CN105529325A - Double-color temperature LED package structure - Google Patents

Double-color temperature LED package structure Download PDF

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Publication number
CN105529325A
CN105529325A CN201610031783.9A CN201610031783A CN105529325A CN 105529325 A CN105529325 A CN 105529325A CN 201610031783 A CN201610031783 A CN 201610031783A CN 105529325 A CN105529325 A CN 105529325A
Authority
CN
China
Prior art keywords
described
led
double
encapsulation structure
colored temperature
Prior art date
Application number
CN201610031783.9A
Other languages
Chinese (zh)
Inventor
徐彭飞
唐晓晖
王思义
刘臻
苏文益
杨萍
Original Assignee
珠海格力电器股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 珠海格力电器股份有限公司 filed Critical 珠海格力电器股份有限公司
Priority to CN201610031783.9A priority Critical patent/CN105529325A/en
Publication of CN105529325A publication Critical patent/CN105529325A/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

The invention provides a double-color temperature LED package structure. The double-color temperature LED package structure comprises a substrate (10), a first LED (20) and a second LED (30), wherein the first LED (20) is fixedly arranged on a first mounting part of the substrate (10); the first LED (20) comprises a first light-transmitting layer (21) for enabling the first LED (20) to send out a first light; the second LED (30) is fixedly arranged on a second mounting part of the substrate (10); and the second LED (30) comprises a second light-transmitting layer (31) for enabling the second LED (30) to send out a second light. According to the double-color temperature LED package structure, two LEDs capable of sending out different lights are fixed on the first mounting part and the second mounting part of a base respectively, and are fixed with the base into a whole; the distance between the two LEDs is fixed, so that the influence on the distance between two LED chips caused by wire arrangement does not need to consider during the wire arrangement; and the difficulty of the wire arrangement is lowered.

Description

A kind of double-colored temperature LED encapsulation structure

Technical field

The present invention relates to LED and manufacture field, in particular to the double-colored temperature LED encapsulation structure of one.

Background technology

Double-colored temperature LED is mainly used in illumination and handheld device photoflash lamp field, is especially applied to smart mobile phone photoflash lamp field.For double-colored temperature LED many employings warm white of photoflash lamp and the LED of the cold white of high brightness with the use of, reach the effect of double-colored temperature LED, compare single led, the photographic quality of bat is more bright-coloured more true to nature.

In prior art, when to carry out encapsulation to double-colored temperature LED and manufacture, generally respectively every LED is encapsulated, and then every LED designing wiring is connected.Because the spacing distribution in double-colored temperature LED between two LED can comparison film effect produce a very large impact, like this, when carrying out wires design to two independent LED, the impact of connecting up on spacing between two LED need be considered, the factor considered increases, and increases the difficulty of wiring.

Summary of the invention

The present invention aims to provide a kind of double-colored temperature LED encapsulation structure, need adjust spacing, the problem that wiring difficulty is larger to solve when double-colored temperature LED installs in prior art.

For achieving the above object, the invention provides a kind of double-colored temperature LED encapsulation structure, comprising: substrate; One LED, a LED is fixedly installed on the first installation portion of substrate, and a LED has the first photic zone making a LED send the first light; And the 2nd LED, the 2nd LED is fixedly installed on the second installation portion of substrate, and the 2nd LED has the second photic zone making the 2nd LED send the second light.

Further, a LED comprises the first LED chip covered by the first photic zone, and the 2nd LED comprises the second LED chip covered by the second photic zone; Wherein, the first LED chip and the second LED chip are blue LED die, and the first photic zone and the second photic zone are formed by the epoxy resin hot setting containing different fluorescent material respectively.

Further, the first LED chip and the second LED chip are fixed on the side of substrate in bonding mode.

Further, substrate comprises heat-conducting plate and insulating barrier, and wherein, insulating barrier is arranged on heat-conducting plate both sides, and fixes with heat-conducting plate.

Further, heat-conducting plate is metallic plate, and insulating barrier is plastics.

Further, substrate has fairlead, fairlead wall is provided with insulating barrier.

Further, the gold thread being welded on the first LED chip and second LED chip the two poles of the earth is also comprised.

Further, also comprise conductive layer, conductive layer is for connecting the first end of gold thread and fairlead.

Further, at the second end of fairlead by electroplating or sputter forming element pad, the second end of fairlead is communicated with by conductive layer with the first end of fairlead.

Further, also comprise and be arranged on substrate and cover the insulating protective layer of a LED, the 2nd LED, gold thread and conductive layer.

In double-colored temperature LED encapsulation structure of the present invention, two LED that can send different light rays are separately fixed at the first installation portion on pedestal and the second installation portion, be fixed as one with pedestal, spacing between two LED is certain, thus when connecting up, without the need to considering that wiring can have an impact to the spacing between two LED chips again, reduce the difficulty of wiring.

Accompanying drawing explanation

The accompanying drawing forming a application's part is used to provide a further understanding of the present invention, and schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:

Fig. 1 is the schematic top plan view according to the double-colored temperature LED encapsulation structure in the embodiment of the present invention;

Fig. 2 is the front elevational schematic according to the double-colored temperature LED encapsulation structure in the embodiment of the present invention;

Fig. 3 is the schematic side view according to the double-colored temperature LED encapsulation structure in the embodiment of the present invention.

Wherein, being labeled as in above-mentioned accompanying drawing:

10, substrate; 11, heat-conducting plate; 13, insulating barrier; 15, fairlead; 20, a LED; 21, the first photic zone; 23, the first LED chip; 30, the 2nd LED; 31, the second photic zone; 33, the second LED chip; 50, gold thread; 60, conductive layer; 70, insulating protective layer; 80, pin.

Embodiment

Below with reference to the accompanying drawings and describe the present invention in detail in conjunction with the embodiments.

As depicted in figs. 1 and 2, comprise according to the double-colored temperature LED encapsulation structure in the embodiment of the present invention: substrate 10; One LED20, a LED20 is fixedly installed on the first installation portion of substrate 10, and a LED20 has the first photic zone 21 making a LED20 send the first light; And the 2nd LED30, the 2nd LED30 is fixedly installed on the second installation portion of substrate 10, and the 2nd LED30 has the second photic zone 31 making the 2nd LED30 send the second light.Wherein, it should be noted that, the color temperature value between the first light and the second light is different.

In double-colored temperature LED encapsulation structure of the present invention, two LED that can send different light rays are separately fixed at the first installation portion on pedestal and the second installation portion, be fixed as one with pedestal, spacing between two LED is certain, thus when connecting up, without the need to considering that wiring can have an impact to the spacing between two LED chips again, reduce the difficulty of wiring.

Particularly, one LED also comprises the first LED chip 23 covered by the first photic zone 21,2nd LED comprises the second LED chip 33 covered by the second photic zone 31, wherein, first LED chip 23 and the second LED chip 33 are blue LED die, send identical light, the first photic zone 21 and the second photic zone 31 are formed by the epoxy resin hot setting of the fluorescent material containing different content respectively.Same light is through the photic zone containing different content fluorescent material, and the colour temperature of light can change, thus produces the first light and second light with different-colour, realizes the effect of double-colored temperature.Be understandable that, the LED chip of other kinds and the photic zone containing different fluorescent material corresponding with it can be adopted to realize the effect of different-colour.And blue LED die is common LED chip, such scheme is adopted to reduce costs.

Preferably, the first LED chip 23 and the second LED chip 33 are fixed on the side of substrate 10 in bonding mode.Due to the small volume of LED chip, adopt bonding mode convenient and swift.

Preferably, as shown in Figure 2, the substrate 10 in the embodiment of the present invention comprises heat-conducting plate 11 and insulating barrier 13, and wherein, insulating barrier 13 is arranged on heat-conducting plate 11 both sides, and fixes with heat-conducting plate 11.Due to LED chip, operationally temperature is higher, and by for the substrate 10 of fixed L ED chip arranges heat-conducting plate 11, thus the high temperature produced when LED chip can be worked distributes, and reduces temperature during LED chip work, improves the useful life of LED chip.By arranging insulating barrier 13, can prevent from arranging being short-circuited on the substrate 10.

Particularly, heat-conducting plate 11 is metallic plate, and insulating barrier 13 is plastics, and metallic plate and plastics easily obtain, and is conducive to saving cost.

Preferably, as shown in Figure 3, have fairlead 15 on the substrate 10, be coated with insulating barrier 13 at fairlead 15 internal face, to avoid the generation of short-circuit conditions.

Usually, as shown in Figure 3, the double-colored temperature LED encapsulation structure of the embodiment of the present invention also comprises the gold thread 50 being welded on the first LED chip 23 and second LED chip 33 the two poles of the earth.Gold thread 50 is general comparatively thin, thus can be connected to above the very little LED chip of volume easily, for realizing the power supply to LED chip.

Preferably, the double-colored temperature LED encapsulation structure of the embodiment of the present invention also comprises conductive layer 60, conductive layer 60 for connecting the first end of gold thread 50 and fairlead 15, for the connection that LED chip is powered.

In an alternative embodiment, no longer additionally arrange conductive layer 60, but be directly connected to the first end of fairlead 15 with gold thread 50, wherein, gold thread 50 adopts the epoxy resin after hot setting protection.

Preferably, at the second end of fairlead 15 by electroplating or sputter forming element pad, for coordinating with pin 80, be communicated with by conductive layer between the first end of fairlead 15 and the second end of fairlead 15.Being understandable that, also can be realize being communicated with by being filled by fairlead 15 with metal between the first end of fairlead 15 and the second end of fairlead 15.Wherein, conductive layer and metal can adopt copper, aluminium, nickel, gold etc. one or more.

Preferably, the double-colored temperature LED encapsulation structure of the embodiment of the present invention also comprises and is arranged on substrate 10 and the insulating protective layer 70 covering a LED20, the 2nd LED30, gold thread 50 and conductive layer 60.Insulating protective layer 70 can be adopt transparent material the one LED20, the 2nd LED30, gold thread 50 and conductive layer 60 to be covered completely, also can be above a LED20, the 2nd LED30, leave the opening that light passes through.Like this, by increasing insulating protective layer 70, the element in double-colored temperature LED encapsulation structure can be avoided to leak electricity on the one hand, on the other hand protection being provided to these elements, improve the life-span of double-colored temperature LED encapsulation structure.

The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. a double-colored temperature LED encapsulation structure, is characterized in that, comprising:
Substrate (10);
One LED (20), a described LED (20) is fixedly installed on the first installation portion of described substrate (10), and a described LED (20) has and makes a described LED (20) send first photic zone (21) of the first light; And
2nd LED (30), described 2nd LED (30) is fixedly installed on the second installation portion of described substrate (10), and described 2nd LED (30) has and makes described 2nd LED (30) send second photic zone (31) of the second light.
2. double-colored temperature LED encapsulation structure according to claim 1, is characterized in that,
A described LED comprises the first LED chip (23) covered by described first photic zone (21), and described 2nd LED comprises the second LED chip (33) covered by described second photic zone (31);
Wherein, described first LED chip (23) and described second LED chip (33) are blue LED die, and described first photic zone (21) and described second photic zone (31) are formed by the epoxy resin hot setting containing different fluorescent material respectively.
3. double-colored temperature LED encapsulation structure according to claim 2, is characterized in that, described first LED chip (23) and described second LED chip (33) are fixed on the side of described substrate (10) in bonding mode.
4. double-colored temperature LED encapsulation structure according to claim 1, it is characterized in that, described substrate (10) comprises heat-conducting plate (11) and insulating barrier (13), wherein, described insulating barrier (13) is arranged on described heat-conducting plate (11) both sides, and fixes with described heat-conducting plate (11).
5. double-colored temperature LED encapsulation structure according to claim 4, is characterized in that, described heat-conducting plate (11) is metallic plate, and described insulating barrier (13) is plastics.
6. double-colored temperature LED encapsulation structure according to claim 4, is characterized in that, described substrate (10) has fairlead (15), and described fairlead (15) internal face is provided with described insulating barrier (13).
7. double-colored temperature LED encapsulation structure according to claim 6, is characterized in that, also comprises the gold thread (50) being welded on described first LED chip (23) and described second LED chip (33) the two poles of the earth.
8. double-colored temperature LED encapsulation structure according to claim 7, it is characterized in that, also comprise conductive layer (60), described conductive layer (60) is for connecting the first end of described gold thread (50) and described fairlead (15).
9. double-colored temperature LED encapsulation structure according to claim 8, it is characterized in that, at the second end of described fairlead (15) by electroplating or sputter forming element pad, the second end of described fairlead (15) and the first end of described fairlead (15) are communicated with by described conductive layer (60).
10. double-colored temperature LED encapsulation structure according to any one of claim 1 to 9; it is characterized in that, described double-colored temperature LED encapsulation structure also comprises and is arranged on described substrate (10) and goes up and the insulating protective layer (70) covering a described LED (20), the 2nd LED (30), gold thread (50) and conductive layer (60).
CN201610031783.9A 2016-01-15 2016-01-15 Double-color temperature LED package structure CN105529325A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610031783.9A CN105529325A (en) 2016-01-15 2016-01-15 Double-color temperature LED package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610031783.9A CN105529325A (en) 2016-01-15 2016-01-15 Double-color temperature LED package structure

Publications (1)

Publication Number Publication Date
CN105529325A true CN105529325A (en) 2016-04-27

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258619A (en) * 2006-03-24 2007-10-04 Ngk Spark Plug Co Ltd Light-emitting element housing package
US20100090231A1 (en) * 2008-10-15 2010-04-15 Samsung Led Co., Ltd. Led package module
CN103000782A (en) * 2011-09-13 2013-03-27 展晶科技(深圳)有限公司 Light emitting diode packaging structure
CN104637930A (en) * 2014-12-30 2015-05-20 木林森股份有限公司 Double color LED (Light Emitting Diode) lamp bead, lamp strip based on lamp bead and packaging process for lamp bead
CN205428921U (en) * 2016-01-15 2016-08-03 珠海格力电器股份有限公司 Double -colored temperature LED packaging structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258619A (en) * 2006-03-24 2007-10-04 Ngk Spark Plug Co Ltd Light-emitting element housing package
US20100090231A1 (en) * 2008-10-15 2010-04-15 Samsung Led Co., Ltd. Led package module
CN103000782A (en) * 2011-09-13 2013-03-27 展晶科技(深圳)有限公司 Light emitting diode packaging structure
CN104637930A (en) * 2014-12-30 2015-05-20 木林森股份有限公司 Double color LED (Light Emitting Diode) lamp bead, lamp strip based on lamp bead and packaging process for lamp bead
CN205428921U (en) * 2016-01-15 2016-08-03 珠海格力电器股份有限公司 Double -colored temperature LED packaging structure

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Application publication date: 20160427

RJ01 Rejection of invention patent application after publication