CN201956394U - LED (Light-Emitting Diode) lighting module - Google Patents
LED (Light-Emitting Diode) lighting module Download PDFInfo
- Publication number
- CN201956394U CN201956394U CN2011200243946U CN201120024394U CN201956394U CN 201956394 U CN201956394 U CN 201956394U CN 2011200243946 U CN2011200243946 U CN 2011200243946U CN 201120024394 U CN201120024394 U CN 201120024394U CN 201956394 U CN201956394 U CN 201956394U
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- Prior art keywords
- led
- lighting module
- layer
- substrate
- silica gel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The utility model relates to an LED (Light-Emitting Diode) lighting module, which comprises a substrate that is coated with a silver layer on the surface, wherein a lead and an LED wafer are laid on the substrate. The LED lighting module is characterized in that a layer of silicon resin is arranged on the surface of the LED wafer; and a layer of silica gel is arranged on the external surface of the silicon resin layer. Compared with the prior art, the LED lighting module has the advantages that the silicon resin layer is spotted on the surface of the LED wafer at first, and then the silica gel layer is spotted, therefore, the silicon resin can protect a silver coating and a gold thread, and two times of glue dispensing can improve the light extraction efficiency.
Description
Technical field
The utility model relates to a kind of LED lighting module.
Background technology
LED (Light Emitting Diode, be called for short LED, Chinese light-emitting diode by name) lamp be called as the 4th generation lighting source or green light source, have characteristics such as energy-saving and environmental protection, volume are little, reliability height, be widely used in fields such as various indications, demonstration, decoration, backlight, general lighting and urban landscape.Along with improving constantly of the integral level of LED wafer, the whole light efficiency of LED illuminating lamp lamp constantly promotes, and makes that the application of its lighting field is constantly enlarged.
Middle and high end LED illumination market more and more adopts the COB plane light source module technology of integrated circuit technique, and main representative products has two kinds of aluminium base and ceramic substrates.In order to improve light extraction efficiency, general this substrate all can adopt silver-plated substrate, generally all encapsulates with silica gel in order to guarantee heat radiation and reliability thereof.
But silica gel has the high ventilation performance, and as containing sulfide in the fruit product environment for use, and silver coating runs into airborne moisture content or sulfide will oxidizedly cause the blackout jaundice, and the luminous flux of product is sharply descended.And the silica gel hardness ratio is low generally all below Shao Shi A70, and the gold thread that is subjected to can to make after the external force extruding connection of product breaks and makes product failure.
The utility model content
Technical problem to be solved in the utility model is to provide the LED lighting module that silver-plating layer can not turn black and turn to be yellow on a kind of substrate at above-mentioned prior art.
The utility model solves the problems of the technologies described above the technical scheme that is adopted: this LED lighting module, comprise the substrate that the surface is silver coated, leaded and the LED wafer in substrate upper berth, it is characterized in that: described LED wafer surface is provided with one deck silicones, and the outer surface of this silicone layer is provided with one deck silica gel.
As improvement, be equipped with fluorescent material in the described layer of silica gel.
The peripheral substrate of described silicone layer, layer of silica gel is provided with the frame box dam.
Compared with prior art, advantage of the present utility model is: by at the first some silicone layer of LED wafer surface, and then secondary point layer of silica gel, silicones can be protected silver coating and gold thread, and secondary point glue can improve light extraction efficiency.
Description of drawings
Fig. 1 is the structural representation of LED lighting module among the utility model embodiment.
Embodiment
Embodiment describes in further detail the utility model below in conjunction with accompanying drawing.
LED lighting module as shown in Figure 1, it comprises the substrate 1 that the surface is silver coated, solid crystalline substance leaded 2 and LED wafer 3 on the substrate 1, intrinsic one deck silicones 4 is put by dispensing technology in LED wafer 3 surfaces, the outer surface of silicone layer is put the silica gel 5 of being furnished with fluorescent material in intrinsic one deck by dispensing technology, and the peripheral substrate of described silicone layer 4, layer of silica gel 5 is provided with frame box dam 6.
Silicones has elasticity, has good cementability with various base materials and white oil, has than the high a lot of heat-resisting and anti-UV performance of epoxy when having good anticol fragility, high rigidity, main its has the low-permeable energy.Low-permeable is embodied in: the heating condition that silver-plated substrate test film is coated behind the silicones in accordance with regulations is heating and curing, again silver-plated substrate experiment slice is put into confined space 72 hours, the silver-plated experiment slice yellowing phenomenon that do not turn black with 80 ℃ in sulphur powder.The hardness of silicones can reach Shao Shi D70 because its low-permeable can solve the product attenuation problem, and its high rigidity can reduce the risk of product failure.The refractive index of silicones is more than 1.5, and the refractive index of silica gel is generally 1.4.Secondary point glue makes luminous energy can improve the light extraction efficiency of product to the glue of low-refraction from the glue of high index of refraction.
Claims (3)
1. a LED lighting module comprises the substrate that the surface is silver coated, and the leaded and LED wafer in substrate upper berth is characterized in that: described LED wafer surface is provided with one deck silicones, and the outer surface of this silicone layer is provided with one deck silica gel.
2. LED lighting module according to claim 1 is characterized in that: be equipped with fluorescent material in the described glue-line.
3. LED lighting module according to claim 1 and 2 is characterized in that: the peripheral substrate of described silicone layer, layer of silica gel is provided with the frame box dam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200243946U CN201956394U (en) | 2011-01-19 | 2011-01-19 | LED (Light-Emitting Diode) lighting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200243946U CN201956394U (en) | 2011-01-19 | 2011-01-19 | LED (Light-Emitting Diode) lighting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201956394U true CN201956394U (en) | 2011-08-31 |
Family
ID=44500496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200243946U Expired - Lifetime CN201956394U (en) | 2011-01-19 | 2011-01-19 | LED (Light-Emitting Diode) lighting module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201956394U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709280A (en) * | 2012-05-29 | 2012-10-03 | 宁波升谱光电半导体有限公司 | Chip on board (COB) integrated light source module |
| CN103413885A (en) * | 2013-07-31 | 2013-11-27 | 广州硅能照明有限公司 | Manufacturing method of isolation type COB light source module |
-
2011
- 2011-01-19 CN CN2011200243946U patent/CN201956394U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709280A (en) * | 2012-05-29 | 2012-10-03 | 宁波升谱光电半导体有限公司 | Chip on board (COB) integrated light source module |
| CN103413885A (en) * | 2013-07-31 | 2013-11-27 | 广州硅能照明有限公司 | Manufacturing method of isolation type COB light source module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 315040, Xinhui Road, national hi tech Zone, Zhejiang, Ningbo, 150 Patentee after: NINGBO SUNPU OPTO CO., LTD. Address before: 315040, Xinhui Road, national hi tech Zone, Zhejiang, Ningbo, 150 Patentee before: Ningbo Sunpu-opto Semiconductor Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110831 |