CN107731990A - 全彩cob显示屏灯珠封装焊盘结构 - Google Patents

全彩cob显示屏灯珠封装焊盘结构 Download PDF

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CN107731990A
CN107731990A CN201711195692.XA CN201711195692A CN107731990A CN 107731990 A CN107731990 A CN 107731990A CN 201711195692 A CN201711195692 A CN 201711195692A CN 107731990 A CN107731990 A CN 107731990A
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pad
bond pad
die bond
blue light
anode
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王传汉
郭同亮
申聪敏
王凯
冯智
程天毓
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Shanxi Huaye Electronic Tech Group Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Led Device Packages (AREA)

Abstract

本发明公开了全彩COB显示屏灯珠封装焊盘结构，涉及一种LED灯珠结构，包括绿光固晶焊盘，公共极焊盘，红光焊线焊盘，蓝光固晶焊盘，红、蓝、绿光晶片，红光晶片焊接在公共极焊盘上，绿光固晶焊盘位于公共极焊盘和红光阳极焊盘上方右侧，蓝光固晶焊盘位于公共极焊盘和红光阳极焊盘下方右侧，公共极焊盘和红光阳极焊盘相平行；本发明固晶与非固晶焊盘合二为一，大大减少了焊盘所占用的空间，为实现极小间距显示屏提供了可能，降低了电路板的设计难度，使得电路板加工工艺更加简单，大大降低了显示屏热量的耗散，为实现节能提供了一种新的解决方法。

Description

全彩COB显示屏灯珠封装焊盘结构
技术领域
本发明涉及一种LED灯珠结构，尤其涉及全彩小间距COB显示屏灯珠封装焊盘结构。
背景技术
LED显示屏封装技术有两种：SMT及COB，传统LED显示屏采用SMT形式，当显示间距减小像素密度增加时，单颗LED是其小间距化的一个限制因素，其电路设计难度增大、品质管控难度增加、材料成本偏高以及散热问题较严重。而传统的COB小间距显示屏，其固晶焊盘有三个，非固晶焊盘有三个，以及部分导线且所占用空间较大，这种情况将会导致极小间距显示屏电路板制作难度、成本增加，焊盘结构工艺难以实现。封装的焊盘结构是决定封装品质的一大因素，目前市场上对COB面板灯珠的封装的要求也更高。
发明内容
鉴于现有技术中的焊盘结构所占用的空间大，导致电路板设计难度和复杂度的提高的问题，有必要提供一种全彩小间距COB显示屏灯珠封装焊盘结构。本发明克服现有技术的不足，基于COB技术为主体，焊盘封装结构大大减少了焊盘所占用的空间，降低了电路板的设计难度以及工艺实现复杂度，公共极的改变也降低了热功率的问题。
为实现上述目的，本发明所采用的技术方案为：
全彩COB显示屏灯珠封装焊盘结构，包括绿光固晶焊盘，公共极焊盘，红光阳极焊盘，蓝光固晶焊盘，红光晶片，蓝光晶片，绿光晶片，绿光晶片焊接在绿光固晶焊盘上，蓝光晶片焊接在蓝光固晶焊盘上，绿光固晶焊盘位于公共极焊盘和红光阳极焊盘上方右侧，蓝光固晶焊盘位于公共极焊盘和红光阳极焊盘下方右侧，公共极焊盘和红光阳极焊盘相平行，所述绿光晶片的阴极通过导线连接在公共极焊盘上，所述绿光晶片的阳极通过导线连接在绿光固晶焊盘上，所述蓝光晶片的阴极通过导线连接在公共极焊盘上，所述蓝光晶片的阳极通过导线连接在蓝光固晶焊盘上。
优选的红光晶片，蓝光晶片，绿光晶片位于同一直线上，红光晶片位于蓝光晶片与绿光晶片的中部。
与现有技术相比本发明具有以下有益效果：本发明的固晶焊盘与非固晶焊盘合二为一，导线通过过孔连接在电路板其它层，大大减少了焊盘所占用的空间，为实现极小间距显示屏提供了可能，降低了电路板的设计难度，使得电路板加工工艺更加简单。采用共阴极方案，红光与蓝绿光分开供电的方法，大大降低了显示屏热量的耗散，为实现节能提供了一种新的解决方法。
附图说明
下面结合附图对本发明做进一步详细的说明。
图1为本发明全彩COB显示屏灯珠封装焊盘结构示意图。
图2为本发明正极性时全彩COB显示屏灯珠封装固晶焊线示意图。
图3为本发明反极性时全彩COB显示屏灯珠封装固晶焊线示意图。
图中，1为固晶焊盘，2为公共极焊盘，3为红光阳极焊盘，4为蓝光固晶焊盘，5为红光晶片，6为蓝光晶片，7为绿光晶片。
具体实施方式
下面结合附图及实施例详细说明本发明的技术方案，但保护范围不被此限制。
实施例一
如图1、图2所示，一种全彩COB显示屏灯珠封装焊盘结构，包括绿光固晶焊盘1，公共极焊盘2，红光阳极焊盘3，蓝光固晶焊盘4，红光晶片5，蓝光晶片6，绿光晶片7，其中，红光晶片5焊接在公共极焊盘2上，绿光晶片7焊接在绿光固晶焊盘1上，蓝光晶片6焊接在蓝光固晶焊盘4上，绿光固晶焊盘1位于公共极焊盘2和红光阳极焊盘3上方右侧，蓝光固晶焊盘4位于公共极焊盘2和红光阳极焊盘3下方右侧，公共极焊盘2和红光阳极焊盘3相平行，红光晶片5，蓝光晶片6，绿光晶片7位于同一直线上，红光晶片5位于蓝光晶片6与绿光晶片7的中部。
其中，红光晶片5的阴极通过导电胶连接在公共极焊盘2上，红光晶片5的阳极通过导线连接在红光阳极焊盘3上，绿光晶片7的阴极通过导线连接在公共极焊盘2上，绿光晶片7的阳极通过导线连接在绿光固晶焊盘1上，蓝光晶片6的阴极通过导线连接在公共极焊盘2上，蓝光晶片6的阳极通过导线连接在蓝光固晶焊盘4上。
如图3所示，反极性时，红光晶片5通过银胶焊接在红光阳极焊盘3上，红光晶片5的阳极通过导线连接在公共极焊盘2上；绿光晶片7的阳极通过导线连接在公共极焊盘2上，绿光晶片7的阴极通过导线连接在绿光固晶焊盘1上，蓝光晶片6的阳极通过导线连接在公共极焊盘2上，蓝光晶片6的阴极通过导线连接在蓝光固晶焊盘4上。
以上内容是结合具体的优选实施方式对本发明所做的进一步详细说明，不能认定本发明的具体实施方式仅限于此，对于本发明所属技术领域的普通技术人员来说，在不脱离本发明的前提下，还可以做出若干简单的推演或替换，都应当视为属于本发明由所提交的权利要求书确定专利保护范围。

Claims (2)

1.全彩COB显示屏灯珠封装焊盘结构，其特征在于，包括绿光固晶焊盘（1），公共极焊盘（2），红光阳极焊盘（3），蓝光固晶焊盘（4），红光晶片（5），蓝光晶片（6），绿光晶片（7），所述的绿光晶片（7）焊接在绿光固晶焊盘（1）上，所述的蓝光晶片（6）焊接在蓝光固晶焊盘（4）上，所述的绿光固晶焊盘（1）位于公共极焊盘（2）和红光阳极焊盘（3）的上方右侧，所述的蓝光固晶焊盘（4）位于公共极焊盘（2）和红光阳极焊盘（3）下方右侧，所述的公共极焊盘（2）和红光阳极焊盘（3）相平行，所述绿光晶片（7）的阴极通过导线连接在公共极焊盘（2）上，所述绿光晶片（7）的阳极通过导线连接在绿光固晶焊盘（1）上，所述蓝光晶片（6）的阴极通过导线连接在公共极焊盘（2）上，所述蓝光晶片（6）的阳极通过导线连接在蓝光固晶焊盘（4）上。
2.根据权利要求1所述的全彩COB显示屏灯珠封装焊盘结构，其特征在于，所述的红光晶片（5），蓝光晶片（6），绿光晶片（7）位于同一直线上，红光晶片（5）位于蓝光晶片（6）与绿光晶片（7）的中部。
CN201711195692.XA 2017-11-24 2017-11-24 全彩cob显示屏灯珠封装焊盘结构 Pending CN107731990A (zh)

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CN114141912A (zh) * 2021-11-24 2022-03-04 东莞市中麒光电技术有限公司 Led显示模组及制作方法
CN114141912B (zh) * 2021-11-24 2023-05-23 东莞市中麒光电技术有限公司 Led显示模组及制作方法

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