CN204836777U - Multilayer high frequency blind hole PCB circuit board - Google Patents
Multilayer high frequency blind hole PCB circuit board Download PDFInfo
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- CN204836777U CN204836777U CN201520462584.4U CN201520462584U CN204836777U CN 204836777 U CN204836777 U CN 204836777U CN 201520462584 U CN201520462584 U CN 201520462584U CN 204836777 U CN204836777 U CN 204836777U
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- blind hole
- hole
- copper foil
- high frequency
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Abstract
The utility model discloses a multilayer high frequency blind hole PCB circuit board, this PCB circuit board include three combination layer, and the range upon range of pressure of three combination is in the same place, and combination layer topmost is the copper foil substrate layer, and middle combination layer is the signals layer, and the layer is made up to the bottom is the stratum, the copper foil substrate layer is equipped with the three -layer, top solder mask, copper foil layer, substrate layer that the branch maybe the superiors, the signals layer has a four layers, and first layer to third layer is the sandwich layer, and the fourth layer is the power plane, the stratum is equipped with the three -layer, and the superiors are ground planes, and the intermediate level is the substrate layer, and the bottom is the bottom solder mask, is provided with the plasma blind hole on the solder mask of top, and end in the copper foil layer bottom this plasma blind hole bottom, the bottom solder mask is provided with the laser micropore, the mipor bottom of laser is by the substrate layer upper portion on the stratum. Be provided with a plurality of blind holes on the PCB board, on the lamination board, the each side is unanimous to the atress, can avoid PCB wane phenomenon.
Description
Technical field
The utility model relates to pcb board, relates to a kind of multilayer high frequency blind hole PCB specifically.
Background technology
In power circuit design, electromagnetic interference be affect properties of product key factor it, the method that tradition solves this problem of electromagnetic interference has a lot, usually adopts and suppresses the method for electromagnetic interference to comprise: electromagnetic interference suppresses coating, electromagnetic interference design of Simulation and selects suitable electromagnetic interference to suppress spare and accessory parts etc.Near the power pins of IC, reasonably settle the electric capacity of suitable capacity, the saltus step of IC output voltage can be made to come faster.But problem is not so far.Due to the characteristic that electric capacity is finite frequency response, this make electric capacity cannot generate on Whole frequency band drive IC neatly export required for harmonic power.In addition, the transient voltage that power bus is formed can fall by coating-forming voltage at the inductance two ends in decoupling path, and these transient voltages are exactly the interference source of main common mode electromagnetic interference.
PCB comprises two essential parts: substrate (sheet material) and track (copper cash).Substrate, as structural member, is the physical support of the track of circuit element and laying, and achieves the electrical isolation between transport element.The most frequently used type of substrate is FR4, and it is a kind of glass fibre/epoxy laminate.It is very similar with old-fashioned glass mat, but has been coated with fire retardant.Substrate also can adopt pottery and particular polymer to make.Traditional pwb signal layer enters out impedance lower (50 ohm), need when connecting up to be coupled between strict consideration line characteristic impedance and line, and different manufacturers and different series-produced sheet material doping difference, dielectric constant is different and unstable, and the phenomenon of seesaw occurs sometimes.
Utility model content
For deficiency of the prior art, the technical problems to be solved in the utility model there are provided a kind of multilayer high frequency blind hole PCB.
For solving the problems of the technologies described above, the utility model is realized by following scheme: a kind of multilayer high frequency blind hole PCB, this PCB comprises three combination layers, three combination layers overlap together, uppermost combination layer is copper foil base material layer, intermediate combination layer is signals layer, bottom combination layer is stratum, described copper foil base material layer is provided with three layers, the top solder mask of the superiors respectively, copper foil layer, substrate layer, described signals layer has four layers, ground floor to third layer is sandwich layer, 4th layer is bus plane, described stratum is provided with three layers, the superiors are ground planes, intermediate layer is substrate layer, bottom is bottom solder mask, top solder mask is provided with plasma blind hole, this plasma blind via bottom terminates in bottom copper foil layer, described bottom solder mask is provided with laser micropore, the bottom of described laser micropore ends in the substrate layer top on stratum.
Further, the material that the substrate layer of described copper foil base material layer uses is polytetrafluoroethylene.
Further, plated through hole is provided with on the left of described circuit board.
Further, the copper foil layer of described copper foil base material layer is provided with fills out creme micropore, and this fills out creme micropore is buried via hole.
Further, described in fill out creme micropore side and be provided with interior blind hole, described interior blind hole is placed between the substrate layer of copper foil layer and copper foil base material layer.
Further, described in fill out below creme micropore and be provided with interior buried via hole, these interior buried via hole two ends are placed in the upper and lower surface of signals layer respectively.
Further, be provided with non-plating hole on the right side of described interior blind hole, this non-plating hole is the through hole of circuit board.
Further, the right side in described non-plating hole is provided with back-drilling formula plating hole, and this back-drilling formula plating hole is the through hole of circuit board, it in two sub-sections, the first half is non-plating hole, and the latter half is plating hole.
Further, be blind hole at described laser micropore, its direction, upper left corner is provided with buried via hole in a laser.
Further, in described laser, buried via hole is at ground plane lower surface opening, ends to ground plane upper surface.
Relative to prior art, the beneficial effects of the utility model are: on pcb board, be provided with multiple blind hole, and on laminated sheet, all directions are unanimously stressed, can avoid PCB seesaw phenomenon.Through hole is instead of by blind hole, make through hole meeting large on pcb board seldom, thus more space can be provided for cabling, remaining space can be used as large area shielding purposes, to improve EMI/RFI performance, simultaneously more remaining space can also be used for internal layer and carries out partly shielding effect to device and crucial netting twine, makes it have best electric property.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the utility model pcb board structural representation.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, to make advantage of the present utility model and feature can be easier to be readily appreciated by one skilled in the art, thus more explicit defining is made to protection range of the present utility model.
Please refer to accompanying drawing 1, a kind of multilayer high frequency blind hole PCB of the present utility model, this PCB comprises three combination layers, three combination layers overlap together, uppermost combination layer is copper foil base material layer 1, intermediate combination layer is signals layer 13, bottom combination layer is stratum 12, described copper foil base material layer 1 is provided with three layers, the top solder mask 2 of the superiors respectively, copper foil layer, substrate layer, described signals layer 13 has four layers, ground floor to third layer is sandwich layer, 4th layer is bus plane, described stratum 12 is provided with three layers, the superiors are ground planes, intermediate layer is substrate layer, bottom is bottom solder mask 11, top solder mask 2 is provided with plasma blind hole 4, terminate in bottom copper foil layer bottom this plasma blind hole 4, described bottom solder mask 11 is provided with laser micropore 9, the bottom of described laser micropore 9 ends in the substrate layer top on stratum 12.The material that the substrate layer of described copper foil base material layer 1 uses is polytetrafluoroethylene, is provided with plated through hole 3 on the left of described circuit board., the copper foil layer of described copper foil base material layer 1 is provided with fills out creme micropore 5, this fills out creme micropore 5 for buried via hole, described creme micropore 5 side of filling out is provided with interior blind hole 51, described interior blind hole 51 is placed between the substrate layer of copper foil layer and copper foil base material layer 1, described filling out below creme micropore 5 is provided with interior buried via hole 8, these interior buried via hole 8 two ends are placed in the upper and lower surface of signals layer 13 respectively, non-plating hole 6 is provided with on the right side of described interior blind hole 51, this non-plating hole 6 is the through hole of circuit board, the right side in described non-plating hole 6 is provided with back-drilling formula plating hole 7, this back-drilling formula plating hole 7 is the through hole of circuit board, it in two sub-sections, the first half is non-plating hole, the latter half is plating hole, be blind hole at described laser micropore 9, its direction, upper left corner is provided with buried via hole 10 in a laser, in described laser, buried via hole 10 is at ground plane lower surface opening, end to ground plane upper surface.
The utility model PCB is that four layers of core are stacking, but the subsidiary layer of top and bottom be employing order lamination make from level to level.The utility model PCB circuit can be used for making blind hole, buried via hole, plating hole, non-plating hole and rear brill plating hole.Resistance and electric capacity also can be embedded in substrate.Pcb board is provided with multiple blind hole, and on laminated sheet, all directions are unanimously stressed, can avoid PCB seesaw phenomenon.Through hole is instead of by blind hole, make through hole meeting large on pcb board seldom, thus more space can be provided for cabling, remaining space can be used as large area shielding purposes, to improve EMI/RFI performance, simultaneously more remaining space can also be used for internal layer and carries out partly shielding effect to device and crucial netting twine, makes it have best electric property.
The foregoing is only preferred implementation of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model specification and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (10)
1. a multilayer high frequency blind hole PCB, it is characterized in that: this PCB comprises three combination layers, three combination layers overlap together, uppermost combination layer is copper foil base material layer (1), intermediate combination layer is signals layer (13), bottom combination layer is stratum (12), described copper foil base material layer (1) is provided with three layers, the top solder mask (2) of the superiors respectively, copper foil layer, substrate layer, described signals layer (13) has four layers, ground floor to third layer is sandwich layer, 4th layer is bus plane, described stratum (12) is provided with three layers, the superiors are ground planes, intermediate layer is substrate layer, bottom is bottom solder mask (11), top solder mask (2) is provided with plasma blind hole (4), this plasma blind hole (4) bottom terminates in bottom copper foil layer, described bottom solder mask (11) is provided with laser micropore (9), the bottom of described laser micropore (9) ends in the substrate layer top on stratum (12).
2. a kind of multilayer high frequency blind hole PCB according to claim 1, is characterized in that: the material that the substrate layer of described copper foil base material layer (1) uses is polytetrafluoroethylene.
3. a kind of multilayer high frequency blind hole PCB according to claim 1, is characterized in that: be provided with plated through hole (3) on the left of described circuit board.
4. a kind of multilayer high frequency blind hole PCB according to claim 1, is characterized in that: the copper foil layer of described copper foil base material layer (1) is provided with fills out creme micropore (5), and this fills out creme micropore (5) is buried via hole.
5. a kind of multilayer high frequency blind hole PCB according to claim 4, is characterized in that: described in fill out creme micropore (5) side and be provided with interior blind hole (51), described interior blind hole (51) is placed between the substrate layer of copper foil layer and copper foil base material layer (1).
6. a kind of multilayer high frequency blind hole PCB according to claim 4, is characterized in that: described in fill out creme micropore (5) below be provided with interior buried via hole (8), these interior buried via hole (8) two ends are placed in the upper and lower surface of signals layer (13) respectively.
7. a kind of multilayer high frequency blind hole PCB according to claim 5, is characterized in that: described interior blind hole (51) right side is provided with non-plating hole (6), the through hole that this non-plating hole (6) is circuit board.
8. a kind of multilayer high frequency blind hole PCB according to claim 7, it is characterized in that: the right side of described non-plating hole (6) is provided with back-drilling formula plating hole (7), the through hole that this back-drilling formula plating hole (7) is circuit board, it in two sub-sections, the first half is non-plating hole, and the latter half is plating hole.
9. a kind of multilayer high frequency blind hole PCB according to claim 1, is characterized in that: be blind hole at described laser micropore (9), and its direction, upper left corner is provided with buried via hole (10) in a laser.
10. a kind of multilayer high frequency blind hole PCB according to claim 1, is characterized in that: in described laser, buried via hole (10) is at ground plane lower surface opening, ends to ground plane upper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520462584.4U CN204836777U (en) | 2015-07-01 | 2015-07-01 | Multilayer high frequency blind hole PCB circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520462584.4U CN204836777U (en) | 2015-07-01 | 2015-07-01 | Multilayer high frequency blind hole PCB circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204836777U true CN204836777U (en) | 2015-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520462584.4U Active CN204836777U (en) | 2015-07-01 | 2015-07-01 | Multilayer high frequency blind hole PCB circuit board |
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| CN (1) | CN204836777U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231788A (en) * | 2016-09-30 | 2016-12-14 | 深圳天珑无线科技有限公司 | Circuit board |
| CN108303635A (en) * | 2017-12-29 | 2018-07-20 | 曙光信息产业(北京)有限公司 | A kind of test board for verifying PCB material electric property |
| CN112770482A (en) * | 2020-12-04 | 2021-05-07 | 深圳国人无线通信有限公司 | Printed board assembly and shielding structure |
-
2015
- 2015-07-01 CN CN201520462584.4U patent/CN204836777U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231788A (en) * | 2016-09-30 | 2016-12-14 | 深圳天珑无线科技有限公司 | Circuit board |
| CN108303635A (en) * | 2017-12-29 | 2018-07-20 | 曙光信息产业(北京)有限公司 | A kind of test board for verifying PCB material electric property |
| CN108303635B (en) * | 2017-12-29 | 2020-08-11 | 中科曙光信息产业成都有限公司 | Test board for verifying electrical performance of PCB material |
| CN112770482A (en) * | 2020-12-04 | 2021-05-07 | 深圳国人无线通信有限公司 | Printed board assembly and shielding structure |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |