CN200972284Y - Semiconductor refrigerator - Google Patents
Semiconductor refrigerator Download PDFInfo
- Publication number
- CN200972284Y CN200972284Y CN 200620111769 CN200620111769U CN200972284Y CN 200972284 Y CN200972284 Y CN 200972284Y CN 200620111769 CN200620111769 CN 200620111769 CN 200620111769 U CN200620111769 U CN 200620111769U CN 200972284 Y CN200972284 Y CN 200972284Y
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- China
- Prior art keywords
- heat
- base plate
- metal
- cooling device
- piece
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a semi-conductor refrigerating device, including a semi-conductor refrigerating bloc, a heat insulation layer arranged outside the semi-conductor refrigerating bloc, an installation rack and a cooling device positioned on the installation rack to transfer the cold energy of the semi-conductor refrigerating bloc to the outside environment. The heat insulation layer is positioned on the installation rack. The device is characterized by a heat transfer element transferring the heat of the semi-conductor refrigerating bloc, a cooling device radiating the heat of the heat-conductive elements and positioning on the installation rack, a first fan that exhausts the heat of the cooling device and a second fan that exhausts the cold air of the cooling device. The device is high in refrigerating efficiency, low in energy consumption and manufacturing cost and cheap in price.
Description
Technical field
The utility model relates to a kind of semiconductor cooling device, relates in particular to a kind of semiconductor cooling device that wine cabinet is used that stores up.
Background technology
The conventional semiconductor refrigerating plant comprises the semiconductor refrigerating piece, is located at semiconductor refrigerating piece outer heat-insulation layer and installing rack; Heat-insulation layer is located on the installing rack.Its refrigerating efficiency is low, compares electricity wasting, the manufacturing cost height.
The utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art and a kind of refrigerating efficiency height is provided, and energy consumption is low, low cost of manufacture and low-cost semiconductor cooling device.
In order to achieve the above object, the utility model is achieved in that it is a kind of semiconductor cooling device, comprises the semiconductor refrigerating piece, be located at the outer heat-insulation layer of semiconductor refrigerating piece, installing rack and be located at the cooler of on the installing rack cold of semiconductor refrigerating piece being derived; Heat-insulation layer is located on the installing rack; It is characterized in that: also comprise the heat-conducting piece that semiconductor refrigerating piece heat is derived, the heat of heat-conducting piece is shed and be located at radiator on the installing rack, first fan that the hot gas of radiator is discharged and second fan that the cold air of cooler is blown out.
Described radiator comprises that heat dissipation metal base plate and end grafting are fixed on the metal fin on the base plate; The heat dissipation metal base plate is located on the installing rack.
Be provided with the oblique cutting groove on described heat dissipation metal base plate, an end of metal fin is plugged in the oblique cutting groove and fixes; On metal fin, be provided with plural louvre.
Described cooler comprises that metal cold scattering base plate and end grafting are fixed on the metal cold scattering piece on the base plate; Metal cold scattering base plate is located on the installing rack.
Be provided with the oblique cutting groove on described metal cold scattering base plate, an end of metal cold scattering piece is plugged in the oblique cutting groove and fixes; On the metal cold scattering piece, be provided with plural cold scattering hole.
Between the described radiator and first fan, be provided with PLASTIC LAMINATED; PLASTIC LAMINATED is located on the installing rack, and first fan is located on the wind shutter, is provided with the ventilation fan mouth on PLASTIC LAMINATED.
The utility model advantage compared with prior art is, the refrigerating efficiency height, and energy consumption is low, low cost of manufacture and low price.
Description of drawings
Fig. 1 is an explosive view of the present utility model;
Fig. 2 is a stereogram of the present utility model;
Fig. 3 is the side enlarged drawing of radiator;
Fig. 4 is the side enlarged drawing of cooler;
Fig. 5 is user mode figure of the present utility model.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further described
Shown in Fig. 1 to 4, its a kind of semiconductor cooling device, comprise semiconductor refrigerating piece 5, be located at the outer heat-insulation layer 4 of semiconductor refrigerating piece, installing rack 3, be located at the cooler 2 of on the installing rack cold of semiconductor refrigerating piece being derived, the heat-conducting piece 6 that the heat of semiconductor refrigerating piece is derived, the heat of heat-conducting piece shed and be located at radiator 7 on the installing rack, first fan 9 that the hot gas of radiator is discharged, second fan 1 that the cold air of cooler is blown out and be located at radiator and first fan between be provided with PLASTIC LAMINATED 8.Heat-insulation layer and PLASTIC LAMINATED all are located on the installing rack 3, and first fan is located on the wind shutter, are provided with ventilation fan mouth 81 on PLASTIC LAMINATED.In the present embodiment, radiator 7 comprises that heat dissipation metal base plate 71 and end grafting are fixed on the metal fin 72 on the base plate, is provided with oblique cutting groove 711 on the heat dissipation metal base plate, and an end of metal fin 72 is plugged in the oblique cutting groove and fixes; The heat dissipation metal base plate is an aluminium alloy plate, and metal fin is an aluminum alloy sheet; The heat dissipation metal base plate is located on the installing rack 3; For more effective heat radiation, on metal fin, be provided with plural louvre 721.Cooler 2 comprises that metal cold scattering base plate 21 and end grafting are fixed on the metal cold scattering piece 22 on the base plate, is provided with oblique cutting groove 211 on metal cold scattering base plate, and an end of metal cold scattering piece 22 is plugged in the oblique cutting groove and fixes; Metal cold scattering base plate is an aluminium alloy plate, and the metal cold scattering piece is an aluminum alloy sheet; Metal cold scattering base plate is located on the installing rack 3; In order to make in cold scattering and to prevent to freeze, on the metal cold scattering piece, be provided with plural cold scattering hole 221.
During work, when semiconductor refrigerating piece 5 conducted the heat that is produced to heat-conducting piece 6, also the cold with its generation conducted to cooler 2, and heat-conducting piece sheds heat again by radiator 7; Because the cold scattering and the good heat dissipation effect of cooler and radiator, so the refrigerating efficiency height of whole semiconductor cooling device, energy consumption is also low.
Claims (6)
1, a kind of semiconductor cooling device comprises the semiconductor refrigerating piece, is located at the outer heat-insulation layer of semiconductor refrigerating piece, installing rack and be located at the cooler of on the installing rack cold of semiconductor refrigerating piece being derived; Heat-insulation layer is located on the installing rack; It is characterized in that: also comprise the heat-conducting piece (6) that the heat of semiconductor refrigerating piece (5) is derived, the heat of heat-conducting piece shed and be located at radiator (7) on the installing rack (3), first fan (9) that the hot gas of radiator is discharged and second fan (1) that the cold air of cooler is blown out.
2, semiconductor cooling device according to claim 1 is characterized in that: radiator (7) comprises that heat dissipation metal base plate (71) and end grafting are fixed on the metal fin (72) on the base plate; The heat dissipation metal base plate is located on the installing rack (3).
3, semiconductor cooling device according to claim 2 is characterized in that: be provided with oblique cutting groove (711) on heat dissipation metal base plate (71), an end of metal fin (72) is plugged in the oblique cutting groove and fixes; On metal fin, be provided with plural louvre (721).
4, semiconductor cooling device according to claim 1 is characterized in that: cooler (2) comprises that metal cold scattering base plate (21) and end grafting are fixed on the metal cold scattering piece (22) on the base plate; Metal cold scattering base plate is located on the installing rack (3).
5, semiconductor cooling device according to claim 4 is characterized in that: be provided with oblique cutting groove (211) on metal cold scattering base plate (21), an end of metal cold scattering piece (22) is plugged in the oblique cutting groove and fixes; On the metal cold scattering piece, be provided with plural cold scattering hole (221).
6, semiconductor cooling device according to claim 1 is characterized in that: be provided with PLASTIC LAMINATED (8) between radiator (7) and first fan (9); PLASTIC LAMINATED is located on the installing rack (3), and first fan is located on the wind shutter, is provided with ventilation fan mouth (81) on PLASTIC LAMINATED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620111769 CN200972284Y (en) | 2006-11-17 | 2006-11-17 | Semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620111769 CN200972284Y (en) | 2006-11-17 | 2006-11-17 | Semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200972284Y true CN200972284Y (en) | 2007-11-07 |
Family
ID=38883537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620111769 Expired - Fee Related CN200972284Y (en) | 2006-11-17 | 2006-11-17 | Semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200972284Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105588363A (en) * | 2016-02-24 | 2016-05-18 | 南京诺尔曼生物技术有限公司 | Refrigerating system applied to chemiluminescence measurement |
| CN107150181A (en) * | 2016-03-03 | 2017-09-12 | Ap系统股份有限公司 | Quasi-molecule laser annealing process laser beam adjustment module |
| CN107280338A (en) * | 2017-07-28 | 2017-10-24 | 成都口口鲜猫信息技术有限公司 | A kind of fresh-keeping lattice and antistaling cabinet |
| CN107997259A (en) * | 2018-01-17 | 2018-05-08 | 北京广顺和科技有限公司 | Semiconductor cooling takes |
| CN110849029A (en) * | 2019-11-20 | 2020-02-28 | 合肥美菱物联科技有限公司 | Semiconductor refrigeration assembly and refrigerator |
-
2006
- 2006-11-17 CN CN 200620111769 patent/CN200972284Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105588363A (en) * | 2016-02-24 | 2016-05-18 | 南京诺尔曼生物技术有限公司 | Refrigerating system applied to chemiluminescence measurement |
| CN107150181A (en) * | 2016-03-03 | 2017-09-12 | Ap系统股份有限公司 | Quasi-molecule laser annealing process laser beam adjustment module |
| CN107280338A (en) * | 2017-07-28 | 2017-10-24 | 成都口口鲜猫信息技术有限公司 | A kind of fresh-keeping lattice and antistaling cabinet |
| CN107997259A (en) * | 2018-01-17 | 2018-05-08 | 北京广顺和科技有限公司 | Semiconductor cooling takes |
| CN110849029A (en) * | 2019-11-20 | 2020-02-28 | 合肥美菱物联科技有限公司 | Semiconductor refrigeration assembly and refrigerator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |