CN201898660U - Combined-type black double-sided copper foil baseplate - Google Patents
Combined-type black double-sided copper foil baseplate Download PDFInfo
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- CN201898660U CN201898660U CN2010206153205U CN201020615320U CN201898660U CN 201898660 U CN201898660 U CN 201898660U CN 2010206153205 U CN2010206153205 U CN 2010206153205U CN 201020615320 U CN201020615320 U CN 201020615320U CN 201898660 U CN201898660 U CN 201898660U
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- copper foil
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Abstract
The utility model discloses a combined-type black double-sided copper foil baseplate, which comprises a first copper foil layer and a second copper foil layer, a black polyimide layer and an adhesive layer. A polymer layer is clamped between the first copper foil layer and the adhesive layer, the adhesive is clamped between the polymer layer and the second copper foil layer, and the total thickness of the polymer layer and the adhesive layer is 12-30 mm. The combined-type black double-side copper foil baseplate has such a good shielding effect as to ensure design security, meets the requirements that high-buckling sliding number and bending round corner are less than 0.8mm, and is suitable for a product requiring a bending or sliding circuit board.
Description
Technical field
The utility model relates to the two-sided copper clad laminate of a kind of combined type, and circuit pattern is covered in particularly a kind of confession, is used for the two-sided copper clad laminate of combined type black of flexible print wiring board.
Background technology
At present electronic system towards compact, high-fire resistance, multifunctionality, densification, high reliability and cheaply direction develop, so selecting for use of substrate just becomes very significant effects factor.And good substrate must possess high thermal conductivity, the high material behavior that hides chromatic effect, high-cooling property, high-fire resistance, reaches low thermal coefficient of expansion.The polyimide resin thermal stability is high and have excellent thermal diffusivity, mechanical strength, reach adherence, often applies to multiple electronic material, as is used for flexible printed wiring board (Flexible Printed Circuit).
Polyimide resin has been widely used in the electronic material, wherein, is used for the polyimide copper foil substrate of flexible printed wiring board, generally divides into single sided board or double sided board.Usually, the problem that the polyimide copper foil substrate is used again is subject to the composition and the thickness thereof of polyimide material, make formed polyimide layer mostly be the colourity of yellow system or other tool high optical transmittance, when causing being used for soft board thereafter, plagiarize because of the light transmission of polyimide layer makes the line design of line layer of flexible printed wiring board distribute to be easy to understand by the same trade, and then the market sale and the company that influences product operate.On the other hand, then the composition of polyimide material and thickness thereof also can influence the production process and the difficulty of copper clad laminate.
The utility model content
In order to remedy above deficiency, the utility model provides a kind of combined type black two-sided copper clad laminate, and the two-sided copper clad laminate of this combined type black is applicable to that circuit board has the product of bending or slip demand.
The utility model for the technical scheme that solves its technical problem and adopt is: the two-sided copper clad laminate of a kind of combined type black, comprise black polyamide layer with opposite first and second surface, be formed at first copper foil layer on the first surface of this black polyamide layer, be formed in the adhesion coating on the second surface of this black polyamide layer and be formed at second copper foil layer on this adhesion coating, described black polyamide layer is folded between the adhesion coating and first copper foil layer, adhesion coating is folded between second copper foil layer and the black polyamide layer, and the thickness summation of this black polyamide layer and this adhesion coating is 12～30 microns.
As further improvement of the utility model, the thickness of described adhesion coating is 3～15 microns, preferably 9～13 microns.
As further improvement of the utility model, the thickness of described first copper foil layer is 8～18 microns, and this first copper foil layer is a kind of in the high flexing copper foil layer of rolled copper foil layer and high temperature.
As further improvement of the utility model, the thickness of described second copper foil layer is 8～18 microns.
As further improvement of the utility model, the thickness of described black polyamide layer is 5～20 microns, preferably 8～14 microns.
The beneficial effects of the utility model are: the utility model is made by easy processing procedure, by adjusting adhesion coating and black polyamide layer thickness, make copper clad laminate of the present utility model meet high flexing slip number of times and bending fillet, be specially adapted to the product that circuit board has bending or slip demand less than the requirement of 0.8mm.
Description of drawings
Fig. 1 is a cross-sectional view of the present utility model.
Embodiment
Be meant the definition to the bright-dark degree of color according to Commission Internationale De L'Eclairage (International Commission onIllumination) in lightness described in the utility model (lightness claims the L value again), usually, white lightness is the highest, and the black lightness is minimum.And the polyimide layer of adjusting copper clad laminate is near black, and lightness then reduces relatively; The coefficient of heat conduction described in the utility model (heat transfercoefficient, claim the K value again) be meant the capacity of heat transmission of copper clad laminate, especially refer to copper clad laminate under the unit temperature difference, the unit interval is called the coefficient of heat conduction of copper clad laminate by the heat of unit are unit distance; Glossiness described in the utility model (Gloss) is meant the reflective degree of copper clad laminate polyimides laminar surface, and glossiness does not have unit, but its numerical value is big more, represent the intensity of its reverberation strong more, otherwise numerical value is more little, represents its catoptrical intensity weak more.
Embodiment: the two-sided copper clad laminate of a kind of combined type black, comprise first copper foil layer 103, be formed at these first copper foil layer, 103 surfaces and go up and have the black polyamide layer 102 of first surface 1021 and second surface 1022, adhesion coating 101 on the second surface 1022 of bonding black polyamide layer 102 and second copper foil layer 104 that is formed on this adhesion coating 101, described black polyamide layer 102 is folded between this adhesion coating 101 and first copper foil layer 103, this adhesion coating 101 is folded between this black polyamide layer 102 and second copper foil layer 104, and described black polyamide layer 102 is 12～30 microns with the thickness sum of described adhesion coating 101.
The thickness of described adhesion coating is 3～15 microns, preferably 9～13 microns.
The employed Copper Foil of described first copper foil layer is a kind of in rolled copper foil (RA Copper Foil) and the high flexing Copper Foil of high temperature (HA Copper Foil), preferably 8～18 microns of the thickness of first copper foil layer.
The employed Copper Foil of second copper foil layer there is no particular restriction, can use general electrolytic copper foil, preferably 8～18 microns of the thickness of second copper foil layer.
In order to make its flexible electric circuit board that manufactures reduce light transmittance and to reduce the not generation of congruent problem of heat radiation, copper clad laminate of the present utility model is to obtain thin thickness but the low copper clad laminate of lightness according to the thickness that the needs of this copper clad laminate are adjusted black polyamide layer in the copper clad laminate, the thickness of the employed black polyamide layer of copper clad laminate of the present utility model is 5～20 microns, when the thickness of adhesion coating was between 9～13 microns, the thickness of black polyamide layer was chosen between 8～14 microns.With regard to the black polyamide layer of copper clad laminate, lightness is for being less than or equal to 25, light transmittance less than 3% and the glossiness of copper clad laminate for being less than or equal to 30, then the thickness of this black polyamide layer should be 5～50 microns.
Lightness of the present utility model (L value) test, slide unit slip test and bounce-back test are as follows:
Lightness (L value) test:
Measure lightness by color difference meter (ColorQuest XEhunterlab), measure penetrance, measure with Grossmeters and measure glossiness, be recorded in table 1 with transmissometer:
Table 1
The heat radiation test:
Thermal conductivity by material learns, when the coefficient of heat conduction high more, the easy more heat radiation of material.Preparation the utility model becomes sample 11, sample 21 and sample 31, totally three samples thing to be detected, and utilize coefficient of heat conduction analyzer (ThermalConductivity Analyzer) that the coefficient of heat conduction is detected respectively, as shown in table 2 below, with the thermal diffusivity of further analysis thing to be detected:
Table 2
On first copper foil layer described in the utility model, adhere to the adhesion coating of 15 micron thickness and the black polyamide layer of 12.5 micron thickness, in order to testing:
The slide test condition of test of slide unit: two-sided copper clad laminate is cut into the test piece of 10mm * 30mm, and setting slide unit test fillet is 0.65mm, and sliding frequency is that 60 times/minute and sliding stroke are 35mm.The standard of test passes is flexing 100,000 times, and in the resistance change rate 10%, test result is recorded in table 3;
The test condition of bounce test: the test piece that two-sided copper clad laminate is cut into 10mm * 30mm, and the second copper foil layer etching of the two-sided copper clad laminate of the utility model removed, and to set the test fillet be 2.35mm, and every group of test piece measured 5 times, is embedded in table 3 behind the calculating mean value.
| Experimental group 1 | Experimental group 2 | |
| Copper thickness (μ m) | 12 | 12 |
| Polyimides thickness (μ m) | 8 | 13 |
| Adhesive layer thickness (μ m) | 8 | 12 |
| Thickness after the single face etching (um) | 29 | 38 |
| Bounce (g) | 4.3 | 6.5 |
| Slip flexing number of times | 100000 | 130000 |
| Resistance change rate | 7.4％ | 4.92％ |
Table 3
By the result shown in the table 3 as can be known, the utlity model has extremely low bounce, and can satisfy the slip testing time requirement when low flexing fillet is 0.65mm, and resistance change rate is also less than 10%, in addition, experimental group 2 is a preferred embodiment of the present utility model, and first copper foil layer of experimental group 2 adopts the high flexing Copper Foil of high temperature, its slip flexing number of times is more up to 130000 times, resistance change rate only 4.92%.
In the utility model, the thickness of black polyamide layer is good with 5～15 microns, is more preferably 10～14 microns; First copper foil layer adopts the high flexing Copper Foil of high temperature (HA Copper Foil) can obtain better performance.
Claims (6)
1. two-sided copper clad laminate of combined type black, it is characterized in that: comprise black polyamide layer with opposite first and second surface, be formed at first copper foil layer on the first surface of this black polyamide layer, be formed in the adhesion coating on the second surface of this black polyamide layer and be formed at second copper foil layer on this adhesion coating, described black polyamide layer is folded between the adhesion coating and first copper foil layer, adhesion coating is folded between second copper foil layer and the black polyamide layer, and the thickness summation of this black polyamide layer and this adhesion coating is 12～30 microns.
2. the two-sided copper clad laminate of combined type black according to claim 1 is characterized in that: the thickness of described adhesion coating is 3～15 microns.
3. the two-sided copper clad laminate of combined type black according to claim 1 is characterized in that: the thickness of described first copper foil layer is 8～18 microns.
4. the two-sided copper clad laminate of combined type black according to claim 1 is characterized in that: the thickness of described second copper foil layer is 8～18 microns.
5. the two-sided copper clad laminate of combined type black according to claim 1 is characterized in that: the thickness of this black polyamide layer is 5～20 microns.
6. the two-sided copper clad laminate of combined type black according to claim 5 is characterized in that: the thickness of this black polyamide layer is 8～14 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206153205U CN201898660U (en) | 2010-11-19 | 2010-11-19 | Combined-type black double-sided copper foil baseplate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206153205U CN201898660U (en) | 2010-11-19 | 2010-11-19 | Combined-type black double-sided copper foil baseplate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201898660U true CN201898660U (en) | 2011-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206153205U Expired - Lifetime CN201898660U (en) | 2010-11-19 | 2010-11-19 | Combined-type black double-sided copper foil baseplate |
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| Country | Link |
|---|---|
| CN (1) | CN201898660U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102463718A (en) * | 2010-11-19 | 2012-05-23 | 昆山雅森电子材料科技有限公司 | Compound black double-side copper foil base plate and manufacture method thereof |
| CN103687459A (en) * | 2012-09-14 | 2014-03-26 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board with same |
-
2010
- 2010-11-19 CN CN2010206153205U patent/CN201898660U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102463718A (en) * | 2010-11-19 | 2012-05-23 | 昆山雅森电子材料科技有限公司 | Compound black double-side copper foil base plate and manufacture method thereof |
| CN103687459A (en) * | 2012-09-14 | 2014-03-26 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board with same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110713 |
|
| CX01 | Expiry of patent term |