CN201839518U

CN201839518U - Lamination structure for embedded capacitor printed circuit boards

Info

Publication number: CN201839518U
Application number: CN2010205829969U
Authority: CN
Inventors: 邓林全
Original assignee: JIANGMEN HINNO-TECH Co Ltd
Current assignee: Guangdong Ying Hua new Mstar Technology Ltd
Priority date: 2010-10-27
Filing date: 2010-10-27
Publication date: 2011-05-18
Anticipated expiration: 2020-10-27

Abstract

The utility model discloses a lamination structure for embedded capacitor printed circuit boards, which comprises embedded capacitor printed circuit boards. Printed circuit boards are respectively arranged on two sides of a capacitor, a glass fiber cloth layer is arranged between the embedded capacitor printed circuit board and the two printed circuit boards, the capacitor comprises an intermediate dielectric layer and two conductive foil layers, the dielectric layer is arranged between the two conductive foil layers, and a glass fiber cloth layer is fixed in the intermediate dielectric layer. Therefore, by the aid of the glass fiber cloth layer fixed in the intermediate dielectric layer, the strength of the intermediate dielectric layer is strengthened greatly, and the intermediate dielectric layer is not easy to crash and has simple structure. Besides, the strength of the intermediate dielectric layer is strengthened, and double-side etching to the embedded printed circuit boards can be realized, thereby effectively improving production efficiency and being favorable of marketing promotion.

Description

Bury the condenser network board laminated structure

Technical field

The utility model relates to capacitive character printed circuit board (PCB) (PCB) art with internal capacitor, refers in particular to a kind of condenser network board laminated structure that buries.

Background technology

Printed circuit board (PCB) (PCB) generally all has part and the grounded part that connects internal electric source, they with link to each other such as being installed in the such surface element of integrated circuit on the PCB.In the course of work of PCB, need compensate connecing the voltage fluctuation that occurs between power supply and the grounded part among the PCB usually, particularly be installed on the circuit board when senser as integrated circuit, and when linking to each other with grounded part with working power.

The voltage fluctuation of the above-mentioned type generally is that the turn-on and turn-off by integrated circuit cause that voltage fluctuation causes " noise ", and this will be undesirable and/or unacceptable in many cases.

A kind of ideal method that addresses this problem is the wiring capacitance device, these capacitors directly with integrated circuit and/or selected integrated circuit near the power supply that connects link to each other with grounded part.Originally, surface capacitor is made of surface element, or is arranged separately on the surface of PCB, and links to each other with each element or integrated circuit etc. by for example surperficial lead or plated-through hole.

Concerning reducing or reduce to greatest extent the undesirable voltage fluctuation of element, such surface capacitor is normally effective.Yet surface or by-pass capacitor are not all always effective in all cases.For example, capacitor often has influence on " response " of integrated circuit or other elements, because capacitor not only has capacitance, but also is that inductance value is arranged.

About this point, what people knew is very clearly, and the reason that promptly produces inductance is because electric current has passed through conductor, for example connects capacitor and element or connects power supply, and such element is worked under different speed or frequency, generally just can see different characteristics.Therefore, the PCB that designs and element arrays and relevant capacitor must guarantee at a high speed and work under the situation of low speed and can both suppress noise.

In order to overcome these restrictions and other reason, many capacitive character PCB have been proposed in prior art.The initial United States Patent (USP) 4 of the Turek that delivers on October 4th, 1988,775, disclose a kind of multilayer board with conductive layer and dielectric layer in 573, these layers are deposited on the surface of circuit board, so that the element that is installed on the circuit board is formed a by-pass capacitor.

Recently, a kind of method of making multilayer board is disclosed in the United States Patent (USP) 5,010,641 of the Sisler that delivers on April 30th, 1991, this circuit board has a dielectric material of handling fully, places the connecing between power supply unit layering and the grounding parts layering of circuit board.

In addition, a kind of capacitive character printed circuit board (PCB) of capacitor laminate is disclosed in the people's such as Howard that deliver on January 7th, 1992 the United States Patent (USP) 5,079,069, so that to being installed in the effect that element on the PCB plays a shunt capacitance.

As shown in Figure 1 to Figure 3, be the schematic diagram that buries the condenser network board laminated structure of the prior art, include bury electric capacity wiring board 10 ' and be arranged at the circuit board 20 that buries electric capacity wiring board 10 ' both sides ', this circuit board 20 ' and bury electric capacity wiring board 10 ' between be folded with glass fabric based reinforcement material 30 '.This bury electric capacity wiring board 10 ' include intermediate dielectric layer 11 ' and conductive foil 12 ', this buries electric capacity wiring board 10 ' when making, at first, as shown in Figure 1, prior to intermediate dielectric layer 11 ' two surfaces up and down on be equipped with conductive foil 13 '.Then, as shown in Figure 2, this conductive foil 13 ' respectively through etching form required circuit 12 '.

The above-mentioned existing condenser network board laminated structure that buries, though can offer the effect that the user effectively suppresses noise, really has progressive, but when using, reality but finds still to have many deficiencies on himself structure and the serviceability, cause the existing condenser network board laminated structure that buries in practical application, fail to reach best result of use and task performance, now its shortcoming be summarized as follows:

Because this intermediate dielectric layer 11 ' employings insulating cement manufacturing forms, it has very crisp characteristic, make intermediate dielectric layer 11 ' undercapacity, fragmentation easily.Also because this intermediate dielectric layer 11 ' have crisp and frangible this characteristic, can only can not carry out the etching of two-sided ground simultaneously to middle dielectric layer 11 ' two lip-deep copper coins 13 ' carry out single face ground etching one by one, make that its production efficiency is lower.

The utility model content

In view of this, the utility model is at the disappearance of prior art existence, and its main purpose provides a kind of condenser network board laminated structure that buries, its have simple in structure, intensity is high, be difficult for the characteristics of fragmentation.

For achieving the above object, the utility model adopts following technical scheme:

A kind of condenser network board laminated structure that buries comprises and buries the electric capacity wiring board, respectively is provided with a circuit board in the both sides of this capacitor, and this buries and respectively is folded with a glass fabric based reinforcement material between electric capacity wiring board and two circuit boards; This capacitor includes one deck intermediate dielectric layer and two-layer conductive foil, and this intermediate dielectric layer is located between two conductive foils, and described intermediate dielectric layer inside is installed with a glass fibre layer of cloth.

As a kind of preferred version, described intermediate dielectric layer is the insulating cement of high DK.

As a kind of preferred version, described conductive foil is a copper material.

The utility model compared with prior art has tangible advantage and beneficial effect, particularly, as shown from the above technical solution, by be installed with a glass fibre layer of cloth in intermediate dielectric layer inside, utilize this glass fibre layer of cloth can make the intensity of intermediate dielectric layer strengthen greatly, be difficult for fragmentation, structure is also very simple; And, utilize the intensity enhancing of this intermediate dielectric layer, can advance two-sided etching to capacitor, and then can effectively enhance productivity, help the popularization in market.

For more clearly setting forth architectural feature of the present utility model and effect, come the utility model is elaborated below in conjunction with accompanying drawing and specific embodiment:

Description of drawings

Fig. 1 is that the capacitor that buries the condenser network board laminated structure in the prior art does not have through overetched structural representation;

Fig. 2 buries the capacitor of condenser network board laminated structure through the structural representation after the etching in the prior art;

Fig. 3 is the schematic diagram that buries the condenser network board laminated structure in the prior art;

Fig. 4 is that the capacitor of the embodiment of the utility model does not have through overetched structural representation;

Fig. 5 is the structural representation after the capacitor of the embodiment of the utility model passes through etching;

Fig. 6 is the schematic diagram of the embodiment of the utility model.

The accompanying drawing identifier declaration:

10,10 ', bury electric capacity wiring board 11,11 ', intermediate dielectric layer

12,12 ', conductive foil 13, glass fibre layer of cloth

14,13 ', Copper Foil 20,20 ', circuit board

30,30 ', the glass fabric based reinforcement material

Embodiment:

Please refer to Fig. 4 to shown in Figure 6, the concrete structure that it has demonstrated the preferred embodiment of the utility model includes one and buries electric capacity wiring board 10 and two circuit boards 20.

Wherein, this buries electric capacity wiring board 10 and includes one deck intermediate dielectric layer 11 and two-layer conductive foil 12, this intermediate dielectric layer 11 is located between the two-layer conductive foil 12, simultaneously, the inside of this intermediate dielectric layer 11 is installed with a glass fibre layer of cloth 13, the intensity of 13 pairs of middle dielectric layers 11 of this glass fibre layer of cloth plays good humidification, and this intermediate dielectric layer 11 forms for the insulating cement manufacturing of high DK.This conductive foil 12 is a copper material.

This two circuit board 20 is arranged at aforementioned both sides of burying electric capacity wiring board 10 respectively, and this buries between electric capacity wiring board 10 and two circuit boards 20 and respectively is folded with a glass fabric based reinforcement material 30.

The manufacturing process that present embodiment is described in detail in detail is as follows:

Embodiment 1:

At first, with 11 coatings of middle dielectric layer or be printed on the Copper Foil 14, dry to form and cover the resin Copper Foil to semi-solid preparation.Glass fabric 13 is routed to covering between the resin Copper Foil pressing and being buried the electric capacity copper clad foil substrate as shown in Figure 4 of two making.Can obtain the electric capacity wiring board 10 that buries shown in Figure 5 after copper clad foil substrate shown in Figure 4 etched line pattern as required.After wiring board shown in Figure 5 is respectively laid glass cloth based reinforcement material 30 and wiring board 20 up and down, after the press pressing, promptly form and bury the electric capacity multilayer circuit board as shown in Figure 6.Its number of plies of multilayer circuit board of burying electric capacity wiring board 10 both sides not necessarily is symmetry status.

Embodiment 2:

Glass fabric 13 is contained in the glue that is dipped into intermediate dielectric layer 11, THICKNESS CONTROL through precision, after the oven dry, can obtain the glass fabric 13 of semi-cured state and the composite material of intermediate dielectric layer 11, this composite material is respectively laid a Copper Foil up and down, can form after the press pressing and bury the electric capacity copper clad foil substrate as shown in Figure 4.Etch copper clad foil substrate shown in Figure 4 behind the line pattern as required and can obtain the electric capacity wiring board 10 that buries shown in Figure 5.After wiring board shown in Figure 5 is respectively laid glass cloth based reinforcement material 30 and wiring board 20 up and down, after the press pressing, promptly form and bury the electric capacity multilayer circuit board as shown in Figure 6.Its number of plies of multilayer circuit board of burying electric capacity wiring board 10 both sides not necessarily is symmetry status.

Design focal point of the present utility model is, by be installed with a glass fibre layer of cloth in intermediate dielectric layer inside, utilizes this glass fibre layer of cloth can make the intensity of intermediate dielectric layer strengthen greatly, is difficult for fragmentation, and structure is also very simple; And, utilize the intensity enhancing of this intermediate dielectric layer, can advance two-sided etching to capacitor, and then can effectively enhance productivity, help the popularization in market.

The above, it only is preferred embodiment of the present utility model, be not that technical scope of the present utility model is imposed any restrictions, so every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment did.

Claims

1. one kind is buried the condenser network board laminated structure, comprises capacitor, respectively is provided with one or more layers circuit board in the both sides of this capacitor, and, respectively be folded with a glass fabric based reinforcement material between this capacitor and two circuit boards; This capacitor includes one deck intermediate dielectric layer and two-layer conductive foil, and this intermediate dielectric layer is located between the two-layer conductive foil, it is characterized in that: described intermediate dielectric layer inside is provided with a glass fibre layer of cloth.

2. the condenser network board laminated structure that buries according to claim 1 is characterized in that: described intermediate dielectric layer is the insulating cement of high DK.

3. the condenser network board laminated structure that buries according to claim 1 is characterized in that: described conductive foil is a copper material.