CN201956341U - 中间引脚的引线框架结构 - Google Patents

中间引脚的引线框架结构 Download PDF

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Publication number
CN201956341U
CN201956341U CN 201120002305 CN201120002305U CN201956341U CN 201956341 U CN201956341 U CN 201956341U CN 201120002305 CN201120002305 CN 201120002305 CN 201120002305 U CN201120002305 U CN 201120002305U CN 201956341 U CN201956341 U CN 201956341U
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framework
pin
bonding zone
middle pin
lead
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Expired - Fee Related
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CN 201120002305
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Inventor
蔡新福
田茂康
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WUXI RED MICROELECTRONICS CO Ltd
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WUXI RED MICROELECTRONICS CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Abstract

中间引脚的引线框架结构，在中间引脚上部增加键合区域结构，将键合在框架底板上的内引线键合在中间引脚上，用管脚键合区替代了框架底板键合区。本实用新型的有益效果是，1.增加中间管脚键合区域结构可以提升产品质量和可靠性；2.增加中间管脚键合区域结构可以增强塑封体与框架的结合力；3.增加中间管脚键合区域结构可以提升该框架封装大芯片IC的能力从而达到降低成本提升效益的目的。

Description

中间引脚的引线框架结构
技术领域
本实用新型涉及半导体分立器件封装设备，特别是中间引脚的引线框架结构。
背景技术
标准的引线框架中间引脚只是起到电性连接作用，对于某种芯片需要在中间引脚上键合引线，只能键合在与中间引脚相连接的框架底板上(图1)。
实用新型内容
本实用新型的目的是提供一种中间引脚的引线框架结构，通过在中间引脚上增加键合区域结构，将键合在框架底板上的内引线键合在中间引脚上。该框架结构封装外型与标准的引线框架的封装外型完全相同，可以广泛使用。引线框架中间引脚增加键合区域结构，可以提高产品的质量和可靠性，增强塑封体与框架的结合力，可以提升该框架封装大芯片IC的能力从而达到降低成本提升效益的目的。
本实用新型的目的是通过以下技术方案来实现：
中间引脚的引线框架结构，在中间引脚上部增加键合区域结构，将键合在框架底板上的内引线键合在中间引脚上，用管脚键合区替代了框架底板键合区。
本实用新型的有益效果是，
1.增加中间管脚键合区域结构可以提升产品质量和可靠性；
2.增加中间管脚键合区域结构可以增强塑封体与框架的结合力；
3.增加中间管脚键合区域结构可以提升该框架封装大芯片IC的能力从而达到降低成本提升效益的目的。
附图说明
下面根据附图和实施例对本实用新型作进一步详细说明。
图1是常用的引线框架结构的内引线结构图。
图2是本实用新型实施例所述中间引脚的引线框架结构的结构图。
具体实施方式
如图2所示，本实用新型所述的中间引脚的引线框架结构，在中间引脚上部增加键合区域结构，将键合在框架底板上的内引线1键合在中间引脚上，用管脚键合区替代了框架底板键合区。
本实用新型的有益效果是，
1.增加中间管脚键合区域结构可以提升产品质量和可靠性；
2.增加中间管脚键合区域结构可以增强塑封体与框架的结合力；
3.增加中间管脚键合区域结构可以提升该框架封装大芯片IC的能力从而达到降低成本提升效益的目的。

Claims (1)

1.中间引脚的引线框架结构，其特征在于，在中间引脚上部增加键合区域结构，将键合在框架底板上的内引线键合在中间引脚上。
CN 201120002305 2011-01-06 2011-01-06 中间引脚的引线框架结构 Expired - Fee Related CN201956341U (zh)

Priority Applications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102956600A (zh) * 2012-11-20 2013-03-06 无锡市威海达机械制造有限公司 一种引线框架结构
CN102956597A (zh) * 2012-11-20 2013-03-06 无锡市威海达机械制造有限公司 一种引线框架结构
CN102969297A (zh) * 2012-11-20 2013-03-13 无锡市威海达机械制造有限公司 一种浇铸槽型引线框架结构

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102956600A (zh) * 2012-11-20 2013-03-06 无锡市威海达机械制造有限公司 一种引线框架结构
CN102956597A (zh) * 2012-11-20 2013-03-06 无锡市威海达机械制造有限公司 一种引线框架结构
CN102969297A (zh) * 2012-11-20 2013-03-13 无锡市威海达机械制造有限公司 一种浇铸槽型引线框架结构
CN102956597B (zh) * 2012-11-20 2016-05-11 无锡市威海达机械制造有限公司 一种引线框架结构

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