CN201748700U - Flue gas condenser - Google Patents

Flue gas condenser Download PDF

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Publication number
CN201748700U
CN201748700U CN2010202758232U CN201020275823U CN201748700U CN 201748700 U CN201748700 U CN 201748700U CN 2010202758232 U CN2010202758232 U CN 2010202758232U CN 201020275823 U CN201020275823 U CN 201020275823U CN 201748700 U CN201748700 U CN 201748700U
Authority
CN
China
Prior art keywords
heat
semiconductor refrigerating
dissipating
flue gas
gas condenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010202758232U
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Chinese (zh)
Inventor
刘向翌
谭麟德
张有温
梅振礼
苏润艇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHUANYI OPERATION COMPLETE EQUIPMENT Co Ltd SHANDONG
Original Assignee
CHUANYI OPERATION COMPLETE EQUIPMENT Co Ltd SHANDONG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHUANYI OPERATION COMPLETE EQUIPMENT Co Ltd SHANDONG filed Critical CHUANYI OPERATION COMPLETE EQUIPMENT Co Ltd SHANDONG
Priority to CN2010202758232U priority Critical patent/CN201748700U/en
Application granted granted Critical
Publication of CN201748700U publication Critical patent/CN201748700U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

A flue gas condenser solves the problem of bad heat-dissipating effect of the existing condenser, and comprises a semiconductor refrigerating block, a cold trap arranged on the end face of the semiconductor refrigerating block, and a heat-dissipating substrate adhered to the hot end face of the semiconductor refrigerating block. A heat-dissipating fin is arranged at the other side of the heat-dissipating substrate. A heat pipe is arranged in the heat-dissipating substrate. The heat pipe is also inserted into the heat-dissipating fin. During working, the heat plane of the semiconductor refrigerating block continuously produces heat quantity which is quickly transferred to the heat-dissipating fin through the heat-dissipating substrate and the heat pipe at the same time and then emitted by the heat-dissipating fin so that the actual temperature at the heat end of the semiconductor refrigerating block is close to the limit of the temperature on the surface of an aluminum radiator, thereby improving efficiency of the semiconductor refrigerating block.

Description

A kind of flue gas condenser
Technical field
The utility model relates to the flue gas condenser in the better semi-conductor dehumidifying device of a kind of condensation effect.
Background technology
The semi-conductor dehumidifying device compare with traditional mechanical compressor formula dehumidifier have pollution-free, volume is little, in light weight, cost is low, no any mechanical rotation part itself, thereby the noiseless that works together, easy to maintenance, popularizing application prospect is good.Usually, using is fully can operate as normal in being furnished with the analysis cabin of air-conditioning.But the main weak point of this semi-conductor dehumidifying device is environment temperature is required than higher, and limit to some extent the application place, and environment temperature is higher than 40 degree and can't uses substantially.
For example adopting model is that to form refrigerating capacity be 133.6 watts refrigeration source for the semiconductor refrigerating piece of TEC1-12704.3.9 amperes of monolithic TEC1-12704 maximum operating currenbts, the temperature difference 67 degree, 33.4 watts of refrigerating capacitys.Refrigeration source adopts direct current supply to use for refrigerating block.During work, forced air cooling and refrigerating block power up work synchronously, and the conductor refrigeration piece can not stop air-cooled in the course of the work.The hot junction face actual temperature of semiconductor refrigerating piece is always than spreader surface temperature height, also there is thermograde between the cold-trap space that is cooled and the cold junction face of semiconductor refrigerating piece, only under heat radiation, the fabulous condition of conducting heat, just can reduce their thermograde, so select for use high-quality aluminum conductive material to make radiator.In order to guarantee the hot plane of semiconductor refrigerating piece good heat radiating, prevent device failure, the sturdy and filling in Aluminium Radiator and the hot plane of semiconductor refrigerating piece is added be coated with the high-quality heat-conducting silicone grease.Sturdy and the filling of semiconductor refrigerating piece cold junction face and cold-trap veneer adds and is coated with the high-quality heat-conducting silicone grease.Device is in continuous operation, and hot-face temperature is low more, and the huyashi-chuuka (cold chinese-style noodles) temperature of device is also low more, so Aluminium Radiator should have enough big area, in the hope of cold-trap cooling effect is preferably arranged.So how to strengthen radiating efficiency is the target of always pursuing in the design.
Summary of the invention
The flue gas condenser that provides a kind of radiating effect fabulous is provided the purpose of this utility model, and is simple in structure simultaneously, long service life.
The technical scheme in the invention for solving the technical problem is: comprise the semiconductor refrigerating piece, be arranged on cold cold junction face of semiconductor cold-trap, invest the heat radiation matrix of semiconductor refrigerating piece hot junction face, the opposite side of described heat radiation matrix is with radiating fin, the characteristics of this programme are: be provided with heat pipe in the described heat radiation matrix, described heat pipe also is inserted in the radiating fin.Described heat radiation matrix is an Aluminium Radiator.The U-shaped that described heat pipe integral body forms for bending.Described radiating fin is provided with fan.
During the utility model work, the hot plane of semiconductor refrigerating piece continuously produces heat, and heat reaches radiating fin rapidly simultaneously by heat radiation matrix and heat pipe, is distributed by radiating fin.
The beneficial effects of the utility model can be learnt according to the narration to such scheme, because heat pipe has the good heat transfer performance, its heat conduction velocity is 30,000 times of argent, the heat that absorbs semiconductor refrigerating piece hot junction face can be delivered to radiating fin rapidly, under the effect of fan, heat is blown away, and the heat that makes its derivation is extremely near the heat that absorbs.Make the hot junction actual temperature and the Aluminium Radiator surface temperature of semiconductor refrigerating piece extremely approaching, improved the efficient of semiconductor refrigerating piece, enlarged the scope of application of semi-conductor dehumidifying device, the environment temperature that the semi-conductor dehumidifying device is adapted to is promoted to 60 degrees centigrade.
Description of drawings
Fig. 1 is a structure chart of the present utility model.
Fig. 2 is the cross section view of Fig. 1.
Among the figure: 1 cold-trap, 2 semiconductor refrigerating pieces, 3 heat radiation matrixes, 4 radiating fins,
5 radiator fans, 6 heat pipes.
The specific embodiment
Shown in Fig. 1, Fig. 2, a kind of flue gas condenser comprises cold-trap 1, semiconductor refrigerating piece 2, heat radiation matrix 3, radiating fin 4, radiator fan 5, heat pipe 6.Semiconductor refrigerating piece 2 cold-smoothing faces and cold-trap 1 veneer is sturdy and filling adds and is coated with the high-quality heat-conducting silicone grease, simultaneously, sturdy and filling adds and is coated with the high-quality heat-conducting silicone grease with heat radiation matrix 3 veneers on semiconductor refrigerating piece 2 hot planes.Radiating fin 4 invests the outside of heat radiation matrix 3, increases radiator fan 5 simultaneously to increase heat radiation, is fixed together by screw each other.
Heat pipe 6 preferred inorganic medium hot pipe techniques, its whole U-shaped that forms for bending, a part is inserted in the matrix 3 that dispels the heat, and another part is inserted in the radiating fin 4, and the heat on semiconductor refrigerating piece 2 hot planes is reached radiating fin 4 parts rapidly through heat pipe.Described heat pipe 6 can be many, is used in combination, and forms heat pipe array, to strengthen heat-conducting effect.
As preferably, described heat radiation matrix 3 is an Aluminium Radiator.
During the utility model work, semiconductor refrigerating piece 2 hot planes continuously produce heat, and heat reaches radiating fin 4 rapidly simultaneously by heat radiation matrix 3 and heat pipe 6, distributes under the effect of radiator fan 5.
Except that the described technical characterictic of specification, be the known technology of those skilled in the art.

Claims (4)

1. flue gas condenser, comprise the semiconductor refrigerating piece, be arranged on cold cold junction face of semiconductor cold-trap, invest the heat radiation matrix of semiconductor refrigerating piece hot junction face, the opposite side of described heat radiation matrix is with radiating fin, it is characterized in that: be provided with heat pipe in the described heat radiation matrix, described heat pipe also is inserted in the radiating fin.
2. a kind of flue gas condenser according to claim 1 is characterized in that: described heat radiation matrix is an Aluminium Radiator.
3. a kind of flue gas condenser according to claim 1 and 2 is characterized in that: the U-shaped that described heat pipe integral body forms for bending.
4. a kind of flue gas condenser according to claim 1 is characterized in that: the described radiating fin outside is provided with fan.
CN2010202758232U 2010-07-30 2010-07-30 Flue gas condenser Expired - Fee Related CN201748700U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202758232U CN201748700U (en) 2010-07-30 2010-07-30 Flue gas condenser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202758232U CN201748700U (en) 2010-07-30 2010-07-30 Flue gas condenser

Publications (1)

Publication Number Publication Date
CN201748700U true CN201748700U (en) 2011-02-16

Family

ID=43583374

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202758232U Expired - Fee Related CN201748700U (en) 2010-07-30 2010-07-30 Flue gas condenser

Country Status (1)

Country Link
CN (1) CN201748700U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105318612A (en) * 2015-12-05 2016-02-10 广东志高空调有限公司 Thermoelectric cooling system for super-cooling section of air-conditioner condenser
CN107404814A (en) * 2016-05-19 2017-11-28 拜默实验设备(上海)股份有限公司 A kind of cabinet for being used to install nitrogen gas generator device
CN108759501A (en) * 2018-06-15 2018-11-06 孙崇正 A kind of assembled flue gas condenser

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105318612A (en) * 2015-12-05 2016-02-10 广东志高空调有限公司 Thermoelectric cooling system for super-cooling section of air-conditioner condenser
CN107404814A (en) * 2016-05-19 2017-11-28 拜默实验设备(上海)股份有限公司 A kind of cabinet for being used to install nitrogen gas generator device
CN107404814B (en) * 2016-05-19 2023-04-21 拜默实验设备(上海)股份有限公司 A quick-witted case for installing nitrogen generator device
CN108759501A (en) * 2018-06-15 2018-11-06 孙崇正 A kind of assembled flue gas condenser

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110216

Termination date: 20110730