CN203386791U - 一种大功率led支架 - Google Patents

一种大功率led支架 Download PDF

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Publication number
CN203386791U
CN203386791U CN201320356549.5U CN201320356549U CN203386791U CN 203386791 U CN203386791 U CN 203386791U CN 201320356549 U CN201320356549 U CN 201320356549U CN 203386791 U CN203386791 U CN 203386791U
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pin
radiating block
power led
electrically connected
led bracket
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Expired - Fee Related
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王卫国
张运华
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Shenzhen Cgx Optoelectronic Technology Inc
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Shenzhen Cgx Led Lightening Industrial Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Led Device Packages (AREA)

Abstract

本实用新型适用于LED技术领域，提供了一种大功率LED支架，包括散热块、第一引脚及第二引脚；第一引脚与散热块电连接，散热块与LED芯片电连接，LED芯片与第二引脚电连接，第一引脚与散热块相互接触。本实用新型将第一引脚直接与散热块相接触，从而实现第一引脚与散热块的电连接，无须用导线连接第一引脚与散热块，节省了制造成本，此外，还解决了现有技术中因导线与散热块连接所导致的降低产品稳定性的问题。

Description

一种大功率LED支架
技术领域
本实用新型属于LED技术领域，尤其涉及一种大功率LED支架。
背景技术
近年来，安防产业快速发展，作为夜视摄像机光源的红外灯也在快速发展，其中大功率红外LED具有节能、环保、夜视效果好等优点被安防领域广泛应用。
现有的大功率LED支架是针对白光LED设计，白光采用的芯片本身为双极性。如图1所示，现有白光LED支架的第一引脚2、第二引脚3与LED芯片4分别通过第一导线6、第二导线7电连接。第一引脚2、第二引脚3与散热块1之间设有一层绝缘层5，第一引脚2、第二引脚3分别与散热块1绝缘。
红外芯片为单极性，如图2所示，使用现有大功率LED支架需要通过第一导线6电连接第一引脚2与散热块1，散热块1再与LED芯片4电连接，LED芯片4再通过第二导线7与第二引脚3电连接，其中，散热块1一般由导电的金属或合金材料制成。这种大功率LED支架应用于红外产品时成本较高、生产效率较低，导线连接引脚与散热块相对会降低产品的稳定性。
实用新型内容
本实用新型所要解决的技术问题在于提供一种大功率LED支架，旨在解决现有技术中的大功率LED支架应用于红外产品时，成本较高、效率较低、产品稳定性较低的问题。
本实用新型是这样实现的，一种大功率LED支架，包括散热块、第一引脚及第二引脚；所述第一引脚与散热块电连接，所述散热块与LED芯片电连接，所述LED芯片与第二引脚电连接，所述第一引脚与所述散热块相互接触。
进一步地，所述散热块往两侧方向分别水平延伸出第一连接部及第二连接部；往竖直方向延伸出一承载部，所述第一引脚压合在所述散热块的第一连接部上。
进一步地，所述散热块的顶部设有一向下凹陷的凹杯，LED芯片设置在所述凹杯的中心处。
进一步地，所述大功率LED支架还包括绝缘层，所述绝缘层由塑胶材料制成，所述散热块、第一引脚及第二引脚通过注塑形成一体，且沿所述散热块外周缘形成一环形凹槽，所述第二引脚于所述凹槽处外露出所述绝缘层形成焊盘，所述焊盘通过一导线与LED芯片电连接。
进一步地，所述散热块的底部外露于所述绝缘层。
进一步地，所述散热块、第一引脚及第二引脚的底部位于同一水平面上。
进一步地，所述散热块的顶部高于所述第一引脚及第二引脚的顶部。
本实用新型与现有技术相比，有益效果在于：本实用新型将第一引脚直接与散热块相接触，从而实现第一引脚与散热块的电连接，无须用导线连接第一引脚与散热块，节省了制造成本，此外，还解决了现有技术中因导线与散热块连接所导致的降低产品稳定性的问题。
附图说明
图1是现有技术提供的大功率白光LED支架结构的剖视示意图。
图2是现有技术提供的大功率红外LED支架结构的剖视示意图。
图3是本实用新型实施例提供的大功率红外LED支架结构的剖视示意图。
图4是图3所示大功率红外LED支架结构的俯视示意图。
具体实施方式
为了使本实用新型所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。
如图3至图4所示，为本实用新型的一较佳实施例，一种大功率LED支架，包括散热块1、第一引脚2及第二引脚3；第一引脚2与散热块1电连接，散热块1与LED芯片4电连接，LED芯片4与第二引脚3电连接，第一引脚2与散热块1相互接触。
具体地，散热块1往两侧方向分别水平延伸出第一连接部11及第二连接部12；往竖直方向延伸出承载部13。第一引脚2压合在散热块1的第一连接部11上，实现第一引脚2与散热块1的电连接。
上述的大功率LED支架将第一引脚2压合在散热块1上，从而实现第一引脚2与散热块1的电连接，无须用导线连接第一引脚2与散热块1，节省了制造成本，此外，还解决了现有技术中因导线与散热块连接所导致的降低产品稳定性的问题。
上述散热块1的顶部设有一向下凹陷的凹杯14，LED芯片4设置在凹杯14的中心处，凹杯14可以起到聚光的作用。
上述的大功率LED支架还包括绝缘层5，绝缘层5由塑胶材料制成，散热块1、第一引脚2、第二引脚3通过注塑形成一体，且沿散热块1外周缘形成一环形凹槽51，以增加成品注胶胶体100的结合力。第二引脚3于凹槽51处外露出绝缘层5形成焊盘31，焊盘31用于焊接第二导线7，从而实现第二引脚3与LED芯片4的电连接。散热块1的底部外露于绝缘层5，可利于散热块1散热。
上述第一引脚2、第二引脚3皆弯折呈台阶状，其底部22、23以及散热块1的底部位于同一水平面上，并且散热块1的顶部高于第一引脚2及第二引脚3的顶部，可有效地增大LED芯片4的出光角度。
以上所述仅为本实用新型的较佳实施例而已，并不用以限制本实用新型，凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本实用新型的保护范围之内。

Claims (7)

1.一种大功率LED支架，包括散热块、第一引脚及第二引脚；所述第一引脚与散热块电连接，所述散热块与LED芯片电连接，所述LED芯片与第二引脚电连接，其特征在于，所述第一引脚与所述散热块相互接触。
2.如权利要求1所述的大功率LED支架，其特征在于，所述散热块往两侧方向分别水平延伸出第一连接部及第二连接部；往竖直方向延伸出一承载部，所述第一引脚压合在所述散热块的第一连接部上。
3.如权利要求1或2所述的大功率LED支架，其特征在于，所述散热块的顶部设有一向下凹陷的凹杯，LED芯片设置在所述凹杯的中心处。
4.如权利要求1所述的大功率LED支架，其特征在于，所述大功率LED支架还包括绝缘层，所述绝缘层由塑胶材料制成，所述散热块、第一引脚及第二引脚通过注塑形成一体，且沿所述散热块外周缘形成一环形凹槽，所述第二引脚于所述凹槽处外露出所述绝缘层形成焊盘，所述焊盘通过一导线与LED芯片电连接。
5.如权利要求4所述的大功率LED支架，其特征在于，所述散热块的底部外露于所述绝缘层。
6.如权利要求1所述的大功率LED支架，其特征在于，所述散热块、第一引脚及第二引脚的底部位于同一水平面上。
7.如权利要求1或6所述的大功率LED支架，其特征在于，所述散热块的顶部高于所述第一引脚及第二引脚的顶部。
CN201320356549.5U 2013-06-20 2013-06-20 一种大功率led支架 Expired - Fee Related CN203386791U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106098902A (zh) * 2016-08-03 2016-11-09 江西亚中电子科技有限公司 一种高亮度led贴片支架

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106098902A (zh) * 2016-08-03 2016-11-09 江西亚中电子科技有限公司 一种高亮度led贴片支架

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Patentee after: SHENZHEN CGX OPTOELECTRONIC TECHNOLOGY, Inc.

Address before: 518000 Guangdong city of Shenzhen province Baoan District Longhua Pine Village Pelton Industrial Zone No. 2 three or four floor

Patentee before: Shenzhen CGX LED Lightening Industrial Co.,Ltd.

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