CN201811026U - Packaging structure of luminous semiconductor chip - Google Patents
Packaging structure of luminous semiconductor chip Download PDFInfo
- Publication number
- CN201811026U CN201811026U CN2010202847876U CN201020284787U CN201811026U CN 201811026 U CN201811026 U CN 201811026U CN 2010202847876 U CN2010202847876 U CN 2010202847876U CN 201020284787 U CN201020284787 U CN 201020284787U CN 201811026 U CN201811026 U CN 201811026U
- Authority
- CN
- China
- Prior art keywords
- semiconductor chip
- luminous semiconductor
- luminous
- encapsulating structure
- carriage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses a packaging structure of a luminous semiconductor chip, and comprises a luminous semiconductor chip and a lamp shade; the luminous semiconductor chip is fixed on a luminous semiconductor chip bracket; the lamp shade is fixedly connected with the luminous semiconductor chip bracket to form a closed cavity; and the luminous semiconductor chip is positioned in the cavity. The closed cavity is formed between the lamp shade and the luminous semiconductor chip, the luminous semiconductor chip is isolated from the outside and oxygen, is not dampened and oxidized easily, is encapsulated without epoxy resin, can be non-packed and can dissipate heat from each direction, and the heat-dissipation environment of the luminous semiconductor chip is further improved greatly, so that the normal working temperature of the luminous semiconductor chip can be ensured without using a radiator, and the packaging structure has low manufacturing cost and is favorable for popularization and application of products; and the packaging process is simple and favorable for large-scale production of the products.
Description
Technical field
The utility model relates to lighting technical field, particularly a kind of encapsulating structure of illuminating luminous semiconductor chip.
Background technology
Luminous semiconductor chip (LED) is exposed when luminous outside, and is oxidized easily and influence its service life.Be the protection luminous semiconductor chip; need in process of production luminous semiconductor chip to be encapsulated; and require after the luminous semiconductor chip encapsulation can printing opacity, and obviously, the quality of the packaging effect of luminous semiconductor chip directly influences the service life of LED lamp and goes out light effect.
Common a kind of luminous semiconductor chip packaged type is at present: luminous semiconductor chip is positioned on the support, then at luminous semiconductor chip surface spot printing fluorescent material, again to carrying out sealing (epoxy resin) on the luminous semiconductor chip and solidifying.In addition, can produce bigger heat when considering luminous semiconductor chip work, and the poor radiation of epoxy resin, and the operating temperature of luminous semiconductor chip is above after the certain numerical value, its life-span will fall suddenly, even just can not work in several hrs, therefore, normal for guaranteeing the luminous semiconductor chip operating temperature, need the corresponding luminous semiconductor chip of support lower surface position that the radiator of larger volume is set; This method for packing can protect luminous semiconductor chip not oxidized when guaranteeing luminous semiconductor chip operate as normal and printing opacity to a certain extent.But part still has some deficits: 1, after the sealing, luminous semiconductor chip can only be from its below heat radiation, need to use the radiator of larger volume to guarantee that its operating temperature is normal, and the radiator of the larger volume made from metal needs higher manufacturing cost, and because the radiator volume is bigger, there is the restriction of physical condition in the installation of its manufactured goods, has limited its scope of application.2, fluorescent material directly is coated in chip surface, because the existence of light scattering, its light extraction efficiency is low.3, fluorescent coating is relatively poor with its heat dispersion after the epoxy resin embedding, is subjected to ultraviolet radiation for a long time, occurs temperature quenching and situation such as aging easily, reduces luminous efficiency.Simultaneously, because the refractive index of fluorescent material and epoxy resin do not match, thereby reduced fluorescent material to the ray refraction effect.During 4, sealing (epoxy resin) operation, comparatively difficult to the control of glue amount, as all there is strict requirement colloid height, some glue position, otherwise can influences light effect; In addition, epoxy resin is retrogradation in use, produces the fluorescent material precipitation and causes the problem of bright dipping aberration.5, the thermal diffusivity of epoxy resin and hear resistance are relatively poor, and often before the life-span of semiconductor core itself arrived, the variable color situation just appearred in epoxy resin, influences light effect.
The utility model content
The purpose of this utility model is to provide a kind of encapsulating structure of luminous semiconductor chip, can effectively dispel the heat to luminous semiconductor chip, and the bright dipping of emitting semiconductor is effective, and not moisture-sensitive or oxidation, long service life, and cost is low, and is applied widely.
The encapsulating structure of luminous semiconductor chip described in the utility model comprises luminous semiconductor chip, lampshade, and described luminous semiconductor chip is fixed on the luminous semiconductor chip carriage; Described lampshade is fixedlyed connected with the luminous semiconductor chip carriage and is formed enclosed cavity, and luminous semiconductor chip is arranged in cavity.
The beneficial effects of the utility model are: at first, form enclosed cavity between lampshade and the luminous semiconductor chip carriage, make the luminous semiconductor chip and the external world and oxygen isolated, moisture-sensitive or oxidized not, and do not need to carry out embedding by epoxy resin, make luminous semiconductor chip to dispel the heat from all directions, greatly improved the heat dissipation environment of luminous semiconductor chip, thereby can not adopt radiator can guarantee that the luminous semiconductor chip operating temperature is normal, so its low cost of manufacture, volume can be adjusted as required, help product promote the use of and range of application can be more wide; Secondly, owing to sealed cavity is vacuum or is filled with inert gas, so its oxygen-proof property is better, and can satisfy moistureproof needs, the longer service life of corresponding luminous semiconductor chip; Moreover, infiltrate or be coated in outward on the lampshade owing to become luminescent material, itself and luminous semiconductor chip surface isolation, thermal diffusivity is good, does not have the light scattering situation, so its bright dipping better effects if; At last, packaging technology of the present utility model is simple, helps the large-scale production of this product.
Description of drawings
Fig. 1 is a kind of structural representation before lampshade of the present utility model and the sealing of luminous semiconductor chip carriage;
Fig. 2 is a kind of structural representation after the utility model encapsulation;
Fig. 3 is the another kind of structural representation after the utility model encapsulation;
Fig. 4 is the another kind of structural representation before lampshade of the present utility model and the sealing of luminous semiconductor chip carriage;
Fig. 5 is the structural representation after the utility model encapsulation;
Fig. 6 is the local enlarged detail of the A part of Fig. 5;
Fig. 7 is the another kind of structural representation after the utility model encapsulation.
The specific embodiment
Embodiment one
Shown in Fig. 1 to 6, the encapsulating structure of luminous semiconductor chip described in the utility model, comprise luminous semiconductor chip 3, lampshade 1, described luminous semiconductor chip 3 is fixed on the luminous semiconductor chip carriage 2, it is electrically connected with power supply by luminous semiconductor chip carriage 2, luminous semiconductor chip carriage 2 is electrically connected with power supply by the connected mode of existing LED light fixture, is electrically connected with power supply as the two pins 6 that stretches out by its underpart; Described lampshade 1 lower ending opening, it is fixedlyed connected with luminous semiconductor chip carriage 2 by opening and forms enclosed cavity 4, makes luminous semiconductor chip 3 be arranged in enclosed cavity 4, and is isolated with the external world and oxygen, be difficult for oxidized, also can be moistureproof.Described luminous semiconductor chip 3 can for one also can be for a plurality of, Fig. 1,2 is depicted as the situation of a luminous semiconductor chip 3, Fig. 3 is the situation of four luminous semiconductor chips.Described luminous semiconductor chip carriage 2 surface recombination have the material that can make printed circuit 7, and one or more luminous semiconductor chips 3 are fixed on the printed circuit 7, and the described material that can make printed circuit 7 can be materials such as copper, aluminium or silver.Described luminous semiconductor chip carriage 2 surfaces can be plane, the arc surfaced that outwards protrudes or irregularly shaped, luminous semiconductor chip 3 is evenly distributed on this surperficial printed circuit, be connected on the circuit by modes such as parallel connection or series connection, so that be applied to the occasion that different optical requires.Be illustrated in figure 4 as arc surfaced, luminous semiconductor chip 3 is evenly arranged on this surperficial printed circuit, and this arrangement mode makes it have broad field of illumination.The utility model does not need to carry out embedding by epoxy resin and can prevent that luminous semiconductor chip 3 is oxidized or make moist, make luminous semiconductor chip 3 to dispel the heat from all directions, greatly be apt to the heat dissipation environment of luminous semiconductor chip 3, thereby can not adopt radiator can guarantee that the luminous semiconductor chip operating temperature is normal, its low cost of manufacture, volume can be adjusted as required, and the installing space restriction is few, helps promoting the use of of product.
The material of described luminous semiconductor chip carriage 2 can be metals such as copper, iron, aluminium, also can be that conductivity ceramics etc. is nonmetal.
Described lampshade 1 is made by the Heat Conduction Material of printing opacity, and it can play the optically focused effect under certain distance.Described Heat Conduction Material can be materials such as glass, devitrified glass or nano ceramics.Be impregnated with or scribble the change luminescent material in the described lampshade 1 outward, itself and luminous semiconductor chip 3 surface isolation, thermal diffusivity is good, does not have the light scattering situation, so its bright dipping better effects if, and this becomes luminescent material can be fluorescent material.
For preventing that further luminous semiconductor chip 3 oxidations from influencing its illumination effect and service life, can vacuumize or fill inert gas with enclosed cavity 4.The halogen of inert gas and part gaseous state can produce the effect that becomes light, may be defined as changeable colour gas, therefore, can in enclosed cavity 4, inject changeable colour gas, reach the effect that becomes light, even can substitute the change luminescent material such as fluorescent material of costliness, thereby further reduce cost.
As shown in Figure 4, be the light source that utilizes luminous semiconductor chip 3 to be produced better, can at least one reflector that caves inward 5 be set on described luminous semiconductor chip carriage 2 surfaces, luminous semiconductor chip 3 is placed in the reflector 5, reflect away by the scattered light of reflector 5, to improve the light emission rate of luminous semiconductor chip 3 luminous semiconductor chip 3 peripheries.
Under certain situation, outside luminous semiconductor chip carriage 2 times or lampshade, can load onto fin to increase radiating rate.
The method for packing of luminous semiconductor chip of the present utility model comprises the steps:
A, will become luminescent material and mix,, perhaps become luminescent material in the spraying of the surface of in type transparent lamp shade by traditional manufacturing process one-shot forming lampshade 1 with the Heat Conduction Material of printing opacity;
B, luminous semiconductor chip 3 is fixed on the luminous semiconductor chip carriage 2;
C, lampshade 1 is connected with the luminous semiconductor chip carriage 2 that is fixed with luminous semiconductor chip 3;
D, lampshade 1 bottom is heated, make its fusing reducing and be close to luminous semiconductor chip carriage 2 outer walls, form sealed cavity 4, simultaneously sealed cavity 4 is vacuumized, perhaps fill inert gas, perhaps in sealed cavity 4, inject changeable colour gas toward sealed cavity 4.
Packaging technology of the present utility model is simple, mainly by lampshade 1 bottom is heated, makes its fusing reducing and luminous semiconductor chip carriage 2 form sealed cavity, with protection luminous semiconductor chip 3, helps the large-scale production of this product.When lampshade 1 bottom is heated, take to set up thermal insulation board or hot spot measure such as is cooled off immediately near luminous semiconductor chip 3 one sides at hot spot and 3 of luminous semiconductor chips, prevent that luminous semiconductor chip 3 is overheated.
Among the described step B, its fixed form is that flanging is fixed, welded, clamping or gluing.
Embodiment two
As shown in Figure 7, the encapsulating structure of luminous semiconductor chip described in the utility model comprises luminous semiconductor chip 3, lampshade 1, and described luminous semiconductor chip 3 is fixed on the luminous semiconductor chip carriage 2; Described lampshade 1 is made up of Lamp cup 8 and saturating lid 9, fixedlys connected with the luminous semiconductor chip carriage in Lamp cup 8 bottoms, the Lamp cup upper end open, and it is fixedlyed connected with saturating lid 9 by opening and forms enclosed cavity 4, and luminous semiconductor chip 3 is arranged in cavity 4.Make luminous semiconductor chip 3 isolated with the external world and oxygen, be difficult for oxidized, also can be moistureproof.Described luminous semiconductor chip carriage 2 surfaces can be plane, inside recessed arc surfaced or irregularly shaped, luminous semiconductor chip 3 is evenly distributed on this surperficial printed circuit, be connected on the circuit by modes such as parallel connection or series connection, so that be applied to the occasion that different optical requires.Other structures and operation principle in the encapsulating structure of the described luminous semiconductor chip of present embodiment are mutually identical with enforcement 1, repeat no more here.
The method for packing of luminous semiconductor chip of the present utility model comprises the steps:
A, will become luminescent material and mix,, perhaps become luminescent material in the spraying of the surface of the saturating lid of in type printing opacity by the saturating lid 9 of traditional manufacturing process moulding with the Heat Conduction Material of printing opacity;
B, luminous semiconductor chip 3 is fixed on the luminous semiconductor chip carriage 2;
C, fixedlyed connected with the luminous semiconductor chip carriage 2 that is fixed with luminous semiconductor chip 3 in Lamp cup 8 bottoms:
D, will cover thoroughly 9 with the open butt joint of Lamp cup 8 upper ends, and be fixedly connected to form sealed cavity 4, simultaneously sealed cavity 4 is vacuumized, perhaps fill inert gases toward sealed cavity 4, perhaps in sealed cavity 4, inject changeable colour gas.
Packaging technology of the present utility model is simple, mainly by make Lamp cup 8, thoroughly cover 9 and luminous semiconductor chip 3 between form sealed cavity 4, with protection luminous semiconductor chip 3, help the large-scale production of this product.
Described going up among the step D, its fixed form are gluing fixing, and be gluing as passing through silica gel.Described Lamp cup is by the traditional handicraft moulding.
Claims (10)
1. the encapsulating structure of a luminous semiconductor chip comprises luminous semiconductor chip (3), lampshade (1), it is characterized in that: described luminous semiconductor chip (3) is fixed on the luminous semiconductor chip carriage (2); Described lampshade (1) is fixedlyed connected with luminous semiconductor chip carriage (2) and is formed enclosed cavity (4), and luminous semiconductor chip (3) is arranged in enclosed cavity (4).
2. the encapsulating structure of luminous semiconductor chip according to claim 1, it is characterized in that: the integral body that described lampshade (1) is formed in one, its lower ending opening, fixedly connected with luminous semiconductor chip carriage (2) and form enclosed cavity (4) by opening, luminous semiconductor chip (3) is arranged in enclosed cavity (4).
3. the encapsulating structure of luminous semiconductor chip according to claim 1, it is characterized in that: described lampshade (1) is made up of Lamp cup (8) and saturating lid (9), fixedly connected with luminous semiconductor chip carriage (2) in Lamp cup (8) bottom, Lamp cup (8) upper end open, it is fixedlyed connected with saturating lid (9) by opening and forms enclosed cavity (4), and luminous semiconductor chip (3) is arranged in enclosed cavity (4).
4. according to the encapsulating structure of claim 2 or 3 described luminous semiconductor chips, it is characterized in that: described enclosed cavity (4) is for vacuum or be filled with inert gas.
5. according to the encapsulating structure of claim 2 or 3 described luminous semiconductor chips, it is characterized in that: described lampshade (1) surface scribbles and becomes luminescent material, is mixed with to become luminescent material or charge in described closed cavity (4) in the lampshade material and can changes photochromic gas.
6. the encapsulating structure of luminous semiconductor chip according to claim 5, it is characterized in that: described change luminescent material is fluorescent material.
7. according to the encapsulating structure of claim 2 or 3 described luminous semiconductor chips, it is characterized in that: described lampshade (1) is made by the Heat Conduction Material of printing opacity.
8. the encapsulating structure of luminous semiconductor chip according to claim 7, it is characterized in that: described Heat Conduction Material is glass, devitrified glass or nano ceramics.
9. according to the encapsulating structure of claim 2 or 3 described luminous semiconductor chips, it is characterized in that: be fixed with at least one luminous semiconductor chip (3) on the described luminous semiconductor chip carriage (2), luminous semiconductor chip carriage (2) surface recombination has the material that can make printed circuit (7), and one or more luminous semiconductor chips (3) are fixed on the printed circuit (7).
10. the encapsulating structure of luminous semiconductor chip according to claim 9, it is characterized in that: described luminous semiconductor chip carriage (2) is a metal or nonmetal, the surface is plane, arc surfaced or irregularly shaped, and luminous semiconductor chip (3) is connected with circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202847876U CN201811026U (en) | 2010-08-06 | 2010-08-06 | Packaging structure of luminous semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202847876U CN201811026U (en) | 2010-08-06 | 2010-08-06 | Packaging structure of luminous semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201811026U true CN201811026U (en) | 2011-04-27 |
Family
ID=43893966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202847876U Expired - Fee Related CN201811026U (en) | 2010-08-06 | 2010-08-06 | Packaging structure of luminous semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201811026U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101975340A (en) * | 2010-08-06 | 2011-02-16 | 敬俊 | Packaging structure of luminous semiconductor chip and packaging method thereof |
-
2010
- 2010-08-06 CN CN2010202847876U patent/CN201811026U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101975340A (en) * | 2010-08-06 | 2011-02-16 | 敬俊 | Packaging structure of luminous semiconductor chip and packaging method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102751274A (en) | Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip | |
| CN201539737U (en) | LED lamp | |
| CN101975340A (en) | Packaging structure of luminous semiconductor chip and packaging method thereof | |
| CN201667346U (en) | Surface-picked and placed LED apparatus and display screen using same | |
| CN201844264U (en) | Light-emitting diode (LED) lamp | |
| CN201190979Y (en) | LED light-emitting device with high thermal diffusivity | |
| CN203941950U (en) | A kind of LED package assembling | |
| CN201811026U (en) | Packaging structure of luminous semiconductor chip | |
| CN103022319A (en) | Light emitting diode (LED) encapsulating structure | |
| CN104218139A (en) | Novel LED package structure | |
| CN101257010A (en) | LED illuminating device with high heat radiation performance | |
| CN103367609A (en) | Low space color cast LED packaging structure | |
| CN102148319A (en) | High-power white light emitting diode (LED) light source packaging structure | |
| CN202018990U (en) | High-power white-light LED light source encapsulating structure | |
| CN102980076B (en) | LED bulb lamp | |
| CN202708751U (en) | Uniform-light type light-emitting diode (LED) tube light | |
| CN202120908U (en) | Single-lead light-emitting diode (LED) module | |
| CN215220749U (en) | Light source packaging structure and LED bulb | |
| CN107482100A (en) | A kind of TOP LED supports with great heat radiation effect | |
| CN205081143U (en) | Two -sided luminous UV encapsulation of LED stereoplasm base plate | |
| CN203118985U (en) | Led packaging structure | |
| CN202972699U (en) | Parabolic aluminum reflector (PAR) lamp | |
| CN207753042U (en) | A kind of inorganic encapsulated LED | |
| CN217768372U (en) | High-light-efficiency high-temperature-resistant LED lamp | |
| CN103928602B (en) | A kind of LED module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110427 Termination date: 20120806 |