CN103101263A - Colored thermal-conductive cover film - Google Patents
Colored thermal-conductive cover film Download PDFInfo
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- CN103101263A CN103101263A CN2011103561790A CN201110356179A CN103101263A CN 103101263 A CN103101263 A CN 103101263A CN 2011103561790 A CN2011103561790 A CN 2011103561790A CN 201110356179 A CN201110356179 A CN 201110356179A CN 103101263 A CN103101263 A CN 103101263A
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Abstract
The invention discloses a colored thermal-conductive cover film. The colored thermal-conductive cover film comprises a thermal-conductive insulating base film. A thermal-conductive insulating glue layer and a colored thermal-conductive insulating polymer layer are adhered respectively to two surfaces of the thermal-conductive insulating base film. All the layers of the colored thermal-conductive cover film have thermal conductivity and thus compared with the common thermal-conductive cover film, the colored thermal-conductive cover film has better thermal conductivity. The colored thermal-conductive insulating polymer layer adhered to the thermal-conductive insulating base film has effects of line shielding and extinction and can improve size stability of the colored thermal-conductive cover film. Through a cover film color as a circuit board color, circuit boards from different clients can be distinguished so that clients can select special circuit board colors and the distinction purpose is realized.
Description
Technical field
The present invention relates to a kind of coverlay of printed circuit board (PCB).
Background technology
The progress of information, communication industry has driven the development of microelectronic industry, and flexible print wiring board (FPC) arises at the historic moment, and has obtained fast development, is used widely at numerous areas such as cell phone, notebook computer, LCDs.Printed circuit board (PCB) is material indispensable in electronic product, and along with the consumption electronic products demand is grown up, and also grows with each passing day for the demand of printed circuit board (PCB).But have the characteristics such as flexibility and three-dimensional space distribution due to flexible print wiring board, emphasize that at the technicalization electronic product development compact, flexibility drives under gesture, computer and ancillary equipment thereof, communication product and consumption electronic products etc. at present are widely used.
Generally speaking, flexible print wiring board is made of copper clad laminate (FCCL) and coverlay (CL).In this board structure of circuit, generally use plastic film as coverlay, perhaps utilize screen printing technology to form one deck thin insulating printing ink.These known coverlays exist ink lay be full of cracks or the problem such as come off.In addition; most coverlay is the light Kapton in the market; and the function of covering circuit layout for the polyimides diaphragm is had; form coloured adhesion layer on Kapton; yet; though this kind structure reaches the purpose of covering, the glossiness on Kapton surface is still excessively bright, can't satisfy the demand that particular optical is used.In order to offset the demand of optical activity polyimides diaphragm in response to market; use is added with coloured Kapton of dyestuff; and form adhesion layer on this coloured Kapton; though the polyimides diaphragm of making in this way has extinction effect preferably; yet the high cost of coloured Kapton; be not inconsistent demand during actual volume production, and the anxiety that the polyimides diaphragm that contains additive also has character variation such as tensile strength, dimensional stability is considered.Therefore, obtain low-cost, the racemization photosensitiveness is good and have the coverlay of excellent folding quality, is the problem for remaining unsolved at present.
Present development along with mobile phone, panel computer industry, design protection for wiring board more and more comes into one's own, extensive use along with the black matt coverlay, line design has obtained good protection, but, each family's mobile phone, panel computer business demand is the wiring board material that own characteristic is arranged at present, be that large producer of every family all wishes the wiring board design that represents own feature, therefore, the demand of colored heat-conductive cover film is just increasing, the color of different main flows can be selected by each manufacturer according to the characteristics of oneself, be formed with the circuit sheet material of own characteristic; And main sale in the market is white and black covering film, in order to satisfy client's demand, and the characteristic line plate of each producer of family demand, demand to red, blue, purple etc. colored heat-conductive cover film is increasing, seek a kind of cheapness, easily the colored heat-conductive cover film of system becomes the demand point of industry.
Along with future developments such as electronic product is short, little, light, thin, high density, multifunctions, on printed circuit board, the element packing density promotes greatly, force the thermal energy exchange of circuit larger, the lifting of heat energy will make the operating ambient temperature of element raise, therefore just greatly reduce the service life of electronic devices and components, for head it off, need better heat sink material, so that the heat that electronic devices and components produce in the course of the work better sheds.
Summary of the invention
In order to overcome defects, the invention provides a kind of colored heat-conductive cover film, this colored heat-conductive cover film is when having high thermal conductivity, not only can reach the effect of covering circuit and delustring, and can distinguish by the different colours of coverlay coloured wiring board of every client, can also improve the dimensional stability of coverlay, again and simple in structure, easy to implement.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of colored heat-conductive cover film is provided with the heat conductive insulating basement membrane, and described heat conductive insulating basement membrane has two relative surfaces, is stained with respectively heat conductive insulating glue-line and colored heat-conductive insulating polymer layer on two surfaces of described heat conductive insulating basement membrane.
Each layer of material of colored heat-conductive cover film of the present invention all has heat conductivility, therefore has better heat conductivility with respect to common heat-conducting covering film and common color covering film.Described " coloured " of the colored heat-conductive insulating polymer layer in the present invention refers to the color except the true qualities of material layer, and except containing conventional black and two kinds of colors of white, also comprise such as red, orange, yellow, green, blue, ingot or the color such as purple, also can be on these primary colours printed patterns and customer ID (logo).Adhere to coloured heat conductive insulating polymeric layer and can play the effect of covering circuit and delustring on the heat conductive insulating basement membrane, and can improve the dimensional stability of coverlay, and can play the function of identifying different customer line plates, wiring board as the first client requires to paste blue coverlay, second client's wiring board requires to paste red coverlay, can distinguish by the color that coverlay is wiring board is which client's of family wiring board, make different clients that the individual character wiring board color of oneself can be arranged, play the effect that identification is distinguished.
The present invention for the further technical scheme that solves its technical problem and adopt is:
Be provided with release layer, described release layer adheres on described heat conductive insulating glue-line, and described heat conductive insulating glue-line is folded between described heat conductive insulating basement membrane and described release layer, and this release layer is used for keeping the viscosity of described insulation glue-line, is beneficial to successive process.Preferably, the thickness of described release layer is 30～200um.
Described heat conductive insulating basement membrane is a kind of in poly-naphthalene ester (PEN) film of heat conduction polyimides (PI) film, heat conduction polyester (PET) film, heat conduction and conducting liquid crystal polymer (LCP) film, heat conduction polyimides (PI) film preferably, the thickness of described heat conductive insulating basement membrane is 7～100um.Preferably, described heat conductive insulating basement membrane is the polyimide film, the polyester film that is added with heat conduction inorganic filler that are added with heat conduction inorganic filler, be added with the poly-naphthalene ester film of heat conduction inorganic filler or be added with the liquid crystalline polymer film of heat conduction inorganic filler, and with the heat conduction inorganic filler that adds as heat-conducting medium, preferably be added with the polyimide film of heat conduction inorganic filler.Wherein, heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and CNT, and the ratio that described heat conduction inorganic filler adds is 20%～90% (percentage by weight) of heat conductive insulating basement membrane solid content.
Described colored heat-conductive insulating polymer layer is a kind of in colored heat-conductive polyimide layer, colored heat-conductive polyester layer, colored heat-conductive acrylate layer, colored heat-conductive ink lay and colored heat-conductive epoxy resin layer, and the thickness of described colored heat-conductive insulating polymer layer is 1～25um.Preferably, described colored heat-conductive insulating polymer layer is polyimide layer, the polyester layer that is added with inorganic color and heat conduction inorganic filler, the acrylate layer that is added with inorganic color and heat conduction inorganic filler that are added with inorganic color and heat conduction inorganic filler, is added with the ink lay of inorganic color and heat conduction inorganic filler or is added with inorganic color and the epoxy resin layer of heat conduction inorganic filler.The inorganic color that adds different colours according to the difference of color demand, heat conductive insulating polymeric layer as blue in needs add the blue inorganic colorant when the configuration polymer.Wherein, with the heat conduction inorganic filler that adds as heat-conducting medium, heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and CNT, and the ratio that described heat conduction inorganic filler adds is 20%～90% (percentage by weight) of colored heat-conductive insulating polymer layer solid content.Wherein, the saturated polyester that uses as colored heat-conductive insulating polymer layer, its characteristic need to have heat resistance and anti-yellowing sex change preferably, therefore selected specific linear saturated polyester, its curing agent that uses is blocked curing agent, after need to being heated to uniform temperature, but clad ability deblocking participates in reaction, and the inorganic color of interpolation is the inorganic filler of respective color.
Described heat conductive insulating glue-line is a kind of in heat-conduction epoxy resin glue-line, heat conduction acrylate glue-line, heat conduction polyester glue-line, heat-conduction polyurethane glue-line and heat conduction polyimides glue-line, and the thickness of described heat conductive insulating glue-line is 5～50um.Preferably, described heat conductive insulating glue-line is the epoxy glue layer that is added with heat conduction inorganic filler, the acrylate glue-line that is added with heat conduction inorganic filler, the polyester glue-line that is added with heat conduction inorganic filler, the polyurethane glue-line that is added with heat conduction inorganic filler or the polyimides glue-line that is added with heat conduction inorganic filler.Wherein, with the heat conduction inorganic filler that adds as heat-conducting medium, described heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and CNT, and the ratio that described heat conduction inorganic filler adds is 20%～90% (percentage by weight) of described heat conductive insulating glue-line solid content.
the invention has the beneficial effects as follows: colored heat-conductive cover film of the present invention, be provided with the heat conductive insulating basement membrane, be stained with respectively heat conductive insulating glue-line and colored heat-conductive insulating polymer layer on two surfaces of described heat conductive insulating basement membrane, because each layer of material of colored heat-conductive cover film of the present invention all has heat conductivility, therefore has better heat conductivility with respect to common heat-conducting covering film and common color covering film, and the coloured heat conductive insulating polymeric layer of adhesion can play the effect of covering circuit and delustring on the heat conductive insulating basement membrane, and can improve the dimensional stability of coverlay, can also distinguish by the color that coverlay is wiring board is which client's of family wiring board, make different clients that the characteristic line plate color of oneself can be arranged, play the effect that identification is distinguished.
Description of drawings
Fig. 1 is colored heat-conductive cover film generalized section of the present invention.
The specific embodiment
Embodiment: below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made more explicit defining.
A kind of colored heat-conductive cover film, be provided with heat conductive insulating basement membrane 1, described heat conductive insulating basement membrane has two relative surfaces, be stained with respectively heat conductive insulating glue-line 2 and colored heat-conductive insulating polymer layer 3 on two surfaces of described heat conductive insulating basement membrane, also be provided with release layer 4, described release layer adheres on described heat conductive insulating glue-line, and described heat conductive insulating glue-line is folded between described heat conductive insulating basement membrane and described release layer.
Wherein, described heat conductive insulating basement membrane 1 for the polyimide film, the polyester film that is added with heat conduction inorganic filler that are added with heat conduction inorganic filler, be added with the poly-naphthalene ester film of heat conduction inorganic filler or be added with the liquid crystalline polymer film of heat conduction inorganic filler, and with the heat conduction inorganic filler that adds as heat-conducting medium, preferably be added with the polyimide film of heat conduction inorganic filler.Wherein, heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and CNT, and the ratio that described heat conduction inorganic filler adds is 20%～90% (percentage by weight) of heat conductive insulating basement membrane solid content.The thickness of described heat conductive insulating basement membrane is 7～100um.
Wherein, described colored heat-conductive insulating polymer layer 3 for polyimide layer, the polyester layer that is added with inorganic color and heat conduction inorganic filler, the acrylate layer that is added with inorganic color and heat conduction inorganic filler that are added with inorganic color and heat conduction inorganic filler, be added with the ink lay of inorganic color and heat conduction inorganic filler or be added with inorganic color and the epoxy resin layer of heat conduction inorganic filler.The thickness of described colored heat-conductive insulating polymer layer 3 is 1～25um.The inorganic color that adds different colours according to the difference of color demand, heat conductive insulating polymeric layer as blue in needs add the blue inorganic colorant when the configuration polymer.Wherein, with the heat conduction inorganic filler that adds as heat-conducting medium, heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and CNT, and the ratio that described heat conduction inorganic filler adds is 20%～90% (percentage by weight) of colored heat-conductive insulating polymer layer solid content.Wherein, the saturated polyester that uses as colored heat-conductive insulating polymer layer, its characteristic need to have heat resistance and anti-yellowing sex change preferably, therefore selected specific linear saturated polyester, its curing agent that uses is blocked curing agent, after need to being heated to uniform temperature, but clad ability deblocking participates in reaction, and the inorganic color of interpolation is the inorganic filler of respective color.
Wherein, described heat conductive insulating glue-line 2 for epoxy glue layer, the acrylate glue-line that is added with heat conduction inorganic filler, the polyester glue-line that is added with heat conduction inorganic filler that are added with heat conduction inorganic filler, be added with the polyurethane glue-line of heat conduction inorganic filler or be added with the polyimides glue-line of heat conduction inorganic filler.The thickness of described heat conductive insulating glue-line is 5～50um.Wherein, with the heat conduction inorganic filler that adds as heat-conducting medium, described heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and CNT, and the ratio that described heat conduction inorganic filler adds is 20%～90% (percentage by weight) of described heat conductive insulating glue-line solid content.
Wherein, the thickness of described release layer 4 is 30～200um.
Above-mentioned colored heat-conductive cover film can make by following method:
One, linear saturated polyester, curing agent are used acetone solvent, stir, add inorganic color and the heat conduction inorganic filler of respective color, stir, and be milled to the fineness of regulation with sand mill, the mixed colored heat-conductive insulating polymer of making after froth breaking;
Two, use coating machine to be coated on a side of heat conductive insulating basement membrane the colored heat-conductive insulating polymer, through online baking-curing, remove the organic solvent that includes, adjusting the colored heat-conductive insulating polymer layer of producing linear speed assurance coating can reach curing when online baking, can mutually not bond;
Three, utilize the needed chemical constituent of organic solvent dissolution heat conductive insulating glue-line preparation, after mixing, add heat conduction inorganic filler, make the heat conductive insulating glue-line through the sand mill sand milling to the regulation fineness;
Four, use coating machine to be coated on another side of heat conductive insulating basement membrane the heat conductive insulating glue-line, after baking by online baking oven, the organic solvent that removal includes, and make the heat conductive insulating glue-line reach the mobile state of semi-solid preparation half, make colored heat-conductive cover film after the applying separated type material.
Colored heat-conductive cover film of the present invention (experimental group) and prior art coverlay (comparative example) are done thermal conductivity, breakdown voltage resistant, dimensional stability, reflectivity and the test of scolding tin heat resistance, and test result is recorded in table one and table two.
Table one: thermal conductivity and breakdown voltage resistant
Can see by the comparison of showing a kind of data, each Laminate construction thickness increases can reduce heat transfer efficiency, and the ratio of heat conduction inorganic filler increases can promote thermal conductivity.And by table one data as can be known, colored heat-conductive cover film of the present invention has high thermal conductivity and high breakdown voltage resistant.
Table two: dimensional stability, reflectivity and scolding tin heat resistance
| Experimental group | Comparative example 5 | Comparative example 6 | Comparative example 7 | Comparative example 8 | |
| Insulating basement membrane | Heat conduction is yellow | Heat conduction is yellow | Heat conduction is yellow | Heat conduction is yellow | Heat conduction is yellow |
| The insulation glue-line | Transparent | Transparent | Transparent | Transparent | Transparent |
| The insulating polymer layer | Colored heat-conductive | Nothing | Black | White | Nothing |
| Dimensional stability | 0.1％ | 0.2％ | 0.15％ | 0.17％ | 0.2％ |
| The scolding tin heat resistance | 288℃10S | 288℃10S | 288℃10S | 288℃10S | 288℃10S |
| Reflectivity | 82％ | 95％ | 85％ | 87％ | 83％ |
| Cover power | Opaque | Transparent | Opaque | Opaque | Opaque |
As shown in Table 2, colored heat-conductive cover film of the present invention has excellent dimensional stability and scolding tin heat resistance, and has antiradar reflectivity (delustring), also has the circuit of covering effect.
Claims (10)
1. colored heat-conductive cover film, it is characterized in that: be provided with heat conductive insulating basement membrane (1), described heat conductive insulating basement membrane has two relative surfaces, is stained with respectively heat conductive insulating glue-line (2) and colored heat-conductive insulating polymer layer (3) on two surfaces of described heat conductive insulating basement membrane.
2. colored heat-conductive cover film according to claim 1, it is characterized in that: be provided with release layer (4), described release layer adheres on described heat conductive insulating glue-line, and described heat conductive insulating glue-line is folded between described heat conductive insulating basement membrane and described release layer.
3. colored heat-conductive cover film according to claim 1, it is characterized in that: a kind of in the poly-naphthalene ester film of heat conduction polyimide film, heat conduction polyester film, heat conduction and conducting liquid crystal polymer film of described heat conductive insulating basement membrane (1), the thickness of described heat conductive insulating basement membrane (1) is 7～100um.
4. colored heat-conductive cover film according to claim 3 is characterized in that: described heat conductive insulating basement membrane (1) for the polyimide film, the polyester film that is added with heat conduction inorganic filler that are added with heat conduction inorganic filler, be added with the poly-naphthalene ester film of heat conduction inorganic filler and be added with a kind of in the liquid crystalline polymer film of heat conduction inorganic filler.
5. colored heat-conductive cover film according to claim 1, it is characterized in that: a kind of in colored heat-conductive polyimide layer, colored heat-conductive polyester layer, colored heat-conductive acrylate layer, colored heat-conductive ink lay and colored heat-conductive epoxy resin layer of described colored heat-conductive insulating polymer layer (3), the thickness of described colored heat-conductive insulating polymer layer (3) is 1～25um.
6. colored heat-conductive cover film according to claim 5 is characterized in that: described colored heat-conductive insulating polymer layer (3) for polyimide layer, the polyester layer that is added with inorganic color and heat conduction inorganic filler, the acrylate layer that is added with inorganic color and heat conduction inorganic filler that are added with inorganic color and heat conduction inorganic filler, be added with the ink lay of inorganic color and heat conduction inorganic filler and be added with inorganic color and the epoxy resin layer of heat conduction inorganic filler in a kind of.
7. colored heat-conductive cover film according to claim 1, it is characterized in that: a kind of in heat-conduction epoxy resin glue-line, heat conduction acrylate glue-line, heat conduction polyester glue-line, heat-conduction polyurethane glue-line and heat conduction polyimides glue-line of described heat conductive insulating glue-line (2), the thickness of described heat conductive insulating glue-line (2) is 5～50um.
8. want 7 described colored heat-conductive cover films according to right, it is characterized in that: described heat conductive insulating glue-line (2) for epoxy glue layer, the acrylate glue-line that is added with heat conduction inorganic filler, the polyester glue-line that is added with heat conduction inorganic filler that are added with heat conduction inorganic filler, be added with the polyurethane glue-line of heat conduction inorganic filler and be added with a kind of in the polyimides glue-line of heat conduction inorganic filler.
9. colored heat-conductive cover film according to claim 2, it is characterized in that: the thickness of described release layer (4) is 30～200um.
10. according to claim 4,6 or 8 described colored heat-conductive cover films, it is characterized in that: described heat conduction inorganic filler is at least a in carborundum, aluminium oxide, boron nitride, aluminium nitride and CNT, and the ratio that described heat conduction inorganic filler adds is 20%～90% (percentage by weight) of its place material layer solid content.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011103561790A CN103101263A (en) | 2011-11-11 | 2011-11-11 | Colored thermal-conductive cover film |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011103561790A CN103101263A (en) | 2011-11-11 | 2011-11-11 | Colored thermal-conductive cover film |
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| CN103101263A true CN103101263A (en) | 2013-05-15 |
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| CN2011103561790A Pending CN103101263A (en) | 2011-11-11 | 2011-11-11 | Colored thermal-conductive cover film |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188322A (en) * | 2015-10-12 | 2015-12-23 | 上海光德电子科技有限公司 | Ultrathin nano radiating film material and preparation method thereof |
| CN107627700A (en) * | 2016-07-29 | 2018-01-26 | 苏州睿利斯电子材料科技有限公司 | A kind of mould release membrance for FPC |
| CN110769614A (en) * | 2019-10-28 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | FPC full-process tracing method with black cover film |
| CN114698275A (en) * | 2020-12-31 | 2022-07-01 | Oppo广东移动通信有限公司 | Shell assembly, preparation method of shell assembly and electronic equipment |
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| EP1037511A2 (en) * | 1999-03-17 | 2000-09-20 | GA-TEK Inc. | Surface treatment of copper to prevent microcracking in flexible circuits |
| CN201721100U (en) * | 2010-07-16 | 2011-01-26 | 广东生益科技股份有限公司 | Black covering film |
| CN102079959A (en) * | 2010-12-18 | 2011-06-01 | 广东生益科技股份有限公司 | High-heat-conductivity white adhesive composition, high-heat-conductivity white cover film made from same and preparation method thereof |
| CN202319173U (en) * | 2011-11-11 | 2012-07-11 | 松扬电子材料(昆山)有限公司 | Colored heat-conductive cover film |
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2011
- 2011-11-11 CN CN2011103561790A patent/CN103101263A/en active Pending
Patent Citations (4)
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| EP1037511A2 (en) * | 1999-03-17 | 2000-09-20 | GA-TEK Inc. | Surface treatment of copper to prevent microcracking in flexible circuits |
| CN201721100U (en) * | 2010-07-16 | 2011-01-26 | 广东生益科技股份有限公司 | Black covering film |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105188322A (en) * | 2015-10-12 | 2015-12-23 | 上海光德电子科技有限公司 | Ultrathin nano radiating film material and preparation method thereof |
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| CN107627700A (en) * | 2016-07-29 | 2018-01-26 | 苏州睿利斯电子材料科技有限公司 | A kind of mould release membrance for FPC |
| CN110769614A (en) * | 2019-10-28 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | FPC full-process tracing method with black cover film |
| CN114698275A (en) * | 2020-12-31 | 2022-07-01 | Oppo广东移动通信有限公司 | Shell assembly, preparation method of shell assembly and electronic equipment |
| CN114698275B (en) * | 2020-12-31 | 2023-11-28 | Oppo广东移动通信有限公司 | Shell assembly, preparation method of shell assembly and electronic equipment |
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Application publication date: 20130515 |