CN201752002U - 一种薄型桥式整流器 - Google Patents

一种薄型桥式整流器 Download PDF

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Publication number
CN201752002U
CN201752002U CN2010202470348U CN201020247034U CN201752002U CN 201752002 U CN201752002 U CN 201752002U CN 2010202470348 U CN2010202470348 U CN 2010202470348U CN 201020247034 U CN201020247034 U CN 201020247034U CN 201752002 U CN201752002 U CN 201752002U
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Prior art keywords
copper
bridge rectifier
tablet
copper sheet
pins
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Expired - Lifetime
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CN2010202470348U
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安国星
李述洲
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Chongqing Pingwei Enterprise Co Ltd
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Chongqing Pingwei Enterprise Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

本实用新型公开了一种薄型桥式整流器，该整流器包括铜料片、玻璃钝化硅芯片、铜跳线，铜料片带有四只引脚，四只引脚均位于铜料片一侧；玻璃钝化硅芯片位于铜料片和铜跳线之间，通过焊料与铜料片和铜跳线固定；铜料片、铜跳线及玻璃钝化硅芯片均包裹在环氧树脂注塑封装的塑封体内，仅铜料片的四只引脚外露。本实用新型的有益效果：结构简单，产品整体尺寸缩小，解决了目前小型化产品无法安装桥式整流器的问题。

Description

一种薄型桥式整流器
技术领域
本实用新型涉及一种半导体整流器件，特别涉及一种薄型桥式整流器。
背景技术
我国的新型电子元器件行业才刚刚起步，目前虽然技术水平不断提高，生产规模也不断扩大，但仍远远满足不了国内市场的需求，因此在今后几十年内市场前景巨大。
当今，我国已成为世界最大的节能灯、家用电器、电脑及通信产品生产与消费大国之一，随着家用电器和通信产品的日益增多，国内对电源设备的需求将不断增加，市场也将随之拓展。
随着电子技术的发展，桥式整流器的需求量逐步增大，但目前的产品普遍整体结构较大，无法交付生产小型产品的客户安装使用，缩小其整体体积又会导致无法保障其性能。
实用新型内容
本实用新型公开了一种薄型桥式整流器，该桥式整流器在保证原性能的情况下解决了上述问题。
为了达到上述目的，本实用新型采用的技术方案是：一种薄型桥式整流器，该整流器包括铜料片、玻璃钝化硅芯片、铜跳线，铜料片带有四只引脚，四只引脚均位于铜料片一侧；玻璃钝化硅芯片位于铜料片和铜跳线之间，通过焊料与铜料片和铜跳线固定；铜料片、铜跳线及玻璃钝化硅芯片均包裹在环氧树脂注塑封装的塑封体内，仅铜料片的四只引脚外露。
本实用新型的有益效果：结构简单，保证产品性能的同时产品整体尺寸缩小，解决了目前小型化产品无法安装桥式整流器的问题。
附图说明
图1为本实用新型剖开环氧塑封体的结构示意图图示一；
图2为本实用新型剖开环氧塑封体的结构示意图图示二。
具体实施方式
为使本实用新型更容易被理解，下面结合具体实施方式和附图对本实用新型做更详细说明。
参阅图1、图2，一种薄型桥式整流器，该整流器包括铜料片2、玻璃钝化硅芯片5、铜跳线3，铜料片2带有四只引脚4，四只引脚4均位于铜料片2一侧；玻璃钝化硅芯片5位于铜料片2和铜跳线3之间，通过焊料与铜料片2和铜跳线3固定；铜料片2、铜跳线3及玻璃钝化硅芯片5均包裹在环氧树脂注塑封装的塑封体1内，仅铜料片2的四只引脚4外露。
由于本实用新型采用了薄型的料片式的结构，使焊接后半成品很薄，经环氧树脂注塑后，其整体尺寸更小、更薄，完全适应客户小型化产品的需求，解决了客户安装上的困扰。

Claims (1)

1.一种薄型桥式整流器，其特征在于：该整流器包括铜料片、玻璃钝化硅芯片、铜跳线，铜料片带有四只引脚，四只引脚均位于铜料片一侧；玻璃钝化硅芯片位于铜料片和铜跳线之间，通过焊料与铜料片和铜跳线固定；铜料片、铜跳线及玻璃钝化硅芯片均包裹在环氧树脂注塑封装的塑封体内，仅铜料片的四只引脚外露。
CN2010202470348U 2010-07-02 2010-07-02 一种薄型桥式整流器 Expired - Lifetime CN201752002U (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104810343A (zh) * 2014-01-28 2015-07-29 英飞凌科技奥地利有限公司 具有多个接触夹片的半导体器件
CN106449536A (zh) * 2016-03-25 2017-02-22 苏州固锝电子股份有限公司 抗浪涌型表面贴装半导体器件
CN106449537A (zh) * 2016-03-25 2017-02-22 苏州固锝电子股份有限公司 散热片结构超薄型表面贴装整流桥器件
CN108807302A (zh) * 2015-10-08 2018-11-13 苏州固锝电子股份有限公司 整流桥式半导体器件

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104810343A (zh) * 2014-01-28 2015-07-29 英飞凌科技奥地利有限公司 具有多个接触夹片的半导体器件
US9837380B2 (en) 2014-01-28 2017-12-05 Infineon Technologies Austria Ag Semiconductor device having multiple contact clips
CN104810343B (zh) * 2014-01-28 2018-02-09 英飞凌科技奥地利有限公司 具有多个接触夹片的半导体器件
CN108807302A (zh) * 2015-10-08 2018-11-13 苏州固锝电子股份有限公司 整流桥式半导体器件
CN106449536A (zh) * 2016-03-25 2017-02-22 苏州固锝电子股份有限公司 抗浪涌型表面贴装半导体器件
CN106449537A (zh) * 2016-03-25 2017-02-22 苏州固锝电子股份有限公司 散热片结构超薄型表面贴装整流桥器件

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Granted publication date: 20110223