CN102463718A - Compound black double-side copper foil base plate and manufacture method thereof - Google Patents
Compound black double-side copper foil base plate and manufacture method thereof Download PDFInfo
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- CN102463718A CN102463718A CN2010105512440A CN201010551244A CN102463718A CN 102463718 A CN102463718 A CN 102463718A CN 2010105512440 A CN2010105512440 A CN 2010105512440A CN 201010551244 A CN201010551244 A CN 201010551244A CN 102463718 A CN102463718 A CN 102463718A
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- copper foil
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Abstract
The invention discloses a compound black double-side copper foil base plate, which comprises a first copper foil layer, a second copper foil layer, a black polyimide layer and a bonding layer, wherein a polymer layer is clamped between the first copper foil layer and the bonding layer, the bonding layer is clamped between the polymer layer and the second copper foil layer, and the sum of the thickness of the polymer layer and the bonding layer is 12 to 30 microns. A manufacture method comprises the steps that: black polymers are coated on any one surface of the first copper foil layer and are baked for forming the black polyimide layer, then, the bonding layer is formed on the surface of the black polyimide layer of a single-side copper foil base plate, and the bonding layer is in a semi-polymerization and semi-solidification state; and the second copper foil layer is pasted on the bonding layer and is pressed so that the second copper foil layer is tightly bonded, the double-side copper foil base plate is baked, and finished products are obtained. The compound black double-side copper foil base plate has the advantages that the shielding effect is good, the effect of design confidentiality is realized, and the compound black double-side copper foil base plate also conforms to requirements of high buckling sliding times and bending round angle smaller than 0.8 millimeter and is applicable to products with circuit board bending or sliding requirements.
Description
Technical field
The present invention relates to two-sided copper clad laminate of a kind of combined type and preparation method thereof, circuit pattern is covered in particularly a kind of confession, is used for two-sided copper clad laminate of combined type black of flexible print wiring board and preparation method thereof.
Background technology
At present electronic system towards compact, high-fire resistance, multifunctionality, densification, high reliability and cheaply direction develop, so selecting for use of substrate just becomes very significant effects factor.And good substrate must possess high thermal conductivity, the high material behavior that hides chromatic effect, high-cooling property, high-fire resistance, reaches low thermal coefficient of expansion.The polyimide resin heat endurance is high and have excellent thermal diffusivity, mechanical strength, reach adherence, often applies to multiple electronic material, as is used for flexible printed wiring board (Flexible Printed Circuit).
Polyimide resin has been widely used in the electronic material, wherein, is used for the polyimide copper foil substrate of flexible printed wiring board, generally divides into single sided board or dual platen.Usually; The problem that the polyimide copper foil substrate is used again is subject to the composition and the thickness thereof of polyimide material; Make formed polyimide layer be mostly the colourity of yellow or other tool high optical transmittance; When causing being used for soft board thereafter, plagiarize, and then the market sale and the company that influences product operate because of the light transmission of polyimide layer makes the line design of line layer of flexible printed wiring board distribute to be easy to understand by the same trade.On the other hand, then the composition of polyimide material and thickness thereof also can influence the production process and the difficulty of copper clad laminate.
Summary of the invention
In order to remedy above deficiency, the invention provides two-sided copper clad laminate of a kind of combined type black and preparation method thereof, the two-sided copper clad laminate preparation method of this combined type black is simple, is applicable to that circuit board has the product of bending or slip demand.
The present invention for the technical scheme that solves its technical problem and adopt is: the two-sided copper clad laminate of a kind of combined type black; First copper foil layer on the first surface that comprise black polyamide layer, is formed at this black polyamide layer, be formed at the adhesion coating on the second surface of this black polyamide layer and be formed at second copper foil layer on this adhesion coating with opposite first and second surface; Said black polyamide layer is folded between the adhesion coating and first copper foil layer; Adhesion coating is folded between second copper foil layer and the black polyamide layer, and the thickness summation of this black polyamide layer and this adhesion coating is 12～30 microns.
As further improvement of the present invention, the thickness of said adhesion coating is 3～15 microns, and preferably 9～13 microns, the thickness of said black polyamide layer is 5～20 microns, preferably 8～14 microns.
As further improvement of the present invention, the thickness of said first copper foil layer is 8～18 microns.
As further improvement of the present invention, said first copper foil layer is a kind of in the high flexing copper foil layer of rolled copper foil layer and high temperature.
As further improvement of the present invention, the thickness of said second copper foil layer is 8～18 microns.
As further improvement of the present invention, said black polyamide layer contains additive, and this additive comprises at least a in material with carbon element, pigment, dyestuff and the toner, and this additive accounts for 3～25wt% of this solid content.
As further improvement of the present invention, said material with carbon element is generally at least a in carbon dust, carbon nanotube, the black pigment.
As further improvement of the present invention, also comprise metal-powder, this metal-powder accounts for 30～80wt% of black polyamide layer solid content.
As further improvement of the present invention, the used material of said adhesion coating is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be at least a in resin and the polyimide resin.
The preparation method of the two-sided copper clad laminate of a kind of combined type black, undertaken by following step:
Step 1:, and obtain the single face copper clad laminate after drying formation black polyamide layer at arbitrary surface coated black polymer of first copper foil layer;
Step 2: on a kind of black polyamide laminar surface that adhesion coating is formed at the single face copper clad laminate in coating and the transfer printing, make adhesion coating be in half polymerization semi-cured state;
Step 3: get second copper foil layer, second copper foil layer is covered on the adhesion coating, and give pressing second copper foil layer is closely bonded, obtain two-sided copper clad laminate;
Step 4: toast two-sided copper clad laminate, obtain two-sided copper clad laminate finished product.
The invention has the beneficial effects as follows: the present invention is made by easy processing procedure; Through adjustment adhesion coating and black polyamide layer thickness; Make copper clad laminate of the present invention meet high flexing slip number of times and bending fillet, be specially adapted to the product that circuit board has bending or slip demand less than the requirement of 0.8mm.
Description of drawings
Fig. 1 is a cross-sectional view of the present invention.
The specific embodiment
Be meant the definition to the bright-dark degree of color according to International Commission on Illumination (International Commission on Illumination) in lightness (lightness claims the L value again) described in the invention, usually, white lightness is the highest, and the black lightness is minimum.And the polyimide layer of adjustment copper clad laminate is near black, and lightness then reduces relatively; The coefficient of heat conduction according to the invention (heat transfer coefficient; Claim the K value again) be meant the capacity of heat transmission of copper clad laminate; Especially refer to copper clad laminate under the unit temperature difference, the unit interval is called the coefficient of heat conduction of copper clad laminate through the heat of unit are unit distance; Glossiness according to the invention (Gloss) is meant the reflective degree of copper clad laminate polyimides laminar surface, and glossiness does not have unit, but its numerical value is big more, represent the intensity of its reverberation strong more, otherwise numerical value is more little, represent its catoptrical intensity more a little less than.
Embodiment: the two-sided copper clad laminate of a kind of combined type black; Comprise first copper foil layer 103, be formed at these first copper foil layer, 103 surfaces and go up and have the adhesion coating 101 on the second surface 1022 of the black polyamide layer 102 of first surface 1021 and second surface 1022, bonding black polyamide layer 102 and be formed at second copper foil layer 104 on this adhesion coating 101; Said black polyamide layer 102 is folded between this adhesion coating 101 and first copper foil layer 103; This adhesion coating 101 is folded between this black polyamide layer 102 and second copper foil layer 104, and said black polyamide layer 102 is 12～30 microns with the thickness sum of said adhesion coating 101.
The employed Copper Foil of said first copper foil layer is a kind of in rolled copper foil (RA Copper Foil) and the high flexing Copper Foil of high temperature (HA Copper Foil), preferably 8～18 microns of the thickness of first copper foil layer; The employed Copper Foil of second copper foil layer does not have particular restriction, can use general electrolytic copper foil, preferably 8～18 microns of the thickness of second copper foil layer.
Also comprise metal-powder; Further increase the capacity of heat transmission of copper clad laminate through metal-powder; This metal-powder accounts for 30～80wt% of black polyamide layer solid content, and preferable content is 40～50wt%, for example; If black polyamide layer solid content is 100g, then metal-powder content is 30～80g.
In order to make its flexible electric circuit board that manufactures reduce light transmittance and to reduce the not generation of congruent problem of heat radiation; Copper clad laminate of the present invention is to adjust the thickness of black polyamide layer in the copper clad laminate and the amount of contained additive obtains thin thickness but the low copper clad laminate of lightness according to the needs of this copper clad laminate; The employed black polyamide layer of copper clad laminate of the present invention does not have special restriction, and it preferably uses has tack and not halogen-containing Thermocurable polyimide material.The thickness of this black polyamide layer is 5～20 microns, and when the thickness of adhesion coating was between 9～13 microns, the thickness of black polyamide layer was chosen between 8～14 microns.The material of this adhesion coating is generally and is selected from epoxy resin, acrylic resin, amido formate is that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be resin (Bimaleimide resin) and polyimide resin is at least a.
With regard to the black polyamide layer of copper clad laminate, lightness is for being less than or equal to 25, light transmittance less than 3% and the glossiness of copper clad laminate for being less than or equal to 30, then the thickness of this black polyamide layer should be 5～50 microns.In addition, lightness of the present invention also can be adjusted the content of the contained additive of this black polyamide layer except through the thickness by adjustment black polyamide layer; And improve the radiating effect of copper clad laminate thus; Usually, the additive content that makes an addition to this black polyamide layer is the 3～25wt% that accounts for black polyamide layer solid content, is good with 5～15wt% again; For example; If black polyamide layer solid content is 100g, then additive content is 3～25g, and the additive of said black polyamide layer comprises material with carbon element, pigment, dyestuff and toner; And the material with carbon element in the additive of this polyimide layer is generally at least a of carbon dust, carbon nanotube, black pigment, and carbon dust also can comprise the carbon black that is commonly called as in the present invention.Pigment can comprise that organic material and inorganic material are prepared.
Lightness of the present invention (L value) test, slide unit slip are tested and are rebounded test as follows:
Lightness (L value) test:
Measure lightness through color difference meter (ColorQuest XEhunterlab), measure penetrance, measure with Grossmeters and measure glossiness, be recorded in table 1 with transmissometer:
Table 1
The heat radiation test:
Thermal conductivity by material learns, when the coefficient of heat conduction high more, the easy more heat radiation of material.Preparation the present invention also is added with the metal-powder that accounts for black polyamide layer solid content 30wt% to form sample 11, sample 21 and sample 31; Totally three kinds of things to be detected; And utilize coefficient of heat conduction analyzer (Thermal ConductivityAnalyzer) that the coefficient of heat conduction is detected respectively; As shown in table 2 below, with the thermal diffusivity of further analysis thing to be detected:
Table 2
On first copper foil layer of the present invention, adhere to the adhesion coating of 15 micron thick and the black polyamide layer of 12.5 micron thick, in order to testing:
The slide test condition of test of slide unit: two-sided copper clad laminate is cut into the test piece of 10mm * 30mm, and setting slide unit test fillet is 0.65mm, and sliding frequency is that 60 times/minute and sliding stroke are 35mm.The standard of test passes is flexing 100,000 times, and in the resistance change rate 10%, test result is recorded in table 3
The test condition of bounce test: the test piece that two-sided copper clad laminate is cut into 10mm * 30mm; And the second copper foil layer etching of the two-sided copper clad laminate of the present invention removed; And to set the test fillet be 2.35mm, and every group of test piece measured 5 times, is embedded in table 3 behind the calculating mean value.
| Experimental group 1 | Experimental group 2 | |
| Copper thickness (μ m) | 12 | 12 |
| Polyimides thickness (μ m) | 8 | 13 |
| Adhesive layer thickness (μ m) | 8 | 12 |
| Thickness after the single face etching (um) | 29 | 38 |
| Bounce (g) | 4.3 | 6.5 |
| Slip flexing number of times | 100000 | 130000 |
| Resistance change rate | 7.4％ | 4.92％ |
Table 3
Can know that by the result shown in the table 3 the present invention has extremely low bounce, and can satisfy the slip testing time requirement when low flexing fillet is 0.65mm, and resistance change rate is also less than 10%.In addition, experimental group 2 is the preferred embodiments of the invention, and first copper foil layer of experimental group 2 adopts the high flexing Copper Foil of high temperature, and its slip flexing number of times is more up to 130000 times, resistance change rate only 4.92%.
In the present invention, the adhesive layer thickness of discovery epoxide resin type is less to the influence of bounce; The thickness of black polyamide layer is good with 5～15 microns, is more preferably 10～14 microns; First copper foil layer adopts the high flexing Copper Foil of high temperature (HA Copper Foil) can obtain better performance.
The preparation method of the two-sided copper clad laminate of this combined type black is following:
Step 1:, and obtain a single face copper clad laminate after drying formation black polyamide layer at arbitrary surface coated black polymer of first copper foil layer;
Step 2: on a kind of black polyamide laminar surface that adhesion coating is formed at the single face copper clad laminate in coating and the transfer printing, make adhesion coating be in half polymerization semi-cured state;
Step 3: get second copper foil layer, second copper foil layer is covered on the adhesion coating, and give pressing second copper foil layer is closely bonded, obtain two-sided copper clad laminate;
Step 4: toast two-sided copper clad laminate, obtain two-sided copper clad laminate finished product.
Claims (10)
1. two-sided copper clad laminate of combined type black; It is characterized in that: first copper foil layer on the first surface that comprise black polyamide layer, is formed at this black polyamide layer, be formed at the adhesion coating on the second surface of this black polyamide layer and be formed at second copper foil layer on this adhesion coating with opposite first and second surface; Said black polyamide layer is folded between the adhesion coating and first copper foil layer; Adhesion coating is folded between second copper foil layer and the black polyamide layer, and the thickness summation of this black polyamide layer and this adhesion coating is 12～30 microns.
2. the two-sided copper clad laminate of combined type black according to claim 1 is characterized in that: the thickness of said adhesion coating is 3～15 microns, and the thickness of said black polyamide layer is 5～20 microns.
3. the two-sided copper clad laminate of combined type black according to claim 1 is characterized in that: the thickness of said first copper foil layer is 8～18 microns.
4. according to claim 1 or the two-sided copper clad laminate of 3 described combined type black, it is characterized in that: said first copper foil layer is a kind of in the high flexing copper foil layer of rolled copper foil layer and high temperature.
5. the two-sided copper clad laminate of combined type black according to claim 1 is characterized in that: the thickness of said second copper foil layer is 8～18 microns.
6. the two-sided copper clad laminate of combined type black according to claim 1; It is characterized in that: said black polyamide layer contains additive; This additive comprises at least a in material with carbon element, pigment, dyestuff and the toner, and this additive accounts for 3～25wt% of this black polyamide layer solid content.
7. the two-sided copper clad laminate of combined type black according to claim 6 is characterized in that: said material with carbon element is at least a in carbon dust, carbon nanotube, the black pigment.
8. according to claim 1 or the two-sided copper clad laminate of 6 described combined type black, it is characterized in that: also comprise metal-powder, this metal-powder accounts for 30～80wt% of black polyamide layer solid content.
9. the two-sided copper clad laminate of combined type black according to claim 1 is characterized in that: said adhesion coating material therefor is that epoxy resin, acrylic resin, amido formate are that resin, silicon rubber are resin, to gather ring diformazan benzene series resin, BMI be at least a in resin and the polyimide resin.
10. the preparation method of the two-sided copper clad laminate of combined type black as claimed in claim 1 is characterized in that: undertaken by following step:
Step 1:, and obtain a single face copper clad laminate after drying formation black polyamide layer at arbitrary surface coated black polymer of first copper foil layer;
Step 2: on a kind of black polyamide laminar surface that adhesion coating is formed at the single face copper clad laminate in coating and the transfer printing, and make adhesion coating be in half polymerization semi-cured state;
Step 3: get second copper foil layer, second copper foil layer is covered on the adhesion coating, and give pressing second copper foil layer is closely bonded, obtain two-sided copper clad laminate;
Step 4: toast two-sided copper clad laminate, obtain two-sided copper clad laminate finished product.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105512440A CN102463718A (en) | 2010-11-19 | 2010-11-19 | Compound black double-side copper foil base plate and manufacture method thereof |
| TW100218664U TWM421878U (en) | 2010-11-19 | 2011-10-05 | Composite black double-sided copper foil substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105512440A CN102463718A (en) | 2010-11-19 | 2010-11-19 | Compound black double-side copper foil base plate and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102463718A true CN102463718A (en) | 2012-05-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105512440A Pending CN102463718A (en) | 2010-11-19 | 2010-11-19 | Compound black double-side copper foil base plate and manufacture method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102463718A (en) |
| TW (1) | TWM421878U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547132A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN114679837A (en) * | 2020-12-24 | 2022-06-28 | 广东生益科技股份有限公司 | Black glue-free flexible copper-clad plate and preparation method and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1097806A2 (en) * | 1999-11-04 | 2001-05-09 | Mitsubishi Gas Chemical Company, Inc. | Copper-clad board, method of making hole in said copper-clad board and printing wiring board comprising said copper-clad board |
| JP2004123774A (en) * | 2002-09-30 | 2004-04-22 | Kanegafuchi Chem Ind Co Ltd | Polyimide resin composition, polyimide film, and polyimide tube |
| CN201590948U (en) * | 2009-12-30 | 2010-09-22 | 昆山雅森电子材料科技有限公司 | Double-surfaced copper clad laminate |
| CN201590949U (en) * | 2009-05-13 | 2010-09-22 | 昆山雅森电子材料科技有限公司 | Copper clad laminate for flexible printed circuit board |
| CN201898660U (en) * | 2010-11-19 | 2011-07-13 | 昆山雅森电子材料科技有限公司 | Combined-type black double-sided copper foil baseplate |
-
2010
- 2010-11-19 CN CN2010105512440A patent/CN102463718A/en active Pending
-
2011
- 2011-10-05 TW TW100218664U patent/TWM421878U/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1097806A2 (en) * | 1999-11-04 | 2001-05-09 | Mitsubishi Gas Chemical Company, Inc. | Copper-clad board, method of making hole in said copper-clad board and printing wiring board comprising said copper-clad board |
| JP2004123774A (en) * | 2002-09-30 | 2004-04-22 | Kanegafuchi Chem Ind Co Ltd | Polyimide resin composition, polyimide film, and polyimide tube |
| CN201590949U (en) * | 2009-05-13 | 2010-09-22 | 昆山雅森电子材料科技有限公司 | Copper clad laminate for flexible printed circuit board |
| CN201590948U (en) * | 2009-12-30 | 2010-09-22 | 昆山雅森电子材料科技有限公司 | Double-surfaced copper clad laminate |
| CN201898660U (en) * | 2010-11-19 | 2011-07-13 | 昆山雅森电子材料科技有限公司 | Combined-type black double-sided copper foil baseplate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103547132A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN103547132B (en) * | 2012-07-17 | 2017-03-22 | 昆山雅森电子材料科技有限公司 | Electromagnetic interference shielding structure and flexible printed circuit board with same |
| CN114679837A (en) * | 2020-12-24 | 2022-06-28 | 广东生益科技股份有限公司 | Black glue-free flexible copper-clad plate and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM421878U (en) | 2012-02-01 |
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Application publication date: 20120523 |