CN201562693U - 一种四点led支架及采用该支架制成的led光源 - Google Patents
一种四点led支架及采用该支架制成的led光源 Download PDFInfo
- Publication number
- CN201562693U CN201562693U CN 200920261460 CN200920261460U CN201562693U CN 201562693 U CN201562693 U CN 201562693U CN 200920261460 CN200920261460 CN 200920261460 CN 200920261460 U CN200920261460 U CN 200920261460U CN 201562693 U CN201562693 U CN 201562693U
- Authority
- CN
- China
- Prior art keywords
- pad
- led
- reflector
- cup
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200920261460 CN201562693U (zh) | 2009-12-14 | 2009-12-14 | 一种四点led支架及采用该支架制成的led光源 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200920261460 CN201562693U (zh) | 2009-12-14 | 2009-12-14 | 一种四点led支架及采用该支架制成的led光源 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201562693U true CN201562693U (zh) | 2010-08-25 |
Family
ID=42627846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200920261460 Expired - Fee Related CN201562693U (zh) | 2009-12-14 | 2009-12-14 | 一种四点led支架及采用该支架制成的led光源 |
Country Status (1)
Country | Link |
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CN (1) | CN201562693U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106848047A (zh) * | 2017-01-17 | 2017-06-13 | 东莞市良友五金制品有限公司 | 一种便于固晶焊线的led支架 |
-
2009
- 2009-12-14 CN CN 200920261460 patent/CN201562693U/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106848047A (zh) * | 2017-01-17 | 2017-06-13 | 东莞市良友五金制品有限公司 | 一种便于固晶焊线的led支架 |
CN106848047B (zh) * | 2017-01-17 | 2018-12-21 | 东莞市良友五金制品有限公司 | 一种便于固晶焊线的led支架 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: GUANGDONG CHANGYING PRECISION TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN EVERWIN PRECISION TECHNOLOGY CO., LTD. Effective date: 20121115 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518000 SHENZHEN, GUANGDONG PROVINCE TO: 523000 DONGGUAN, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20121115 Address after: 523000, Guangdong, Dongguan Songshan Lake hi tech Industrial Development Zone, industrial North Road, No. 4, on the first floor (part) of the two layer Patentee after: Guangdong Changying Precision Technology Co., Ltd. Address before: 518000, Fuyong Third Bridge Industrial Zone, Qiaotou bridge, Shenzhen, Guangdong, Baoan District Patentee before: Shenzhen Everwin Precision Technology Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100825 Termination date: 20171214 |
|
CF01 | Termination of patent right due to non-payment of annual fee |