CN201681969U - 一种小功率led封装结构 - Google Patents

一种小功率led封装结构 Download PDF

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CN201681969U
CN201681969U CN2010201674742U CN201020167474U CN201681969U CN 201681969 U CN201681969 U CN 201681969U CN 2010201674742 U CN2010201674742 U CN 2010201674742U CN 201020167474 U CN201020167474 U CN 201020167474U CN 201681969 U CN201681969 U CN 201681969U
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low
gold thread
led wafer
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任瑞奇
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SHENZHEN SMALITE OPTOELECTRONICS CO Ltd
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Abstract

本实用新型涉及一种小功率LED封装结构，包括支架(10)、LED晶片(20)、金线(30)和覆盖在LED晶片(20)上的胶水层(80)；支架(10)又包括相互绝缘的第一焊盘(11)和第二焊盘(12)，LED晶片(20)借助导电银胶层(40)固定在第一焊盘(11)上；LED晶片(20)的底部电极通过导电银胶层(40)与第一焊盘(11)电性连接；金线(30)的一端与LED晶片(20)的另一电极焊接，金线(30)的另一端焊接至第二焊盘(12)；还包括保护导线(50)，该保护导线(50)的两端均焊接在第一焊盘(11)上，且其中一端的焊点被导电银胶层(40)覆盖。同现有技术相比较，本实用新型具有可靠性高、能有效避免接触不良甚至死灯现象的发生等优点。

Description

一种小功率LED封装结构
技术领域 本实用新型涉及至少有一个电位跃变势垒或表面势垒的适用于光发射的半导体器件，特别是涉及发光二极管的封装结构。
背景技术 发光二极管(简称LED，Light Emitting Diode)具有低能耗、利环保、高亮度和长寿命等优点，国家大力提倡节能减排实行低碳经济，因而发光二极管的各个领域的应用也越来越广泛。现有技术的小功率LED封装结构一般如图1所示，包括支架10’、LED晶片20’、金线30’和覆盖在LED晶片20’上的胶水层80’；所述支架10’又包括相互绝缘的第一焊盘11’和第二焊盘12’，所述LED晶片20’借助导电银胶层40’固定在所述第一焊盘11’上；LED晶片20’的底部电极通过所述导电银胶层40’与所述第一焊盘11’电性连接；所述金线30’的一端与所述LED晶片20’的另一电极焊接，金线30’的另一端焊接至所述第二焊盘12’。这种小功率LED封装结构存在的不足之处是：胶水层80’的热胀冷缩或给LED晶片施加外拉力，或在其它原因外力的作用下，LED晶片存在与所述第一焊盘11’脱离的可能，一旦脱离，就造成LED晶片处于开路状态即产生死灯现象，因此，产品的可靠性能低下。
实用新型内容 本实用新型要解决的技术问题在于避免上述现有技术的不足之处而提出一种产品可靠性高的小功率LED封装结构。
本实用新型解决所述技术问题可以通过采用以下技术方案来实现：
设计、制作一种小功率LED封装结构，包括支架、LED晶片、金线和覆盖在LED晶片上的胶水层；所述支架又包括相互绝缘的第一焊盘和第二焊盘，所述LED晶片借助导电银胶层固定在所述第一焊盘上；LED晶片的底部电极通过所述导电银胶层与所述第一焊盘电性连接；所述金线的一端与所述LED晶片的另一电极焊接，金线的另一端焊接至所述第二焊盘；还包括保护导线，该保护导线的两端均焊接在所述第一焊盘上，且其中一端的焊点被所述导电银 胶层覆盖。
作为本实用新型的进一步改进，所述保护导线另一端的焊点处覆盖有保护胶层；所述保护导线为金线、银线、铜线或铝线；所述保护胶层为导电胶或绝缘胶。
同现有技术相比较，本实用新型小功率LED封装结构的技术效果在于：设置保护导线，固晶时产生接触不良的情形下，或当LED晶片受外力作用连同导电银胶层一起与第一焊盘脱离时，通过导电银胶层，LED晶片的底部电极仍然与保护导线的一端电连接，而保护导线的另一端还能保持与第一焊盘电连接，因此，LED晶片的底部电极还是能够与第一焊盘实现电连接，有效地保持通路状态，避免了接触不良甚至死灯现象的发生，大大提高了产品的可靠性和稳定性；保护导线另一端的焊点处覆盖保护胶层，实现双保险，进一步加强保护导线与第一焊盘之间连接的稳固性。
附图说明
图1是现有技术小功率LED封装结构的结构示意图；
图2是本实用新型小功率LED封装结构的结构示意图；
图3示意出本实用新型小功率LED封装结构的LED晶片与支架的第一焊盘脱离后，借助保护导线的作用，仍然能保持通路的状态。
具体实施方式 以下结合附图所示之优选实施例作进一步详述。
一种小功率LED封装结构，如图2所示，包括支架10、LED晶片20、金线30和覆盖在LED晶片20上的胶水层80；所述支架10又包括相互绝缘的第一焊盘11和第二焊盘12，所述LED晶片20借助导电银胶层40固定在所述第一焊盘11上；LED晶片20的底部电极通过所述导电银胶层40与所述第一焊盘11电性连接；所述金线30的一端与所述LED晶片20的另一电极焊接，金线30的另一端焊接至所述第二焊盘12；还包括保护导线50，该保护导线50的两端均焊接在所述第一焊盘11上，且其中一端的焊点被所述导电银胶层40覆盖；所述保护导线50另一端的焊点处覆盖有保护胶层60。所述保护导线50为金线、银线、铜线或铝线所述保护胶层60为导电胶或绝缘胶。
如图3所示，图中，虚线箭头方向示意出LED晶片所受外力方向，当LED晶片20受外力作用连同导电银胶层40一起与第一焊盘11脱离时，LED晶片20的底部电极通过导电银胶层40的传导，仍然与保护导线50的一端电连接，在保护胶层60的稳定作用下，保护导线50的另一端能更完好地保持与第一焊盘11电连接，因此，即使LED晶片20底部与第一焊盘11完全脱离，LED晶片20的底部电极仍能够与第一焊盘11实现电连接，有效地保持通路状态。
以上内容是结合具体的优选技术方案对本实用新型所作的进一步详细说明，不能认定本实用新型的具体实施只局限于这些说明。对于本实用新型所属技术领域的普通技术人员来说，在不脱离本实用新型构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本实用新型的保护范围。

Claims (4)

1.一种小功率LED封装结构，包括支架(10)、LED晶片(20)、金线(30)和覆盖在LED晶片(20)上的胶水层(80)；所述支架(10)又包括相互绝缘的第一焊盘(11)和第二焊盘(12)，所述LED晶片(20)借助导电银胶层(40)固定在所述第一焊盘(11)上；LED晶片(20)的底部电极通过所述导电银胶层(40)与所述第一焊盘(11)电性连接；所述金线(30)的一端与所述LED晶片(20)的另一电极焊接，金线(30)的另一端焊接至所述第二焊盘(12)；其特征在于：还包括保护导线(50)，该保护导线(50)的两端均焊接在所述第一焊盘(11)上，且其中一端的焊点被所述导电银胶层(40)覆盖。
2.根据权利要求1所述的小功率LED封装结构，其特征在于：所述保护导线(50)另一端的焊点处覆盖有保护胶层(60)。
3.根据权利要求1或2所述的小功率LED封装结构，其特征在于：所述保护导线(50)为金线、银线、铜线或铝线。
4.根据权利要求2所述的小功率LED封装结构，其特征在于：所述保护胶层(60)为导电胶或绝缘胶。
CN2010201674742U 2010-04-16 2010-04-16 一种小功率led封装结构 Expired - Fee Related CN201681969U (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102130280A (zh) * 2010-12-31 2011-07-20 浙江名芯半导体科技有限公司 一种led封装焊点结构及工艺
CN105226168A (zh) * 2015-11-02 2016-01-06 浙江古越龙山电子科技发展有限公司 一种不易吸湿死灯的led及其加工方法
CN106057092A (zh) * 2016-07-30 2016-10-26 深圳浩翔光电技术有限公司 一种用于led显示屏的灯板与驱动板的连接结构
WO2021017562A1 (zh) * 2020-02-18 2021-02-04 旭宇光电（深圳）股份有限公司 Led封装结构及led固晶方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102130280A (zh) * 2010-12-31 2011-07-20 浙江名芯半导体科技有限公司 一种led封装焊点结构及工艺
CN105226168A (zh) * 2015-11-02 2016-01-06 浙江古越龙山电子科技发展有限公司 一种不易吸湿死灯的led及其加工方法
CN106057092A (zh) * 2016-07-30 2016-10-26 深圳浩翔光电技术有限公司 一种用于led显示屏的灯板与驱动板的连接结构
WO2021017562A1 (zh) * 2020-02-18 2021-02-04 旭宇光电（深圳）股份有限公司 Led封装结构及led固晶方法

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