CN201590949U - Copper clad laminate for flexible printed circuit board - Google Patents
Copper clad laminate for flexible printed circuit board Download PDFInfo
- Publication number
- CN201590949U CN201590949U CN2009201503479U CN200920150347U CN201590949U CN 201590949 U CN201590949 U CN 201590949U CN 2009201503479 U CN2009201503479 U CN 2009201503479U CN 200920150347 U CN200920150347 U CN 200920150347U CN 201590949 U CN201590949 U CN 201590949U
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- copper clad
- clad laminate
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- polyimide layer
- polyimide
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Abstract
A copper clad laminate for a flexible printed circuit comprises a copper foil and a black polyimide layer formed on the surface of the copper foil. The utility model also provides a double-sided copper clad laminate structure which is formed in the way that an adhesive layer is bonded to the polyimide layers of two one-side copper clad laminates, wherein the polyimide layers of the two one-side copper clad laminates have the same thickness. The copper clad laminate has the advantages of simple and convenient manufacture and low cost, can adjust the composition and the thickness of the adhesive layer and the polyimide layers as needed, has good effect on shielding the circuit patterns, and is particularly suitable for consumer electronic products with the requirement for circuit pattern protection or heat radiation.
Description
Technical field
The utility model is about a kind of copper clad laminate, especially covers the copper clad laminate of circuit pattern about a kind of confession.
Background technology
At present electronic system towards compact, high-fire resistance, multifunctionality, densification, high reliability and cheaply direction develop, so selecting for use of substrate just becomes very significant effects factor.And good substrate must possess high thermal conductivity, the high material behavior that hides chromatic effect, high-cooling property, high-fire resistance, reaches low thermal coefficient of expansion.The polyimide resin thermal stability is high and have excellent thermal diffusivity, mechanical strength, reach then property, often applies to multiple electronic material, as is used for flexible printed wiring board (Flexible Printed Circuit).
Polyimide resin has been widely used in the electronic material, wherein, is used for the polyimide copper foil substrate of flexible printed wiring board, generally also divides into single sided board or double sided board.Usually, the problem of polyimide copper foil substrate on using is composition and the thickness thereof that is subject to polyimide material, make formed polyimide layer mostly be the colourity of yellow system or other tool high optical transmittance, when causing being used for soft board thereafter, plagiarize because of the light transmission of polyimide layer makes the line design of line layer of flexible printed wiring board distribute to be easy to understand by the same trade, and then the market sale and the company that influences product operate.On the other hand, then the composition of polyimide material and thickness thereof also can influence the production process and the difficulty of copper clad laminate.
The utility model content
The disappearance of prior art the purpose of this invention is to provide a kind of copper clad laminate that is used for flexible print wiring board in view of the above, not only thin thickness and have the black screening effect and can reduce production costs.
The utility model provides a kind of copper clad laminate that is used for flexible print wiring board, comprise first Copper Foil and be formed on this first copper foil surface and thickness is 5 to 50 microns first polyimide layer, and this first polyimide layer comprises the additive that is selected from carbon dust, carbon nanotube, black pigment or its mixture.
In addition, the utility model also provides a kind of copper clad laminate structure, be included on the repeatedly structure with first Copper Foil and first polyimide layer, also comprise the lip-deep adhesion layer that is added with carbon dust, carbon nanotube, black pigment or its mixture of first polyimide layer that is formed at this structure that changes, this first polyimide layer is folded between this adhesion layer and first Copper Foil; And be formed at thickness second polyimide layer and second Copper Foil identical on this adhesion layer in regular turn with first polyimide layer, so that this adhesion layer is folded in this first and second polyimides interlayer.
Copper clad laminate of the present utility model is made by easy manufacturing process, also can optionally adjust polyimide layer and adhesion layer thickness, cover and radiating effect to have, compared with prior art, thin thickness and have the black screening effect and can reduce production costs not only.
Description of drawings
Fig. 1 is for showing the schematic diagram of copper clad laminate structure of the present utility model.
Fig. 2 is for showing the schematic diagram of another copper clad laminate structure of the present utility model.
The main element symbol description
100,201a, 201b single face copper clad laminate
101,203a first Copper Foil
102,202a first polyimide layer
200 two-sided copper clad laminates
202b second polyimide layer
203b second Copper Foil
204 adhesion layers
Embodiment
Below for by specific instantiation execution mode of the present utility model to be described, the personage who is familiar with this skill can understand advantage of the present utility model and effect easily by the content that this specification disclosed.The utility model can also other different mode be implemented, and promptly under not departing from the category that the utility model disclosed, can give different modifications and change.
In this article, lightness (lightness claims the L value again) is for referring to according to the definition of Commission Internationale De L'Eclairage (International Commission on Illumination) to the bright-dark degree of color.Usually, white lightness is the highest, and the black lightness is minimum, and the polyimide layer or the adhesion layer of adjustment copper clad laminate are near black, and lightness then reduces relatively.
The coefficient of heat conduction (heat transfer coefficient, claim the K value again), the capacity of heat transmission that refers to copper clad laminate in this article, especially refer to that copper clad laminate is under the unit temperature difference, unit interval is by the heat of unit are unit distance, the coefficient of heat conduction that is called copper clad laminate, if measure the thickness L of this copper clad laminate, then this measuring value then needs to multiply by L and the coefficient of heat conduction that obtains copper clad laminate.
Glossiness (Gloss) is for referring to the reflective degree of copper clad laminate polyimides laminar surface of the present utility model, and glossiness does not have unit, but its numerical value is big more, represents its catoptrical intensity strong more, otherwise numerical value is more little, represents its catoptrical intensity weak more.
Fig. 1 is for showing first specific embodiment of single face copper clad laminate 100 of the present utility model, and it presents with a single sided board form, and this single face copper clad laminate 100 comprises first Copper Foil 101; And be formed at first polyimide layer 102 on this first Copper Foil.
Fig. 2 is for showing another two-sided copper clad laminate 200 of the present utility model, this two-sided copper clad laminate 200 comprises two single face copper clad laminate 201a, 201b, wherein, this single face copper clad laminate 201a, 201b comprise the first polyimide layer 202a, the second polyimide layer 202b and are formed at the first Copper Foil 203a and the second Copper Foil 203b on these polyimide layers 202a, the 202b outer surface; And the adhesion layer 204 of shape between this first and second polyimide layer.
In order to make its flexible electric circuit board that manufactures reduce light transmittance and to reduce the not generation of congruent problem of heat radiation, copper clad laminate of the present utility model, look the needs of this copper clad laminate, adjust the thickness and the contained additive of polyimide layer in the copper clad laminate, and obtain thin thickness but the low copper clad laminate of lightness, to this, the employed polyimide layer of copper clad laminate of the present utility model is also without particular limitation, is preferably the not halogen-containing Thermocurable polyimide material of use.
In a specific embodiment of the present utility model, with regard to the polyimide layer of copper clad laminate, lightness is for being less than or equal to 25, light transmittance less than 3% and the glossiness of copper clad laminate for being less than or equal to 30, then the thickness of this polyimide layer should be 5 to 50 microns, in another instantiation, for example, the lightness of copper clad laminate polyimide layer is between 5 to 23, and the thickness of this first and second polyimide layer can be 5 or 8 microns.In addition, in having the embodiment of two-sided Copper Foil, the thickness of this first and second polyimide layer is identical and be all 5 to 50 microns.In addition, the lightness of copper clad laminate of the present utility model is except the thickness by the adjustment polyimide layer, also can adjust the content of the contained additive of this polyimide layer, and improve the heat sinking benefit of copper clad laminate by this, usually, the additive content that makes an addition to this polyimide layer be account for the polyimides solid content 3 to 20wt%, be good with 5 to 15wt% again, for example, if the polyimides solid content is 100g, then additive content is 3 to 20g.For this reason, the additive of its polyimide layer is for being selected from material with carbon element, pigment, dyestuff or toner, and the material with carbon element that this polyimide layer added is generally and is selected from carbon dust, carbon nanotube, black pigment or its mixture, and carbon dust can comprise the carbon black that is commonly called as in the utility model.And the toner that pigment is also contained dyestuff or is commonly called as, and pigment can comprise with the obtained person of organic or inorganic material.
In one embodiment, the additive content of first polyimide layer and/or second polyimide layer be account for the polyimides solid content 3 to 20wt%.
Again, copper clad laminate of the present utility model also can further comprise metal-powder, pass through metal-powder, further increase the capacity of heat transmission of copper clad laminate, to this, this metal-powder is to account in 30 to 80wt% the scope of polyimides solid content in polyimide layer content, and in a preferred embodiments, the content of metal-powder is in 40 to 50wt% the scope.For example, if the polyimides solid content is 100g, then metal-powder content is 30 to 80g.Similarly, in a specific embodiment, first and/or second polyimide layer also comprises the metal-powder that accounts for polyimides solid content 30 to 80wt%.
In addition, the material of this adhesion layer be generally be selected from epoxy resin, acrylic resin, amido formate be resin, silicon rubber be resin, poly-be resin (Bimaleimide resin), polyimide resin or its mixture to ring diformazan benzene series resin, bismaleimides, and be preferable with being selected from bismaleimides (Bimaleimide resin) resin, acrylic resin (acrylic resin) or the mixed type adhesion layer that polyimides was used in combination with epoxy resin.In a specific embodiment of the present utility model, the thickness of this adhesion layer is 2 to 25 microns, therefore, can provide the copper clad laminate of excellent performance under the condition of effectively controlling cost.In addition, the thickness of the adhesion layer of the polyimide layer of this two copper clad laminate of above-mentioned bonding be with 8 to 10 microns for good, and in this specific embodiment, also make the thickness of the polyimide layer of this two copper clad laminate be all ideal mutually.Again, in a specific embodiment, also can be added with carbon dust, carbon nanotube, black pigment or its mixture in the adhesion layer, and its consumption account for not adhesion layer solid content before adding 3 to 20wt%.
Moreover this Copper Foil is for being selected from electrolytic copper foil or rolled copper foil, and on using, and the thickness of this Copper Foil even reaches 36 microns between 9 to 20 microns usually.In a specific embodiment, the thickness of this adhesion layer and polyimide layer is all 8 microns, and the thickness of this Copper Foil is 12 to 35 microns, perhaps, in another embodiment, the thickness of this adhesion layer is 10 microns, the thickness of this polyimide layer is 5 microns, and the thickness of this Copper Foil is 12 to 35 microns.
The structure of copper clad laminate of the present utility model can be finished by following manufacturing technology steps, and its manufacturing technology steps is as follows:
First preparation example:
At first, the Copper Foil of one 12 micron thickness is provided, and add the polyimides of 10wt% carbon black in arbitrary surface coated one of this Copper Foil, and obtain a single face copper clad laminate after being dried the polyimide layer that forms 8 micron thickness, then, the single face copper clad laminate that forms polyimide layer is imposed a roller manufacturing process,, make polyimide layer be attached on the copper foil surface securely and make not produce bubble between Copper Foil and the polyimide layer by gap between the roller and pressure that roller gave; At last, toast this copper clad laminate, polyimide layer is solidified, to have lightness be 23 single face copper clad laminate product of the present utility model to finish.
Second preparation example:
At first, get the single face copper clad laminate of aforementioned first preparation example, polyimide layer surface coated epoxy resin adhesive agent in this single face copper clad laminate, and with this single face copper clad laminate of epoxy resin coating coating carry out baking processing, cause this epoxy resin adhesive agent between the B-stage state, simultaneously, for avoiding a large amount of waste of the coating that is caused and phenomenons of crawling of being coated with, for the mode with screen painting or rotary coating is good, then, the single face copper clad laminate that is formed with adhesion layer is imposed a roller manufacturing process, by gap between the roller and pressure that roller gave, make adhesion layer be bonding on the single face copper clad laminate surface securely and make and do not produce bubble between adhesion layer and the polyimide layer, at last, get one again by the preparation of same manufacturing process but do not form the single face copper clad laminate (additive of this polyimide layer form and content can be different from aforesaid single face copper clad laminate) certainly of adhesion layer, the polyimide layer of this single face copper clad laminate is covered on the adhesion layer of aforementioned single face copper clad laminate, and give pressing, two single face copper clad laminates are closely binded, to form two-sided copper clad laminate by the adhesion layer of centre; At last, toast this two-sided copper clad laminate, the epoxy resin adhesion layer is solidified, to finish two-sided copper clad laminate product of the present utility model.In this preparation example, the lightness that forms is that 23 two-sided copper clad laminate can be avoided light transmission because of polyimide layer to make that the line design of the line layer of formed flexible print wiring board was easy to understand by the same trade afterwards plagiarizing.
According to the manufacture method of first preparation example, make and add various different additives and the polyimide layer of different-thickness and the single face copper clad laminate of adhesion layer, shown in following table one:
The single face copper clad laminate of the various different additives of table one
According to the manufacture method of second preparation example and form the adhesion layer of 8 micron thickness, make the two-sided copper clad laminate that adds various different additives, shown in following table two:
The two-sided copper clad laminate of the various different additives of table two
Test case one: lightness (L value) test
At first, get according to the first preparation example manufactured samples 1 to 3, and the second instantiation manufactured samples 4 to 6, totally 6 samples thing to be detected, measure lightness by color difference meter (ColorQuestXEhunterlab) again,, measure with Grossmeters (Novo Gloss with transmissometer (NDH-2000) penetrance
TM) measure glossiness, with shown in following table three:
The lightness test of table three single face and two-sided copper clad laminate
Test case two: heat radiation test
Thermal conductivity by material learns, when the coefficient of heat conduction high more, the easy more heat radiation of material.Therefore prepare copper clad laminate as first and second preparation example, be added with the metal-powder that accounts for polyimides solid content 30wt% again to form sample 1 ' to 6 ', totally 6 samples thing to be detected, and utilize coefficient of heat conduction analyzer (Thermal Conductivity Analyzer) that the coefficient of heat conduction is detected respectively, shown in following table four, with the thermal diffusivity of further analysis thing to be detected.
| Numbering | The gross thickness of copper clad laminate (micron) | The thickness of polyimide layer (micron) | The coefficient of heat conduction of copper clad laminate (W/m.K) |
| Sample 1 ' | 20 | 8 | 0.4 |
| Sample 2 ' | 20 | 8 | 0.4 |
| Sample 3 ' | 17 | 5 | 0.38 |
| Sample 4 ' | 48 | 8 | 0.4 |
| Sample 5 ' | 48 | 8 | 0.4 |
| Sample 6 ' | 42 | 8 | 0.4 |
The coefficient of heat conduction test of table four copper clad laminate
Single or double copper clad laminate of the present utility model is for carrying out the test of L value and thermal diffusivity, the outward appearance penetrance that can find black single or double copper clad laminate of the present utility model and known general copper clad laminate mutually recently very low (≤2%), have covering property fully, vertical have its L value of phenomenon of printing opacity also smaller or equal to 25.In addition, copper clad laminate of the present utility model also has low-luster (≤20), the problem of no-reflection.
In sum, the utility model utilization contains the polyimide layer of specific additive and adjusts its thickness, make the single or double copper clad laminate that makes have lower lightness and good thermal diffusivity, moreover, the use that reduces polyimides changes with adhesion layer and also can reduce cost as binding base material, in addition, single or double copper clad laminate of the present utility model, have more the advantage of low lightness and high-cooling property compared to known copper clad laminate, be fit to be applied to the demand that the flexible copper foil circuit machine substrate black of electronic product covers or dispels the heat.
Above-mentioned specification and embodiment only are illustrative principle of the present utility model and effect thereof, but not are used to limit the utility model.Rights protection scope of the present utility model should be listed as claim.
Claims (7)
1. copper clad laminate that is used for flexible print wiring board comprises:
First Copper Foil; And
Be formed at first polyimide layer on this first copper foil surface, it is characterized in that, the thickness of this first polyimide layer is 5 to 50 microns.
2. the copper clad laminate that is used for flexible print wiring board as claimed in claim 1 is characterized in that, also comprises:
Adhesion layer, it is formed on the first polyimides laminar surface of this copper clad laminate, and this first polyimide layer is folded between this adhesion layer and first Copper Foil; And
Be formed at thickness second polyimide layer and second Copper Foil identical on this adhesion layer in regular turn with first polyimide layer, so that this adhesion layer is folded in this first and second polyimides interlayer, it is characterized in that the thickness of this first and second polyimide layer is 5 to 50 microns.
3. the copper clad laminate that is used for flexible print wiring board as claimed in claim 2 is characterized in that, the thickness of this adhesion layer is 2 to 25 microns.
4. the copper clad laminate that is used for flexible print wiring board as claimed in claim 3 is characterized in that, the thickness of this adhesion layer is between 8 to 10 microns.
5. the copper clad laminate that is used for flexible print wiring board as claimed in claim 4 is characterized in that, the thickness of this first and second polyimide layer is between 5 to 8 microns.
6. the copper clad laminate that is used for flexible print wiring board as claimed in claim 5 is characterized in that the thickness of this adhesion layer and first and second polyimide layer is all 8 microns, and the thickness of this Copper Foil is 12 to 35 microns.
7. the copper clad laminate that is used for flexible print wiring board as claimed in claim 5 is characterized in that, the thickness of this adhesion layer is 10 microns, and the thickness of this polyimide layer is 5 microns, and the thickness of this Copper Foil is 12 to 35 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201503479U CN201590949U (en) | 2009-05-13 | 2009-05-13 | Copper clad laminate for flexible printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201503479U CN201590949U (en) | 2009-05-13 | 2009-05-13 | Copper clad laminate for flexible printed circuit board |
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| CN201590949U true CN201590949U (en) | 2010-09-22 |
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| CN2009201503479U Expired - Lifetime CN201590949U (en) | 2009-05-13 | 2009-05-13 | Copper clad laminate for flexible printed circuit board |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998759A (en) * | 2010-11-26 | 2011-03-30 | 台龙电子（昆山）有限公司 | Flexible circuit board structure of light-emitting diode (LED) light bars |
| CN102186315A (en) * | 2011-04-21 | 2011-09-14 | 淳华科技(昆山)有限公司 | Manufacturing process of soft-type printed circuit board with different appearances at upper and lower layers |
| CN102463718A (en) * | 2010-11-19 | 2012-05-23 | 昆山雅森电子材料科技有限公司 | Compound black double-side copper foil base plate and manufacture method thereof |
| CN103625036A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Composite-structure copper foil substrate and making method thereof |
| CN103687459A (en) * | 2012-09-14 | 2014-03-26 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board with same |
| CN104575691A (en) * | 2014-12-31 | 2015-04-29 | 东莞市蓝姆材料科技有限公司 | Shielding composite copper foil and pair twist data transmission line applying same |
| CN105719726A (en) * | 2016-04-27 | 2016-06-29 | 云南科威液态金属谷研发有限公司 | Conductive soft ooze and preparation method thereof |
| CN105984181A (en) * | 2015-02-11 | 2016-10-05 | 昆山雅森电子材料科技有限公司 | Double-sided copper foil substrate for printed circuit board and manufacturing method thereof |
| CN114679837A (en) * | 2020-12-24 | 2022-06-28 | 广东生益科技股份有限公司 | Black glue-free flexible copper-clad plate and preparation method and application thereof |
-
2009
- 2009-05-13 CN CN2009201503479U patent/CN201590949U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102463718A (en) * | 2010-11-19 | 2012-05-23 | 昆山雅森电子材料科技有限公司 | Compound black double-side copper foil base plate and manufacture method thereof |
| CN101998759A (en) * | 2010-11-26 | 2011-03-30 | 台龙电子（昆山）有限公司 | Flexible circuit board structure of light-emitting diode (LED) light bars |
| CN102186315A (en) * | 2011-04-21 | 2011-09-14 | 淳华科技(昆山)有限公司 | Manufacturing process of soft-type printed circuit board with different appearances at upper and lower layers |
| CN103625036A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Composite-structure copper foil substrate and making method thereof |
| CN103687459A (en) * | 2012-09-14 | 2014-03-26 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board with same |
| CN104575691A (en) * | 2014-12-31 | 2015-04-29 | 东莞市蓝姆材料科技有限公司 | Shielding composite copper foil and pair twist data transmission line applying same |
| CN105984181A (en) * | 2015-02-11 | 2016-10-05 | 昆山雅森电子材料科技有限公司 | Double-sided copper foil substrate for printed circuit board and manufacturing method thereof |
| CN105719726A (en) * | 2016-04-27 | 2016-06-29 | 云南科威液态金属谷研发有限公司 | Conductive soft ooze and preparation method thereof |
| CN105719726B (en) * | 2016-04-27 | 2018-03-09 | 云南科威液态金属谷研发有限公司 | A kind of conductive ooze and preparation method thereof |
| CN114679837A (en) * | 2020-12-24 | 2022-06-28 | 广东生益科技股份有限公司 | Black glue-free flexible copper-clad plate and preparation method and application thereof |
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| C14 | Grant of patent or utility model | ||
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| CX01 | Expiry of patent term |
Granted publication date: 20100922 |
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| CX01 | Expiry of patent term |