CN103013282B - Light-failure-resistant LED (Light-emitting Diode) die-bonding insulation paste - Google Patents
Light-failure-resistant LED (Light-emitting Diode) die-bonding insulation paste Download PDFInfo
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- CN103013282B CN103013282B CN201210544105.4A CN201210544105A CN103013282B CN 103013282 B CN103013282 B CN 103013282B CN 201210544105 A CN201210544105 A CN 201210544105A CN 103013282 B CN103013282 B CN 103013282B
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Abstract
The invention provides light-failure-resistant LED (Light-emitting Diode) die-bonding insulation paste which comprises the following components in weight proportion: 55.5-65.5% of cycloaliphatic epoxy resin, 4.5-7.8% of bisphenol S epoxy resin, 11.2-28.2% of phenyl silicon resin, 3.2-4.5% of toughening agent, 3.5-5.5% of organic thixotropic agent, 2.4-3.7% of liquid thermal stabilizer, 2.4-3.7% of liquid light stabilizer, 0.2-5% of cation curing agent, and 0.1-2% of coupling agent. According to the components and proportion, the obtained light-failure-resistant LED die-bonding insulation paste has the characteristics of high light failure resistance, long service life, good UV (ultraviolet) resistance, no yellowing, excellent bonding performance and insulating performance, and the like.
Description
Technical field
The present invention relates to a kind of LED chip surface coating material field, refer to a kind of anti-light LED die bond insulation paste that declines especially.
Background technology
As the pioneer of global illuminations, incandescent light is replaced and the life of people of progressively fading out by illuminations photodiode (LED) of new generation gradually.In the past few years, the color category of LED, brightness and power all there occurs very big change.As new and effective solid light source, LED has the remarkable advantages such as volume is little, energy-saving and environmental protection, therefore the aspects such as pilot lamp, display screen and backlight are widely used in, play the unrivaled effect of conventional light source, but up to the present, they also fail to play one's part to the full in family and public illumination field.
The anti-light material that declines relies on the performance of its excellence to come into huge numbers of families for LED illumination instrument to lay the foundation.LED is a kind of light-emitting semiconducting material, is the light-emitting display device that directly converting electric energy can be become luminous energy.The heart of LED is a semiconductor wafer, and energising can be luminous.LED owing to having easy control, low dc voltage drives, power consumption less, stability is high, the time of response is short, the advantage such as multicolor luminous, therefore the fields such as on-screen display system, pilot lamp, mobile phone or digital product backlight are widely used in, Landscape Lighting, indoor decoration lamp, automobile lamp, the application in mine lamp etc. have also been obtained positive development, but LED is also immature in the use of power lighting field.
LED realizes white light various ways, and exploitation comparatively early and the mode having realized industrialization is exactly coating fluorescent powder and realize white light on LED chip.
The thermal source of LED is the key coat from chip, and when continuing to light, key coat temperature (Junction Temperature, TJ) reaches as high as more than 180 DEG C.How being derived by this high temperature, this scientist being LED is correlated with in recent years endeavours the direction studied.At this high temperature heat source and before derivation not yet in effect, the glue material directly contacted with LED chip: as the quality of die bond insulation paste and fluorescent glue, determine attenuation degree and the life-span of LED; The not good colloid of quality will hold can't stand high temperature, and produce the phenomenon of colloid xanthochromia (yellowing) and carbonization, this phenomenon is the principal element causing LED to decay.Along with the development of LED, the light decay encapsulating direct insertion white light LEDs more and more receives the concern of industry and society, therefore in encapsulation glue, fluorescent glue and crystal-bonding adhesive, these are all the concern work-ing life of LED product and the main raw of reliability, for meeting the need of market and industry needs, improve LED work-ing life and LED luminous intensity and an overall property processed, develop a kind of high resistance optical attenuation, the high life, good uv-resistant (ultraviolet) characteristic, very necessary without the LED die bond insulation paste of xanthochromia, superior adhesiveproperties, excellent insulation performance etc.
Summary of the invention
The present invention proposes a kind of anti-light LED die bond insulation paste that declines, and has high resistance optical attenuation, high life, good uv-resistant (ultraviolet) characteristic, can be good at meeting the demand of LED illumination without features such as xanthochromia, superior adhesiveproperties, excellent insulation performance.
Technical scheme of the present invention is achieved in that a kind of anti-light LED die bond insulation paste that declines, and comprises the component of following weight proportion:
Preferably, the anti-light LED of declining die bond insulation paste comprises the component of following weight proportion:
Preferably, described liquid photostabilizer is liquid ultraviolet absorber, can absorb ultraviolet, reduces ultraviolet to the infringement of colloid.
Preferably, described phenyl polysiloxane is 233 silicone resin, can improve thermostability and the weather resisteant of finished product.
Preferably, described toughner is QS63 toughner, for improving the shock resistance of finished product, and reduces the fragility of finished product, thus extends the work-ing life of the described anti-light LED die bond insulation paste that declines.
Preferably, described organic thixotropic agents is hydrogenated castor oil, for increasing finished product denseness and there is thixotropy.
Preferably, described cation curing agent is Irgacure261, for improving the intensity of finished product, increases the service life.
Preferably, described coupling agent is KH-560, i.e. γ-glycidyl ether oxygen propyl trimethoxy silicane, is a kind of coupling agent containing epoxy group(ing), can the adhesive of strengthening ring epoxy resins, improves the bonding force between resin and matrix, thus difficult drop-off.
Described cycloaliphatic epoxy resin is as the base resin of the described anti-light LED die bond insulation paste that declines, uv-resistant (ultraviolet) property is good, respectively as modified resin and properties-correcting agent, modification is carried out to it by heat-resisting described bisphenol-s epoxy resin and described phenyl polysiloxane, and the polymkeric substance generation thermal ageing reaction when described liquid heat stabilizer prevents at high temperature, and described liquid photostabilizer (described UV light absorber) prevent polymer substance generation photoaging from reacting collaborative under, the described anti-light LED of declining die bond insulation paste is made to have the high-adhesive-strength of epoxy resin and the resistance to Decay Rate of silica gel, under hot and humid, the anti-yellowing variable coefficient of glue material is high, thermal ageing, photoaging effect is little, thus greatly extend the work-ing life of the described anti-light LED die bond insulation paste that declines.
Further, because have employed described bisphenol-s epoxy resin in formula, melted to be dissolved in matrix resin and described cycloaliphatic epoxy resin and can be adjusted colloid viscosity, effectively can resist fluorescent material precipitation, thus solve the problem of to add optical attenuation that anti-heavy powder brings as the inorganic powder such as diffusant, whitening powder and colour consistency in colloid.
Above-mentioned each component all adopts the title known to industry technician, and all commercially can buy and obtain, described cycloaliphatic epoxy resin, described bisphenol-s epoxy resin, described liquid heat stabilizer, described liquid ultraviolet absorber etc. are a class material, this class material all can as the component in the present invention, its difference is only some differences in effect, can find out in the embodiment of the difference brought below.
In sum, the described anti-light LED of the declining die bond insulation paste that the present invention proposes has following beneficial effect:
1, high life characteristic: this point we choose and arrange in pairs or groups can draw to the analysis of above-mentioned each component.
2, high resistance to UV characteristic: owing to have employed uv-resistant resin and described cycloaliphatic epoxy resin and described liquid photostabilizer, make the described anti-light LED of declining die bond insulation paste have high resistance to UV characteristic.
3, high temperature tolerance: have employed temperature-resistant material and add described liquid heat stabilizer, make the resistance to elevated temperatures of the described anti-light LED die bond insulation paste that declines more outstanding, it can work for a long time under 200 DEG C of-500 DEG C of high temperature, colloid non yellowing and carbonization.
4, high adhesion: splendid with the LED base material adherence such as silver-plated support, in addition, the described anti-light LED of declining die bond insulation paste proposed by the invention also has high resistance optical attenuation, anti-fluorescent material precipitation, the advantage such as easy to use.
Embodiment
For understanding the present invention better; below by following examples, elaboration concrete is further done to the present invention; but unintelligible is limitation of the invention; for some nonessential improvement and adjustment that those skilled in the art does according to foregoing invention content, be also considered as dropping in protection scope of the present invention.
Embodiment 1
Embodiment 2
Embodiment 3
The specific product model of each component is in embodiment 1,2,3 bracket, and each component model all adopts the title known to industry technician, and all commercially can buy and obtain, the product be made up of said components, we carry out the test of performance again, obtain following data:
Table 1 shows the product performance of embodiment 1:
Table 1
Table 2 shows the product performance of embodiment 2:
Table 2
Table 3 shows the product performance of embodiment 3:
Table 3
Further, the finished product of embodiment 2 is used for white light pearl by us, and after 30MA/3000H is aging, its brightness on average about rises 0.4%, without electrically bad abnormal.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. the anti-light LED die bond insulation paste that declines, is characterized in that: the component comprising following weight proportion:
Described cation curing agent is Irgacure261.
2. the anti-light LED die bond insulation paste that declines as described in claim 1, is characterized in that: the component comprising following weight proportion:
Described cation curing agent is Irgacure261.
3. the anti-light LED die bond insulation paste that declines as described in claim 2, is characterized in that: described liquid photostabilizer is liquid ultraviolet absorber.
4. the anti-light LED die bond insulation paste that declines as described in claim 1, is characterized in that: described phenyl polysiloxane is 233 silicone resin.
5. the anti-light LED die bond insulation paste that declines as described in claim 1, is characterized in that: described organic thixotropic agents is hydrogenated castor oil.
6. the anti-light LED die bond insulation paste that declines as described in claim 1, is characterized in that: described coupling agent is KH-560.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210544105.4A CN103013282B (en) | 2012-12-14 | 2012-12-14 | Light-failure-resistant LED (Light-emitting Diode) die-bonding insulation paste |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210544105.4A CN103013282B (en) | 2012-12-14 | 2012-12-14 | Light-failure-resistant LED (Light-emitting Diode) die-bonding insulation paste |
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| Publication Number | Publication Date |
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| CN103013282A CN103013282A (en) | 2013-04-03 |
| CN103013282B true CN103013282B (en) | 2015-02-25 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103351785A (en) * | 2013-05-30 | 2013-10-16 | 蚌埠市时代电子有限公司 | High temperature resistant heat dissipating coating and preparation method thereof |
| CN104282671B (en) * | 2013-07-01 | 2018-08-21 | 晶元光电股份有限公司 | Light-emitting diode component and production method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1827684A (en) * | 2005-03-01 | 2006-09-06 | 日东电工株式会社 | Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same |
| CN101525467A (en) * | 2009-04-03 | 2009-09-09 | 复旦大学 | Epoxy/organosilicon hybrid material, and preparation method and application thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1827684A (en) * | 2005-03-01 | 2006-09-06 | 日东电工株式会社 | Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same |
| CN101525467A (en) * | 2009-04-03 | 2009-09-09 | 复旦大学 | Epoxy/organosilicon hybrid material, and preparation method and application thereof |
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