CN202998658U - Printed circuit board with two blind holes arranged at the same side - Google Patents
Printed circuit board with two blind holes arranged at the same side Download PDFInfo
- Publication number
- CN202998658U CN202998658U CN 201220687148 CN201220687148U CN202998658U CN 202998658 U CN202998658 U CN 202998658U CN 201220687148 CN201220687148 CN 201220687148 CN 201220687148 U CN201220687148 U CN 201220687148U CN 202998658 U CN202998658 U CN 202998658U
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- Prior art keywords
- copper foil
- hole
- layer
- circuit board
- foil layer
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Abstract
The utility model discloses a printed circuit board with two blind holes arranged at the same side. The printed circuit board comprises four copper foil layers and core plates. A core plate is arranged between each two copper foil layers. A through hole used for conducting the four copper foil layers is arranged between a first copper foil layer and a fourth copper foil layer. A blind hole I is arranged between the first copper foil layer and a second copper foil layer. A blind hole II is arranged between the first copper foil layer and the third copper foil layer. The blind hole II is positioned between the blind hole I and the through hole. According to the printed circuit board, a large number of through hole designs is eliminated, and the wiring density and packaging density are improved; the design of interconnection structures in a multilayer plate is diversified; and the reliability of the multilayer plate and the electronic performance of an electronic product are obviously raised.
Description
Technical field
The utility model relates to printed-board technology, particularly relates to the printed circuit board (PCB) of a kind of double blinding hole homonymy setting.
Background technology
Printed circuit board (Printed Circuit Board, be called for short PCB) be physical entity and the supporter that in the electronic products such as modern communications equipment, computer, consumer electronics, electronic devices and components connect, undertaking signal transmission, Power supply key effect, is the requisite basic element of character in electronic equipment.Fast development along with electronic technology, electronic product is to light, thin, short and smallization direction fast development, promoted printed circuit board to high accuracy, high density, the progress of graph thinning direction, high density interconnect (High Density Interconnect, HDI) technology is flourish under this background.Printed circuit board (PCB) is again pcb board, is the fundamental parts of all electronic products, is the carrier of all electronic devices and components, is the main support body of electronic components when installing with interconnection.
For example application number is CN201120065087.2, publication number is the Chinese utility model patent " a kind of multilayer circuit board " of CN201947529U, a kind of multilayer circuit board is disclosed, comprise the Floor 12 structure, this Floor 12 wiring board is formed by four central layers and four layers of copper foil layer compacting, and ground floor, the second layer, eleventh floor and Floor 12 are copper foil layer, and four central layers are positioned at the centre of the second layer and eleventh floor, each central layer is similar to a double sided board, and all there is circuit on its two sides; This patent shortcoming is that all electrical connections are all to lean on the insert hole of through hole and components and parts to form electric interconnection, and the volume of product is large, and the number of plies is many, is not suitable for the development of Modern Electronic Packaging Technology.When having high most advanced and sophisticated pcb board to need further compression pcb board space and wiring distance, can not meet the demands.Core material is superimposed too much, and during making, the rear multilayer build-up off normal that easily occurs is closed at the fourth of the twelve Earthly Branches, for follow-up boring has increased scrapping that the hole is inclined to one side, the hole is broken.When holing, the single face copper conducting of needs central layer can not accomplish.The manufacture craft more complicated, equipment investment is large, and raw material are expensive, and medium-sized and small enterprises can only be hung back.
Yet the conducting between each layer and disconnection are all to depend on pad to realize, the voltage layer integrality in multi-layer sheet can be destroyed in too many all-pass hole, electric capacity is sustained a loss, increase noise, the pad of all size and resistance are from the existence of ring, to conflict with part and the wiring generation of assembling, the area of PCB is increased, be not suitable for the fast development needs of Electronic Encapsulating Technology.
Employing can address this problem in printed board design buried blind via technology.Blind/buried via hole, multiple-plate structure of standard is to contain internal layer circuit and outer-layer circuit, recycling is holed, and metallized processing procedure in the hole, reaches the interior bonds function of each sandwich circuit.But because the increase of line density, the packaged type of part constantly upgrades.In order to allow limited PCB area, can place more more high performance parts, except line width was thinner, the aperture also was reduced into 0.6 mm of SMD from DIP jack aperture 1 mm, further be reduced into below 0.4mm.But still can take surface area, thereby the appearance of buried via hole and blind hole is arranged again.
The utility model content
The purpose of this utility model is to overcome the problems referred to above that prior art exists, and proposes the printed circuit board (PCB) of a kind of double blinding hole homonymy setting.Structure of the present utility model is eliminated a large amount of via design, improves wiring density and packaging density; Make multi-layer sheet inner interconnection structure design variation; Obviously improved the electric property of multiple-plate reliability and electronic product.
The utility model is realized by the following technical solutions:
The printed circuit board (PCB) that a kind of double blinding hole homonymy arranges, comprise four layers of copper foil layer and central layer, be provided with a central layer between described every two-layer copper foil layer, be provided with the through hole for four layers of copper foil layer of conducting between described the first copper foil layer to the four copper foil layers, it is characterized in that: be provided with the blind hole I between described the first copper foil layer to the second copper foil layer, be provided with the blind hole II between described the first copper foil layer to the three copper foil layers, described blind hole II is between blind hole I and through hole.
Described central layer comprises insulating barrier and conductive layer.
Described insulating barrier is epoxy resin.
Described conductive layer is electrolytic copper foil.
The utility model compared with prior art, its advantage is:
1, structure of the present utility model is eliminated a large amount of via design, improves wiring density and packaging density; Make multi-layer sheet inner interconnection structure design variation; Obviously improved the electric property of multiple-plate reliability and electronic product.
2, density of texture of the present utility model is high, and the plank of two-sided SMD design has outer up and down, and interfering with each other between the I/O guide hole, having solved has VIP(Via-in-pad) time difficult design problem.
3, structure of the present utility model, the processing procedure making step is simple, and first boring, carry out copper Tonghua, hole, make again the figure circuit of internal layer, implement pressing for the first time, then carry out the making of two-layer blind hole, the requirement of closing according to lamination, carry out lamination, improved the electric property of product, reduced the degree of depth in hole and hole, thereby the reduction entozoic inductance in hole and electric capacity are on the impact of signal.Reduced the thickness of product, reduced the size of installation, increased wiring density, the scope of application of product has obtained increase, and multiple-plate number of plies has reduced, and has reduced cost.
4, structure of the present utility model can design the pcb board that adapts according to the requirement difference of pcb board, can compress to greatest extent space and the wiring distance of pcb board, makes characteristic impedance control to become and is more prone to; And alleviate that signal between parallel wire disturbs and the generation of noise.
5, structure internal layer of the present utility model does not need too many central layer superimposed, the difficulty of making has obtained reduction, and uses the manufacture craft of tradition can complete the making of PCB, makes medium-sized and small enterprises can accomplish high-precision pcb board, also for making the blind mixing of burying, bury brilliant plate the space is provided.
6, structure of the present utility model because further compressing space and the wiring distance of PCB, makes operating voltage constantly descend, and has reduced loss and the decay of signal energy, has promoted the service time of the fixed supply energy; Signal delay and signal pulse sequential mistake have been reduced.
7, Structure Decreasing PCB cost of the present utility model; Increase line density; Be conducive to the use of advanced structure packing technique; Have better electrical property and signal correctness; Reliability is better; Can improve thermal property; Can improve radio frequency interference/Electromagnetic Interference/static and discharge (RFI/EMI/ESD); Increase design efficiency.
Description of drawings
Fig. 1 is the utility model structural representation.
Be labeled as in figure: 1, copper foil layer, 2, central layer, 3, through hole, 4, the blind hole I, 5, the blind hole II.
Embodiment
As shown in Figure 1:
The printed circuit board (PCB) that a kind of double blinding hole homonymy arranges, comprise four layers of copper foil layer 1 and central layer 2, be provided with a central layer 2 between described every two-layer copper foil layer, be provided with the through hole 3 for four layers of copper foil layer of conducting between described the first copper foil layer to the four copper foil layers, be provided with blind hole I 4 between described the first copper foil layer to the second copper foil layer, be provided with blind hole II 5 between described the first copper foil layer to the three copper foil layers, described blind hole II 5 is between blind hole I 4 and through hole 3.
In the utility model, described central layer 2 comprises insulating barrier and conductive layer.
In the utility model, described insulating barrier is epoxy resin.
In the utility model, described conductive layer is electrolytic copper foil.
The utility model comprises following technique during fabrication:
Be followed successively by sequentially: sawing sheet, boring, deburring, heavy copper, panel plating, dry film, plating hole, move back film, polishing, the processing of plate face, internal layer dry film, internal layer etching, internal layer AOI, brown, lamination, boring etc.
Claims (4)
1. printed circuit board (PCB) that double blinding hole homonymy arranges, comprise four layers of copper foil layer (1) and central layer (2), be provided with a central layer (2) between described every two-layer copper foil layer, be provided with the through hole (3) for four layers of copper foil layer of conducting between described the first copper foil layer to the four copper foil layers, it is characterized in that: be provided with blind hole I (4) between described the first copper foil layer to the second copper foil layer, be provided with blind hole II (5) between described the first copper foil layer to the three copper foil layers, described blind hole II (5) is positioned between blind hole I (4) and through hole (3).
2. the printed circuit board (PCB) that arranges of a kind of double blinding according to claim 1 hole homonymy, it is characterized in that: described central layer (2) comprises insulating barrier and conductive layer.
3. the printed circuit board (PCB) that arranges of a kind of double blinding according to claim 2 hole homonymy, it is characterized in that: described insulating barrier is epoxy resin.
4. the printed circuit board (PCB) that arranges of a kind of double blinding according to claim 2 hole homonymy, it is characterized in that: described conductive layer is electrolytic copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220687148 CN202998658U (en) | 2012-12-13 | 2012-12-13 | Printed circuit board with two blind holes arranged at the same side |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220687148 CN202998658U (en) | 2012-12-13 | 2012-12-13 | Printed circuit board with two blind holes arranged at the same side |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202998658U true CN202998658U (en) | 2013-06-12 |
Family
ID=48569779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220687148 Expired - Fee Related CN202998658U (en) | 2012-12-13 | 2012-12-13 | Printed circuit board with two blind holes arranged at the same side |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202998658U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107135599A (en) * | 2017-07-05 | 2017-09-05 | 京东方科技集团股份有限公司 | A kind of wiring board and its wiring method, electronic installation |
-
2012
- 2012-12-13 CN CN 201220687148 patent/CN202998658U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107135599A (en) * | 2017-07-05 | 2017-09-05 | 京东方科技集团股份有限公司 | A kind of wiring board and its wiring method, electronic installation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20151213 |
|
| EXPY | Termination of patent right or utility model |