CN201956351U - 全彩led封装结构 - Google Patents

全彩led封装结构 Download PDF

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Publication number
CN201956351U
CN201956351U CN2011200788740U CN201120078874U CN201956351U CN 201956351 U CN201956351 U CN 201956351U CN 2011200788740 U CN2011200788740 U CN 2011200788740U CN 201120078874 U CN201120078874 U CN 201120078874U CN 201956351 U CN201956351 U CN 201956351U
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China
Prior art keywords
chip
light chip
red light
electric connecting
utility
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Expired - Fee Related
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CN2011200788740U
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English (en)
Inventor
张坤
黎新彩
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GUMAI OPTICAL AND ELECTRONIC TECHNOLOGY CO., LTD.
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Dongguan Yitang Shine Sun Optical Technology Co Ltd
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Abstract

本实用新型涉及一种全彩LED封装结构，包括PCB板、红光芯片、绿光芯片、蓝光芯片、电连接片，所述红光芯片、绿光芯片、蓝光芯片与PCB板之间均连接有电连接片，所述红光芯片、绿光芯片、蓝光芯片均为倒装芯片并封装于PCB板上。本实用新型的红光芯片、绿光芯片、蓝光芯片均采用倒装芯片，不会增加接触电阻，从而芯片不会增加发热量，还可以提升芯片35%左右的出光效率。

Description

全彩LED封装结构
技术领域
本实用新型涉及LED封装技术，尤其涉及一种全彩LED封装结构。
背景技术
传统正装芯片需经打线设备将P、N焊垫与功能区连接，此工艺不利于电流的扩散，会增加接触电阻，一般打线后的芯片VF值会上升0.1V左右，且不利于散热。
实用新型内容
本实用新型针对现有技术的上述缺陷，提供一种全彩LED封装结构，以消除上述接触电阻，降低发热量。
为了解决上述技术问题，本实用新型是通过以下技术方案实现的：
一种全彩LED封装结构，包括PCB板、红光芯片、绿光芯片、蓝光芯片、电连接片，所述红光芯片、绿光芯片、蓝光芯片与PCB板之间均连接有电连接片，所述红光芯片、绿光芯片、蓝光芯片均为倒装芯片并封装于PCB板上。
优选地，所述电连接片为导电胶或金属片。
从以上技术方案可以看出，本实用新型的红光芯片、绿光芯片、蓝光芯片均采用倒装芯片，不会增加接触电阻，从而芯片不会增加发热量，还可以大大提升芯片的出光效率，一般会提升35%左右的亮度。
附图说明
附图1为本实用新型结构示意图。
具体实施方式
下面结合具体实施方式对本实用新型作进一步详细的说明。
参见附图所示，全彩LED封装结构，包括PCB板1、红光芯片2、绿光芯片3、蓝光芯片4、电连接片，所述红光芯片2、绿光芯片3、蓝光芯片4与PCB板1之间均连接有电连接片，所述红光芯片、绿光芯片、蓝光芯片均为倒装芯片并封装于PCB板上。
作为本实用新型的优选实施方式，所述电连接片为导电胶或金属片。
上述之具体实施例是用来详细说明本实用新型之目的、特征及功效，对于熟悉此类技艺之人士而言，根据上述说明，可能对该具体实施例作部分变更及修改，其本质未脱离出本实用新型之精神范畴者，皆应包含在本案的申请专利范围中，宜先陈明。

Claims (2)

1.一种全彩LED封装结构，其特征在于，包括PCB板、红光芯片、绿光芯片、蓝光芯片、电连接片，所述红光芯片、绿光芯片、蓝光芯片与PCB板之间均连接有电连接片，所述红光芯片、绿光芯片、蓝光芯片均为倒装芯片并封装于PCB板上。
2.根据权利要求1所述的全彩LED封装结构，其特征在于，所述电连接片为导电胶或金属片。
CN2011200788740U 2011-03-23 2011-03-23 全彩led封装结构 Expired - Fee Related CN201956351U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200788740U CN201956351U (zh) 2011-03-23 2011-03-23 全彩led封装结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011200788740U CN201956351U (zh) 2011-03-23 2011-03-23 全彩led封装结构

Publications (1)

Publication Number Publication Date
CN201956351U true CN201956351U (zh) 2011-08-31

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105303983A (zh) * 2015-10-03 2016-02-03 上海铁歌科技有限公司 一种使用单层pcb板实现的小间距的led全彩显示屏
CN105552070A (zh) * 2015-12-10 2016-05-04 江苏稳润光电有限公司 一种全彩贴片指示led

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105303983A (zh) * 2015-10-03 2016-02-03 上海铁歌科技有限公司 一种使用单层pcb板实现的小间距的led全彩显示屏
CN105552070A (zh) * 2015-12-10 2016-05-04 江苏稳润光电有限公司 一种全彩贴片指示led

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Owner name: DONGGUAN GUMAI OPTOELECTRONIC TECHNOLOGY LTD.

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Address after: 523000 Dongguan City, Shek Pai Town Po Po Industrial Zone

Patentee after: Dongguan Gumai Photoelectric Technology Co., Ltd.

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Patentee before: Dongguan Yitang Shine Sun Optical Technology Co., Ltd.

C56 Change in the name or address of the patentee

Owner name: DONGGUAN GMA OPTOELECTRONIC TECHNOLOGY LIMITED

Free format text: FORMER NAME: DONGGUAN GUMAI PHOTOELECTRICITY TECHNOLOCY CO., LTD.

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Address after: 523338 Guangdong Cereal & Light Technology Co., Ltd. of Dongguan City, Guangdong

Patentee after: Dongguan GMA Optoelectronic Technology Limited

Address before: 523000 Dongguan City, Shek Pai Town Po Po Industrial Zone

Patentee before: Dongguan Gumai Photoelectric Technology Co., Ltd.

C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Address after: 523000 Dongguan City, Shek Pai Town Po Po Industrial Zone

Patentee after: Guangdong GMA Optoelectronic Technology Limited

Address before: 523338 Guangdong Cereal & Light Technology Co., Ltd. of Dongguan City, Guangdong

Patentee before: Dongguan GMA Optoelectronic Technology Limited

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Address after: 464000 No. 1 Fuqiang Road, Jinniu Industrial Agglomeration Area, Shuhe District, Xinyang City, Henan Province

Patentee after: GUMAI OPTICAL AND ELECTRONIC TECHNOLOGY CO., LTD.

Address before: 523000 Puxin Industrial Zone, Shipai Town, Dongguan City, Guangdong Province

Patentee before: Guangdong GMA Optoelectronic Technology Limited

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110831

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