CN209472864U - Composite decking - Google Patents
Composite decking Download PDFInfo
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- CN209472864U CN209472864U CN201821434088.8U CN201821434088U CN209472864U CN 209472864 U CN209472864 U CN 209472864U CN 201821434088 U CN201821434088 U CN 201821434088U CN 209472864 U CN209472864 U CN 209472864U
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Abstract
The utility model relates to a kind of composite deckings and preparation method thereof.The composite decking includes substrate, hardened layer and functional layer; substrate has opposite first surface and second surface, and hardened layer is covered in first surface, and functional layer includes conductive layer and the protective layer that is covered on conductive layer; conductive layer has etch via, and conductive layer is covered in second surface.The composite decking of the utility model, hardened layer can be improved the hardness of composite decking, additionally it is possible to composite decking be made to have the colors decorative effects such as colorful, metallochrome.Functional layer includes conductive layer and protective layer; conductive layer has etch via; etch via enables to conductive layer to obtain required route; this setting enhances the heating conduction of composite decking; and make composite decking while with defencive function, it is also embedded in circuit system, the partial circuit of electronic product can be transferred on composite decking; reduce circuit board size, provides greater room for the other component of electronic product.
Description
Technical field
The utility model relates to technical field of electronic products, more particularly to a kind of composite decking.
Background technique
With the continuous development of electronics and information industry, more and more electronic products are emerged in the market.Electronic product table
Face is typically provided cover sheet, and for protecting the internal structure of electronic product, wherein plastic cover plate is since its is at low cost, is easy to add
The characteristics such as work and have been to be concerned by more and more people；But plastic cover plate also has the shortcomings that poor thermal conductivity, easily-deformable, causes its right
The protectiveness of area of cell is poor, so that the application of plastic cover plate is restricted.In addition, current plastic cover plate has a single function,
It is typically only capable to play a protective role.
Utility model content
Based on this, it is necessary to plastic cover plate poor thermal conductivity, easily-deformable and aiming at the problem that have a single function, provide a kind of hard
Degree is high, thermal conductivity is good and multi-functional composite decking.
Specific technical solution is as follows:
A kind of composite decking, including substrate, hardened layer and functional layer, the substrate have opposite first surface and
Second surface, the hardened layer are covered in the first surface, and the functional layer includes conductive layer and is covered in the conduction
Protective layer on layer, the conductive layer have etch via, and the conductive layer is covered in the second surface.
The substrate is composite plate, resin and the glass fabric of resin and glass fibre in one of the embodiments,
Composite plate, the composite plate of the composite plate of resin and ceramic powder or resin and ceramic fiber cloth.
The hardened layer is inorganic oxide layer, alkaline-earth nitride layer, alkaline-earth metal in one of the embodiments,
Oxynitride layer, transition metal nitride layer, alkaline-earth metal oxynitride layer, silicone layer or fluoride layer.
The composite decking further includes adhesive layer in one of the embodiments, and the hardened layer is silicone layer or fluorine
Compound layer, for the adhesive layer between the first surface and the hardened layer, the adhesive layer is polymethacrylates
Layer.
The composite decking further includes anti-fingerprint layer in one of the embodiments, the hardened layer be machine oxide skin(coating),
Alkaline-earth nitride layer, alkaline-earth metal oxynitride layer, transition metal nitride layer or alkaline-earth metal oxynitride layer, it is described
Anti-fingerprint layer is covered on the hardened layer.
The hardened layer is multilayer in one of the embodiments,.
The protective layer is insulation material layer in one of the embodiments,.
The functional layer is multilayer in one of the embodiments,.
In one of the embodiments, the substrate with a thickness of 0.05mm~5mm.
The protective layer thickness is 0.1 μm~100 μm in one of the embodiments,.
Compared with prior art, the utility model has the following beneficial effects:
The composite decking of the utility model, by being covered with hardened layer on the first surface of the substrate, hardened layer can be mentioned
The hardness of high composite decking, additionally it is possible to make composite decking that there is the colors decorative effects such as colorful, metallochrome.The second surface of substrate
On be covered with functional layer, functional layer includes conductive layer and protective layer, and conductive layer has etch via, and etch via enables to
Conductive layer obtains required route, this setting enhances the heating conduction of composite decking, and composite decking is made to have protection function
While energy, it is also embedded in circuit system, the partial circuit of electronic product can be transferred on composite decking, reduces circuit board
Size provides greater room for the other component of electronic product.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of composite decking described in an embodiment；
Fig. 2 is the structural schematic diagram of composite decking described in another embodiment.
Description of symbols
10, composite decking；100, substrate；110, first surface；120, second surface；130, hardened layer；140, functional layer；
141, conductive layer；142, protective layer；150, adhesive layer；160, anti-fingerprint layer.
Specific embodiment
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms in fact
It is existing, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes public affairs to the utility model
The understanding for opening content is more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein "and/or" includes
Any and all combinations of one or more related listed items.
Referring to shown in Fig. 1 and Fig. 2, an embodiment of the present invention is related to a kind of composite decking 10.Above-mentioned composite cover
Plate 10 includes substrate 100, hardened layer 130 and functional layer 140.Substrate 100 has opposite first surface 110 and the second table
Face 120, hardened layer 130 are covered in first surface 110, and functional layer 140 includes conductive layer 141 and is covered on conductive layer 141
Protective layer 142, conductive layer 141 has etch via, and conductive layer 141 is covered in second surface 120.
Substrate 100 can be lamina, be also possible to multilayer composite sheet.Substrate 100 can be resin and glass fibre
Composite plate, the composite plate of resin and glass fabric, resin and the composite plate or resin of ceramic powder and answering for ceramic fiber cloth
Plywood.
Hardened layer 130 can be inorganic oxide layer, alkaline-earth nitride layer, alkaline-earth metal oxynitride layer, transition
Metal nitride layer, alkaline-earth metal oxynitride layer, silicone layer or fluoride layer.Hardened layer 130 is inorganic oxide layer, alkali
Earth metal nitride layer, alkaline-earth metal oxynitride layer, transition metal nitride layer, alkaline-earth metal oxynitride layer, organosilicon
Layer or fluoride layer are covered on first surface 110, and hardened layer 130 can be improved the hardness of substrate 100, and can be hard by adjusting
The raw material for changing layer 130 makes composite decking 10 have the colors decorative effects such as colorful, metallochrome.
In a specific example, above-mentioned composite decking 10 further includes adhesive layer 150.Hardened layer 130 is silicone layer
Or fluoride layer, adhesive layer 150 is between first surface 110 and hardened layer 130.Adhesive layer 150 can be polymethyl
Acid esters etc. has the coating of adhesiveness.Specifically, adhesive layer 150 can be polymethyl methacrylate (PMMA).
In a specific example, above-mentioned composite decking 10 further includes anti-fingerprint layer 160.Hardened layer 130 is inorganic oxygen
Compound layer, alkaline-earth nitride layer, alkaline-earth metal oxynitride layer, transition metal nitride layer or alkaline-earth metal nitrogen oxides
Layer, anti-fingerprint layer 160 are covered on hardened layer 130.Anti-fingerprint layer 160 is covered on hardened layer 130, composite cover is enabled to
Outwardly-facing surface has the effect of anti-fingerprint after plate 10 is placed in electronic product, more clean when in use.
Conductive layer 141 can be conducting metal plated layer, and etch via is to be etched to be processed to conducting metal plated layer
It obtains.Conductive layer 141 has etch via, and etch via enables to conductive layer 141 to obtain required route, with electronics member device
Part combination, it can so that composite decking 10 has the circuit functions such as aerial signal, sensor, system control.
Protective layer 142 can be insulating layer.Specifically, the insulating materials of insulating layer can be polyethylene, polytetrafluoroethylene (PTFE),
Rubber, polyacrylate etc..
In a specific example, substrate 100 with a thickness of 0.05mm~5mm.
In a specific example, conductive layer 141 with a thickness of 0.005 μm~70 μm.
In a specific example, protective layer 142 with a thickness of 0.1 μm~100 μm.
In a specific example, when hardened layer 130 is silicone layer or fluoride layer, hardened layer 130 with a thickness of
0.1 μm~100 μm.When hardened layer 130 is inorganic oxide layer, alkaline-earth nitride layer, alkaline-earth metal oxynitride layer, mistake
When crossing metal nitride layer or alkaline-earth metal oxynitride layer, hardened layer 130 with a thickness of 10nm~5 μm.
In a specific example, hardened layer 130 can be multilayer.
In a specific example, above-mentioned composite decking 10 further includes texture layer.Texture layer be located at first surface 110 with
Between hardened layer 130.Texture layer can form various textured patterns on the first surface 110 of composite decking 10, be composite cover
Plate 10 provides more pattern selections.
In a specific example, functional layer 140 can be multilayer.It can be appreciated that the specific number of plies of functional layer 140 can be with
It is adjusted according to actual line layout needs.The design of multiple function layers 140, can be more by the circuit in electronic product
Insertion composite decking 10 in, be electronic product inside other component save space.
Above-mentioned composite decking 10, by being covered with hardened layer 130, hardened layer on the first surface 110 of substrate 100
130 can be improved the hardness of composite decking 10, additionally it is possible to composite decking 10 be made to have the colors decorative effects such as colorful, metallochrome.
Functional layer 140 is covered on the second surface 120 of substrate 100, functional layer 140 includes conductive layer 141 and protective layer 142, is led
Electric layer 141 has etch via, and etch via enables to conductive layer 141 to obtain required route, this setting enhances composite cover
The heating conduction of plate 10, and make composite decking 10 while with defencive function, is also embedded in circuit system, can will be electric
The partial circuit of sub- product is transferred on composite decking, reduces circuit board size, is provided more greatly for the other component of electronic product
Space.
The present embodiment further relates to a kind of preparation method of composite decking, comprising the following steps:
1) in first surface coating inorganic oxide, alkaline-earth nitride, the alkaline-earth metal nitrogen oxides, transition of substrate
Metal nitride, alkaline-earth metal nitrogen oxides, organosilicon or fluoride form hardened layer.
After forming hardened layer by coating, the hardness of composite decking can be promoted to 4H~5H from 1H.
In a specific example, in first surface coating inorganic oxide, alkaline-earth nitride, the alkaline earth gold of substrate
Belonging to nitrogen oxides, transition metal nitride, alkaline-earth metal nitrogen oxides is to complete to coat by way of vacuum coating.In substrate
First surface coating organosilicon or fluoride, be to complete to coat by way of spraying or showering.
In a specific example, hardened layer is hard coating.
In a specific example, the material of hardened layer is selected from SiO2、TiO2、Al2O3、Nb2O5、Si3N4、Si2N2O、
AlON, SiAlON, TiN, CrN, TiC, CrC and Ta2O5At least one of.
Preferably, the material of hardened layer is selected from Si3N4, at least one of Si2N2O, AlON and SiAlON；By
Si3N4, the hardened layer that is prepared of at least one of Si2N2O, AlON and SiAlON, have highlight, colorful and stiffened
Effect.Nano hardness can reach 1~15GPa, and brightness can reach 40~90.The hardened layer on the noiseless influence of electromagnetic signal,
Be applicable to 5G etc. it is high to semaphore request, in the application of the demanding electronic product of surface hardness.
In a specific example, need first to be surface-treated the first surface of substrate before coating hardened layer.Specifically
Ground, surface treatment include flatness processing, grain effect processing etc..The first surface of substrate carries out table outwardly, to first surface
Surface treatment meets the appearance demand to composite decking.
It is organic in the first surface coating of substrate in the preparation method of above-mentioned composite decking in a specific example
Further include following steps when silicon or fluoride form hardened layer: being formed in the first surface coating polymethacrylates of substrate
Adhesive layer, then the hardened layer is coated on the adhesive layer.
2) conductive material is coated in the opposite second surface of substrate, forms conductive coating, then lose to conductive coating
It carves, generates etch via to get conductive layer.
In a specific example, conductive material can be the conductive metal materials such as copper, silver, and it is nonmetallic to be also possible to carbon etc.
Conductive material.
It is by calendering, plating or silk-screen in the second surface coating conductive material of substrate in a specific example
Mode carries out, and being etched to conductive coating is the side processed by yellow light etching and processing, laser processing or printing etching ink
Formula carries out.
3) on the surface of conductive layer, coating insulating materials forms protective layer.
In a specific example, armor coated is by way of spraying, printing or silk-screen by insulator-coating
On the electrically conductive, that is, protective layer is formed.
It in a specific example, can continue to coat conductive material on the protection layer, form conductive coating, then apply to conduction
Layer is etched, and is generated etch via, is obtained conductive layer.According to this, plurality of conductive layers and protective layer can be prepared according to actual needs,
To meet different needs.
In a specific example, substrate is selected from answering for the composite plate of resin and glass fibre, resin and glass fabric
The composite plate of plywood, the composite plate of resin and ceramic powder or resin and ceramic fiber cloth.
Substrate can also be designed as the substrate with 3D shape effect according to actual needs.
In a specific example, in the preparation method of composite decking, substrate first surface coating inorganic oxide,
When alkaline-earth nitride, alkaline-earth metal nitrogen oxides, transition metal nitride, alkaline-earth metal nitrogen oxides form hardened layer,
Further include following steps: coating anti-fingerprint layer on the hardened layer.Anti-fingerprint layer can be avoided answers using with above-mentioned
There are fingerprint traces when the electronic product of closing lid plate, influence beauty.
In a specific example, above-mentioned preparation method obtains composite decking, and it is accurate to carry out computer digital control
It is machined (CNC processing), various sizes of composite decking can be obtained, to meet different electronic products to the difference of composite decking
Demand.
Embodiment 1
The composite decking of the present embodiment the preparation method comprises the following steps:
1) the second surface of substrate using plating by the way of copper facing, then to copper plate using printing etching ink process into
Row etching, obtains conductive layer；
2) insulating materials is printed on the electrically conductive, obtains protective layer；
3) first surface of substrate is surface-treated；
4) PMMA is sprayed on the first surface of the substrate, obtains adhesive layer；
5) organosilicon is sprayed on adhesive layer, forms 6 μm of hardened layer；
6) it carries out CNC processing and is cleaned to get composite decking (referring to attached drawing 1).
Embodiment 2
The composite decking of the present embodiment the preparation method comprises the following steps:
1) the second surface of substrate using plating by the way of copper facing, then to copper plate using printing etching ink process into
Row etching, obtains the first conductive layer；
2) insulating materials is printed on the first conductive layer, obtains the first protective layer；
3) continue copper facing on the first protective layer, then copper plate is etched, generate etch via, obtain the second conduction
Layer；
4) insulating materials is printed on the second conductive layer, obtains the second protective layer；
5) first surface of substrate is surface-treated；
6) vacuum sputtering coating is carried out in the first surface of substrate, the material of plated film is SiO2、Si3N4、Si2N2The mixing of O
Object forms 0.8 μm of hardened layer；
7) anti-fingerprint layer is sprayed on hardened layer；
8) it carries out CNC processing and is cleaned to get composite decking.
Embodiment 3
The composite decking of the present embodiment the preparation method comprises the following steps:
1) the second surface of substrate using plating by the way of copper facing, then to copper plate using printing etching ink process into
Row etching, obtains conductive layer；
2) insulating materials is printed on the electrically conductive, obtains protective layer；
3) first surface of substrate is surface-treated；
4) vacuum sputtering coating is carried out on the first surface of the substrate, and the material of plated film is TiN, obtains hardened layer；
5) anti-fingerprint layer is sprayed on hardened layer；
6) it carries out CNC processing and is cleaned to get composite decking (referring to attached drawing 2).
Test example 1
Three-point bending stress test is carried out to the composite decking that Examples 1 to 3 is prepared:
Test method:
It is tested using Anton Paar nano-indenter test instrument: span 40mm；Specimen width 72mm；Style height:
0.8mm。
Experimental result is shown in Table 1:
Table 1: the bending stress of the composite decking of Examples 1 to 3
| Bending stress (Mpa) | Nano-hardness improvement (GPa) | |
| Embodiment 1 | 429 | 4~10 |
| Embodiment 2 | 432 | 5~12 |
| Embodiment 3 | 438 | 9~22 |
| Common PC/PMMA plate | 85 | 0.3~0.6 |
Interpretation of result: the bending stress of the composite decking of Examples 1 to 3 is respectively 429Mpa, 432Mpa, 438Mpa, and
The bending stress of common PC/PMMA plate is only 85Mpa, it is seen then that the bending resistance with higher of the composite decking of the utility model
Transverse stress.In addition, the nano-hardness improvement of the composite decking of Examples 1 to 3 is in the range of 4GPa~22GPa, and it is common
PC/PMMA plate nano-hardness improvement in the range of 0.3GPa~0.6GPa, it is seen then that the composite decking of the utility model
Surface hardness also with higher.
Test example 2
Determination of conductive coefficients is carried out to the composite decking that Examples 1 to 3 is prepared:
Test method:
Using stable state list thermal conductivity determination using slab method: 1~3 composite decking of Example, with contact heater plate composite cover
The second side of plate is tested.Calculation of thermal conductivity (Q: composite decking heat flow according to the following formula；δ: composite cover plate thickness
Degree；Δ t: composite decking temperature difference；A: the heat-conducting area in vertical heat flow direction).
Experimental result is shown in Table 2:
Table 2: the bending stress of the composite decking of Examples 1 to 3
| Thermal coefficient (W/ (mK)) | |
| Embodiment 1 | 3.5~3.8 |
| Embodiment 2 | 6.3~6.7 |
| Embodiment 3 | 4.9~5.2 |
| Common PC/PMMA plate | 0.1~0.3 |
Interpretation of result: the thermal coefficient of the composite decking of Examples 1 to 3 is respectively 3.5W/ (mK)~3.8W/ (m
K), 6.3W/ (mK)~6.7W/ (mK), 4.9W/ (mK)~5.2W/ (mK), and common PC/PMMA plate is led
Hot coefficient is only 0.1W/ (mK)~0.3W/ (mK), it is seen then that the composite decking of the utility model has high thermal conductivity characteristic.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of composite decking, which is characterized in that including substrate, hardened layer and functional layer, the substrate has opposite the
One surface and second surface, the hardened layer are covered in the first surface, and the functional layer includes conductive layer and covering
Protective layer on the conductive layer, the conductive layer have etch via, and the conductive layer is covered in the second surface.
2. composite decking according to claim 1, which is characterized in that the substrate is the compound of resin and glass fibre
Plate, the composite plate of resin and glass fabric, the composite plate of the composite plate or resin of resin and ceramic powder and ceramic fiber cloth.
3. composite decking according to claim 1, which is characterized in that the hardened layer is inorganic oxide layer, alkaline earth gold
Belong to nitride layer, alkaline-earth metal oxynitride layer, transition metal nitride layer, silicone layer or fluoride layer.
4. composite decking according to claim 3, which is characterized in that the composite decking further includes adhesive layer, described hard
Changing layer is silicone layer or fluoride layer, and the adhesive layer is between the first surface and the hardened layer, the bonding
Layer is polymethacrylates layer.
5. composite decking according to claim 3, which is characterized in that the composite decking further includes anti-fingerprint layer, described
Hardened layer be machine oxide skin(coating), alkaline-earth nitride layer, transition metal nitride layer or alkaline-earth metal oxynitride layer, it is described
Anti-fingerprint layer is covered on the hardened layer.
6. composite decking described in any one according to claim 1~5, which is characterized in that the hardened layer is multilayer.
7. composite decking described in any one according to claim 1~5, which is characterized in that the protective layer is insulating materials
Layer.
8. composite decking described in any one according to claim 1~5, which is characterized in that the functional layer is multilayer.
9. composite decking described in any one according to claim 1~5, which is characterized in that the substrate with a thickness of
0.05mm~5mm.
10. composite decking described in any one according to claim 1~5, which is characterized in that the protective layer thickness is 0.1 μ
M~100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821434088.8U CN209472864U (en) | 2018-09-03 | 2018-09-03 | Composite decking |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821434088.8U CN209472864U (en) | 2018-09-03 | 2018-09-03 | Composite decking |
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| CN209472864U true CN209472864U (en) | 2019-10-08 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882598A (en) * | 2018-09-03 | 2018-11-23 | 维达力实业(深圳)有限公司 | Composite decking and preparation method thereof |
| CN113747710A (en) * | 2021-08-27 | 2021-12-03 | 维达力实业(深圳)有限公司 | Cover plate, preparation method thereof and electronic equipment |
-
2018
- 2018-09-03 CN CN201821434088.8U patent/CN209472864U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882598A (en) * | 2018-09-03 | 2018-11-23 | 维达力实业(深圳)有限公司 | Composite decking and preparation method thereof |
| CN113747710A (en) * | 2021-08-27 | 2021-12-03 | 维达力实业(深圳)有限公司 | Cover plate, preparation method thereof and electronic equipment |
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