CN201877426U - Heat conducting and reflecting structure with encapsulated LEDs - Google Patents
Heat conducting and reflecting structure with encapsulated LEDs Download PDFInfo
- Publication number
- CN201877426U CN201877426U CN2010205809113U CN201020580911U CN201877426U CN 201877426 U CN201877426 U CN 201877426U CN 2010205809113 U CN2010205809113 U CN 2010205809113U CN 201020580911 U CN201020580911 U CN 201020580911U CN 201877426 U CN201877426 U CN 201877426U
- Authority
- CN
- China
- Prior art keywords
- light
- heat conduction
- led package
- emitting diode
- catoptric arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Abstract
A heat conducting and reflecting structure with encapsulated LEDs comprises a substrate, LED chips and optical units, wherein a plurality of light-focusing areas are arranged on one side of the substrate, and contact points are arranged on the outer sides of the light-focusing areas; the LED chips are respectively combined in the light-focusing areas and are electrically connected with the contact points through lead wires respectively; and the optical units are respectively combined with the light-focusing areas and seal the contact points and the LED chips. Accordingly, the heat conducting and reflecting structure can serve as a television backlight module or be used for lighting, component density of both the LED chips and the optical units are higher, and better effects of heat conduction, heat dissipation and reflection can be achieved.
Description
Technical field
The utility model is relevant for a kind of heat conduction and catoptric arrangement of LED package, especially refer to a kind of can be used as TV backlight module or illumination use, make the component density between light-emitting diode chip for backlight unit and optical unit higher, and reach the heat conduction and the catoptric arrangement of the LED package of preferable heat conduction, heat radiation and reflection effect.
Background technology
General heat conduction and the catoptric arrangement of having used LED package, it is by a base material, majority be located at contact on the base material, and most light-emitting diodes of being located on the base material constitute, and each light-emitting diode is welded on each contact with pin, use can be used as TV backlight module or illumination use, and each light-emitting diode is dispelled the heat by base material.
But because each light-emitting diode of usefulness lies in after the encapsulation welding again and is located on the substrate, so, not only can make and component density between each light-emitting diode and base material relatively poor (assembly height, density wide) more can when using, cause the relatively poor situation of heat conduction, heat radiation and reflecting effect to take place.
The utility model content
The utility model main purpose is, a kind of heat conduction and catoptric arrangement of LED package are provided, it can be used as the TV backlight module or illumination is used, and makes the component density between light-emitting diode chip for backlight unit and optical unit higher, and reaches the effect of preferable heat conduction, heat radiation and reflection.
For reaching above-mentioned purpose, the utility model is a kind of heat conduction and catoptric arrangement of LED package, includes a base material, and the one side of this base material is provided with most extraction regions, and the outside of each extraction regions is provided with contact; Most light-emitting diode chip for backlight unit are incorporated into respectively in each extraction regions, and each light-emitting diode chip for backlight unit electrically connects with lead and each contact respectively; And most optical units combine and seal contact and light-emitting diode chip for backlight unit with each extraction regions respectively.
In the utility model one embodiment, this base material can be the metal substrate with circuit layout.
In the utility model one embodiment, each extraction regions is a recess.
In the utility model one embodiment, each light-emitting diode chip for backlight unit is incorporated in each extraction regions with elargol.
In the utility model one embodiment, each light-emitting diode chip for backlight unit directly is engaged in each extraction regions with eutectic.
In the utility model one embodiment, each lead can be gold thread or aluminum steel.
In the utility model one embodiment, each optical unit produces the surface that meets light type demand in mould envelope mode.
In the utility model one embodiment, each optical unit produces the surface that meets light type demand in tool point glue mode.
In the utility model one embodiment, each optical unit can be printing opacity or semi-transparent material.
Compared with prior art, the beneficial effects of the utility model are: each light-emitting diode chip for backlight unit of the utility model is engaged in each extraction regions of base material with elargol or eutectic, electrically connect as lead and each contact with gold thread or aluminum steel more afterwards, after make each optical unit combine and seal light-emitting diode chip for backlight unit with each extraction regions respectively with mould envelope or tool point glue mode again, and make each optical unit produce the surface that meets light type demand, so, the utility model is used as TV backlight module or illumination, and make the component density between light-emitting diode chip for backlight unit and optical unit higher, use and when using, have preferable heat conduction, heat radiation and reflecting effect.
Description of drawings
Fig. 1 is the utility model three-dimensional appearance schematic diagram.
Fig. 2 is the utility model perspective exploded view.
Fig. 3 is the local enlarged diagram of the utility model in conjunction with light-emitting diode chip for backlight unit.
Among the figure: base material 1; Extraction regions 11; Contact 12; Light-emitting diode chip for backlight unit 2; Lead 21; Optical unit 3.
Embodiment
See also Fig. 1,2 and shown in Figure 3, be respectively the utility model three-dimensional appearance schematic diagram, the utility model perspective exploded view and the utility model local enlarged diagram in conjunction with light-emitting diode chip for backlight unit.As shown in the figure: the utility model is a kind of heat conduction and catoptric arrangement of LED package, and it comprises a base material 1, most light-emitting diode chip for backlight unit 2 and most optical unit 3 at least and constitutes.
The above-mentioned base material 1 of carrying can be the metal substrate with circuit layout, and this base material 1 its one side is provided with the extraction regions 11 that majority is a recess, and the outside of each extraction regions 11 is provided with contact 12.
Each light-emitting diode chip for backlight unit 2 is incorporated into respectively in each extraction regions 11, and each light-emitting diode chip for backlight unit 2 electrically connects with lead 21 and each contact 12 respectively.
Each optical unit 3 combines and seals contact 12 and light-emitting diode chip for backlight unit 2 with each extraction regions 11 respectively, and each optical unit 3 can be printing opacity or semi-transparent material.In this way, constitute the heat conduction and the catoptric arrangement of a brand-new LED package by said structure.
When the utility model when making, system is engaged in each light-emitting diode chip for backlight unit 2 in each extraction regions 11 of base material 1 with elargol or eutectic, and each light-emitting diode chip for backlight unit 2 can be according to required by blue chip, red light chips, green glow the chip respectively or simultaneously mixed light mode of doping fluorescent powder constitutes required light source, electrically connect as lead 21 and each contact 12 with gold thread or aluminum steel more afterwards, after make each optical unit 3 combine and seal light-emitting diode chip for backlight unit 2 with each extraction regions 11 respectively with mould envelope or tool point glue mode again, and make each optical unit 3 produce the surface that meets light type demand, so, the utility model is used as TV backlight module or illumination, and make the component density of 3 of light-emitting diode chip for backlight unit 2 and optical units higher, use and when using, have preferable heat conduction, heat radiation and reflecting effect.
In sum, the heat conduction of the utility model LED package and catoptric arrangement can effectively improve the various shortcoming of usefulness, can be used as TV backlight module or illumination use, make the component density between light-emitting diode chip for backlight unit and optical unit higher, and reach preferable heat conduction, heat radiation and reflection effect; And then make generation of the present utility model can more progressive, more practical, more meet the consumer use institute must, really met the utility application important document, the whence proposes patent application in accordance with the law.
Claims (9)
1. the heat conduction of a LED package and catoptric arrangement include a base material, it is characterized in that, the one side of this base material is provided with most extraction regions, and the outside of each extraction regions is provided with contact; Most light-emitting diode chip for backlight unit are incorporated into respectively in each extraction regions, and each light-emitting diode chip for backlight unit electrically connects with lead and each contact respectively; And most optical units combine and seal contact and light-emitting diode chip for backlight unit with each extraction regions respectively.
2. the heat conduction of LED package according to claim 1 and catoptric arrangement is characterized in that, this base material is the metal substrate with circuit layout.
3. the heat conduction of LED package according to claim 1 and catoptric arrangement is characterized in that, each extraction regions is a recess.
4. the heat conduction of LED package according to claim 1 and catoptric arrangement is characterized in that, each light-emitting diode chip for backlight unit is incorporated in each extraction regions with elargol.
5. the heat conduction of LED package according to claim 1 and catoptric arrangement is characterized in that, each light-emitting diode chip for backlight unit directly is engaged in each extraction regions with eutectic.
6. the heat conduction of LED package according to claim 1 and catoptric arrangement is characterized in that, each lead is gold thread or aluminum steel.
7. the heat conduction of LED package according to claim 1 and catoptric arrangement is characterized in that, each optical unit produces the surface that meets light type demand in mould envelope mode.
8. the heat conduction of LED package according to claim 1 and catoptric arrangement is characterized in that, each optical unit produces the surface that meets light type demand in tool point glue mode.
9. the heat conduction of LED package according to claim 1 and catoptric arrangement is characterized in that, each optical unit is printing opacity or semi-transparent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205809113U CN201877426U (en) | 2010-10-28 | 2010-10-28 | Heat conducting and reflecting structure with encapsulated LEDs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205809113U CN201877426U (en) | 2010-10-28 | 2010-10-28 | Heat conducting and reflecting structure with encapsulated LEDs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201877426U true CN201877426U (en) | 2011-06-22 |
Family
ID=44165336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205809113U Expired - Fee Related CN201877426U (en) | 2010-10-28 | 2010-10-28 | Heat conducting and reflecting structure with encapsulated LEDs |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201877426U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979454A (en) * | 2014-04-03 | 2015-10-14 | 弘凯光电(深圳)有限公司 | LED light-emitting device and LED lamp |
-
2010
- 2010-10-28 CN CN2010205809113U patent/CN201877426U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979454A (en) * | 2014-04-03 | 2015-10-14 | 弘凯光电(深圳)有限公司 | LED light-emitting device and LED lamp |
| CN104979454B (en) * | 2014-04-03 | 2017-11-28 | 弘凯光电(深圳)有限公司 | LED light emission device and LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HUANG HUANZHANG Free format text: FORMER OWNER: FINECHY INTERNATIONAL LIMITED Effective date: 20121224 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20121224 Address after: 56, Zhenxing Road, turtle mountain, Taoyuan County, Taiwan, China Patentee after: Huang Huanzhang Address before: 56, Zhenxing Road, turtle mountain, Taoyuan County, Taiwan, China Patentee before: Lucky Catch International Limited |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110622 Termination date: 20171028 |