film 86, and the yellow purple compensation film 88, a backlight module 64 of the present invention deployment of the mold than the conventional backlight using only three-color LED chips

块更佳的色彩均勾性及更优的色彩饱和度,而且本发明也可以应用在双色或4色以上,例如红、缘、蓝与青色等多色系LED模块中,以调配出更广的色彩饱和度。 Better color blocks of both the hook and better color saturation, and the present invention can also be applied to two-color or four or more colors, such as red, edges, and other cyan blue color LED module to a wider deployment of color saturation.

综上所迷,相比较于现有技术,本发明是将红光LED芯片、蓝光LED 芯片及缘光LED芯片配合相对应红光LED芯片的青色补偿膜、相对应绿光LED芯片的紫色补偿膜以及相对应蓝光LED芯片的黄色补偿膜形成一发光二极管混光元件,以利用更短的混光距离来改善现有利用发光二极管产生白光需加大导光板尺寸的问题。 In summary the fans, as compared to the prior art, the present invention is a corresponding red LED chip, a blue LED chip and the edge-light LED chip with blue compensation film of the red LED chip, a green LED corresponding to a compensation chip violet and a compensation film yellow film corresponding to the blue LED chip emitting diode forming a light mixing element, to the use of a shorter mixing of light from the light emitting diode to improve the conventional problem by using white light need to increase the size of the light guide plate. 同时,本发明的各色LED芯片与相对应各LED 芯片的补偿膜的数量、颜色以及配置方式并不限于前述实施例所揭露者,并可依产品需求制作工艺而设计,以有效提高混光效果。 Meanwhile, the present invention is an LED chip of each color corresponding to each LED chip compensation film of the number and arrangement of colors is not limited by the disclosed embodiments, and according to the product design needs of the production process, in order to improve the light mixing effect . 此外,本发明的背光模块也可同时放置至少一感应器于导光板的出光面表面来测量发光二极管混光元件所投射出的光谱,然后根据感应器所测量出的光谱参数来适时调整背光模块的电压或电流,以维持显示区域中色彩的均匀性。 Further, the backlight module of the present invention may also be placed at the same time at least one sensor to a surface of the light guide plate exit surface of the light emitting diode to measure the mixed light projected by the spectral element, and then adjust the backlight module according to the measured sensor spectral parameters voltage or current, to maintain the uniformity of color in the display region.

进一步的探讨,由于本发明背光模块的发光二极管与对应的补偿膜可?昆合出六种颜色,故在整个模块所包括的NTSC较以往三色LED含盖更广的区城,也就是NTSC值会相对的提高。 Further discussion, since the LED backlight module of the present invention may be the corresponding compensation film? Queensland six colors out of engagement, it covers a wider area than a conventional city in the three-color LED module included throughout NTSC, NTSC i.e. value will be relatively improved. 然后如图6所示,通过控制IC102与电源104来分别调控发光二极管106的电流及电压值,进而改变每个区碱的色度值,并通过上迷的感应器110,利用回i^(feedback)的方式来调整模块的色度分布状态,最后由输出端108输出。 Then, as shown in FIG. 6, respectively, and voltage regulation of LED current 106 by controlling the value of the power IC102 and 104, thereby changing the color value of each region of the base, and through the inductor 110 on the fan, back to the use of i ^ ( Feedback) manner to adjust the chromaticity distribution module, the final output from an output terminal 108. 换言之,所舍盖的色饱和度(NTSC) 值会因此旋转,如囝7所示,由此就可轻易挑选出最适宜的输出颜色。 In other words, the rounded lid color saturation (NTSC) so that the rotation value, as shown in FIG. 7 Kids, thereby can easily select the most appropriate output color.

以上所迷仅为本发明的较佳实施例,凡依本发明权利要求所做的均等变化与修饰,皆应属本发明的涵盖范围。 The fan of the present invention, the above is only the preferred embodiments, all modifications and alterations made under this invention as claimed in claim, also belong to the scope of the present invention.

Claims (15)

  1. 1.一种背光模块,其包括:一导光板,具有一入光面与一出光面;至少一光谱感应器设置在该出光面上;至少一发光二极管混光元件,设于该入光面附近,用以作为该背光模块的光源,且该发光二极管混光元件包括有:至少一第一色光LED芯片与至少一相对应该第一色光LED芯片的第一色补偿膜,该第一色补偿膜设置于该导光板的入光面表面;以及至少一第二色光LED芯片与至少一相对应该第二色光LED芯片的第二色补偿膜,该第二色补偿膜设置于该导光板的入光面表面。 A backlight module comprising: a light guide plate having a light incident surface and a light exit surface; at least one sensor disposed on the spectral light emitting surface; at least one light emitting diode light mixing element, disposed on the light incident surface nearby, as the light source for the backlight module, and the mixed light emitting diode element comprising: at least a first color LED chip and at least a first color compensation film should opposing first color LED chips, the first Smooth surface of the color compensation film disposed on the light guide plate; and at least a second color LED chip and at least a second color compensation film should opposing second color LED chip, the second color compensation film disposed on the light guide plate the surface of the light incident surface.
  2. 2. 如权利要求1所述的背光模块,其中该光谱感应器用来测量该发光二极管混光元件所投射出的光i普。 2. The backlight module according to claim 1, wherein the sensor for measuring the spectrum of the mixed light emitting diode element P i projected light.
  3. 3. 如权利要求1所述的背^JI块,其中该背光模块另包括有至少一第三色光LED芯片以及相对应第三色光LED芯片的第三色^M尝膜,该第三色补偿膜设置于该导光板的入光面表面。 3. The backing of claim 1 to claim ^ JI block, wherein the backlight module further comprises at least a third color and the third color LED chips taste ^ M film corresponding to the third color LED chips, the third color compensation the surface film is disposed on the surface of the light guide plate.
  4. 4. 如权利要求1所迷的背光模块,其中该第一色光LED芯片包括红光LED芯片。 A fan backlight module as claimed in claim 4, wherein the first color light comprises a red LED chip LED chip.
  5. 5. 如权利要求4所述的背光模块,其中该第一色补偿膜包括音色##膜。 The backlight module according to claim 4, wherein the first color tone compensation film ## comprises a film.
  6. 6. 如权利要求1所迷的背it^块,其中该第二色光LED芯片包括绿光LED芯片。 ^ Back block a fan as claimed in claim, wherein the second color light comprises a green LED chip LED chip.
  7. 7. 如权利要求6所述的背ib漢块,其中该第二色##膜包括紫色##膜。 7. Han ib back block according to claim 6, wherein the second film ## comprises a color purple membrane ##.
  8. 8. 如权利要求3所述的背光模块,其中该第三色光LED芯片包括蓝光LED芯片。 The backlight module as claimed in claim 3, wherein the third color light LED chip comprises a blue LED chip.
  9. 9. 如权利要求8所述的背光模块,其中该第三色^hf尝膜包括黄色4M尝膜。 The backlight module according to claim 8, wherein the third color comprising a yellow film taste ^ hf film 4M taste.
  10. 10. 如权利要求3所述的背^JI块,其中该第一色#^尝膜、该第二色补偿膜以及该第三色补偿膜为全透式4h^膜或半透式4M尝膜。 10. The back according to claim 3 ^ JI block, wherein the first color # ^ taste film, the second and third color compensation film for color compensation film is a film Transmissive or transflective type 4H ^ 4M taste of formula membrane.
  11. 11. 如权利要求1所述的背M块,其中该背光模块另包括至少一光学元件,设于该背光模块的出光面上. 11. The back of the block M to claim 1, wherein the backlight module further comprises at least one optical element disposed in the light-emitting surface of the backlight module.
  12. 12. 如权利要求11所迷的背i!Mi块,其中该光学元件另包括有至少一扩散片、至少一菱镜片或上述的组合。 12. A fan 11 back i! Mi block claim, wherein the optical element further comprises at least one diffusion sheet, a prism or at least one combination thereof.
  13. 13. 如权利要求1所述的背it^块,其中该背光模块为一側光式背M 块,而该入光面设于该导光板的一側面。 13 it back according to claim 1 ^ block, wherein the backlight module is a back side of the light formula M blocks, and the light incident surface provided on a side surface of the light guide plate.
  14. 14. 如权利要求1所述的背M块,其中该导光板为一楔形板或平板。 14. The back-M block according to claim 1, wherein the guide plate is a flat plate or wedge plate.
  15. 15. 如权利要求1所述的背^l块,其中该背光模块为一直下式背光模块,而该入光面设于该导先板的底面且该出光面设于该导光板的顶面。 15. The top surface of the block back ^ l to claim 1, wherein the backlight module is a module type backlight, and the light incident surface disposed on the bottom surface of the first guide plate and the light emitting surface provided on the light guide plate .
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CN101458421B (en) 2007-12-13 2012-01-18 奇美电子股份有限公司 LCD, back light module unit and light guide board
CN102330924A (en) * 2011-09-20 2012-01-25 浙江迈勒斯照明有限公司 Backlight source of liquid crystal display with high color saturation
CN104100924B (en) 2013-11-26 2016-04-13 深圳市华星光电技术有限公司 The backlight using the backlight module and a backlight module system
CN104793397A (en) * 2015-03-16 2015-07-22 厦门天马微电子有限公司 LCD module and the liquid crystal display device

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