CN201562693U - 一种四点led支架及采用该支架制成的led光源 - Google Patents

一种四点led支架及采用该支架制成的led光源 Download PDF

Info

Publication number
CN201562693U
CN201562693U CN 200920261460 CN200920261460U CN201562693U CN 201562693 U CN201562693 U CN 201562693U CN 200920261460 CN200920261460 CN 200920261460 CN 200920261460 U CN200920261460 U CN 200920261460U CN 201562693 U CN201562693 U CN 201562693U
Authority
CN
China
Prior art keywords
pad
led
reflector
cup
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 200920261460
Other languages
English (en)
Inventor
孙业民
廖家扬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Evenwin Precision Technology Co Ltd
Original Assignee
Shenzhen Everwin Precision Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Everwin Precision Technology Co Ltd filed Critical Shenzhen Everwin Precision Technology Co Ltd
Priority to CN 200920261460 priority Critical patent/CN201562693U/zh
Application granted granted Critical
Publication of CN201562693U publication Critical patent/CN201562693U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)

Abstract

本实用新型公开一种用于LED光源的四点LED支架及采用该支架制成的LED光源。四点LED支架包括反光杯和与反光杯固定在一起的焊盘,焊盘包括四个,第一个焊盘设置在反光杯底部中间位置,呈“L”形,第一个焊盘面积大于其他三个面积,第二个焊盘设置在第一个焊盘与反光杯围城的区域内,第三个焊盘和第四个焊盘设置在第一个焊盘侧面,各个焊盘之间相互绝缘。LED光源第一个焊盘上固定安装有三个LED晶片,每个LED晶片分别通过一条金线与其余三个焊盘中的一个相连接。本实用新型使得三个LED晶片可同时集中在反光杯杯底中心,更加有利于聚光,提高发光强度。另外,反光杯的特殊结构可增强产品的易焊性和散热性,减小产品的光衰减。

Description

一种四点LED支架及采用该支架制成的LED光源
技术领域
本实用新型公开一种LED光源,特别是一种用于LED光源的四点LED支架及采用该支架制成的LED光源。
背景技术
随着LED照明技术日益发展,LED在人们日常生活中的应用越来越广泛。普通的单色LED逐渐不能满足人们的需求,于是变出现了三色LED及多色LED,三色LED即是在一个LED支架上安装有三个不同颜色的LED晶片构成,现有技术中的三色LED光源通常采用的四点LED支架,请参看附图1和附图2,目前的四点LED支架都包括一个反光杯1和四个固定安装在反光杯1底部的焊盘,四个焊盘在反光杯底部呈矩阵型分布,四个焊盘之间的绝缘部分呈“十”字形,四个焊盘分别设置在一角,使用时,三个LED晶片2分别设置在一个焊盘上,再通过金线3与第四个焊盘相连接。现有技术中的LED支架上的反光杯1内部呈圆台形。由于现有技术中的LED支架的结构限制,使得LED晶片2发光不能很好的被射出,使用受到一定限制。
发明内容
针对上述提到的现有技术中的LED支架的结构,使得LED晶片发光不鞥你很好射出的缺点,本实用新型提供一种新的四点LED支架结构以及用该支架制成的LED光源,LED光源的三个LED晶片排列设置在一个焊盘上,更加有利于聚光和提高发光强度。
本实用新型解决其技术问题采用的技术方案是:一种四点LED支架,包括反光杯和与反光杯固定在一起的焊盘,焊盘包括四个,第一个焊盘设置在反光杯底部中间位置,呈“L”形,第一个焊盘面积大于其他三个面积,第二个焊盘设置在第一个焊盘与反光杯围城的区域内,第三个焊盘和第四个焊盘设置在第一个焊盘侧面,各个焊盘之间相互绝缘。
一种采用上述的四点LED支架制成的LED光源,包括反光杯、与反光杯固定在一起的焊盘和固定安装在焊盘上的LED晶片,第一个焊盘上固定安装有三个LED晶片,每个LED晶片分别通过一条金线与其余三个焊盘中的一个相连接。
本实用新型解决其技术问题采用的技术方案进一步还包括:
所述的反光杯杯底呈方形,杯口呈圆形,杯底至杯口为平滑过渡。
本实用新型的有益效果是:本实用新型结构简单,其改变了焊盘的结构,使得三个LED晶片可同时焊接在中间一个焊盘上,且集中在反光杯杯底中心,更加有利于聚光,提高发光强度。本实用新型反光杯杯底采用方形,杯口采用圆形结构,可有效增强产品的易焊性和散热性,减小产品的光衰减。
下面将结合附图和具体实施方式对本实用新型做进一步说明。
附图说明
图1为现有技术中LED光源俯视结构示意图。
图2为现有技术中LED光源侧视结构示意图。
图3为本实用新型LED光源俯视结构示意图。
图4为本实用新型LED光源侧视结构示意图。
图5为本实用新型LED光源立体结构示意图。
图6为本实用新型反光杯立体结构示意图。
图7为本实用新型焊盘立体结构示意图。
图中,1-反光杯,2-LED晶片,3-金线,4-第一焊盘,5-第二焊盘,6-第三焊盘,7-第四焊盘。
具体实施方式
本实施例为本实用新型优选实施方式,其他凡其原理和基本结构与本实施例相同或近似的,均在本实用新型保护范围之内。
请参看附图3至附图7,本实用新型主要包括一个反光杯1和四个焊盘,请具体参看附图6,本实施例中,反光杯1采用塑料材质制成,反光杯1内部杯底呈正方形,反光杯1杯口呈圆形,由杯底至杯口平滑过渡,可有效增强产品的易焊性和散热性,减小产品的光衰减。请具体参看附图7,本实施例中的四个焊盘分别为第一焊盘4、第二焊盘5、第三焊盘6和第四焊盘7,其中第一焊盘4有效面积最大,可占四个焊盘有效面积的一半以上,本实施例中,第一焊盘4呈“L”形,主要有限部分集中在中间,第二焊盘5设置在第一焊盘4包围部分,第三焊盘6和第四焊盘7设置在第一焊盘4左侧,四个焊盘之间均绝缘,本实施例中,四个焊盘之间的绝缘部分呈“儿”字形。四个焊盘分别固定安装在反光杯1底部,且每个焊盘伸出一个引脚,以供焊接。
请参看附图3和附图5,本实用新型在使用时,将三个LED晶片2焊接在焊盘上,即可成为本实用新型的LED光源。本实用新型中,三个LED晶片2均固定在第一焊盘4上,本实施例中给出一种参考位置,请参看附图3和附图5,其中,三个LED晶片2并排分布,并集中在反光杯1底部中间,具体实施时,可根据实际需要将其固定在第一焊盘4上的其他位置,三个LED晶片2分别通过一条金线3与其他三个焊盘相连接,其中一个LED晶片通过一条金线与第二焊盘5电连接,另一个LED晶片通过一条金线与第三焊盘6电连接,第三个LED晶片通过一条金线与第四焊盘7相连接。
本实用新型结构简单,其改变了焊盘的结构,使得三个LED晶片可同时焊接在中间一个焊盘上,且集中在反光杯杯底中心,更加有利于聚光,提高发光强度。本实用新型反光杯杯底采用方形,杯口采用圆形结构,可有效增强产品的易焊性和散热性,减小产品的光衰减。

Claims (3)

1.一种四点LED支架,包括反光杯和与反光杯固定在一起的焊盘,其特征是:所述的焊盘包括四个,第一个焊盘设置在反光杯底部中间位置,呈“L”形,第一个焊盘面积大于其他三个面积,第二个焊盘设置在第一个焊盘与反光杯围城的区域内,第三个焊盘和第四个焊盘设置在第一个焊盘侧面,各个焊盘之间相互绝缘。
2.根据权利要求1所述的四点LED支架,其特征是:所述的反光杯杯底呈方形,杯口呈圆形,杯底至杯口为平滑过渡。
3.一种采用如权利要求1所述的四点LED支架制成的LED光源,包括反光杯、与反光杯固定在一起的焊盘和固定安装在焊盘上的LED晶片,其特征是:所述的第一个焊盘上固定安装有三个LED晶片,每个LED晶片分别通过一条金线与其余三个焊盘中的一个相连接。
CN 200920261460 2009-12-14 2009-12-14 一种四点led支架及采用该支架制成的led光源 Expired - Fee Related CN201562693U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200920261460 CN201562693U (zh) 2009-12-14 2009-12-14 一种四点led支架及采用该支架制成的led光源

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200920261460 CN201562693U (zh) 2009-12-14 2009-12-14 一种四点led支架及采用该支架制成的led光源

Publications (1)

Publication Number Publication Date
CN201562693U true CN201562693U (zh) 2010-08-25

Family

ID=42627846

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200920261460 Expired - Fee Related CN201562693U (zh) 2009-12-14 2009-12-14 一种四点led支架及采用该支架制成的led光源

Country Status (1)

Country Link
CN (1) CN201562693U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106848047A (zh) * 2017-01-17 2017-06-13 东莞市良友五金制品有限公司 一种便于固晶焊线的led支架

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106848047A (zh) * 2017-01-17 2017-06-13 东莞市良友五金制品有限公司 一种便于固晶焊线的led支架
CN106848047B (zh) * 2017-01-17 2018-12-21 东莞市良友五金制品有限公司 一种便于固晶焊线的led支架

Similar Documents

Publication Publication Date Title
CN201562693U (zh) 一种四点led支架及采用该支架制成的led光源
CN103782094A (zh) 照明装置
CN203932051U (zh) 一种特殊结构灯丝led
CN201547541U (zh) 一种led灯具
CN203398110U (zh) 定型定规封装的led光源组合
CN202546606U (zh) 一种led蜡烛灯透镜
CN202009035U (zh) 一种大角度led封装器件
CN201636612U (zh) 新型高效散热led灯泡
CN203787425U (zh) 一种led灯丝及照明器
CN201521907U (zh) 一种led支架
CN201568884U (zh) 一种新型灯罩
CN202167484U (zh) 一种5050led支架及led光源
CN201475693U (zh) 一种高发光效率的led的封装结构
CN201936882U (zh) 一种led光源的封装结构
CN206163520U (zh) 一种led封装支架及led发光体
CN202308048U (zh) 一种led光源模组基板
CN204922872U (zh) 一种新型led灯管
CN203192837U (zh) 一种具有高发光强度的led支架
CN201992483U (zh) 一种用于射灯的面光源led
CN201910422U (zh) 一种5050led支架及其制成的led光源
CN202209564U (zh) 一种提高良率的led装置
CN203386791U (zh) 一种大功率led支架
CN201069117Y (zh) 中间环带透光的荧光灯支架
CN201925759U (zh) 一种节能灯泡
CN203150605U (zh) 一种led支架

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: GUANGDONG CHANGYING PRECISION TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: SHENZHEN EVERWIN PRECISION TECHNOLOGY CO., LTD.

Effective date: 20121115

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 518000 SHENZHEN, GUANGDONG PROVINCE TO: 523000 DONGGUAN, GUANGDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20121115

Address after: 523000, Guangdong, Dongguan Songshan Lake hi tech Industrial Development Zone, industrial North Road, No. 4, on the first floor (part) of the two layer

Patentee after: Guangdong Changying Precision Technology Co., Ltd.

Address before: 518000, Fuyong Third Bridge Industrial Zone, Qiaotou bridge, Shenzhen, Guangdong, Baoan District

Patentee before: Shenzhen Everwin Precision Technology Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100825

Termination date: 20171214

CF01 Termination of patent right due to non-payment of annual fee