CN202222080U - Copper foil substrate for a flexible printed circuit board - Google Patents
Copper foil substrate for a flexible printed circuit board Download PDFInfo
- Publication number
- CN202222080U CN202222080U CN201120315655XU CN201120315655U CN202222080U CN 202222080 U CN202222080 U CN 202222080U CN 201120315655X U CN201120315655X U CN 201120315655XU CN 201120315655 U CN201120315655 U CN 201120315655U CN 202222080 U CN202222080 U CN 202222080U
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- copper foil
- clad laminate
- copper clad
- reflector
- polyimide layer
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Abstract
The utility model discloses a copper foil substrate for a flexible printed circuit board, comprising a first copper foil, a polyimide layer and a second copper foil, wherein the polyimide layer is located between the first copper foil and the second copper foil, the thickness of the polyimide layer is 7 to 50 microns, a first reflective layer is arranged between the second copper foil and the polyimide layer or furthermore a second reflective layer is arranged between the first copper foil and the polyimide layer, the thickness of the polyimide layer is adjusted to obtain the copper foil substrate with thin thickness and low lightness and the lightness of the copper foil substrate is changed by adjusting a content of an additive contained in the first reflective layer and the second reflective layer. Compared with the conventional copper substrate, the copper foil substrate has high lightness and high heat radiation and is suitable for white shading a soft copper foil circuit substrate applied on electronic products or radiating the heat.
Description
Technical field
The utility model relates to a kind of copper clad laminate, especially a kind of copper clad laminate that is used for flexible print wiring board.
Background technology
At present electronic system towards compact, high-fire resistance, multifunctionality, densification, high reliability and cheaply direction develop, so selecting for use of substrate just becomes very significant effects factor.And good substrate must possess high thermal conductivity, the high material behavior that hides chromatic effect, high-cooling property, high-fire resistance, reaches low thermal coefficient of expansion.The polyimide resin thermal stability is high and have excellent thermal diffusivity, mechanical strength, reach then property, often applies to multiple electronic material, as is used for flexible printed wiring board (Flexible Printed Circuit).
Polyimide resin has been widely used in the electronic material, wherein, is used for the polyimide copper foil substrate of flexible printed wiring board, generally divides into single sided board or double sided board again.Usually; The problem of polyimide copper foil substrate on using is composition and the thickness thereof that is subject to polyimide material; Make formed polyimide layer be mostly the colourity of yellow or other tool high optical transmittance; When causing being used for soft board thereafter, plagiarize, and then the market sale and the company that influences product operate because of the light transmission of polyimide layer makes the line design of line layer of flexible printed wiring board distribute to be easy to understand by the same trade.On the other hand, on circuit, lay a welding resisting layer and reflector often again like the electronic product of luminescence component, its production process is comparatively complicated.
Therefore, still need a kind of thin thickness and have the copper clad laminate that screening effect has reflecting effect again.
The utility model content
In order to overcome above-mentioned defective, the utility model provides a kind of flexible print wiring board to use copper clad laminate, and said flexible print wiring board is used the copper clad laminate thinner thickness, and has effect reflective and that cover line pattern.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of flexible print wiring board is used copper clad laminate; Comprise first Copper Foil, polyimide layer and second Copper Foil; Said polyimide layer is between said first Copper Foil and said second Copper Foil; Said polyimides layer thickness is 7 to 50 microns, is provided with first reflector, and said first reflector is formed between said polyimide layer and said second Copper Foil.
The utility model also can adopt following technical measures further to realize in order to solve its technical problem:
Preferably, also be provided with second reflector, said second reflector is formed between said first Copper Foil and the said polyimide layer.
Preferably; The said first reflector material therefor contains tackness resin and the additive that is used to increase lightness; Wherein, Said tackness resin is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin and BMI (Bismaleimide resin) be at least a in the resin, and said additive is at least a in Chinese white, titanium dioxide and the boron nitride.
Preferably; The said second reflector material therefor contains tackness resin and the additive that is used to increase lightness; Wherein, Said tackness resin is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin and BMI (Bismaleimide resin) be at least a in the resin, and said additive is at least a in Chinese white, titanium dioxide and the boron nitride.
Preferably, the thickness in said first reflector is 15 to 25 microns.
Preferably, the thickness in said second reflector is 15 to 25 microns.
Preferably, the thickness difference in said first reflector and second reflector is less than 35 microns.
Preferably, the thickness of said first Copper Foil is 9 to 35 microns.
Preferably, the thickness of said second Copper Foil is 9 to 35 microns.
Preferably, the thickness difference of said first Copper Foil and second Copper Foil is less than 26 microns.
The beneficial effect of the utility model is: the flexible print wiring board of the utility model with copper clad laminate except having first Copper Foil, polyimide layer and second Copper Foil; Also between second Copper Foil and polyimide layer, be provided with first reflector; Perhaps further, between first Copper Foil and polyimide layer, also establish second reflector, through the thickness of adjustment polyimide layer; Obtain thin thickness but the low copper clad laminate of lightness; The lightness of copper clad laminate also can change through adjusting the contained content of additive in first reflector and second reflector, can know through test result among the utility model embodiment, and the copper clad laminate of the utility model can be avoided making that because of the light transmission of polyimide layer the line design of the line layer of formed flexible print wiring board was easy to understand by same trade plagiarism afterwards; Moreover; The use that can simplify welding resisting layer promptly has reflecting effect and also can reduce cost, in addition, and the copper clad laminate of the utility model; Have more the advantage of high brightness and high-cooling property compared to the convention copper clad laminate, be fit to be applied to the demand that the flexible copper foil circuit substrate white of electronic product is covered or dispelled the heat.
Description of drawings
Fig. 1 is the utility model embodiment 1 described copper clad laminate profile;
Fig. 2 is the utility model embodiment 2 described copper clad laminate profiles.
Embodiment
Below through the execution mode of specific this creation of instantiation explanation, the personage who is familiar with this skill can be understood the advantage and the effect of this creation easily by the content that this specification disclosed.This creation also can be implemented with other different mode,, under the category that discloses from this creation that is not contrary to, can give different modifications and change that is.
In this article, lightness (brightness claims the L value again) is meant the definition to the bright-dark degree of color according to Commission Internationale De L'Eclairage (International Commission on Illumination).Usually, white lightness is the highest, and the black lightness is minimum, and the polyimide layer or the adhesion layer of adjustment copper clad laminate are near black, and lightness then reduces relatively.
The coefficient of heat conduction (thermal conductivity; Claim the K value again), in this article refer to the capacity of heat transmission of copper clad laminate, refer to that especially copper clad laminate is under the unit temperature difference; Unit interval is through the heat of unit are unit distance; The coefficient of heat conduction that is called copper clad laminate, if measure the thickness H of said copper clad laminate, then said measuring value then need multiply by H and obtain the coefficient of heat conduction of copper clad laminate.
Glossiness (Gloss) is meant the reflective degree of the copper clad laminate polyimides laminar surface of this creation, and glossiness does not have unit, but its numerical value is big more, represent the intensity of its reverberation strong more, otherwise numerical value is more little, the intensity of representing its reverberation more a little less than.
Embodiment 1: the flexible print wiring board of shown in Figure 1 is the utility model embodiment 1 is with copper clad laminate 100; It appears with the double sided board form, and said copper clad laminate 100 is provided with the first Copper Foil 101a, polyimide layer 102, first reflector 103 and the second Copper Foil 101b.
The first Copper Foil 101a and the second Copper Foil 101b of this example can be electrolytic copper foil or rolled copper foil; And in the application; Usually the thickness of the said first Copper Foil 101a and the second Copper Foil 101b separately can be between 9 to 35 microns, and the thickness difference of said first Copper Foil and second Copper Foil is less than 26 microns.
In order to make its flexible electric circuit board that manufactures reduce light transmittance and to reduce the not generation of congruent problem of heat radiation; The copper clad laminate of this creation; Thickness through polyimide layer 102 in the adjustment copper clad laminate obtains thin thickness but the low copper clad laminate of lightness, to this; The employed polyimide layer 102 of the copper clad laminate of this creation does not have special restriction, is preferably the not halogen-containing Thermocurable polyimide material of use.The thickness of said polyimide layer 102 should be 7 to 50 microns.
The lightness of the copper clad laminate of this creation also can change through said first reflector of adjustment 103 contained content of additive; And improve the heat sinking benefit of copper clad laminate by this, usually, the additive level that makes an addition to said first reflector 103 be account for resin content in first reflector 103 10 to 95wt%; Be good with 70 to 90wt% again; For example, if resin content is 100 grams, then additive level is 10 to 90 grams.Wherein, the toner that Chinese white is also contained dyestuff or is commonly called as, and pigment can comprise with the obtained person of organic or inorganic material.
The copper clad laminate of present embodiment, can accomplish through following fabrication steps:
At first; The Copper Foil of one 35 micron thick is provided, and in arbitrary surface coated one polyimides of said Copper Foil, and obtain a single face copper clad laminate after drying the polyimide layer that forms 25 micron thick; Then; Single face copper clad laminate to forming polyimide layer imposes a roller processing procedure, by gap between the roller and pressure that roller gave, makes polyimide layer be attached on the copper foil surface securely and make not produce bubble between Copper Foil and the polyimide layer; Contain the epoxy resin adhesive agent of additive in the polyimide layer surface coated of said single face copper clad laminate, and the single face copper clad laminate of the said coating of epoxy resin coating is carried out baking processing, cause said epoxy resin adhesive agent between the B-stage state; To form first reflector; Simultaneously, for avoiding the waste and the crawling phenomenons of the coating that a large amount of coatings are caused, be that the mode with screen painting or rotary coating is good; At last; Get again and take off on first reflector of single face copper clad laminate before one 35 micron thick Copper Foils are covered on, and give pressing, to form two-sided copper clad laminate; At last, toast said two-sided copper clad laminate, make epoxy resin cure, to accomplish two-sided copper clad laminate product shown in Figure 1.In the present embodiment, formed two-sided copper clad laminate can be avoided making that because of the light transmission of polyimide layer the line design of the line layer of formed flexible print wiring board was easy to understand by same trade plagiarism afterwards.
According to the manufacture method of embodiment 1, make copper clad laminate with first reflector of adding various different additive, like following table 1:
Table 1: the copper clad laminate of various different additive
Embodiment 2: the flexible print wiring board of shown in Figure 2 is the utility model embodiment 2 is with copper clad laminate 200; This routine copper clad laminate is two-sided copper clad laminate, is provided with the first Copper Foil 201a, polyimide layer 202, the first reflector 203a, the second reflector 203b and the second Copper Foil 201b.
The difference of the copper clad laminate 100 of present embodiment and embodiment 1 is that present embodiment also comprises the second reflector 203b that is formed between said first Copper Foil 201a and the polyimide layer 202.The said second reflector 203b comprises that being selected from epoxy resin, acrylic resin, amido formate is that resin, silicon rubber are resin, to gather ring diformazan benzene series resin and BMI (Bismaleimide resin) be one or more resins of group that resin is formed and one or more additives that are selected from Chinese white, titanium dioxide and group that boron nitride is formed, and the thickness in said second reflector is 15 to 25 microns.The material of the said second reflector 203b and thickness can be identical or different with the first reflector 203a.Preferably, the thickness difference of the said first reflector 203a and the second reflector 203b is less than 35 microns.
The copper clad laminate of present embodiment, can accomplish through following fabrication steps:
At first; Go up the epoxy resin adhesive agent that coating contains additive in two Copper Foils (respectively being 35 micron thick); The NPI polyimide layer of producing just like KANEKA company (25 micron thick) then is set between said two Copper Foils; Bind said polyimide layer through said diepoxy resin adhesive agent, can obtain copper clad laminate shown in Figure 2.
According to the two-sided copper clad laminate that the manufacture method of embodiment 2 forms, as shown in table 2 below:
Table 2: the two-sided copper clad laminate of various different additive
Test case 1: lightness (L value) test
At first; Get 1 manufactured samples 1 to 3 according to embodiment, and embodiment 2 manufactured samples 4 to 6, totally 6 kinds of things to be detected; Behind the etching Copper Foil; Measure lightness by color difference meter (ColorQuest XEhunterlab) again,, measure with Grossmeters (Novo Gloss with transmissometer (NDH-2000) penetrance
TM) measure glossiness, with as shown in table 3 below:
Table 3: the lightness test of copper clad laminate
Test case 2: heat radiation test
Thermal conductivity by material learns, when the coefficient of heat conduction high more, the easy more heat radiation of material.Therefore 6 detected samples that prepare copper clad laminates like embodiment 1,2; And utilize coefficient of heat conduction analyzer (Thermal Conductivity Analyzer) to carry out the coefficient of heat conduction respectively and detect; As shown in table 4 below, with the thermal diffusivity of further analysis thing to be detected.
Table 4: the coefficient of heat conduction test of copper clad laminate
After the copper clad laminate to the utility model carries out the test of L value and thermal diffusivity, can find the utility model two-sided copper clad laminate outward appearance penetrance and the general copper clad laminate of convention mutually recently very low (≤2%), have covering property and reflective fully.
In addition, each is made sample places on the smooth flat, leave standstill 20 minutes after, measure the depth of camber (centimetre) of four corners, carry out the flatness test, find each corner depth of camber all less than 0.5 centimeter, therefore, have good property and the dimensional stability endured.
In sum; The copper clad laminate of the utility model has higher lightness and good thermal diffusivity, moreover the use that can simplify welding resisting layer promptly has reflecting effect and also can reduce cost; In addition; The copper clad laminate of the utility model has more the advantage of high brightness and high-cooling property compared to the convention copper clad laminate, is fit to be applied to the demand that the flexible copper foil circuit substrate white of electronic product is covered or dispelled the heat.
Above-mentioned specification and embodiment are merely the principle and the effect thereof of illustrative the utility model, but not are used to limit the utility model, and the rights protection scope of the utility model should be listed like claims.
Claims (8)
1. a flexible print wiring board is used copper clad laminate; Comprise first Copper Foil, polyimide layer and second Copper Foil; Said polyimide layer is between said first Copper Foil and said second Copper Foil; It is characterized in that: said polyimides layer thickness is 7 to 50 microns, is provided with first reflector, and said first reflector is formed between said polyimide layer and said second Copper Foil.
2. flexible print wiring board according to claim 1 is used copper clad laminate, it is characterized in that: be provided with second reflector, said second reflector is formed between said first Copper Foil and the said polyimide layer.
3. flexible print wiring board according to claim 1 is used copper clad laminate, it is characterized in that: the thickness in said first reflector is 15 to 25 microns.
4. flexible print wiring board according to claim 2 is used copper clad laminate, it is characterized in that: the thickness in said second reflector is 15 to 25 microns.
5. flexible print wiring board according to claim 2 is used copper clad laminate, it is characterized in that: the thickness difference in said first reflector and second reflector is less than 35 microns.
6. flexible print wiring board according to claim 1 is used copper clad laminate, it is characterized in that: the thickness of said first Copper Foil is 9 to 35 microns.
7. flexible print wiring board according to claim 1 is used copper clad laminate, it is characterized in that: the thickness of said second Copper Foil is 9 to 35 microns.
8. flexible print wiring board according to claim 1 and 2 is used copper clad laminate, it is characterized in that: the thickness difference of said first Copper Foil and second Copper Foil is less than 26 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120315655XU CN202222080U (en) | 2011-08-26 | 2011-08-26 | Copper foil substrate for a flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120315655XU CN202222080U (en) | 2011-08-26 | 2011-08-26 | Copper foil substrate for a flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202222080U true CN202222080U (en) | 2012-05-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120315655XU Expired - Lifetime CN202222080U (en) | 2011-08-26 | 2011-08-26 | Copper foil substrate for a flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202222080U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950835A (en) * | 2011-08-26 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Copper foil substrate for flexible printed circuit boards |
-
2011
- 2011-08-26 CN CN201120315655XU patent/CN202222080U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950835A (en) * | 2011-08-26 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Copper foil substrate for flexible printed circuit boards |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120516 |
|
| CX01 | Expiry of patent term |